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KR970002471A - 포지티브형 포토레지스트조성물 - Google Patents

포지티브형 포토레지스트조성물 Download PDF

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Publication number
KR970002471A
KR970002471A KR1019960021658A KR19960021658A KR970002471A KR 970002471 A KR970002471 A KR 970002471A KR 1019960021658 A KR1019960021658 A KR 1019960021658A KR 19960021658 A KR19960021658 A KR 19960021658A KR 970002471 A KR970002471 A KR 970002471A
Authority
KR
South Korea
Prior art keywords
photoresist composition
positive photoresist
positive
composition
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019960021658A
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English (en)
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KR100240184B1 (ko
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Publication of KR970002471A publication Critical patent/KR970002471A/ko
Application granted granted Critical
Publication of KR100240184B1 publication Critical patent/KR100240184B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1019960021658A 1995-06-15 1996-06-15 포지티브형 포토레지스트조성물 Expired - Fee Related KR100240184B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-172899 1995-06-15
JP7172899A JP3046225B2 (ja) 1995-06-15 1995-06-15 ポジ型レジスト膜形成用塗布液

Publications (2)

Publication Number Publication Date
KR970002471A true KR970002471A (ko) 1997-01-24
KR100240184B1 KR100240184B1 (ko) 2000-01-15

Family

ID=15950407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960021658A Expired - Fee Related KR100240184B1 (ko) 1995-06-15 1996-06-15 포지티브형 포토레지스트조성물

Country Status (6)

Country Link
US (1) US5948589A (ko)
EP (1) EP0749046B1 (ko)
JP (1) JP3046225B2 (ko)
KR (1) KR100240184B1 (ko)
DE (1) DE69608167T2 (ko)
TW (1) TW412663B (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980035211A (ko) * 1996-11-12 1998-08-05 박병재 배기관 오염 경보장치
KR100573819B1 (ko) * 2001-05-31 2006-04-26 토쿄오오카코교 가부시기가이샤 감광성 적층체 및 그것을 이용한 레지스트패턴 형성방법
KR20160102754A (ko) * 2015-02-23 2016-08-31 현대중공업 주식회사 Scr 시스템의 촉매 성능진단 장치 및 방법

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042988A (en) * 1996-12-26 2000-03-28 Tokyo Ohka Kogyo Co., Ltd. Chemical-amplification-type negative resist composition
JP2998682B2 (ja) * 1997-03-13 2000-01-11 日本電気株式会社 化学増幅系レジスト
TW546540B (en) * 1997-04-30 2003-08-11 Wako Pure Chem Ind Ltd An agent for reducing the substrate dependence of resist and a resist composition
EP0887707B1 (en) 1997-06-24 2003-09-03 Fuji Photo Film Co., Ltd. Positive photoresist composition
US6103447A (en) * 1998-02-25 2000-08-15 International Business Machines Corp. Approach to formulating irradiation sensitive positive resists
IL141803A0 (en) * 1998-09-23 2002-03-10 Du Pont Photoresists, polymers and processes for microlithography
JP3707655B2 (ja) * 1998-10-24 2005-10-19 東京応化工業株式会社 ネガ型レジスト組成物
KR100363273B1 (ko) * 2000-07-29 2002-12-05 주식회사 동진쎄미켐 액정표시장치 회로용 포토레지스트 조성물
JP2002091003A (ja) * 2000-09-19 2002-03-27 Tokyo Ohka Kogyo Co Ltd 薄膜形成用ポジ型レジスト組成物及びそれを用いた感光材料
US6743563B2 (en) * 2001-08-15 2004-06-01 Shipley Company, L.L.C. Photoresist compositions
JP4053402B2 (ja) * 2002-10-23 2008-02-27 東京応化工業株式会社 Ｌｃｄ製造用ポジ型ホトレジスト組成物およびレジストパターンの形成方法
KR100813458B1 (ko) 2003-05-20 2008-03-13 도오꾜오까고오교 가부시끼가이샤 화학증폭형 포지티브형 포토레지스트 조성물 및 레지스트패턴형성방법
KR20050054954A (ko) 2003-05-22 2005-06-10 도오꾜오까고오교 가부시끼가이샤 화학증폭형 포지티브형 포토레지스트 조성물 및 레지스트패턴 형성방법
JP4131864B2 (ja) * 2003-11-25 2008-08-13 東京応化工業株式会社 化学増幅型ポジ型感光性熱硬化性樹脂組成物、硬化物の形成方法、及び機能素子の製造方法
JP2005173369A (ja) 2003-12-12 2005-06-30 Tokyo Ohka Kogyo Co Ltd レジストパターンの剥離方法
KR100825465B1 (ko) * 2004-02-19 2008-04-28 도쿄 오카 고교 가부시키가이샤 포토레지스트 조성물 및 레지스트 패턴 형성방법
WO2005081061A1 (ja) * 2004-02-19 2005-09-01 Tokyo Ohka Kogyo Co., Ltd. フォトレジスト組成物およびレジストパターン形成方法
US8062825B2 (en) * 2004-12-03 2011-11-22 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and resist pattern forming method
WO2006120896A1 (ja) * 2005-05-02 2006-11-16 Tokyo Ohka Kogyo Co., Ltd. ポジ型レジスト組成物およびレジストパターン形成方法
US8153346B2 (en) 2007-02-23 2012-04-10 Fujifilm Electronic Materials, U.S.A., Inc. Thermally cured underlayer for lithographic application
US8715918B2 (en) * 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
TWI556958B (zh) 2010-09-14 2016-11-11 東京應化工業股份有限公司 基質劑及含嵌段共聚物之層的圖型形成方法
EP2447773B1 (en) 2010-11-02 2013-07-10 Fujifilm Corporation Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure
JP5635449B2 (ja) 2011-03-11 2014-12-03 富士フイルム株式会社 樹脂パターン及びその製造方法、ｍｅｍｓ構造体の製造方法、半導体素子の製造方法、並びに、メッキパターン製造方法
US11385543B2 (en) 2016-08-09 2022-07-12 Merck Patent Gmbh Enviromentally stable, thick film, chemically amplified resist
JP7407587B2 (ja) * 2019-12-19 2024-01-04 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491628A (en) * 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
DE3930087A1 (de) * 1989-09-09 1991-03-14 Hoechst Ag Positiv arbeitendes strahlungsempfindliches gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
US5225316A (en) * 1990-11-26 1993-07-06 Minnesota Mining And Manufacturing Company An imagable article comprising a photosensitive composition comprising a polymer having acid labile pendant groups
KR950000482B1 (ko) * 1991-04-30 1995-01-20 가부시키가이샤 도시바 패턴형성용 레지스트
EP0537524A1 (en) * 1991-10-17 1993-04-21 Shipley Company Inc. Radiation sensitive compositions and methods
JPH05127369A (ja) * 1991-10-31 1993-05-25 Nec Corp レジスト材料
JP3010607B2 (ja) * 1992-02-25 2000-02-21 ジェイエスアール株式会社 感放射線性樹脂組成物
JPH05289322A (ja) * 1992-04-10 1993-11-05 Hitachi Ltd パタン形成材料及びそれを用いたパタン形成方法
JP3351582B2 (ja) * 1993-03-12 2002-11-25 株式会社東芝 感放射線性樹脂組成物
US5374500A (en) * 1993-04-02 1994-12-20 International Business Machines Corporation Positive photoresist composition containing photoacid generator and use thereof
JPH0792678A (ja) * 1993-06-29 1995-04-07 Nippon Zeon Co Ltd レジスト組成物
JPH0792679A (ja) * 1993-06-29 1995-04-07 Nippon Zeon Co Ltd レジスト組成物
JPH07120929A (ja) * 1993-09-01 1995-05-12 Toshiba Corp 感光性組成物
JP3297199B2 (ja) * 1993-09-14 2002-07-02 株式会社東芝 レジスト組成物
JPH07104475A (ja) * 1993-10-08 1995-04-21 Hitachi Ltd 感光性樹脂組成物
JP3271728B2 (ja) * 1994-02-14 2002-04-08 日本電信電話株式会社 ポジ型レジスト組成物
US5736296A (en) * 1994-04-25 1998-04-07 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition comprising a mixture of two polyhydroxystyrenes having different acid cleavable groups and an acid generating compound
JP2956824B2 (ja) * 1995-06-15 1999-10-04 東京応化工業株式会社 ポジ型レジスト膜形成用塗布液

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980035211A (ko) * 1996-11-12 1998-08-05 박병재 배기관 오염 경보장치
KR100573819B1 (ko) * 2001-05-31 2006-04-26 토쿄오오카코교 가부시기가이샤 감광성 적층체 및 그것을 이용한 레지스트패턴 형성방법
KR20160102754A (ko) * 2015-02-23 2016-08-31 현대중공업 주식회사 Scr 시스템의 촉매 성능진단 장치 및 방법

Also Published As

Publication number Publication date
EP0749046A1 (en) 1996-12-18
DE69608167T2 (de) 2001-01-11
TW412663B (en) 2000-11-21
KR100240184B1 (ko) 2000-01-15
EP0749046B1 (en) 2000-05-10
DE69608167D1 (de) 2000-06-15
JP3046225B2 (ja) 2000-05-29
JPH096001A (ja) 1997-01-10
US5948589A (en) 1999-09-07

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