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KR970000427A - 납땜성이 우수한 무연땜납 - Google Patents

납땜성이 우수한 무연땜납 Download PDF

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Publication number
KR970000427A
KR970000427A KR1019950019010A KR19950019010A KR970000427A KR 970000427 A KR970000427 A KR 970000427A KR 1019950019010 A KR1019950019010 A KR 1019950019010A KR 19950019010 A KR19950019010 A KR 19950019010A KR 970000427 A KR970000427 A KR 970000427A
Authority
KR
South Korea
Prior art keywords
free solder
lead
excellent solderability
lead free
solderability
Prior art date
Application number
KR1019950019010A
Other languages
English (en)
Other versions
KR0168964B1 (ko
Inventor
유충식
김미연
윤덕용
Original Assignee
이형도
삼성전기 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이형도, 삼성전기 주식회사 filed Critical 이형도
Priority to KR1019950019010A priority Critical patent/KR0168964B1/ko
Priority to US08/540,694 priority patent/US5843371A/en
Priority to SG1995002014A priority patent/SG46159A1/en
Priority to JP7352387A priority patent/JP2665328B2/ja
Publication of KR970000427A publication Critical patent/KR970000427A/ko
Application granted granted Critical
Publication of KR0168964B1 publication Critical patent/KR0168964B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본발명의 목적은 전자부품의 전자기기 배선용으로 사용되는 무연땜납을 제공함에 있다.
본발명은 그 조성이 중량％로, Ag;3-4％, In:2-5％, Bi:6-14％ 및 잔부 Sn 으로 조성되는 납땜성이 우수한 무연땜납에 관한 것을 그 기술적 요지로 한다.

Description

납땜성이 우수한 무연땜납
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래재와 본발명재에 대한 납땜특성을 나타낸 그래프, 제2도는 본발명에 의한 무연땜납의 미세조직사진. 제3도는 종래재와 본발명재에 대한 기계적 특성을 나타낸 그래프

Claims (4)

  1. 중량비로, Ag;3-4％, In:2-5％, Bi:6-14％ 및 잔부 Sn 으로 조성되는 납땜성이 우수한 무연땜납
  2. 제1항에 있어서, 상기 무연땜납의 조성이 중량비로, Ag;3-4％, In:2-3％, Bi:6-7％ 및 잔부 Sn으로 이루어지는 무연땜납
  3. 제1항에 있어서, 상기 무연땜납의 조성이 중량비로, Ag;3-4％, In:4-5％, Bi:7-10％ 및 잔부 Sn으로 이루어지는 무연땜납
  4. 고상선 온도가 202-213℃이고, 액상선 온도가 187-199℃이며, Ag, In, Bi, 및 Sn을 포함하여 구성됨을 특징으로 하는 납땜성이 우수한 무연땜납
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950019010A 1995-06-30 1995-06-30 납땜성이 우수한 무연땜납 KR0168964B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950019010A KR0168964B1 (ko) 1995-06-30 1995-06-30 납땜성이 우수한 무연땜납
US08/540,694 US5843371A (en) 1995-06-30 1995-10-11 Lead-free soldering material having superior solderability
SG1995002014A SG46159A1 (en) 1995-06-30 1995-12-04 Universal lead-free soldering material
JP7352387A JP2665328B2 (ja) 1995-06-30 1995-12-28 半田付け性が優れた無鉛半田

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950019010A KR0168964B1 (ko) 1995-06-30 1995-06-30 납땜성이 우수한 무연땜납

Publications (2)

Publication Number Publication Date
KR970000427A true KR970000427A (ko) 1997-01-21
KR0168964B1 KR0168964B1 (ko) 1999-01-15

Family

ID=19419406

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019010A KR0168964B1 (ko) 1995-06-30 1995-06-30 납땜성이 우수한 무연땜납

Country Status (4)

Country Link
US (1) US5843371A (ko)
JP (1) JP2665328B2 (ko)
KR (1) KR0168964B1 (ko)
SG (1) SG46159A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328242B1 (ko) * 1997-11-27 2002-04-17 이형도 고온용무연땜납

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184475B1 (en) * 1994-09-29 2001-02-06 Fujitsu Limited Lead-free solder composition with Bi, In and Sn
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
JP2001071174A (ja) * 1999-09-07 2001-03-21 Mitsui Mining & Smelting Co Ltd 錫−銀系ハンダ合金
US6433425B1 (en) 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US6837947B2 (en) 2002-01-15 2005-01-04 National Cheng-Kung University Lead-free solder
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US6917113B2 (en) * 2003-04-24 2005-07-12 International Business Machines Corporatiion Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly
JP4453473B2 (ja) * 2003-10-10 2010-04-21 パナソニック株式会社 鉛フリーはんだ合金と、それを用いたはんだ材料及びはんだ接合部
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070231594A1 (en) * 2005-08-12 2007-10-04 John Pereira Multilayer solder article
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
WO2009013210A1 (en) * 2007-07-23 2009-01-29 Henkel Limited Solder flux
CN103203563A (zh) * 2013-04-08 2013-07-17 上海大学 纳米TiO2颗粒强化复合无铅焊料
CN104690442A (zh) * 2015-03-17 2015-06-10 湖南新瑞化工有限公司 一种低熔点无铅焊料合金及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
TW251249B (ko) * 1993-04-30 1995-07-11 At & T Corp
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328242B1 (ko) * 1997-11-27 2002-04-17 이형도 고온용무연땜납

Also Published As

Publication number Publication date
JP2665328B2 (ja) 1997-10-22
KR0168964B1 (ko) 1999-01-15
JPH0919793A (ja) 1997-01-21
SG46159A1 (en) 1998-02-20
US5843371A (en) 1998-12-01

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