KR960039132A - 씨브이디장치의 가열장치 - Google Patents
씨브이디장치의 가열장치 Download PDFInfo
- Publication number
- KR960039132A KR960039132A KR1019960012585A KR19960012585A KR960039132A KR 960039132 A KR960039132 A KR 960039132A KR 1019960012585 A KR1019960012585 A KR 1019960012585A KR 19960012585 A KR19960012585 A KR 19960012585A KR 960039132 A KR960039132 A KR 960039132A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- heating
- cvd apparatus
- purge gas
- ceramic heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract 16
- 239000007789 gas Substances 0.000 claims abstract 9
- 238000010926 purge Methods 0.000 claims abstract 9
- 239000000919 ceramic Substances 0.000 claims abstract 8
- 239000012495 reaction gas Substances 0.000 claims abstract 4
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 230000001681 protective effect Effects 0.000 claims 1
- 239000003870 refractory metal Substances 0.000 claims 1
Classifications
-
- H01L21/205—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
- C23C16/45521—Inert gas curtains the gas, other than thermal contact gas, being introduced the rear of the substrate to flow around its periphery
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Resistance Heating (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (9)
- 반응용기내에 설치한 기판지지수단의 위에 기판에 대하여 반응가스공급수단에서 공급된 반응가스를 공급함으로써 상기 기판의 위에 성막을 행하는 동시에, 상기 기판의 외주에지의 가까이에 배치되는 링부를 포함하는 실드기구를 상기 기판지지수단의 주위에 설치함으로써 퍼지가스공급로를 형성하고, 상기 성막시에, 상기 기판과 상기 링부와의 사이의 간극으로부터 상기 퍼지가스공급로에서 공급되는 퍼지가스를 분출하도록 한 CVD장치에 있어서, 상기 퍼지가스공급로내에 있어서의 상기 기판지지수단에 근접한 곳에, 상기 기판 지지수단에 비접촉상태로 발열체를 배치한 것을 특징으로 하는 CVD장치의 가열장치.
- 제1항에 있어서, 상기 발열체는 세라믹히터이고, 이 세라믹히터는 상기 반응용기의 벽부에 설치된 최소한 3개의 세라믹제 지지부의 위에 고정되는 것을 특징으로 하는 CVD장치의 가열장치.
- 제2항에 있어서, 상기 세라믹히터는 평판형이고, 그 발열면은 상기 기판지지수단의 저면에 대향하도록 배치되는 것을 특징으로 하는 CVD장치의 가열장치.
- 제2항에 있어서, 상기 세라믹히터의 배선단자에 보호커버를 설치한 것을 특징으로 하는 CVD장치의 가열장치.
- 제3항에 있어서, 상기 세라믹히터의 상기 발열면은 개별로 온도제어되는 최소한 2개의 영역으로 분할되는 것을 특징으로 하는 CVD장치의 가열장치.
- 제5항에 있어서, 상기 발열면의 상기 영역은 내측영역, 중간영역, 외측영역으로 이루어지는 것을 특징으로 하는 CVD장치의 가열장치.
- 제4항에 있어서, 상기 배선단자는 고융점 금속으로 만들어지는 것을 특징으로 하는 CVD장치의 가열장치.
- 제2항에 있어서, 상기 세라믹히터의 내면위치에 반사수단이 설치되는 것을 특징으로 하는 CVD장치의 가열장치.
- 제1항에 있어서, 상기 발열체는 평판형 부재인 것을 특징으로 하는 CVD장치의 가열장치.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7129207A JPH08302474A (ja) | 1995-04-28 | 1995-04-28 | Cvd装置の加熱装置 |
JP1995-129207 | 1995-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960039132A true KR960039132A (ko) | 1996-11-21 |
KR100244954B1 KR100244954B1 (ko) | 2000-02-15 |
Family
ID=15003789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960012585A Expired - Lifetime KR100244954B1 (ko) | 1995-04-28 | 1996-04-24 | 씨브이디(cvd) 장치의 가열장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5766363A (ko) |
JP (1) | JPH08302474A (ko) |
KR (1) | KR100244954B1 (ko) |
TW (1) | TW353764B (ko) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6002109A (en) | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
JPH10135315A (ja) * | 1996-10-29 | 1998-05-22 | Tokyo Electron Ltd | 試料載置台の温度制御装置及び検査装置 |
US6189482B1 (en) | 1997-02-12 | 2001-02-20 | Applied Materials, Inc. | High temperature, high flow rate chemical vapor deposition apparatus and related methods |
US5994678A (en) * | 1997-02-12 | 1999-11-30 | Applied Materials, Inc. | Apparatus for ceramic pedestal and metal shaft assembly |
JPH113868A (ja) * | 1997-06-12 | 1999-01-06 | Nec Yamagata Ltd | ランプアニール装置およびランプアニール方法 |
US5911896A (en) * | 1997-06-25 | 1999-06-15 | Brooks Automation, Inc. | Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element |
US6296712B1 (en) * | 1997-12-02 | 2001-10-02 | Applied Materials, Inc. | Chemical vapor deposition hardware and process |
JP3477062B2 (ja) * | 1997-12-26 | 2003-12-10 | 京セラ株式会社 | ウエハ加熱装置 |
US6225601B1 (en) * | 1998-07-13 | 2001-05-01 | Applied Komatsu Technology, Inc. | Heating a substrate support in a substrate handling chamber |
JP4040814B2 (ja) * | 1998-11-30 | 2008-01-30 | 株式会社小松製作所 | 円盤状ヒータ及び温度制御装置 |
US6140624A (en) * | 1999-07-02 | 2000-10-31 | Advanced Ceramics Corporation | Pyrolytic boron nitride radiation heater |
JP2001118662A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
US6494955B1 (en) | 2000-02-15 | 2002-12-17 | Applied Materials, Inc. | Ceramic substrate support |
EP1274280A1 (en) | 2000-04-14 | 2003-01-08 | Ibiden Co., Ltd. | Ceramic heater |
US6440219B1 (en) * | 2000-06-07 | 2002-08-27 | Simplus Systems Corporation | Replaceable shielding apparatus |
KR100401042B1 (ko) * | 2000-06-26 | 2003-10-10 | 주식회사 유진테크 | 씨브이디 박막제조장치 |
JP4328009B2 (ja) * | 2000-11-30 | 2009-09-09 | 日本碍子株式会社 | 加熱装置 |
US6576572B2 (en) | 2000-12-28 | 2003-06-10 | Schott Lithotec Ag | Method of heating a substrate using a variable surface hot plate for improved bake uniformity |
JP4690368B2 (ja) * | 2000-12-28 | 2011-06-01 | 東京エレクトロン株式会社 | 基板加熱装置および基板加熱方法 |
US20030016727A1 (en) * | 2001-06-29 | 2003-01-23 | Tokyo Electron Limited | Method of and apparatus for measuring and controlling substrate holder temperature using ultrasonic tomography |
US6730175B2 (en) | 2002-01-22 | 2004-05-04 | Applied Materials, Inc. | Ceramic substrate support |
US6890596B2 (en) * | 2002-08-15 | 2005-05-10 | Micron Technology, Inc. | Deposition methods |
US6860422B2 (en) * | 2002-09-03 | 2005-03-01 | Ricoh Company, Ltd. | Method and apparatus for tracking documents in a workflow |
JP4119211B2 (ja) * | 2002-09-13 | 2008-07-16 | 日本碍子株式会社 | 加熱装置 |
US20050223984A1 (en) | 2004-04-08 | 2005-10-13 | Hee-Gyoun Lee | Chemical vapor deposition (CVD) apparatus usable in the manufacture of superconducting conductors |
US20050223983A1 (en) | 2004-04-08 | 2005-10-13 | Venkat Selvamanickam | Chemical vapor deposition (CVD) apparatus usable in the manufacture of superconducting conductors |
US7241476B2 (en) * | 2004-09-16 | 2007-07-10 | Honeywell International Inc. | Airflow masking of carbon-carbon composites for application of antioxidants |
US7387811B2 (en) * | 2004-09-21 | 2008-06-17 | Superpower, Inc. | Method for manufacturing high temperature superconducting conductors using chemical vapor deposition (CVD) |
DE102004047359B3 (de) * | 2004-09-29 | 2006-01-26 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses |
JP5317424B2 (ja) | 2007-03-28 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP5236197B2 (ja) * | 2007-03-28 | 2013-07-17 | 東京エレクトロン株式会社 | 成膜方法および成膜装置 |
US20110073039A1 (en) * | 2009-09-28 | 2011-03-31 | Ron Colvin | Semiconductor deposition system and method |
KR101205433B1 (ko) | 2010-07-28 | 2012-11-28 | 국제엘렉트릭코리아 주식회사 | 기판 서셉터 및 그것을 갖는 증착 장치 |
US10138551B2 (en) * | 2010-07-29 | 2018-11-27 | GES Associates LLC | Substrate processing apparatuses and systems |
JP5973731B2 (ja) | 2012-01-13 | 2016-08-23 | 東京エレクトロン株式会社 | プラズマ処理装置及びヒータの温度制御方法 |
US9085824B2 (en) | 2012-06-22 | 2015-07-21 | Veeco Instruments, Inc. | Control of stray radiation in a CVD chamber |
US11004663B2 (en) * | 2013-03-15 | 2021-05-11 | Applied Materials, Inc. | Chamber design for semiconductor processing |
JP6219227B2 (ja) * | 2014-05-12 | 2017-10-25 | 東京エレクトロン株式会社 | ヒータ給電機構及びステージの温度制御方法 |
KR101962859B1 (ko) * | 2017-05-18 | 2019-03-28 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP7321768B2 (ja) * | 2018-05-23 | 2023-08-07 | 信越化学工業株式会社 | 化学気相成長装置および被膜形成方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6139520A (ja) * | 1984-07-31 | 1986-02-25 | Hitachi Ltd | プラズマ処理装置 |
US4854263B1 (en) * | 1987-08-14 | 1997-06-17 | Applied Materials Inc | Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films |
US5094885A (en) * | 1990-10-12 | 1992-03-10 | Genus, Inc. | Differential pressure cvd chuck |
US5294778A (en) * | 1991-09-11 | 1994-03-15 | Lam Research Corporation | CVD platen heater system utilizing concentric electric heating elements |
JPH05223342A (ja) * | 1992-02-14 | 1993-08-31 | Toshiba Electric Appliance Co Ltd | 電気暖房器 |
JP2766433B2 (ja) * | 1992-07-23 | 1998-06-18 | 株式会社東芝 | 半導体気相成長装置 |
US5343022A (en) * | 1992-09-29 | 1994-08-30 | Advanced Ceramics Corporation | Pyrolytic boron nitride heating unit |
JP2934565B2 (ja) * | 1993-05-21 | 1999-08-16 | 三菱電機株式会社 | 半導体製造装置及び半導体製造方法 |
JP3165938B2 (ja) * | 1993-06-24 | 2001-05-14 | 東京エレクトロン株式会社 | ガス処理装置 |
US5476548A (en) * | 1994-06-20 | 1995-12-19 | Applied Materials, Inc. | Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring |
-
1995
- 1995-04-28 JP JP7129207A patent/JPH08302474A/ja active Pending
-
1996
- 1996-04-19 TW TW085104694A patent/TW353764B/zh not_active IP Right Cessation
- 1996-04-19 US US08/634,873 patent/US5766363A/en not_active Expired - Lifetime
- 1996-04-24 KR KR1019960012585A patent/KR100244954B1/ko not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW353764B (en) | 1999-03-01 |
US5766363A (en) | 1998-06-16 |
JPH08302474A (ja) | 1996-11-19 |
KR100244954B1 (ko) | 2000-02-15 |
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