[go: up one dir, main page]

KR960016670A - 평형 불평형 변환회로 - Google Patents

평형 불평형 변환회로 Download PDF

Info

Publication number
KR960016670A
KR960016670A KR1019950036951A KR19950036951A KR960016670A KR 960016670 A KR960016670 A KR 960016670A KR 1019950036951 A KR1019950036951 A KR 1019950036951A KR 19950036951 A KR19950036951 A KR 19950036951A KR 960016670 A KR960016670 A KR 960016670A
Authority
KR
South Korea
Prior art keywords
balanced
unbalanced
layer
conversion circuit
circuits
Prior art date
Application number
KR1019950036951A
Other languages
English (en)
Inventor
도오루 이즈미야마
Original Assignee
가다오까 마사다까
아루푸스 덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가다오까 마사다까, 아루푸스 덴키 가부시키가이샤 filed Critical 가다오까 마사다까
Publication of KR960016670A publication Critical patent/KR960016670A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
    • H03D9/00—Demodulation or transference of modulation of modulated electromagnetic waves
    • H03D9/06—Transference of modulation using distributed inductance and capacitance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

[구성]
다층회로기판(1)의 내층 또는 표면도체층에 프트립라인으로 평형 불평형 변환기(7a,7b)를 한 개로 형성하고 제1도체층(1a)상의 면실장 부품인 더블밸랜스 믹서(2)와 접속하였다.
[효과]
종래의 면실장 부품의 일부가 다층회로기판으로부터 제거됨으로서 다른 면실장 부품이 고밀도 실장가능하게 되고 휴대용전화 전체의 소형화, 슬림화, 경량화 또한 저가격화에 공헌한다. 또 다층기판내층의 접지도체층에 끼워진 층에 형성하기 위하여 전기적인 결합, 간섭이 적어져 성능향상이 기대된다.

Description

평형 불평형 변환회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 평형 불평형 변환기를 다층회로기판에 구성한 예를 나타낸 설명도,
제2도는 본 발명에 의한 평형 불평형 변환기의 회로도,
제3도는 본 발명에 의한 평형 불평형 변환기를 이용하여 더블밸런스믹서에 응용한 블록도.

Claims (4)

  1. 한 개 이상의 평형형 회로와, 한개 이상의 불평형형 회로와, 상기 평형형 회로와 불평형형 회로를 접속하는 평형 불평형 변환기로 이루어지고, 상기 평형형 회로 및 불평형형 회로를 다층회로기판의 가장 바깥층에 설치하고, 상기 평형 불평형 변환기를 상기 다층회로기판의 가장 바깥층 또는 내층 도체층에 마이크로 스트립라인으로 구성함과 동시에 상기 변환기가 구성된 층의 상측 또는 하측의 적어도 어느 한쪽층을 접지시킨 도체층으로 한 것을 특징으로 하는 평형 불평형 변환회로.
  2. 제1항에 있어서, 상기 평형 불평형 변환기를 복수개 구비하고 이들 변환기가 서로 다른 내층 도체층에 구성된 것을 특징으로 하는 평형 불평형 변환회로.
  3. 제2항에 있어서, 상기 내층 도체층간에 접지된 도체층을 설치한 것을 특징으로 하는 평형 불평형 변환회로.
  4. 제1항에 있어서, 상기 평형 불평형 변환회로는 평형형의 더블밸런스 믹서와 불평형형의 국부발진회로 및 밴드펄스 필터를 가지는 주파수 변환회로이고, 상기 더블밸런스 믹서와 상기 국부발진회로와의 사이 및 상기 더블밸런스 믹서와 상기 밴드펄스 필터와의 사이에 상기 평형 불평형 변환기를 구비한 것을 특징으로 하는 평형 불평형 변환회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950036951A 1994-10-26 1995-10-25 평형 불평형 변환회로 KR960016670A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-285940 1994-10-26
JP06285940A JP3136058B2 (ja) 1994-10-26 1994-10-26 平衡不平衡変換回路

Publications (1)

Publication Number Publication Date
KR960016670A true KR960016670A (ko) 1996-05-22

Family

ID=17697958

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950036951A KR960016670A (ko) 1994-10-26 1995-10-25 평형 불평형 변환회로

Country Status (3)

Country Link
US (1) US5705960A (ko)
JP (1) JP3136058B2 (ko)
KR (1) KR960016670A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100500893B1 (ko) * 2001-03-08 2005-07-14 가부시키가이샤 무라타 세이사쿠쇼 혼합기와 그것을 이용한 변환기

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3663898B2 (ja) * 1997-04-14 2005-06-22 株式会社村田製作所 高周波モジュール
US5880646A (en) * 1997-05-07 1999-03-09 Motorola, Inc. Compact balun network of doubled-back sections
US5861853A (en) * 1997-05-07 1999-01-19 Motorola, Inc. Current balanced balun network with selectable port impedances
USH1959H1 (en) 1998-09-03 2001-05-01 Anthony Kikel Single balanced to dual unbalanced transformer
JP2000307452A (ja) * 1999-02-16 2000-11-02 Murata Mfg Co Ltd 高周波複合部品及びそれを用いた携帯無線機
US6675005B2 (en) 1999-03-25 2004-01-06 Zenith Electronics Corporation Printed single balanced downconverter mixer
JP2001185951A (ja) * 1999-12-24 2001-07-06 Murata Mfg Co Ltd 電圧制御発振器および通信装置
WO2002037709A1 (fr) * 2000-11-01 2002-05-10 Hitachi Metals, Ltd. Module de commutation
JP2003087008A (ja) * 2001-07-02 2003-03-20 Ngk Insulators Ltd 積層型誘電体フィルタ
US6803835B2 (en) * 2001-08-30 2004-10-12 Agilent Technologies, Inc. Integrated filter balun
JP2005184245A (ja) * 2003-12-17 2005-07-07 Mitsumi Electric Co Ltd 結合装置及び高周波モジュール
WO2006003959A1 (ja) * 2004-06-30 2006-01-12 Hitachi Metals, Ltd. 高周波回路、高周波部品及びマルチバンド通信装置
US7489872B2 (en) * 2004-09-24 2009-02-10 National Central University Optical fiber system and method for carrying both CATV and Ethernet signals
KR100576883B1 (ko) * 2004-12-30 2006-05-10 삼성전기주식회사 발룬 및 안테나 일체형 발룬 패키지
EP3422465B1 (en) * 2016-02-24 2020-12-23 NEC Space Technologies, Ltd. Hybrid circuit, power supply circuit, antenna device, and power supply method
JP7130444B2 (ja) * 2018-06-05 2022-09-05 矢崎総業株式会社 アンテナユニット

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758922A (en) * 1986-11-14 1988-07-19 Matsushita Electric Industrial Co., Ltd. High frequency circuit having a microstrip resonance element
US4949398A (en) * 1988-06-09 1990-08-14 The Aerospace Corporation GaAs MESFET balanced resistive mixer
DE69318879T2 (de) * 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Keramisches Mehrschicht-Substrat für hohe Frequenzen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100500893B1 (ko) * 2001-03-08 2005-07-14 가부시키가이샤 무라타 세이사쿠쇼 혼합기와 그것을 이용한 변환기

Also Published As

Publication number Publication date
JP3136058B2 (ja) 2001-02-19
US5705960A (en) 1998-01-06
JPH08125413A (ja) 1996-05-17

Similar Documents

Publication Publication Date Title
KR960016670A (ko) 평형 불평형 변환회로
US7164306B2 (en) Composite multiplexer circuit and chip component, high-frequency module and radio communication apparatus using the same
US5719750A (en) Multilayer printed wiring board with plurality of ground layers forming separate ground planes
KR950030325A (ko) 반도체 패키지
JPH07273502A (ja) ローパスフィルタ
KR970060575A (ko) 복합 고주파 부품
EP0784384A4 (en) ANTENNA SWITCH
KR910002107A (ko) 주파수 특성 보정회로
EP1096662B1 (en) Oscillator attachment structure preventing interference by beat signal
KR970024540A (ko) 음향 표면파장치
CA2145622A1 (en) Quadrature Modulator Operable in Quasi-Microwave Band of Digital Communication System
JP2000138425A (ja) 接続配線構造
JPH088573A (ja) シールドケース構造
JPH0738301A (ja) ストリップ線路の交差回路
KR920001823A (ko) 주파수 혼합 평형 변조기
KR100268666B1 (ko) 방사노이즈의제거를위한인쇄회로기판및그구조방법
JPS6424636A (en) Microwave converter
JPH07109946B2 (ja) プリント配線板
JPH04192904A (ja) 高周波発振装置
JP2005175638A (ja) 分波器
JPH07142871A (ja) プリント基板
JPH0220111A (ja) 分波器
JP2001196855A (ja) 電圧制御発振器
SU824453A1 (ru) Балансный смеситель
JP2001257529A (ja) 発振器

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19951025

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19951025

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19981117

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19990224

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19981117

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I