KR950008846B1 - Amorphous silicon deposition apparatus using micro wave - Google Patents
Amorphous silicon deposition apparatus using micro wave Download PDFInfo
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- KR950008846B1 KR950008846B1 KR1019920007478A KR920007478A KR950008846B1 KR 950008846 B1 KR950008846 B1 KR 950008846B1 KR 1019920007478 A KR1019920007478 A KR 1019920007478A KR 920007478 A KR920007478 A KR 920007478A KR 950008846 B1 KR950008846 B1 KR 950008846B1
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Abstract
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Description
첨부한 도면은 본 발명에 의한 비정질 실리콘 증착장치의 구성도.The accompanying drawings are schematic diagrams of an amorphous silicon deposition apparatus according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 진공챔버 2 : 수은램프1: vacuum chamber 2: mercury lamp
3 : 마이크로 웨이브 발생기 4,7,9 : 밸브3: microwave generator 4,7,9: valve
5,8 : 로터리 펌프 6 : 터보펌프5,8: rotary pump 6: turbo pump
본 발명은 비정질 실리콘 증착장치에 관한 것으로, 특히 광 화학증착(photo-CVD : photo-Chemical Vapor Deposition)시 마이크로 웨이브를 이용하여 증착율을 향상시키도록 한 마이크로 웨이브를 이용한 비정질 실리콘 증착장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an amorphous silicon deposition apparatus, and more particularly, to an amorphous silicon deposition apparatus using microwaves to improve deposition rate using microwaves during photo-CVD (photo-chemical vapor deposition).
종래의 광 화학증착방법, 즉 빛이 가지는 에너지(energy)를 이용하여 SiH4, SiH6등의 가스상 결합(gas phase bonding)을 래디컬(radical) 상태로 분해하여 증착시키는 방법은 R.F(Radio Frequence)를 이용하는 플라즈마 증착법(plasma-CVD)에 비해서 SiH4등의 가스 상 본딩을 분해하는 에너지가 작아서 서브스트레이트(substrate)에서의 증착율이 현저히 작다.Conventional photochemical deposition method, that is, a method of dissolving and depositing gas phase bonding such as SiH 4 , SiH 6 into a radical state by using energy of light (Radio Frequence) Compared to the plasma deposition method using plasma-CVD, the energy for decomposing gas phase bonding such as SiH 4 is small, and the deposition rate in the substrate is significantly smaller.
즉, 10-6Torr 정도의 진공도를 가진 쳄버 내에서 SiH4, SiH6S2H6, PH3등의 가스 분산상을 이루게 되면 Si-H 결합, 또 B-H 결합 등이 가지는 결합에너지 이상의 에너지가 전달되어 분산상에서의 분자들이 분해되어 Si-Si 등의 동일 원자간의 결합이 형성되어 비정질 실리콘 성막이 이루어지게 되는데 광 화학증착의 경우에는 광 에너지(photo energy)를 이용한다.That is, when a gas dispersed phase such as SiH 4 , SiH 6 S 2 H 6 , or PH 3 is formed in a chamber having a vacuum degree of about 10- 6 Torr, energy above the binding energy of Si-H bonds and BH bonds is transferred. As a result, molecules in the dispersed phase are decomposed to form bonds between the same atoms, such as Si-Si, to form amorphous silicon. In the case of photochemical deposition, photo energy is used.
기존의 광 화학증착법은 진공챔버 내에 인가되는 광 에너지를 수은 램프(mercury lamp)를 이용하여 발생시켜 광 화학증착을 수행하며, 이때 증착율은 10∼20/H 정도이다.Conventional photochemical deposition method generates photochemical deposition by using a mercury lamp to generate the light energy applied in the vacuum chamber, the deposition rate is 10 ~ 20 / H or so.
이에 비하여 플라즈마 화학증착의 경우에는 수천∼1μ/H의 증착율을 가진다. 따라서 기존의 광 화학증착을 이용하는 경우에는 증착 두께가 작은 영역에서만 적용이 가능하다.On the other hand, in the case of plasma chemical vapor deposition, it has a deposition rate of several thousand to 1 mu / H. Therefore, in the case of using conventional photochemical vapor deposition, it can be applied only in the region where the deposition thickness is small.
다시 말하면, 화학증착에 있어서 SiH4분해의 경우에는 Si와 H와의 결합을 끊어서 Si-Si 결합으로 재결합하는 기구(mechanism)와 일차결합(primary bond)에서 떨어져 나간 H가 또 다른 SiH4가스 상의 수소를 떼어내는(즉, 수소끼리의 충돌을 유발하는) 이차기구(secondary mechanism)로 대별될 수 있는 바, 광화학증착 공정에서 수은 램프에서의 광 에너지가 일차 반응(priamry reaction) 즉, SiH4분자에서 H를 떼어내는 활동력(diriving force) 역할을 하게 된다. 그런데 그러한 광 에너지가 미약하여서 진공 쳄버(cahmber) 내에 존재하는 SiH4상의 5%(vol. percent) 이하의 분해만이 가능하게 된다.In other words, in the case of SiH 4 decomposition in chemical vapor deposition, H separated from the primary bond and the mechanism of breaking the bond between Si and H and recombining into the Si-Si bond are hydrogen in another SiH 4 gas. In the photochemical deposition process, the light energy in the mercury lamp is the primary reaction, i.e., in the SiH 4 molecule. It acts as a dividing force to release H. However, such light energy is so weak that only decomposition of 5% (vol. Percent) or less of the SiH 4 phase present in the vacuum chamber is possible.
따라서, 종래의 광 화학증착법은 광에너지가 가지는 저 에너지로 인하여 비정질 실리콘층의 증착시간이 과도하게 요구되므로 생산성이 저하되는 결함이 있었다.Therefore, the conventional photochemical deposition method has a defect in that productivity is lowered because the deposition time of the amorphous silicon layer is excessively required due to the low energy of the light energy.
본 발명은 상기한 바와 같은 종래 기술의 결함을 해소하기 위한 것으로, 광화학증착시 가스 상 분해를 촉진시켜 비정질 실리콘의 증착율을 향상하도록 한 것이며, 이러한 본 발명의 마이크로 웨이브를 이용한 비정질 실리콘 증착장치는 화학증착법으로 비정질 실리콘을 증착함에 있어서, 진공쳄버에 고주파를 가하면서 비정질 실리콘을 증착하는 것을 특징으로 하고 있다.The present invention is to solve the defects of the prior art as described above, to promote the gas phase decomposition during photochemical deposition to improve the deposition rate of amorphous silicon, such an amorphous silicon deposition apparatus using a microwave of the present invention is a chemical In the deposition of amorphous silicon by the vapor deposition method, the amorphous silicon is deposited while applying a high frequency to the vacuum chamber.
첨부한 도면은 본 발명이 적용되는 광 화학증착 장치의 구성을 보인 것으로 이에 도시한 바와 같이,진공챔버 상부에는 진공챔버 내의 가스에 광에너지를 인가하여 광화학 반응을 일으키는 수은램프(2)가 설치되고, 진공쳄버의 저부에는 로타리 펌프(5,8) 및 터브 펌프(6)가 연결되어 있는데 이 펌프들에 의해 진공챔퍼내로 가스들이 유입되게 된다. 상기 챔버 내로 유입되는 가스는 밸브(4,7,9)에 의해 그 양이 조절된다. 그리고 진공챔버 측면에는 상기 수은 램프에 의한 광에너지를 보완하기 위해 챔버내에 고주파를 인가하는 마이크로 웨이브 발생기(3)가 설치된다.The accompanying drawings show a configuration of an optical chemical vapor deposition apparatus to which the present invention is applied. As shown in the drawing, a mercury lamp 2 is installed on the upper part of the vacuum chamber to generate photochemical reactions by applying light energy to a gas in the vacuum chamber. At the bottom of the vacuum chamber, rotary pumps 5 and 8 and tub pumps 6 are connected, and gases are introduced into the vacuum chamber by these pumps. The amount of gas introduced into the chamber is controlled by the valves 4, 7 and 9. And the side of the vacuum chamber is provided with a microwave generator 3 for applying a high frequency in the chamber to supplement the light energy by the mercury lamp.
이러한 장치를 이용하여 비정질 실리콘을 증착하게 되면 SiH4분해 기구에서의 일차반응을 촉진시킬 수 있다. 즉 마이크로 웨이브가 SiH4결합을 효과적으로 분리할 수 있으며, 이차충돌(secondary collision)을 더 촉진시켜서 SiH4가스 분해율을 단위시간당 약 30∼40%(vol.percent)로 증가시킴으로써 광 화학증착 공정에서의 비정질 실리콘 증착율을 증가시킬 수 있다.The deposition of amorphous silicon using such a device can facilitate the first reaction in the SiH 4 decomposition mechanism. That is, microwaves can effectively separate the SiH 4 bonds and further promote secondary collisions to increase the SiH 4 gas decomposition rate to about 30 to 40% (vol. Percent) per unit time. It is possible to increase the amorphous silicon deposition rate.
다시 말하면 본 발명은 광 화학증착에서의 활동력(driving force)을 마이크로 웨이브를 인가하여 촉진시키므로써 SiH4와 SiH4, 또는 PH3와 PH3등의 분자충돌(molecude)과 떨어져 나간 H가 다른 분자의 수소를 쳐내는 반응이 증가하여 분자상의 가스들의 분해가 빨리 이루어져 비정질 실리콘의 증착율을 향상할 수 있게 되는 것이다.In other words, the present invention promotes the driving force in photochemical vapor deposition by applying microwaves, and thus the H molecules separated from the molecular collisions such as SiH 4 and SiH 4 , or PH 3 and PH 3 are separated from other molecules. The reaction to squeeze out of hydrogen is increased, so that the decomposition of molecular gases is accelerated, thereby improving the deposition rate of amorphous silicon.
이상에서 설명한 바와 같이 본 발명은 광 화학증착에서의 증착율을 증가시킬 수 있기 때문에 생산성이 향상되는 이점이 있으며, 이러한 본 발명은 솔라 셀(sola cell), 이미지 센서(image sensor), TFT LCD, PSD와 같은 소자의 제조에 매우 유리하게 이용할 수 있다.As described above, the present invention has an advantage of improving productivity because it can increase the deposition rate in photochemical deposition, and the present invention provides a solar cell, an image sensor, a TFT LCD, and a PSD. It can be used very advantageously in the manufacture of such devices.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920007478A KR950008846B1 (en) | 1992-05-01 | 1992-05-01 | Amorphous silicon deposition apparatus using micro wave |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920007478A KR950008846B1 (en) | 1992-05-01 | 1992-05-01 | Amorphous silicon deposition apparatus using micro wave |
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| Publication Number | Publication Date |
|---|---|
| KR930024085A KR930024085A (en) | 1993-12-21 |
| KR950008846B1 true KR950008846B1 (en) | 1995-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1019920007478A Expired - Fee Related KR950008846B1 (en) | 1992-05-01 | 1992-05-01 | Amorphous silicon deposition apparatus using micro wave |
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