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KR930019797A - 아크릴 접착제 조성물 및 유기붕소 개시제시스템 - Google Patents

아크릴 접착제 조성물 및 유기붕소 개시제시스템 Download PDF

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KR930019797A
KR930019797A KR1019930003694A KR930003694A KR930019797A KR 930019797 A KR930019797 A KR 930019797A KR 1019930003694 A KR1019930003694 A KR 1019930003694A KR 930003694 A KR930003694 A KR 930003694A KR 930019797 A KR930019797 A KR 930019797A
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carbon atoms
alkyl
aldehyde
hydrogen
group
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KR1019930003694A
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KR960008486B1 (en
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엠. 스쿨치 마틴
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데이비드 엘. 해밀톤
내쇼날 스타치 앤드 케미칼 인베스트 홀딩 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/42—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/52—Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides selected from boron, aluminium, gallium, indium, thallium or rare earths
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/939—Multipackage system
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerization Catalysts (AREA)

Abstract

본 발명은 아크릴접착제 조설물에 유용한 2요소 개시제시스템에 관한 것이며, 제1요소는 안정화된 유기붕소아민착물로 이루어지고, 제2요소는 알데히드 불안정화제 또는 활성화제로 이루어진다. 본 개시제는 엘라스토머 아크릴접착제 조성물에 특히 유용하며, 실온에서 우수한 접착특성으로 비교적 느린 경화시스템을 제공하므로, 보다 긴 개방시간이 요구되는 응용분야에 유용하다.

Description

아크릴 접착제 조성물 및 유기붕소 개시제시스템.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. A)다음식
    으로 이루어지는 안정화된 유기붕소 아민착물(식중, R, R1 ,R2는 탄소원자수 1~10의 알킬 또는 페닐이고, R3, R4는 수소 또는 탄소원자수 1~10의 알킬, 또는
    또는
    여기서, R5, R6은 수소 또는 탄소원자수 1~10의 알킬, m은 2~10, n은 1~6)과, B)다음식 r-(CHO)x으로 이루어지는 불안정화 유효향의 알데히드 활성화제(식중, R은 탄소원자수 1~10의 일킬 또는 탄소원자수 6~10의 아릴이고, x는 1~2)로 이루어지는 2요소 개시제 조성물.
  2. 제1항에 있어서, 유기붕소 아민착물에 있어서 R, R1 ,R2는 탄소원자수 1~4의 알킬이고, R3, R4,R5는 수소 또는 탄소원자수 1~4의 알킬이고, R6은 수소이고, m은 2~6, n은 1~2이고, B)부분의 알데히드의 R기는 탄소원자수 1~4의 알킬기 또는 탄소원자수 6~8의 아릴이고, x는 1인 2요소 개시제 조성물.
  3. 제2항에 있어서, 알데히드의 R기는 아릴기이고, 알대히드 대아민착물은 중량부로 0.5 : 1 내지 20 : 1로 사용되고, B)부분은 또한 식 R-OOH(식중, R은 수소, 탄소원자수 1~10의 알킬 또는 탄소원자수6~14의 아릴 또는 알카릴)의 히드로페록시 화합물을 포함하는 2요소 개시제 조성물.
  4. 제3항에 있어서, 착물은 트리에틸 붕소와 에틸렌 디아민 또는 프로필렌 디아민의 조합물인 2요소 개시제 조성물.
  5. 제1요소는 중합가능한 아크릴모노머와, 다음식
    으로 이루어지는 유효량의 안정화된 유기붕소 아민착물개시제(식중, R, R1,R2는 탄소원자수 1~10의 알킬 또는 페닐이고, R3, R4는 수소 또는 탄소원자수 1~10의 알킬또는
    또는
    여기서, r5, r6은 수소 또는 탄소원자수 1~10의 알킬, m은 2~10, n은 1~6)로 이루어지고, 제2요소는 다음식 r-(cho)x으로 이루어지는 불안정화 유효량의 유기알데히드(식중, r은 탄소원자수 1~10의 알킬 또는 탄소 원자수 6~10의 아릴이고, x는 1~2)로 이루어지는 경화가능한 2요소 접착제 조성물.
  6. 제5항에 있어서, 유기붕소 아민착물에 있어서 R, R1,R2는 탄소원자수 1~4의 알킬이고, R3, R4,R5는 수소 또는 탄소원자수 1~4의 알킬이고, R6은 수소이고, m은 2~6, n은 1~2이고, 알데히드 활성제의 R기는 탄소원자수 1~4의 알킬기 또는 탄소원자수 6~8의 아릴기이고, x는 1인 2요소 접착제 조성물.
  7. 제6항에 있어서, 알데히드의 R기는 아릴기이고, 알데히드 대아민착물은 중량부로 0.5 : 1 내지 20 : 1로 사용되고, 제2요소는 또한 식 R-OOH(식중, R은 수소, 탄소원자수 6~14의 아릴 또는 알카릴)의 히드로페록시 화합물을 포함하는 2요소 접착제 조성물.
  8. 제5항에 있어서, 아크릴모노머를 함유하는 조성물의 제1요소는 또한 고무폴리머를 포함하고, 알데히드 활성화재를 함유하는 제2요소는 또한 고무폴리머가 용해된 중합가능한 아크릴모노머를 포함하고, 조성물의 총중량을 기준으로 유기붕소 아민착물은 0.1~5중량%, 알대히드 활성화제는 0.5~10.0중량%로 사용되는 2요소 접착제 조성물.
  9. 제8항에 있어서, 조성물의 총중량을 기준으로 아클리모노머는 10~90중량%, 고무폴리머는 5~80중량%로 사용되고, 아크릴모노머는 알킬 아크릴레이트 또는 메타크릴레이트이고, 고무폴리머는 폴리부타디엔, 폴리이소프렌 폴리이소부틸렌, 스티렌/부타디엔/스티렌, 스티렌/이소프렌/스티렌, 부타디엔/스티렌, 부타디엔/아클리로니트릴 및 부타디엔/알킬 아크릴레이트의 폴리머, 코폴리머, 블록, 그라프트 또는 랜덤 코폴리머이고, 제2요소는 또한 식 R-OOH(식중, R은 수소, 탄소원자수 1~10의 알킬 또는 탄소원자수 6~14의 아릴 또는 알키릴)의 히드로페록시 화합물을 포함하는 2요소 접착제 조성물.
  10. 제5항 내지 제9항중 어느 한항의 경화가능한 접착제 조성물을 대향하는 표면사이에 삽입하고, 상기 표면을 서로 인접한 관계로 배치하고, 접착제를 경화시키는 단계로 이루어지는 대향표면의 접착방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR93003694A 1992-03-17 1993-03-12 A crylic adhesive composition and organoboron initiator system KR960008486B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US852,855 1992-03-17
US07/852,855 US5286821A (en) 1992-03-17 1992-03-17 Acrylic adhesive composition and organoboron initiator system

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KR930019797A true KR930019797A (ko) 1993-10-19
KR960008486B1 KR960008486B1 (en) 1996-06-26

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US (2) US5286821A (ko)
EP (1) EP0561352A1 (ko)
JP (1) JPH07116249B2 (ko)
KR (1) KR960008486B1 (ko)
AU (1) AU649582B2 (ko)
CA (1) CA2091701A1 (ko)

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US5376746A (en) 1994-12-27
CA2091701A1 (en) 1993-09-18
US5286821A (en) 1994-02-15
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