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KR927003885A - 비전도체의 금속화 방법 - Google Patents

비전도체의 금속화 방법 Download PDF

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Publication number
KR927003885A
KR927003885A KR1019920701251A KR920701251A KR927003885A KR 927003885 A KR927003885 A KR 927003885A KR 1019920701251 A KR1019920701251 A KR 1019920701251A KR 920701251 A KR920701251 A KR 920701251A KR 927003885 A KR927003885 A KR 927003885A
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KR
South Korea
Prior art keywords
conductor
conductive
process according
solution
deposited
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KR1019920701251A
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English (en)
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KR950010242B1 (ko
Inventor
말코브 하르트무트
브레셀 부르크하르트
Original Assignee
한스-위르겐 쉰헤르
쉐링 아크티엔젤샤프트
페터 혹스
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Publication of KR927003885A publication Critical patent/KR927003885A/ko
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Publication of KR950010242B1 publication Critical patent/KR950010242B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Cylinder Crankcases Of Internal Combustion Engines (AREA)
  • Valve-Gear Or Valve Arrangements (AREA)

Abstract

내용 없음

Description

비전도체의 금속화 방법
[도면의 간단한 설명]
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (15)

  1. 5원 헤테로사이클의 초기의 비전도성 올리고머수용액(가능한한 가용화제를 함유함)으로부터 강한 접착성의 불용성 중합체성 생성물을 비전도체상에 흡착된 산화제와 접촉시켜 1단계 공정으로 비전도체 표면상에 침착시킴에 의해 이들 중합체성 생성물의 전기 전도도가 전기 욕조중에서 전류를 적용시키는 경우 금속이 중합체 표면상에 침착되도록 하기에 충분하게 됨을 특징으로 하는 비전도체의 직접 금속화 방법.
  2. 5원 헤테로사이클의 초기의 비전도성 각종 단량체 또는 단량체 혼합물의 수용액(가능한한 가용화제를 함유함)으로부터의 강한 접착성의 불용성 중합체성 생성물을, 비전도체상에 흡착된 산화제와 접촉시켜 1단계 공정으로 비전도체 표면상에 침착시킴에 의해 이들 중합체성 생성물의 전기 전도도가 전기 욕조중에서 전류를 적용시키는 경우 금속이 중합체표면상에 침착되도록 하기에 충분하게 됨을 특징으로 하는 비전도체의 직접 금속화 방법.
  3. 5원 헤테로사이클의 초기의 비전도성 올리고머 단량체 혼합물의 수용액(가능한한 가용화제를 함유함)으로부터의 강한 접착성의 불용성 중합체성 생성물을, 비전도체상에 흡착된 산화제와 접촉시켜 1단계 공정으로 비전도체 표면상에 침착시킴에 의해 이들 중합체성 생성물의 전기 전도도가 전기 욕조중에서 전류를 적용시키는 경우 금속이 중합체표면상에 침착되도록 하기에 충분하게 됨을 특징으로 하는 비전도체의 직접 금속화 방법.
  4. 제1항 또는 3항에 있어서, 5원 헤테로사이클 그룹으로부터의 수용성 올리고머의 생성이, 단량체 및 약산의 용액으로 부터 가능한한 용액의 빙점 미만의 저온에서 진행되는 방법.
  5. 제1항 내지 4항중 어느 한 항에 있어서, 헤테로사이클로서 푸란, 피롤, 티오펜 또는 이의 치환된 유도체를 사용함을 특징으로 하는 방법.
  6. 제1항 내지 5항중 어느 한 항에 있어서, 올리고머, 단량체 또는 이의 혼합물의 농도가 0.1 내지 200g/l인 방법.
  7. 제1항 내지 제4항중 어느 한 항에 있어서, 수용액중에서 양성자에 대한 해리상수가 0.1 내지 0.01인 산 또는 산성염을 사용함을 특징으로하는 방법.
  8. 제1항 내지 제3항중 어느 한 항에 있어서, 흡착된 산화제가, 바람직하게는 과망간산염과 비전도체의 반응을 통해 생성된 이산화망간(피롤루자이트)인 방법.
  9. 제1항 내지 제3항중 어느 한 항에 있어서, 바람직하게는 산성 전기구리 욕조를 사용함을 특징으로 하는 방법.
  10. 제1항 내지 제4항중 어느 한 항에 있어서, 가용화제로서 강한 극성 유기 용매를 사용함을 특징으로 하는 방법.
  11. 제1항 내지 제9항중 어느 한 항에 있어서, 주로 인쇄 회로판내비전도성 보오호울(borehole)의 벽을 금속화시킴을 특징으로 하는 방법.
  12. 제11항에 있어서, 인쇄 회로판을 제조(예:광프린트에 의해)한 다음 전도성 중합체 필름을 형성시킨후 전기 금속화를 수행함으로써, 전도성 중합체 필름이 전기금속화직전에 산 및/또는 산화제를 함유하는 하나의 용액으로 처리되는 방법.
  13. 제1항 내지 제9항중 어느 한 항에 있어서, 비전도체의 표면을 금속화시킴을 특징으로 하는 방법.
  14. 제1항 내지 제9항중 어느 한 항에 있어서, 공정을 위해 액침 및/또는 분무 기술로 수행함을 특징으로 하는 방법.
  15. 제1항 내지 제9항중 어느 한 항에 있어서, 공정을 위해 수명, 연속적 통과를 사용함을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920701251A 1989-11-28 1990-11-27 비전도체의 금속화 방법 KR950010242B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEP3939676.2 1989-11-28
DE3939676A DE3939676C2 (de) 1989-11-28 1989-11-28 Metallisierung von Nichtleitern
PCT/DE1990/000920 WO1991008324A1 (de) 1989-11-28 1990-11-27 Metallisierung von nichtleitern

Publications (2)

Publication Number Publication Date
KR927003885A true KR927003885A (ko) 1992-12-18
KR950010242B1 KR950010242B1 (ko) 1995-09-12

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KR1019920701251A KR950010242B1 (ko) 1989-11-28 1990-11-27 비전도체의 금속화 방법

Country Status (8)

Country Link
EP (1) EP0502023B1 (ko)
JP (1) JP2746748B2 (ko)
KR (1) KR950010242B1 (ko)
AT (1) ATE188752T1 (ko)
CA (1) CA2069865C (ko)
DE (3) DE3939676C2 (ko)
ES (1) ES2141082T3 (ko)
WO (1) WO1991008324A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3939676C2 (de) * 1989-11-28 1994-01-27 Schering Ag Metallisierung von Nichtleitern
GB2243838A (en) * 1990-05-09 1991-11-13 Learonal Process for metallising a through-hole printed circuit board by electroplating
DE4138771A1 (de) * 1991-11-26 1993-05-27 Daimler Benz Ag Verfahren zur bildung elektrisch leitender schichten auf kunststoffoberflaechen
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
DE4227836C2 (de) * 1992-08-20 1997-09-25 Atotech Deutschland Gmbh Verfahren zur Metallisierung von Nichtleitern
DE4412463C3 (de) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung
DE19527056C1 (de) * 1995-07-25 1996-11-28 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer)
DE19740431C1 (de) * 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats
FR2776211B1 (fr) * 1998-03-19 2000-07-13 Scps Structures poreuses complexes epaisses rendues electriquement conductrices, et procede d'activation conductrice correspondant
US6182791B1 (en) 1998-06-19 2001-02-06 James L. Cope Adjustable scaffolding and lift carriage and support member therefor
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen

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DE3931003A1 (de) * 1989-09-14 1991-03-28 Schering Ag Verfahren zur direkten metallisierung von leiterplatten
DE3939676C2 (de) * 1989-11-28 1994-01-27 Schering Ag Metallisierung von Nichtleitern

Also Published As

Publication number Publication date
DE3939676C2 (de) 1994-01-27
JPH05502270A (ja) 1993-04-22
CA2069865C (en) 2000-01-11
DE59010892D1 (de) 2000-02-17
DE3939676A1 (de) 1991-05-29
DE9017668U1 (de) 1991-08-14
KR950010242B1 (ko) 1995-09-12
JP2746748B2 (ja) 1998-05-06
EP0502023B1 (de) 2000-01-12
ES2141082T3 (es) 2000-03-16
ATE188752T1 (de) 2000-01-15
WO1991008324A1 (de) 1991-06-13
EP0502023A1 (de) 1992-09-09

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