KR920000221B1 - 저유전율 복합재료 - Google Patents
저유전율 복합재료 Download PDFInfo
- Publication number
- KR920000221B1 KR920000221B1 KR1019880005212A KR880005212A KR920000221B1 KR 920000221 B1 KR920000221 B1 KR 920000221B1 KR 1019880005212 A KR1019880005212 A KR 1019880005212A KR 880005212 A KR880005212 A KR 880005212A KR 920000221 B1 KR920000221 B1 KR 920000221B1
- Authority
- KR
- South Korea
- Prior art keywords
- microspheres
- dielectric constant
- ptfe
- composite material
- low dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
- H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Moulding By Coating Moulds (AREA)
- Organic Insulating Materials (AREA)
- Inorganic Insulating Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Claims (5)
- 섬유질 4불화에틸렌 수지중에 절연재료로 되는 미소중공구체를 분산시켜서 된 저유전율 복합재료.
- 특허청구의 범위 제1항기재의 저유전율 복합재료에 있어서, 미소중공구체는 유리, 플라스틱, 고무로 되는 군에서 선택된 절연재료로 되는 것을 특징으로 하는 저유전율 복합재료.
- 특허청구의 범위 제2항기재의 저유전율 복합재료에 있어서, 유리는 이산화규소의 함유량이 80% 이상인 것을 특징으로 하는 저유전율 복합재료.
- 특허청구범위 제1항 내지 제3항중 어느 하나의 항에 기재된 저유전율 복합재료에 있어서, 미소중공구체는 카프링제에 의해 표면처리되어 있는 것을 특징으로 하는 저유전율 복합재료.
- 특허청구범위 제1항 내지 제4항 기재의 어느 하나의 항에 기재된 저유전율 복합재료에 있어서, 미소중공구체의 함유량은 50-95중량%인 것을 특징으로 하는 저유전율 복합재료.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-214604 | 1987-08-28 | ||
JP62214604A JPS6460648A (en) | 1987-08-28 | 1987-08-28 | Low-permittivity composite material |
JP?62-214604 | 1987-08-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890004358A KR890004358A (ko) | 1989-04-21 |
KR920000221B1 true KR920000221B1 (ko) | 1992-01-10 |
Family
ID=16658463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880005212A Expired KR920000221B1 (ko) | 1987-08-28 | 1988-05-04 | 저유전율 복합재료 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0304699A3 (ko) |
JP (1) | JPS6460648A (ko) |
KR (1) | KR920000221B1 (ko) |
DE (1) | DE304699T1 (ko) |
GB (1) | GB2209167B (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5126192A (en) * | 1990-01-26 | 1992-06-30 | International Business Machines Corporation | Flame retardant, low dielectric constant microsphere filled laminate |
US5055342A (en) * | 1990-02-16 | 1991-10-08 | International Business Machines Corporation | Fluorinated polymeric composition, fabrication thereof and use thereof |
JPH03238410A (ja) * | 1990-02-16 | 1991-10-24 | Sumitomo Electric Ind Ltd | 通信用線材 |
JPH0413770A (ja) * | 1990-05-01 | 1992-01-17 | Junkosha Co Ltd | 絶縁材料及びその製造方法 |
JPH0799646B2 (ja) * | 1991-05-03 | 1995-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 分子的多孔性エーロゲルで充填された低誘電率複合積層品 |
GB9206960D0 (en) * | 1992-03-31 | 1992-05-13 | Tba Industrial Products Ltd | Sheet sealing material |
US6042936A (en) * | 1997-09-23 | 2000-03-28 | Fibermark, Inc. | Microsphere containing circuit board paper |
JP4617538B2 (ja) * | 2000-06-15 | 2011-01-26 | ダイキン工業株式会社 | 高周波信号伝送用製品の絶縁用ポリテトラフルオロエチレン混合粉末およびそれを用いた高周波信号伝送用製品 |
DE20318330U1 (de) * | 2003-11-25 | 2005-04-14 | Brandenburger Isoliertechnik Gmbh & Co | Thermoisolierplatte |
US20060210806A1 (en) * | 2005-01-19 | 2006-09-21 | Nelson Kevin G | Methods and compositions for dielectric materials |
CN102627818A (zh) * | 2011-05-12 | 2012-08-08 | 天津市天塑科技集团有限公司技术中心 | 一种漂珠填充改性ptfe类树脂 |
NZ721792A (en) | 2014-01-21 | 2020-05-29 | Prysmian Spa | High-voltage electric cable |
JP2017031256A (ja) * | 2015-07-29 | 2017-02-09 | 日東電工株式会社 | フッ素樹脂多孔質体、それを用いた金属層付多孔質体及び配線基板 |
US10435534B2 (en) * | 2015-11-25 | 2019-10-08 | Garlock Sealing Technologies Llc | Dielectric substrate comprising unsintered polytetrafluoroethylene and methods of making the same |
CN114516993B (zh) * | 2020-11-20 | 2023-12-22 | 河南纳牛新材料科技有限公司 | 一种ptfe-空心玻璃微球复合材料及其制备方法和应用 |
JP2023061322A (ja) * | 2021-10-19 | 2023-05-01 | 株式会社オートネットワーク技術研究所 | 導体被覆材料、電線、及び導体被覆材料の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3015604A (en) * | 1957-05-02 | 1962-01-02 | Du Pont | Porous polytetrafluoroethylene article containing glass microballoons |
US3787281A (en) * | 1968-10-29 | 1974-01-22 | Du Pont | Forming a hydrolytically stable bond between glass and polytetrafluoroethylene |
DE3433879A1 (de) * | 1984-09-14 | 1986-03-27 | Japan Vilene Co.,Ltd., Tokio/Tokyo | Isolationsmaterial hoher thermischer leitfaehigkeit sowie verfahren zu seiner herstellung |
-
1987
- 1987-08-28 JP JP62214604A patent/JPS6460648A/ja active Granted
-
1988
- 1988-05-04 KR KR1019880005212A patent/KR920000221B1/ko not_active Expired
- 1988-08-01 GB GB8818243A patent/GB2209167B/en not_active Expired - Fee Related
- 1988-08-04 EP EP88112746A patent/EP0304699A3/en not_active Withdrawn
- 1988-08-04 DE DE198888112746T patent/DE304699T1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
KR890004358A (ko) | 1989-04-21 |
GB2209167B (en) | 1991-03-13 |
GB2209167A (en) | 1989-05-04 |
JPH0125769B2 (ko) | 1989-05-19 |
EP0304699A2 (en) | 1989-03-01 |
DE304699T1 (de) | 1989-05-11 |
EP0304699A3 (en) | 1990-05-09 |
JPS6460648A (en) | 1989-03-07 |
GB8818243D0 (en) | 1988-09-07 |
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St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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