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KR910015035A - 반도체 패키지 - Google Patents

반도체 패키지 Download PDF

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Publication number
KR910015035A
KR910015035A KR1019910000151A KR910000151A KR910015035A KR 910015035 A KR910015035 A KR 910015035A KR 1019910000151 A KR1019910000151 A KR 1019910000151A KR 910000151 A KR910000151 A KR 910000151A KR 910015035 A KR910015035 A KR 910015035A
Authority
KR
South Korea
Prior art keywords
semiconductor die
semiconductor
package material
package
leads
Prior art date
Application number
KR1019910000151A
Other languages
English (en)
Other versions
KR100222157B1 (ko
Inventor
더블유. 호킨스 죠시
Original Assignee
빈센트 조셉 로너
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 조셉 로너, 모토로라 인코포레이티드 filed Critical 빈센트 조셉 로너
Publication of KR910015035A publication Critical patent/KR910015035A/ko
Application granted granted Critical
Publication of KR100222157B1 publication Critical patent/KR100222157B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체 패키지
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명을 구체화하는 반도체 패키지에 대한 매우 확대된 횡단면도, 제3 및 4도는 본 발명을 구체화하는 반도체 패키지 리이드의 일부분에 대한 매우 확대된 횡단면도.

Claims (3)

  1. 반도체 패키지에 있어서, 반도체 장치와, 상기 반도체 장치 주변에 배치된 패키지 재질과, 상기 반도체 장치에 전기적으로 연결된 제1 부분을 갖는 다수의 리이드를 구비하며, 상기 다수의 리이드는 상기 패키지 재질로부터 더 연장하고, 상기 다수의 리이드중 적어도 몇몇이 소정의 스트레스를 받게 될때 상기 패키지 재질로부터 벗어나도록 상기 패키지 재질의 외부에 부착된 제2부분을 가진 반도체 패키지.
  2. 반도체 패키지에 있어서, 제1 표면과 제2표면을 갖는 반도체 다이와, 상기 반도체 다이 주변에 배치된 보호 프레임과, 상기 반도체 다이에 전기적으로 연결된 제1 부분을 가진 다수의 리이드를 구비하고 상기 반도체 다이와 상기 보호 프레임에 부착된 리이드 테이프와, 상기 반도체 다이 주변에 배치된 패키지 재질을 구비하며, 상기 보호 프레임과 상기 리이드 테이프는 상기 제1 부분을 구비하며, 상기 리이드 테이프의 상기 다수의 리이드중 적어도 몇몇이 소정의 스트레스를 받게될때 상기 패키지 재질로부터 벗어나도록 상기 패키지 재질의 외부에 부착된 제2부분을 가진 반도체 패키지.
  3. 반도체 패키지에 있어서, 제1표면과 제2 표면을 갖는 반도체 다이와, 상기 반도체 다이 주변에 배치되고 거의 유사한 열팽창 계수를 갖는 스트레스 버퍼 프레임과, 그 상에 배치되고, 상기 반도체 다이에 전기적으로 연결된 제1 부분을 가진 금속 리이드로서 중합체를 구비하며, 상기 금속 리이드가 상기 반도체 다이와 상기 스트레스 버퍼 프레임으로부터 연장되도록 상기 반도체 다이와 상기 스크레스 버퍼 프레임에 부착된 리이드 테이프와, 상기 반도체 다이 주변에 배치된 하나의 중합체 또는 세라믹을 구비하는 패키지 재질을 포함하며, 상기 스트레스 버퍼 프레임과 상기 리이드 테이프가 상기 제1 부분을 구비하며, 상기 금속 리이드중 적어도 몇몇이 소정의 스트레스를 받게될때 상기 패키지 재질로부터 벗어나도록 상기 패키지 재질의 외부에 부착된 제2 부분을 가진 반도체 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910000151A 1990-01-29 1991-01-08 반도체 패키지 KR100222157B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US471,470 1990-01-29
US07/471,470 US4989069A (en) 1990-01-29 1990-01-29 Semiconductor package having leads that break-away from supports

Publications (2)

Publication Number Publication Date
KR910015035A true KR910015035A (ko) 1991-08-31
KR100222157B1 KR100222157B1 (ko) 1999-10-01

Family

ID=23871757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000151A KR100222157B1 (ko) 1990-01-29 1991-01-08 반도체 패키지

Country Status (5)

Country Link
US (1) US4989069A (ko)
EP (1) EP0439825B1 (ko)
JP (1) JP2570917B2 (ko)
KR (1) KR100222157B1 (ko)
DE (1) DE69008702T2 (ko)

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Also Published As

Publication number Publication date
JPH0750359A (ja) 1995-02-21
US4989069A (en) 1991-01-29
EP0439825A3 (en) 1991-09-11
KR100222157B1 (ko) 1999-10-01
JP2570917B2 (ja) 1997-01-16
DE69008702D1 (de) 1994-06-09
DE69008702T2 (de) 1994-11-24
EP0439825B1 (en) 1994-05-04
EP0439825A2 (en) 1991-08-07

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