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KR910013444A - 전자장치 및 그 제조방법 - Google Patents

전자장치 및 그 제조방법 Download PDF

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Publication number
KR910013444A
KR910013444A KR1019900021113A KR900021113A KR910013444A KR 910013444 A KR910013444 A KR 910013444A KR 1019900021113 A KR1019900021113 A KR 1019900021113A KR 900021113 A KR900021113 A KR 900021113A KR 910013444 A KR910013444 A KR 910013444A
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South Korea
Prior art keywords
electronic component
bonding
substrate
area
component receiving
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티. 린 폴
비.맥셰인 마이클
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빈센트 죠셉 로너
모토로라 인코포레이티드
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Publication of KR910013444A publication Critical patent/KR910013444A/ko
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    • H—ELECTRICITY
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract

내용 없음.

Description

전자장치 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 부분적으로 도시된 프린트 배선판에 적층된 얇고, 몰드되고 흡착된 면의 캡슐형 전자장치 3/4의 사시도.

Claims (3)

  1. 본딩 랜드를 갖는 프린트 배선판(PCB)(12)상에 장착되는 면을 위한 전자 장치(10)로서, 주변(44)을 갖는 절연성있고, 유연성 있는 기판(32)을 구비하며, 여기서 기판(32)은 전자 성분 수용 영역(36)을 가지며, 상기 전자 성분 수용영역(36)에서 주변(44)까지 연장되는 기판(32)상에 다수의 전기적 전도 트레이스(34)를 구비하며, 여기서 상기 트레이스는 내부 밴딩 영역(42)은 전자 성분 수용영역(36)이 가까이 있으며, 상기 주변(44) 가까이 외부 본딩 영역(50)을 구비하며, 여기서 적어도 2개의 트레이스 그룹(34)은 상기 장치(10)가 거기에 장착될때 PCB(12)상의 본딩 랜드(16)에 밴드되고 접촉되기 위해 상기 외부 본딩 영역(50)을 허용하기 위해 리드 어레이(24)내에 형성되며; 다수의 본딩 패드(40)를 가지는 전자 성분(38)을 구비하며, 여기서 전자 성분(38)이 기판(32)상의 전자 성분 수용영역(36)에 접착되고 상기 본딩 패드는 내부 본딩 영역(42)에 전기적으로 접속되며; 적어도 전자 성분(38)과 내부 본딩 영역(42)둘레에 패캐지 바디(20)를 구비하는 전자 장치.
  2. 본딩 랜드(16)를 갖는 프린트 배선판 상에 장착되는 면에 대한 전자 장치로서, 주변(44)을 갖는 절연성, 유연성 있는 기판(32)을 구비하며, 여기서 상기 기판(32)은 전자 성분 수용영역(36)을 가지며, 상기 전자성분 수용영역(36)에서 주변(44)까지 연장되는 기판상에 다수의 전기적 전도성 트레이스(34)를 구비하며, 여기서 상기 트레이스는 전자 성분 수용영역(36) 가까이 내부 본딩 영역(42)을 가지며, 주변(44)까지 이 외부 본딩 영역(50)과, 각 트레이스(34)에 대해 테스트 포인트(46)를 가지며 여기서 테스트 포인트는 외부 본딩 영역(50)보다는 전자 성분 수용영역(36)으로부터 약간 제거되어 기판 주변(44)에서 존재하며, 상기 테스트 포인트(46)와 기판 주변(44)은 외부 본딩 영역(50)을 포함하는 기판 부분으로부터 세이브 가능하며, 적어도 2개의 트레이스(34) 그룹은 상기 장치가 거기에 적층될때 PCB(12)상의 본딩 랜드(16)에 대해 본드되고 접촉하기 위해 외부 본딩 영역(50)을 허용하기 위해 리드 어레이(24)내에 형성되며, 거기로부터 다수의 본딩 패드(40)를 가지는 전자성분(38)을 구비하며, 여기서 상기 전자 성분은 기판(32)상에서 전자 성분 수용영역에서 위치하며 상기 본딩 패드(40)는 내부 본딩 영역(42)에 전기적으로 접속되며, 적어도 전자 성분(38)과 내부 본딩 영역(42)을 캡슐레이팅하는 패캐지 바디(20)를 구비하는 전자 장치.
  3. 본딩 랜드(16)를 갖는 프린트 배선판(PCB)(12)에 적층되는 면에 적당한 전자 장치제조 방법으로서, 주변(44)을 갖는 절연성, 유연성 있는 기판(32)을 제공하는 것을 포함하며, 상기 기판(32)은 거기에서 전자성분 수용 영역(36)을 가지며, 상기 기판(32)는 첨가적으로 전자 성분 수용영역(36)에서 주변(44)까지 연장된 다수의 전기적 전도 트레이스(34)를 가지며, 상기 트레이스(34)는 전자 성분 수용영역(36) 가까이 내부 밴딩 영역(42)을 가지며; 주변(44) 가까이 외부 밴딩 영역(50)과; 기판(32)상에 전자 성분 수용영역(36)에 대해 다수의 본딩 패드(40)을 갖고 에픽싱하는 전자 성분(38)을 가지며, 내부 본딩 영역(42)에 전기적으로 접속되는 본딩 패드(40)와, 패캐지 바디(20)를 갖는 최소한의 전자 성분(38)과 내부 본딩 영역(42)을 서라운딩하는 것과, (PCB)(12)상에 본딩 랜드(16)에 본드되고 접촉하기 위한 외부 본딩 영역(50)을 허용하기 위해 리드 어레이(24)내에 적어도 2개의 트레이스(34) 그룹을 형성하는 것을 포함하는 전자 장치 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900021113A 1989-12-27 1990-12-20 전자장치 및 그 제조방법 Withdrawn KR910013444A (ko)

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