KR900700231A - 웨이브 납땜장치와 그의 공정 - Google Patents

웨이브 납땜장치와 그의 공정

Info

Publication number: KR900700231A
Authority: KR; South Korea
Prior art keywords: soldering device; wave soldering; wave; soldering
Prior art date: 1988-04-19

Application number

KR1019890702413A

Other languages

English (en)

Inventor

로버트 스코르타

Original Assignee

이탈텔 쏘시에떼 이탈리아나 텔레코뮤니케이션니 쏘시에떼 퍼 아찌오니

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-04-19

Filing date

1989-12-20

Publication date

1990-08-11

1989-12-20 Application filed by 이탈텔 쏘시에떼 이탈리아나 텔레코뮤니케이션니 쏘시에떼 퍼 아찌오니 filed Critical 이탈텔 쏘시에떼 이탈리아나 텔레코뮤니케이션니 쏘시에떼 퍼 아찌오니

1990-08-11 Publication of KR900700231A publication Critical patent/KR900700231A/ko

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Molten Solder (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

KR1019890702413A 1988-04-19 1989-12-20 웨이브 납땜장치와 그의 공정 KR900700231A (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
IT8820244A IT1216594B (it)	1988-04-19	1988-04-19	Metodo e dispositivo per la saldatura ad onda.
PCT/EP1988/000989 WO1989010230A1 (en)	1988-04-19	1988-10-28	Wavesoldering device and procedure

Publications (1)

Publication Number	Publication Date
KR900700231A true KR900700231A (ko)	1990-08-11

Family

ID=11165093

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019890702413A KR900700231A (ko)	1988-04-19	1989-12-20	웨이브 납땜장치와 그의 공정

Country Status (8)

Country	Link
US (1)	US5368222A (ko)
EP (1)	EP0413689B1 (ko)
KR (1)	KR900700231A (ko)
CN (1)	CN1041377C (ko)
CA (1)	CA1311064C (ko)
DE (1)	DE3873778T2 (ko)
IT (1)	IT1216594B (ko)
WO (1)	WO1989010230A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10132029A1 (de) *	2001-07-03	2003-01-16	Seho Systemtechnik Gmbh	Lötdüse zum Wellenlöten von Leiterplatten
WO2007131360A1 (en) *	2006-05-16	2007-11-22	Celestica International Inc.	Laminar flow well
US20080302861A1 (en) *	2007-06-11	2008-12-11	Szymanowski Richard A	Method and apparatus for wave soldering an electronic substrate
US8146792B2 (en) *	2010-03-16	2012-04-03	Flextronics Ap, Llc	Solder return for wave solder nozzle
TWM454066U (zh) *	2013-01-25	2013-05-21	Inventec Corp	自動焊接設備
DE102013110731B3 (de) *	2013-09-27	2014-11-06	Ersa Gmbh	Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
DE102014110720A1 (de) *	2014-07-29	2016-02-04	Illinois Tool Works Inc.	Lötmodul

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US1572306A (en) *	1924-11-13	1926-02-09	Northcutt Florence	Churn
NZ200043A (en) *	1981-04-15	1986-01-24	W Maurer	Producing soft ice-cream by fragmenting frozen block under gas-pressure
GB2117690B (en) *	1982-04-02	1986-01-08	Zevatron Gmbh	Apparatus for soldering workpieces
EP0159425B1 (en) *	1984-04-17	1988-06-15	Nihon Den-Netsu Keiki Co., Ltd.	Soldering apparatus
IT1200402B (it) *	1985-03-06	1989-01-18	Roberto Scorta	Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati
US4684056A (en) *	1985-05-03	1987-08-04	Electrovert Limited	Vibratory wave soldering

1988
- 1988-04-19 IT IT8820244A patent/IT1216594B/it active
- 1988-10-28 DE DE8888910014T patent/DE3873778T2/de not_active Expired - Fee Related
- 1988-10-28 US US07/585,139 patent/US5368222A/en not_active Expired - Fee Related
- 1988-10-28 EP EP88910014A patent/EP0413689B1/en not_active Expired - Lifetime
- 1988-10-28 WO PCT/EP1988/000989 patent/WO1989010230A1/en active IP Right Grant
- 1988-12-12 CA CA000585658A patent/CA1311064C/en not_active Expired - Lifetime
1989
- 1989-04-14 CN CN89102276A patent/CN1041377C/zh not_active Expired - Fee Related
- 1989-12-20 KR KR1019890702413A patent/KR900700231A/ko not_active Application Discontinuation

Also Published As

Publication number	Publication date
US5368222A (en)	1994-11-29
EP0413689B1 (en)	1992-08-12
CN1038007A (zh)	1989-12-13
CA1311064C (en)	1992-12-01
CN1041377C (zh)	1998-12-23
WO1989010230A1 (en)	1989-11-02
DE3873778T2 (de)	1993-03-18
IT1216594B (it)	1990-03-08
EP0413689A1 (en)	1991-02-27
DE3873778D1 (de)	1992-09-17
IT8820244A0 (it)	1988-04-19

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Legal Events

Date	Code	Title	Description
1989-12-19	PA0109	Patent application	Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19891219
1990-08-11	PG1501	Laying open of application
1994-12-19	PC1203	Withdrawal of no request for examination
1994-12-19	WITN	Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid