DE69500904D1 - Wellenlötverfahren und -vorrichtung - Google Patents

Wellenlötverfahren und -vorrichtung

Info

Publication number: DE69500904D1
Authority: DE; Germany
Prior art keywords: soldering method; wave soldering; wave; soldering
Prior art date: 1994-05-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69500904T

Other languages

English (en)

Inventor

Harbhajan S Nayar

Sean M Adams

Neeraj Saxena

Bohdan A Wasiczko

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Messer LLC

Original Assignee

BOC Group Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-05-31

Filing date

1995-05-03

Publication date

1997-11-27

1995-05-03 Application filed by BOC Group Inc filed Critical BOC Group Inc

1997-11-27 Application granted granted Critical

1997-11-27 Publication of DE69500904D1 publication Critical patent/DE69500904D1/de

2015-05-04 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Molten Solder (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

DE69500904T 1994-05-31 1995-05-03 Wellenlötverfahren und -vorrichtung Expired - Lifetime DE69500904D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US08/251,055 US5509598A (en)	1994-05-31	1994-05-31	Wave soldering apparatus and process

Publications (1)

Publication Number	Publication Date
DE69500904D1 true DE69500904D1 (de)	1997-11-27

Family

ID=22950291

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69500904T Expired - Lifetime DE69500904D1 (de)	1994-05-31	1995-05-03	Wellenlötverfahren und -vorrichtung

Country Status (9)

Country	Link
US (1)	US5509598A (de)
EP (1)	EP0685287B1 (de)
KR (1)	KR950035550A (de)
CN (1)	CN1115560A (de)
AU (1)	AU1798195A (de)
CA (1)	CA2148210A1 (de)
DE (1)	DE69500904D1 (de)
PH (1)	PH30880A (de)
ZA (1)	ZA954134B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3306468B2 (ja) *	1997-10-30	2002-07-24	セレスティカ・ジャパン・イーエムエス株式会社	自動ハンダ付け機構及びその機構を用いる装置並びにそのハンダ付け方法
DE19749185A1 (de) *	1997-11-07	1999-05-12	Messer Griesheim Gmbh	Mit einer Gasversorgung verbindbare Gasverteilung
US6326797B2 (en) *	1998-03-04	2001-12-04	International Business Machines Corporation	Apparatus and method for evaluating printed circuit board assembly manufacturing processes
DE19955659A1 (de) *	1999-11-19	2001-05-31	Messer Griesheim Gmbh	Verfahren und Vorrichtung zum flussmittelfreien Löten mit reaktivgasangereicherten Metallschmelzen
NL1017843C2 (nl) *	2001-04-12	2002-10-22	Vitronics Soltec B V	Inrichting voor selectief solderen.
TW200610122A (en) *	2004-09-14	2006-03-16	P Kay Metal Inc	Soldering process
DE502007006711D1 (de) *	2006-05-23	2011-04-28	Linde Ag	Vorrichtung und Verfahren zum Wellenlöten
US20090261147A1 (en) *	2008-04-22	2009-10-22	Lambertus Petrus Christinus Willemen	Dross Removal
FR2946271B1 (fr) *	2009-06-04	2011-08-05	Air Liquide	Procede et installation de traitement de l'alliage de tout ou partie de la zone "morte" du bain de soudure d'une machine de brasage ou etamage a la vague, visant a eliminer tout ou partie des scories d'oxyde formees dans le bain de
SG174695A1 (en) *	2010-03-12	2011-10-28	Air Prod & Chem	Apparatus and method for providing an inerting gas during soldering
US8220699B2 (en) *	2010-03-12	2012-07-17	Air Products And Chemicals, Inc.	Apparatus and method for providing an inerting gas during soldering
US8146792B2 (en)	2010-03-16	2012-04-03	Flextronics Ap, Llc	Solder return for wave solder nozzle
US20130045131A1 (en) *	2011-08-17	2013-02-21	Honeywell International Inc.	Lead-Free Solder Compositions
CN114226907B (zh) *	2022-02-23	2022-04-26	飞荣达科技(江苏)有限公司	一种助焊剂流体压力控制装置
CN115476015A (zh) *	2022-11-01	2022-12-16	成都科力深传感技术有限公司	一种钎焊钎料敷设方法
CN117798451B (zh) *	2024-03-01	2024-04-30	深圳市志胜威电子设备有限公司	一种选择性波峰焊喷锡装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57169295A (en) *	1981-04-10	1982-10-18	Aiwa Co	Method of soldering electric part or like
GB2083773B (en) *	1980-08-01	1984-10-24	Aiwa Co	A soldering method for electric and/or electronic components
JPS5731195A (en) *	1980-08-01	1982-02-19	Aiwa Co	Method of soldering leadless electric part
US5228614A (en) *	1990-07-09	1993-07-20	Electrovert Ltd.	Solder nozzle with gas knife jet
US5203489A (en) *	1991-12-06	1993-04-20	Electrovert Ltd.	Gas shrouded wave soldering
US5297724A (en) *	1993-05-26	1994-03-29	The Boc Group, Inc.	Wave soldering method and apparatus
US5409159A (en) *	1994-02-28	1995-04-25	L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude	Apparatus and methods for inerting solder during wave soldering operations

1994
- 1994-05-31 US US08/251,055 patent/US5509598A/en not_active Expired - Fee Related
1995
- 1995-04-28 CA CA002148210A patent/CA2148210A1/en not_active Abandoned
- 1995-05-03 DE DE69500904T patent/DE69500904D1/de not_active Expired - Lifetime
- 1995-05-03 EP EP95303027A patent/EP0685287B1/de not_active Expired - Lifetime
- 1995-05-05 PH PH50488A patent/PH30880A/en unknown
- 1995-05-10 AU AU17981/95A patent/AU1798195A/en not_active Abandoned
- 1995-05-19 ZA ZA954134A patent/ZA954134B/xx unknown
- 1995-05-30 CN CN95105638A patent/CN1115560A/zh active Pending
- 1995-05-30 KR KR1019950013853A patent/KR950035550A/ko active IP Right Grant

Also Published As

Publication number	Publication date
EP0685287B1 (de)	1997-10-22
EP0685287A1 (de)	1995-12-06
AU1798195A (en)	1995-12-07
CN1115560A (zh)	1996-01-24
KR950035550A (ko)	1995-12-30
CA2148210A1 (en)	1995-12-01
ZA954134B (en)	1996-04-02
PH30880A (en)	1997-12-23
US5509598A (en)	1996-04-23

Publication	Publication Date	Title
KR960008976A (ko)	1996-03-22	처리장치 및 처리방법
DE69527353D1 (de)	2002-08-14	Beschichtungsverfahren und -vorrichtung
DE69509327D1 (de)	1999-06-02	Pumpvorrichtung und -verfahren
DE19581386T1 (de)	1996-12-05	Hemmsteg-Schneidevorrichtung und Hemmsteg-Schneideverfahren
DE69523670D1 (de)	2001-12-13	Anzeigeverfahren und -gerät
DE69517459D1 (de)	2000-07-20	Bilderzeugungsgerät und -verfahren
DK0741594T3 (da)	2002-07-15	Fototermisk terapeutisk anordning og metode
NL194776B (nl)	2002-11-01	Plantenvermeerderingsinrichting en werkwijze.
DE69827915D1 (de)	2005-01-05	Verarbeitungsverfahren und -vorrichtung
FI973330L (fi)	1997-10-13	Paikanninmenetelmä ja -laite
KR960013620A (ko)	1996-05-22	성형 방법 및 성형 장치
DE69821408D1 (de)	2004-03-11	Multiplikationsverfahren und -vorrichtung
DE69429561D1 (de)	2002-02-07	Übertragungsverfahren und -gerät
DE69527170D1 (de)	2002-08-01	Navigationsvorrichtung und -verfahren
DE69517786D1 (de)	2000-08-10	Drahtzusammenbauapparat und -verfahren
DE69535201D1 (de)	2006-10-12	Positionsbestimmungsgerät und -verfahren
DE69500904D1 (de)	1997-11-27	Wellenlötverfahren und -vorrichtung
DE69517913D1 (de)	2000-08-17	Fixiervorrichtung und Fixierverfahren
DE69421191D1 (de)	1999-11-18	Kommunikationsverfahren und vorrichtung dafür
DE69518183D1 (de)	2000-09-07	Beschichtungsvorrichtung und -verfahren
EP0730380A4 (de)	2000-09-20	Einrichtung und verfahren zur datenausgabe
DE69518883D1 (de)	2000-10-26	Druckvorrichtung und -verfahren
DE19681593T1 (de)	1998-10-08	Gravierverfahren und -vorrichtung
FI962103A0 (fi)	1996-05-17	Höyrystyslaite ja menetelmä
EE9700109A (et)	1997-12-15	Telekommunikatsiooni meetod ja seade

Legal Events

Date	Code	Title	Description
1998-05-07	8332	No legal effect for de