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KR900006995A - 밀봉체 - Google Patents

밀봉체 Download PDF

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Publication number
KR900006995A
KR900006995A KR1019890014265A KR890014265A KR900006995A KR 900006995 A KR900006995 A KR 900006995A KR 1019890014265 A KR1019890014265 A KR 1019890014265A KR 890014265 A KR890014265 A KR 890014265A KR 900006995 A KR900006995 A KR 900006995A
Authority
KR
South Korea
Prior art keywords
encapsulated
component
thermally conductive
conductive material
body according
Prior art date
Application number
KR1019890014265A
Other languages
English (en)
Other versions
KR0132052B1 (ko
Inventor
쉬어 엠.라나
씨. 솔렌 버거 죤
Original Assignee
원본미기재
이. 아이. 듀퐁 드 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 이. 아이. 듀퐁 드 네모아 앤드 캄파니 filed Critical 원본미기재
Publication of KR900006995A publication Critical patent/KR900006995A/ko
Application granted granted Critical
Publication of KR0132052B1 publication Critical patent/KR0132052B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/421—Polyesters
    • H01B3/422—Linear saturated polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Insulating Of Coils (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Thermistors And Varistors (AREA)
  • Details Of Resistors (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

밀봉체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명에 따른 변압기의 개략적인 횡단면도.

Claims (4)

  1. 개량된 밀봉체는 전기적으로 능동적인 콤포넌트를 갖고있는 전기 소자를 포함하며, 상기 컴포넌트는 전기적 절연 재료로 캡슐되어 있고, 상기 콤포넌트를 포함하는 상기 소자는 상기 아티클을 위한 외부면을 형성하는 열적 전도 재료로 캡슐되어 있는 것을 특징으로 하는 밀봉체.
  2. 제1항에 있어서, 상기 열적 전도 재료를 메조페이즈 피치 기저카본 파이버의 3차원 배열로 보강된 수지인 것을 특징으로 하는 밀봉체.
  3. 제2항에 있어서, 상기 카본 파이버는 거의 판자 모양이 구조로 되어 있는 것을 특징으로 하는 밀봉체.
  4. 제1,2 또는 3항에 있어서, 상기 전지 소자는 두-스텝 주입 모울딩 처리에 의해 캡슐되어 있으며, 상기 수지는 열가소성인 것을 특징으로 하는 밀봉체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890014265A 1988-10-03 1989-10-04 봉입된 전기 및 전자 소자 KR0132052B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25177288A 1988-10-03 1988-10-03
US251,772 1988-10-03

Publications (2)

Publication Number Publication Date
KR900006995A true KR900006995A (ko) 1990-05-09
KR0132052B1 KR0132052B1 (ko) 1998-04-24

Family

ID=22953347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890014265A KR0132052B1 (ko) 1988-10-03 1989-10-04 봉입된 전기 및 전자 소자

Country Status (10)

Country Link
EP (1) EP0375851B1 (ko)
JP (1) JPH02198114A (ko)
KR (1) KR0132052B1 (ko)
AU (1) AU637583B2 (ko)
BR (1) BR8905014A (ko)
CA (1) CA2000087A1 (ko)
DE (1) DE68923945T2 (ko)
ES (1) ES2077573T3 (ko)
HK (1) HK101896A (ko)
IL (1) IL91868A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026748A (en) * 1990-05-07 1991-06-25 E. I. Du Pont De Nemours And Company Thermally conductive adhesive
JPH06270175A (ja) * 1991-05-15 1994-09-27 E I Du Pont De Nemours & Co 多段階圧縮成型により熱可塑性シート材料で封入したインサート
IT1268492B1 (it) * 1993-10-26 1997-03-04 Hydor Srl Metodo per realizzare apparecchiature elettromeccaniche funzionanti in immersione ed apparecchiatura ottenuta con il metodo
US6198373B1 (en) * 1997-08-19 2001-03-06 Taiyo Yuden Co., Ltd. Wire wound electronic component
JP2001523892A (ja) * 1997-11-13 2001-11-27 ビーピー・アモコ・コーポレーション 熱管理デバイス
JPH11186003A (ja) * 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
DE10328373B4 (de) * 2003-06-24 2015-10-08 Continental Automotive Gmbh Piezoelektrisches Bauteil mit Temperiervorrichtung und Verwendung des Bauteils
WO2009138096A1 (de) * 2008-05-13 2009-11-19 Abb Technology Ag Trockentransformator
JP5534551B2 (ja) * 2009-05-07 2014-07-02 住友電気工業株式会社 リアクトル
EP2355116A1 (en) 2010-01-29 2011-08-10 ABB Research Ltd. An electric device and a method for manufacturing the device
JP7130039B2 (ja) * 2018-06-29 2022-09-02 新電元工業株式会社 磁性部品

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3030597A (en) * 1958-02-28 1962-04-17 Westinghouse Electric Corp Insulated electrical apparatus
FR2003774A1 (ko) * 1968-03-13 1969-11-14 Licentia Gmbh
CH576206A5 (ko) * 1974-08-06 1976-05-31 Braun Franz
JPS51111862A (en) * 1975-03-27 1976-10-02 Denki Onkyo Co Ltd Synthetic resin mold
JPS51134869A (en) * 1975-05-19 1976-11-22 Hitachi Ltd Mould coil
US4138525A (en) * 1976-02-11 1979-02-06 Union Carbide Corporation Highly-handleable pitch-based fibers
JPS5450865A (en) * 1977-09-30 1979-04-21 Hitachi Ltd Coil for electrical apparatus
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
LU85462A1 (fr) * 1984-07-11 1986-02-12 Univ Louvain Nouvelles compositions polymeres,procedes pour leur production et leurs applications
JPS6169813U (ko) * 1984-10-12 1986-05-13
JPS61296068A (ja) * 1985-06-20 1986-12-26 シ−メンス、アクチエンゲゼルシヤフト プラスチツクコンパウンド
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite

Also Published As

Publication number Publication date
AU637583B2 (en) 1993-06-03
IL91868A (en) 1994-06-24
EP0375851A2 (en) 1990-07-04
HK101896A (en) 1996-06-21
BR8905014A (pt) 1990-05-08
AU4244989A (en) 1990-04-05
KR0132052B1 (ko) 1998-04-24
ES2077573T3 (es) 1995-12-01
CA2000087A1 (en) 1990-04-03
DE68923945T2 (de) 1996-04-25
EP0375851A3 (en) 1990-11-28
IL91868A0 (en) 1990-06-10
DE68923945D1 (de) 1995-09-28
JPH02198114A (ja) 1990-08-06
EP0375851B1 (en) 1995-08-23

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