KR900003772B1 - 이미지 센서(image sensor) - Google Patents
이미지 센서(image sensor) Download PDFInfo
- Publication number
- KR900003772B1 KR900003772B1 KR1019850008472A KR850008472A KR900003772B1 KR 900003772 B1 KR900003772 B1 KR 900003772B1 KR 1019850008472 A KR1019850008472 A KR 1019850008472A KR 850008472 A KR850008472 A KR 850008472A KR 900003772 B1 KR900003772 B1 KR 900003772B1
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- South Korea
- Prior art keywords
- wiring pattern
- capacitance
- photoelectric conversion
- image sensor
- wiring
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Abstract
Description
Claims (16)
- 절연기판(3)에 형성된 여러개의 광전변환소자(11)를 배열하여 이루어진 광전변환부(B)와, 이들 광전변환소자(11)로 부터의 출력신호를 차례로 판독하는 구동회로부(A)를 구비하고, 전술한 광전변환부(B)와 전술한 구동회로부(A)가 전술한 절연기판(3) 위에 형성된 배선길이가 적어도 하나가 다른 접속용 배선패턴(4a)에 의해 접속된 이미지 센서에 있어서, 전술한 접속용 배선패턴(4a)의 적어도 하나의 배선 길이를 보정하는 용량조정용 배선패턴(4b)을 전술한 광전변환부(B)의 아래쪽 또는 그 근방 중에서 적어도 한쪽에 절연층을 사이에 두고 설치하고, 또학 각각의 전술한 접속용 배선패턴(4a)의 부유용량을 실질적으로 균일하게 한 것을 특징으로 하는 이미지 센서.
- 제 1 항에 있어서, 전술한 용량 조정용 배선패턴(4b)의 적어도 일부는 전술한 광전변환 소자(11)의 일부를 구성하고 있는 것을 특징으로 하는 이미지 센서.
- 제 1 항 또는 제 2 항에 있어서, 전술한 광전변환 소자(11)는 전하축적형의 광전변환소자(11)인 것을 특징으로 하는 이미지 센서.
- 제 1 항 또는 제 2 항에 있어서, 각각의 전술한 접속응 배선패틴(4a)의 부유용량을 실질적으로 균일하게 하는 것은, 전술한 용량조정용 배선패턴(4b)의 각각의 면적이 전술한 접속용 배선(4a)의 각각의 길이에 비례하여 작게 하므로써 이루어지는 것을 특징으로 하는 이미지 센서.
- 제 1 항 또는 제 2 항에 있어서, 각각의 전술한 접속용 배선패턴(4a)의 부유용량을 실질적으로 균일하게 하는 것은 전술한 용량 조정용 배선패턴(4b)의 상호 간에 인접하는 배선간 콘덴서 용량이, 전술한 용량조정용 배선패턴의 각각에 접속하는 전술한 접속용 배선패턴(4a)의 길이에 비례하여 작게하도록 전술한 용량조정용 배선패턴(4b)의 길이 또는 배선간격의 적어도 한쪽을 조정하고 있는 것을 특징으로 하는 이미지센서.
- 제 1 항 또는 제2 항에 있어서, 각각의 전술한 접속용 배선패턴(4a)의 부유용량을 실질적으로 균일하게 하는 것은, 전술한 용량조정용 배선패턴 상호간에 인접하는 배선간 콘덴서 용량이, 전술한 용량조정용 배선패턴(4b)의 각각에 접속하는 전술한 접속용 배선패턴(4a)의 각 배선 길이에 비례하여 작아지도록 전술한 용량조정용 배선패턴(4b)의 각 배선 길이 또는 배선 간격의 적어도 한쪽을 조정하고 또한 전술한 용량조정용 배선패턴(4b)의 적어도 일부에 일정한 접지된 콘덴서 용량 보정수단(4d)을 설치한 것을 특징으로하는 이미지 센서.
- 제 6 항에 있어서, 전술한 접지된 콘덴서 용량 보정수단(4d)은, 접지된 콘덴서 용량보정용의 배선패턴(4d)인 것을 특징으로 하는 이미지 센서.
- 광전변환소자 어레이와 이들 소자의 전극에 접속된 개별전극 배선패턴(11a)으로 이루어진 광전변환부(B)와, 전술한 광전변환소자를 구동하는 IC 및 이 IC에 접속된 접속용 배선패턴(4a)으로 이루어진 구동회로부(A)와, 전술한 광전변환부(B)가 위치하는 광전변환부 영역과 전술한 구동회로부(A)가 위치하는 구동회로부 영역을 형성하여 이루어진 절연기판(3)과, 전술한 구동회로부(A)가 위치하는 구동회로부 영역을 형성하여 이루어진 절연기판(3)과, 전술한 구동회로부(A)의 영역에 따라서 전술한 접속용 배선패턴(4a)에 설치된 접속패드와, 이들 접속패드와 전술한 개별 전극 배선패턴(11a)을 접속하는 수단과, 전술한 절연기판(3)의 전술한 광전변환부 영역에 전술한 광전변환부(B)의 아래쪽에서 또한 절연층(10)을 사이에 두고 뻗어 나오고 전술한 각 접속용 배선패턴에 접속된 용량 조정용 배선패턴(4b)으로 이루어진 이미지 센서.
- 제 8 항에 있어서, 절연기판(3)이 장방향이며 광전변환부(B)가 전술한 기판(3)의 길이가 긴방향에 따라서 설치되어 있는 이미지 센서.
- 제 8 항에 있어서, 용량조정용 배선패턴(4b)이 전술한 접속용 배선패턴(4a)의 피드로부터 연장되어 끝부분이 오픈된 이미지 센서.
- 제 10 항에 있어서, 용량조정용 배선패턴(4b)과 접속용 배선패턴(4a)의 적어도 한쪽에 폭이 넓은 곳을 형성하여 이루어진 이미지 센서.
- 제10항에 있어서, 용량조정용 배선패턴(4b)에 주로 폭이 넓은 곳을 형성하여 이루어진 이미지 센서.
- 제 8 항에 있어서, 용량조정용 배선패턴(4b)과 접속용 배선패턴(4a)의 전체 길이의 합이 각각 동등한 이미지 센서.
- 제 10 항에 있어서, 용량조정용 배선패턴(4b)의 폭이 넓은 곳이 배선 사이에 인접하고 있는 이미지 센서.
- 제 10 항에 있어서, 접접속용 배선패턴(4a)중 그 길이가 짧은 접속용 배선패턴(4a)는 폭이 넓은 곳이 길게 되어 있는 이미지 센서.
- 제 10 항에 있어서, 폭이 넓은 곳이 패드를 겸하고 있는 이미지 센서.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59-250879 | 1984-11-28 | ||
JP59250879A JPH0650772B2 (ja) | 1984-11-28 | 1984-11-28 | イメージセンサ |
JP60-136991 | 1985-06-25 | ||
JP60136991A JPS61295656A (ja) | 1985-06-25 | 1985-06-25 | イメ−ジセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860004539A KR860004539A (ko) | 1986-06-23 |
KR900003772B1 true KR900003772B1 (ko) | 1990-05-31 |
Family
ID=26470429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850008472A Expired KR900003772B1 (ko) | 1984-11-28 | 1985-11-13 | 이미지 센서(image sensor) |
Country Status (4)
Country | Link |
---|---|
US (1) | US4679088A (ko) |
EP (1) | EP0183525B1 (ko) |
KR (1) | KR900003772B1 (ko) |
DE (1) | DE3579890D1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4660089A (en) * | 1985-07-22 | 1987-04-21 | Eastman Kodak Company | Image sensor having normalized areal conductive elements to effect uniform capacitative loading |
US6069393A (en) * | 1987-06-26 | 2000-05-30 | Canon Kabushiki Kaisha | Photoelectric converter |
EP0296603A3 (en) * | 1987-06-26 | 1989-02-08 | Canon Kabushiki Kaisha | Photoelectric converter |
JPH0682820B2 (ja) * | 1987-06-26 | 1994-10-19 | キヤノン株式会社 | 光電変換装置 |
US4943839A (en) * | 1987-08-19 | 1990-07-24 | Ricoh Company, Ltd. | Contact type image sensor |
JP2824996B2 (ja) * | 1989-09-13 | 1998-11-18 | 株式会社リコー | イメージセンサ |
JP2911519B2 (ja) * | 1990-02-06 | 1999-06-23 | キヤノン株式会社 | 光電変換装置 |
JPH04154166A (ja) * | 1990-10-18 | 1992-05-27 | Fuji Xerox Co Ltd | イメージセンサ |
JP3484705B2 (ja) * | 1991-07-18 | 2004-01-06 | ソニー株式会社 | 半導体ウエハ |
US7291923B1 (en) | 2003-07-24 | 2007-11-06 | Xilinx, Inc. | Tapered signal lines |
EP1761954A1 (en) * | 2004-06-18 | 2007-03-14 | Koninklijke Philips Electronics N.V. | X-ray image detector |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2112274A1 (de) * | 1970-03-16 | 1971-10-14 | Matsushita Electric Ind Co Ltd | Lichtsensor-Matrizenanordnung aus photoleitenden Bauelementen |
JPS5582562A (en) * | 1978-12-18 | 1980-06-21 | Fuji Xerox Co Ltd | Pick up unit for original read-in |
JPS55141767A (en) * | 1979-04-24 | 1980-11-05 | Fuji Xerox Co Ltd | One-dimensional image sensor |
DE3121494A1 (de) * | 1981-05-29 | 1983-01-05 | Siemens AG, 1000 Berlin und 8000 München | Anordnung zum beruehrungslosen messen von elektrischen ladungsbildern bei elektroradiographischen aufzeichnungsverfahren |
JPS57211868A (en) * | 1981-06-23 | 1982-12-25 | Fuji Xerox Co Ltd | Long dimensional photodetector |
US4453187A (en) * | 1981-06-25 | 1984-06-05 | Nippon Telegraph & Telephone Public Corporation | Image sensor |
JPS5824266A (ja) * | 1981-08-04 | 1983-02-14 | Seiko Epson Corp | イメ−ジセンサ |
JPS5848962A (ja) * | 1981-09-18 | 1983-03-23 | Hitachi Ltd | 光センサアレイ装置 |
JPS5856363A (ja) * | 1981-09-30 | 1983-04-04 | Hitachi Ltd | 受光素子 |
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1985
- 1985-11-13 KR KR1019850008472A patent/KR900003772B1/ko not_active Expired
- 1985-11-25 US US06/802,160 patent/US4679088A/en not_active Expired - Lifetime
- 1985-11-26 DE DE8585308577T patent/DE3579890D1/de not_active Expired - Lifetime
- 1985-11-26 EP EP85308577A patent/EP0183525B1/en not_active Expired - Lifetime
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Publication number | Publication date |
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US4679088A (en) | 1987-07-07 |
EP0183525B1 (en) | 1990-09-26 |
DE3579890D1 (de) | 1990-10-31 |
EP0183525A3 (en) | 1987-06-03 |
KR860004539A (ko) | 1986-06-23 |
EP0183525A2 (en) | 1986-06-04 |
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