KR860004539A - 이미지 센서(image sensor) - Google Patents

이미지 센서(image sensor)

Info

Publication number: KR860004539A
Authority: KR; South Korea
Prior art keywords: image sensor; sensor; image
Prior art date: 1984-11-28

Application number

KR1019850008472A

Other languages

English (en)

Other versions

KR900003772B1 (ko

Inventor

히토시 찌요마

젠사쿠 와타나베

마사히로 나카가와

Original Assignee

가부시끼가이샤 도시바

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-11-28

Filing date

1985-11-13

Publication date

1986-06-23

1984-11-28 Priority claimed from JP59250879A external-priority patent/JPH0650772B2/ja

1985-06-25 Priority claimed from JP60136991A external-priority patent/JPS61295656A/ja

1985-11-13 Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바

1986-06-23 Publication of KR860004539A publication Critical patent/KR860004539A/ko

1990-05-31 Application granted granted Critical

1990-05-31 Publication of KR900003772B1 publication Critical patent/KR900003772B1/ko

Classifications

- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
- H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

Engineering & Computer Science (AREA)
Multimedia (AREA)
Signal Processing (AREA)
Solid State Image Pick-Up Elements (AREA)
Facsimile Heads (AREA)

KR1019850008472A 1984-11-28 1985-11-13 이미지 센서(image sensor) KR900003772B1 (ko)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP59-250879		1984-11-28
JP59250879A JPH0650772B2 (ja)	1984-11-28	1984-11-28	イメージセンサ
JP60136991A JPS61295656A (ja)	1985-06-25	1985-06-25	イメ−ジセンサ
JP60-136991		1985-06-25

Publications (2)

Publication Number	Publication Date
KR860004539A true KR860004539A (ko)	1986-06-23
KR900003772B1 KR900003772B1 (ko)	1990-05-31

Family

ID=26470429

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019850008472A KR900003772B1 (ko)	1984-11-28	1985-11-13	이미지 센서(image sensor)

Country Status (4)

Country	Link
US (1)	US4679088A (ko)
EP (1)	EP0183525B1 (ko)
KR (1)	KR900003772B1 (ko)
DE (1)	DE3579890D1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4660089A (en) *	1985-07-22	1987-04-21	Eastman Kodak Company	Image sensor having normalized areal conductive elements to effect uniform capacitative loading
EP0296603A3 (en) *	1987-06-26	1989-02-08	Canon Kabushiki Kaisha	Photoelectric converter
JPH0682820B2 (ja) *	1987-06-26	1994-10-19	キヤノン株式会社	光電変換装置
US6069393A (en) *	1987-06-26	2000-05-30	Canon Kabushiki Kaisha	Photoelectric converter
US4943839A (en) *	1987-08-19	1990-07-24	Ricoh Company, Ltd.	Contact type image sensor
JP2824996B2 (ja) *	1989-09-13	1998-11-18	株式会社リコー	イメージセンサ
JP2911519B2 (ja) *	1990-02-06	1999-06-23	キヤノン株式会社	光電変換装置
JPH04154166A (ja) *	1990-10-18	1992-05-27	Fuji Xerox Co Ltd	イメージセンサ
JP3484705B2 (ja) *	1991-07-18	2004-01-06	ソニー株式会社	半導体ウエハ
US7291923B1 (en)	2003-07-24	2007-11-06	Xilinx, Inc.	Tapered signal lines
WO2005124866A1 (en) *	2004-06-18	2005-12-29	Koninklijke Philips Electronics N.V.	X-ray image detector

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3668408A (en) *	1970-03-16	1972-06-06	Matsushita Electric Ind Co Ltd	Light sensor matrix device consisting of photo-conductive elements
JPS5582562A (en) *	1978-12-18	1980-06-21	Fuji Xerox Co Ltd	Pick up unit for original read-in
JPS55141767A (en) *	1979-04-24	1980-11-05	Fuji Xerox Co Ltd	One-dimensional image sensor
DE3121494A1 (de) *	1981-05-29	1983-01-05	Siemens AG, 1000 Berlin und 8000 München	Anordnung zum beruehrungslosen messen von elektrischen ladungsbildern bei elektroradiographischen aufzeichnungsverfahren
JPS57211868A (en) *	1981-06-23	1982-12-25	Fuji Xerox Co Ltd	Long dimensional photodetector
US4453187A (en) *	1981-06-25	1984-06-05	Nippon Telegraph & Telephone Public Corporation	Image sensor
JPS5824266A (ja) *	1981-08-04	1983-02-14	Seiko Epson Corp	イメ−ジセンサ
JPS5848962A (ja) *	1981-09-18	1983-03-23	Hitachi Ltd	光センサアレイ装置
JPS5856363A (ja) *	1981-09-30	1983-04-04	Hitachi Ltd	受光素子

1985
- 1985-11-13 KR KR1019850008472A patent/KR900003772B1/ko not_active IP Right Cessation
- 1985-11-25 US US06/802,160 patent/US4679088A/en not_active Expired - Lifetime
- 1985-11-26 EP EP85308577A patent/EP0183525B1/en not_active Expired - Lifetime
- 1985-11-26 DE DE8585308577T patent/DE3579890D1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE3579890D1 (de)	1990-10-31
EP0183525A2 (en)	1986-06-04
KR900003772B1 (ko)	1990-05-31
EP0183525A3 (en)	1987-06-03
US4679088A (en)	1987-07-07
EP0183525B1 (en)	1990-09-26

Publication	Publication Date	Title
KR850006792A (ko)	1985-10-16	이미지 센서(Image Sensor)
DE3588227D1 (de)	2001-04-19	Bildsensoranordnung
DE3578843D1 (de)	1990-08-30	Farbbildsensor.
DE3579564D1 (de)	1990-10-11	Visuellbild-sensorsystem.
AT384924B (de)	1988-01-25	Bildaufnahmeanordnung
DE3855971D1 (de)	1997-08-28	Bildaufzeichnungsgerät
DE3586961D1 (de)	1993-02-18	Farbensensor.
DE3584703D1 (de)	1992-01-02	Festkoerper-bildsensor.
EP0169411A3 (en)	1988-08-17	Image sensor
DE3579937D1 (de)	1990-11-08	Bildabaenderung.
GB8518195D0 (en)	1985-08-21	Image sensor unit
DE3750859D1 (de)	1995-01-26	Bildaufzeichnungsvorrichtung.
DE3485050D1 (de)	1991-10-17	Bildsensor.
KR850008079A (ko)	1985-12-11	영상감지기
DE3869974D1 (de)	1992-05-21	Bildersynthetisiergeraet.
DE3787610D1 (de)	1993-11-04	Bildsensoren.
DE3684966D1 (de)	1992-05-27	Bildsignalkodiergeraet.
KR850010655U (ko)	1985-12-30	화상판독장치
KR860004552A (ko)	1986-06-23	컬러영상신호의 처리장치
KR860004539A (ko)	1986-06-23	이미지 센서(image sensor)
DE3572280D1 (en)	1989-09-14	Image sensor
DE3585895D1 (de)	1992-05-27	Bildverbesserung.
DE3578368D1 (de)	1990-07-26	Farbbildgeraet.
FR2508746B1 (fr)	1985-12-20	Capteur d'image
DE3672922D1 (de)	1990-08-30	Festkoerperbildsensor.

Legal Events

Date	Code	Title	Description
1985-11-13	A201	Request for examination
1985-11-13	PA0109	Patent application	Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19851113
1985-11-13	PA0201	Request for examination
1986-06-23	PG1501	Laying open of application
1989-11-21	E902	Notification of reason for refusal
1989-11-21	PE0902	Notice of grounds for rejection	Comment text: Notification of reason for refusal Patent event date: 19891121 Patent event code: PE09021S01D
1990-04-30	G160	Decision to publish patent application
1990-05-31	PG1605	Publication of application before grant of patent	Comment text: Decision on Publication of Application Patent event code: PG16051S01I Patent event date: 19900430
1990-08-27	E701	Decision to grant or registration of patent right
1990-08-27	PE0701	Decision of registration	Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19900827
1990-09-25	GRNT	Written decision to grant
1990-09-25	PR0701	Registration of establishment	Comment text: Registration of Establishment Patent event date: 19900925 Patent event code: PR07011E01D
1990-09-25	PR1002	Payment of registration fee	Payment date: 19900925 End annual number: 3 Start annual number: 1
1993-04-22	PR1001	Payment of annual fee	Payment date: 19930422 Start annual number: 4 End annual number: 4
1994-04-22	PR1001	Payment of annual fee	Payment date: 19940422 Start annual number: 5 End annual number: 5
1995-04-24	PR1001	Payment of annual fee	Payment date: 19950424 Start annual number: 6 End annual number: 6
1996-04-26	PR1001	Payment of annual fee	Payment date: 19960426 Start annual number: 7 End annual number: 7
1997-04-28	PR1001	Payment of annual fee	Payment date: 19970428 Start annual number: 8 End annual number: 8
1997-12-26	PR1001	Payment of annual fee	Payment date: 19971226 Start annual number: 9 End annual number: 9
1999-04-16	PR1001	Payment of annual fee	Payment date: 19990417 Start annual number: 10 End annual number: 10
2000-04-28	FPAY	Annual fee payment	Payment date: 20000428 Year of fee payment: 11
2000-04-28	PR1001	Payment of annual fee	Payment date: 20000428 Start annual number: 11 End annual number: 11
2001-06-01	LAPS	Lapse due to unpaid annual fee
2001-06-01	PC1903	Unpaid annual fee