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KR890003013A - 반도체 장치용 부품간의 접속 구조물 - Google Patents

반도체 장치용 부품간의 접속 구조물 Download PDF

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KR890003013A
KR890003013A KR1019880008211A KR880008211A KR890003013A KR 890003013 A KR890003013 A KR 890003013A KR 1019880008211 A KR1019880008211 A KR 1019880008211A KR 880008211 A KR880008211 A KR 880008211A KR 890003013 A KR890003013 A KR 890003013A
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alloy
iron
nickel
substrate
semiconductor device
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KR1019880008211A
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KR910007016B1 (ko
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아끼라 사사메
히또유끼 사까노우에
히사오 다께우찌
마사야 미야께
아끼라 야마까와
야스히사 유시오
히또시 아까자와
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나까하라 쯔네오
스미또모 덴끼 고교 가부시끼 가이샤
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Abstract

내용 없음

Description

반도체 장치용 부품간의 접속 구조물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3 A 및 3B도는 본 발명에 따라 반도체 장치용 부품간 접속 구조물을 제조하는 2가지 방법을 개략적으로 도시한 공정도. 제 4 A,제 4 B및 4 C도는 본 발명의 실시예에 따른 반도체 장치용 부품간 접속 구조물, 즉 리드 프레임, 응력 제거 부재 및 질화 알루미늄 기판간 접속 구조물을 도시한 평면도 및 단면도. 제 5 A,5 B 및 5 C 도는 본 발명의 다른 실시예에 따른 반도체 장치용 부품간 접속 구조, 즉 복합 금속판의 리드 프레임 및 질화 알루미늄 기판간 접속 구조물을 도시한 평면도 및 단면도.

Claims (19)

  1. 반도체 장치의 부품간 접속 구조물에 있어서, 반도체 장치가 설치되는 주 표면을 가진 질화 알루미늄의 기재와, 상기 기재에 결합되면서 주 재료의 철-니켈 합금과 철-니켈-코발트 합금의 어느 것을 포함하는 접속 부재와, 상기 접속 부재 사이에 개재된 응력 제거 부재와, 상기 기재, 상기 응력 제거 부재 및 상기 접속 부재를 결합시키는 납땜 재료를 포함하며, 상기 응력 제거 부재는 소성으로 변형되는 높은 소성 변형성을 가진 연성 금속 및 연성 합금의 어느 것으로 형성되어 납땜시의 냉각 처리시 상기 기재의 열팽창 계수와 상기 접속 부재의 열 팽창 계수간의 차이에 의해 생기는 열 응력을 제거하게 되어 있는 것을 특징으로 하는 접속 구조물.
  2. 제 1 항에 있어서, 상기 응력 제거 부재는 구리, 구리합금, 니켈합금, 철 및 알루미늄 중에서 선택된 재료중의 어느 것으로 형성되는 것이 특징인 접속 구조물.
  3. 제 1 항에 있어서, 상기 접속 부재는 리드 프레임을 포함하는 것이 특징인 접속 구조물.
  4. 제 3 항에 있어서, 상기 응력 제거 부재는, 상기 리드 프레임이 0.1 mm의 두께와 8mm폭을 가질때 0.01 내지 1mm범위의 두께를 가지는 것이 특징인 접속 구조물.
  5. 제 1 항에 있어서, 상기 기재는 소결체를 포함하는 것이 특징인 접속 구조물.
  6. 제 1 항에 있어서, 상기 접속 구조물은 상기 기재의 접합면상에 형성된 금속화층을 추가로 포함하는 것이 특징인 접속 구조물.
  7. 제 6 항에 있어서, 상기 금속화층은 텅스텐과 몰리브덴 중에서 선택된 적어도 하나의 금속과, 질화 알루미늄, 산화 알루미늄 및 산소 질화 알루미늄의 그룹 중에서 선택된 적어도 하나의 알루미늄 화합물을 산화칼슘을 포함하는 것이 특징인 접속 구조물.
  8. 제 6 항에 있어서, 상기 납땜 재료와 결합되기 위하여 상기 접속 부재의 표면상에 형성된 도금층을 추가로 포함하는 것이 특징인 접속 구조물.
  9. 제 8 항에 있어서, 상기 납땜 재료와 결합되기 위하여 상기 접속 부재의 표면상에 형성된 도금층을 추가로 포함하는 것이 특징인 접속 구조물.
  10. 반도체 장치의 부품간 접속 구조물에 있어서, 반도체 장치가 설치되는 주 표면을 가진 질화 알루미늄의 기재와, 상기 기재에 결합되면서 주 재료의 철-니켈 합금과 철-니켈-코발트 합금의 어느 것을 포함하는 접속 부재와, 상기 기재와 상기 부재를 결합시키는 납땜 재료와, 소성으로 변형되는 높은 소성 변형성을 가진 연성 금속 및 연성 합금의 어느 것으로 형성되면서 상기 기재에 결합되는 상기 접속 부재의 적어도 한 표면을 포함하여, 납땜시의 냉각 처리시 상기 기재의 열 팽창 계수와 상기 접속 부재의 열 팽창 계수간의 차이에 의해 생기는 열 응력을 제거하게 되어 있는 것을 특징으로 하는 접속 구조물.
  11. 제10항에 있어서, 상기 기재에 결합되는 상기 접속 부재의 적어도 한 표면은 구리, 구리합금, 니켈합금, 철 및 알루미늄 중에서 선택된 재료중의 어느 것으로 형성되는 것이 특징인 접속 구조물.
  12. 제10항에 있어서, 상기 접속 부재는 리드 프레임을 포함하는 것이 특징인 접속 구조물.
  13. 제12항에 있어서, 상기 기재에 결합되는 상기 접속 부재의 적어도 한 부분은 철-니켈 합금과 철-니켈-코발트 중의 어느 것으로 형성된 내층부와 연성 금속 및 연성 합금중의 어느 것으로 형성된 외층부를 포함하는 것을 특징으로 하는 접속 구조물.
  14. 제13항에 있어서, 상기 접속 부재는 철-니켈 합금과 철-니켈-코발트 합금중의 어느 것으로 형성된, 상기 기재에 결합되는 부분 이외의 다른 부분을 가지는 것이 특징인 접속 구조물.
  15. 절연 기판상에 설치된 반도체 장치를 기밀적으로 둘러싸는 캡에 있어서, 상기 반도체 장치를 보호하기 위하여 상기 반도체 장치상에 구비된 질화 알루미늄의 덮개 부재와, 상기 덮개 부재 아래에 위치된 상기 반도체 장치를 둘러싸기 위하여 상기 덮개 부재에 결합되면서, 주 재료로서 철-니켈 합금과 철-니켈-코발트 합금중의 어느 것을 포함하는 프레임 부재와, 상기 덮개 부재와 상기 프레임 부재 사이에 개재된 응력 제거 부재와, 상기 덮개 부재, 상기 응력 제거 부재 및 상기 프레임 부재를 결합시키는 납땜 재료를 포함하며, 상기 응력 제거 부재는 소성으로 변형되는 높은 소성 변형성을 가진 연성 금속 및 연성 합금의 어느 것으로 형성되어 납땜시의 냉각 처리시 상기 덮개 부재의 열 팽창 계수와 상기 프레임 부재의 열 팽창 계수간의 차이에 의해 생기는 열 응력을 제거하게 되어 있는 것을 특징으로 하는 캡.
  16. 제15항에 있어서, 상기 응력 제거 부재는 구리, 구리합금, 니켈합금, 철 및 알루미늄 중에서 선택된 재료중의 어느 것으로 형성되는 것을 특징으로 하는캡.
  17. 절연 기판상에 설치된 반도체 장치를 기밀적으로 둘러싸는 캡에 있어서, 상기 반도체 장치를 보호하기 위하여 상기 반도체 장치상에 구비된 질화 알루미늄의 덮개 부재와, 상기 덮개 부재 아래에 위치된 상기 반도체 장치를 둘러싸기 위하여 상기 덮개 부재에 결합되면서, 주 재료로서 철-니켈 합금과 철-니켈-코발트 합금중의 어느 것을 포함하는 프레임 부재와, 상기 덮개 부재와 상기 프레임 부재를 결합시키는 납땜 재료와, 가소성으로 변형되는 높은 플라스틱 변형성을 가진 연성 금속 및 연성 합금의 어느 것으로 형성되면서 상기 덮개 부재에 결합되는 상기 프레임 부재의 적어도 한 표면을 포함하여, 납땜시의 냉각 처리시 상기 덮개 부재의 열 팽창 계수와 상기 프레임 부재의 열 팽창 계수간의 차이에 의해 생기는 열 응력을 제거하게 되어 있는 것을 특징으로 하는 캡.
  18. 제17항에 있어서, 상기 덮개 부재에 결합되는 상기 프레임 부재의 적어도 한 표면은 구리, 구리합금, 니켈, 니켈합금, 철 및 알루미늄 중에서 선택된 재료중의 어느 것으로 형성되는 것을 특징으로 한는 캡.
  19. 제17항에 있어서, 상기 덮개 부재에 결합되는 상기 프레임 부재의 적어도 한 부분은 철-니켈 합금과 철-니켈-코발트 합금중의 어느 것으로 형성된 내층부와, 연성 금속 및 연성 합금중의 어느 것으로 형성된 외층부를 포함하는 것이 특징인 캡.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880008211A 1987-07-03 1988-07-02 반도체 장치용 부품간의 접속 구조물 KR910007016B1 (ko)

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DE3856562T2 (de) 2004-08-05
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