KR880701454A - 반도체 웨이퍼 세정 방법 및 장치 - Google Patents
반도체 웨이퍼 세정 방법 및 장치Info
- Publication number
- KR880701454A KR880701454A KR1019870701247A KR870701247A KR880701454A KR 880701454 A KR880701454 A KR 880701454A KR 1019870701247 A KR1019870701247 A KR 1019870701247A KR 870701247 A KR870701247 A KR 870701247A KR 880701454 A KR880701454 A KR 880701454A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor wafer
- cleaning method
- wafer cleaning
- semiconductor
- wafer
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/864,633 US4924890A (en) | 1986-05-16 | 1986-05-16 | Method and apparatus for cleaning semiconductor wafers |
| PCT/US1987/001084 WO1987007077A2 (en) | 1986-05-16 | 1987-05-11 | Method and apparatus for cleaning semiconductor wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR880701454A true KR880701454A (ko) | 1988-07-27 |
Family
ID=25343715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019870701247A KR880701454A (ko) | 1986-05-16 | 1987-12-30 | 반도체 웨이퍼 세정 방법 및 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4924890A (ko) |
| EP (1) | EP0307409A1 (ko) |
| JP (1) | JPH01502867A (ko) |
| KR (1) | KR880701454A (ko) |
| CN (1) | CN87103641A (ko) |
| WO (1) | WO1987007077A2 (ko) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4902608A (en) * | 1987-12-17 | 1990-02-20 | Texas Instruments Incorporated | Immersion development and rinse machine and process |
| JP2683940B2 (ja) * | 1989-08-09 | 1997-12-03 | 信越半導体 株式会社 | ワークの自動洗浄装置 |
| US6375741B2 (en) | 1991-03-06 | 2002-04-23 | Timothy J. Reardon | Semiconductor processing spray coating apparatus |
| JP2644912B2 (ja) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
| USRE39756E1 (en) * | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| US7089680B1 (en) | 1990-08-29 | 2006-08-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| USRE39823E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| JP3162704B2 (ja) * | 1990-11-28 | 2001-05-08 | 東京エレクトロン株式会社 | 処理装置 |
| US5203360A (en) * | 1990-12-17 | 1993-04-20 | Seagate Technology, Inc. | Disc washing system |
| JP2901098B2 (ja) * | 1991-04-02 | 1999-06-02 | 東京エレクトロン株式会社 | 洗浄装置および洗浄方法 |
| GB2266992A (en) * | 1992-05-06 | 1993-11-17 | Surface Tech Sys Ltd | Apparatus for loading semi-conductor wafers |
| US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
| JP2862754B2 (ja) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | 処理装置及び回転部材 |
| US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
| US5911837A (en) * | 1993-07-16 | 1999-06-15 | Legacy Systems, Inc. | Process for treatment of semiconductor wafers in a fluid |
| US5431178A (en) * | 1994-03-30 | 1995-07-11 | Chiu; Hsien Hsin | Centrifugal type, enclosed cleaning apparatus |
| US6833035B1 (en) | 1994-04-28 | 2004-12-21 | Semitool, Inc. | Semiconductor processing system with wafer container docking and loading station |
| US6712577B2 (en) | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
| EP0757844A1 (en) * | 1994-04-28 | 1997-02-12 | Semitool, Inc. | Semiconductor processing systems |
| EP0757843A1 (en) * | 1994-04-28 | 1997-02-12 | Semitool, Inc. | Semiconductor processing system with wafer container docking and loading station |
| US5544421A (en) * | 1994-04-28 | 1996-08-13 | Semitool, Inc. | Semiconductor wafer processing system |
| US5664337A (en) * | 1996-03-26 | 1997-09-09 | Semitool, Inc. | Automated semiconductor processing systems |
| JPH0817894A (ja) * | 1994-06-27 | 1996-01-19 | Dainippon Screen Mfg Co Ltd | 基板表面処理装置 |
| US5954911A (en) * | 1995-10-12 | 1999-09-21 | Semitool, Inc. | Semiconductor processing using vapor mixtures |
| US6239038B1 (en) | 1995-10-13 | 2001-05-29 | Ziying Wen | Method for chemical processing semiconductor wafers |
| US6942738B1 (en) | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
| US6723174B2 (en) | 1996-03-26 | 2004-04-20 | Semitool, Inc. | Automated semiconductor processing system |
| US5778554A (en) * | 1996-07-15 | 1998-07-14 | Oliver Design, Inc. | Wafer spin dryer and method of drying a wafer |
| US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6203582B1 (en) | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US6672820B1 (en) | 1996-07-15 | 2004-01-06 | Semitool, Inc. | Semiconductor processing apparatus having linear conveyer system |
| US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US5954068A (en) * | 1996-12-06 | 1999-09-21 | Steag Microtech Gmbh | Device and method for treating substrates in a fluid container |
| US5922136A (en) * | 1997-03-28 | 1999-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaner apparatus and method |
| TW405158B (en) * | 1997-09-17 | 2000-09-11 | Ebara Corp | Plating apparatus for semiconductor wafer processing |
| US5849103A (en) * | 1997-12-22 | 1998-12-15 | Seh America, Inc. | Method of monitoring fluid contamination |
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| US6497801B1 (en) | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US5989359A (en) * | 1998-10-09 | 1999-11-23 | Berbel; Jose A. | Method for drying objects with fluids |
| US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| CN1217034C (zh) | 1999-04-13 | 2005-08-31 | 塞米用具公司 | 具有改进的处理流体流的处理腔的工件处理装置 |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6457199B1 (en) | 2000-10-12 | 2002-10-01 | Lam Research Corporation | Substrate processing in an immersion, scrub and dry system |
| AU2001268656A1 (en) * | 2000-07-07 | 2002-01-21 | Semitool, Inc. | Automated processing system |
| EP1481114A4 (en) | 2001-08-31 | 2005-06-22 | Semitool Inc | DEVICE AND METHOD FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES |
| US7114903B2 (en) * | 2002-07-16 | 2006-10-03 | Semitool, Inc. | Apparatuses and method for transferring and/or pre-processing microelectronic workpieces |
| JP4219799B2 (ja) * | 2003-02-26 | 2009-02-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| WO2007085022A2 (en) * | 2006-01-20 | 2007-07-26 | Akrion Technologies, Inc. | System, apparatus and methods for processing substrates using acoustic energy |
| CN100385629C (zh) * | 2006-09-18 | 2008-04-30 | 无锡华润华晶微电子有限公司 | 半导体晶圆片的清洗方法及其清洗设备 |
| JP4953892B2 (ja) * | 2007-04-13 | 2012-06-13 | 新科實業有限公司 | 超音波洗浄装置及び方法 |
| CN103567175A (zh) * | 2013-10-30 | 2014-02-12 | 广西钦州天山微电子有限公司 | 铬板清洗机 |
| CN108772399A (zh) * | 2018-06-11 | 2018-11-09 | 杭州和源精密工具有限公司 | 圆锯片清洗用工件框及装夹圆锯片的方法 |
| JP7234527B2 (ja) * | 2018-07-30 | 2023-03-08 | Tdk株式会社 | センサー内蔵フィルタ構造体及びウエハ収容容器 |
| CN109148339A (zh) * | 2018-09-26 | 2019-01-04 | 广西桂芯半导体科技有限公司 | 圆片清洗装置及清洗方法 |
| CN110091011B (zh) * | 2019-06-12 | 2021-06-11 | 东莞市闻誉实业有限公司 | 超声波清洗装置及产品加工装置 |
| CN110931406B (zh) * | 2019-11-18 | 2022-10-21 | 北京北方华创微电子装备有限公司 | 升降门及槽式清洗机 |
| JP7417636B2 (ja) * | 2020-01-17 | 2024-01-18 | ダイキンファインテック株式会社 | 薬液処理装置 |
| CN111370298A (zh) * | 2020-04-16 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | 半导体衬底清洗方法及调整方法 |
| CN111906077B (zh) * | 2020-06-29 | 2022-03-25 | 广州国显科技有限公司 | 清洗装置 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2559921A (en) * | 1943-03-20 | 1951-07-10 | Hyman Landaw | Automatic machine for sequentially immersing machine parts in successive cleaning liquids |
| US2546385A (en) * | 1944-11-29 | 1951-03-27 | Logan Lab Inc | Apparatus for washing and sterilizing medicinal containers |
| US2646807A (en) * | 1947-05-13 | 1953-07-28 | Theodore L Martin | Watch cleaning machine |
| US2692603A (en) * | 1950-10-07 | 1954-10-26 | Borg George W Corp | Watch cleaning machine |
| US3136609A (en) * | 1959-07-02 | 1964-06-09 | Raymond P Ciagne | Slide producing machine |
| US3276983A (en) * | 1962-07-25 | 1966-10-04 | Gen Motors Corp | Method and apparatus for movement of workpieces in a plating machine |
| US3479222A (en) * | 1966-06-22 | 1969-11-18 | Disc Pack Corp | Apparatus for and method of cleaning memory discs |
| US3645581A (en) * | 1968-11-26 | 1972-02-29 | Ind Modular Systems Corp | Apparatus and method for handling and treating articles |
| US3812947A (en) * | 1969-07-29 | 1974-05-28 | Texas Instruments Inc | Automatic slice processing |
| US3893869A (en) * | 1974-05-31 | 1975-07-08 | Rca Corp | Megasonic cleaning system |
| US3973665A (en) * | 1975-03-07 | 1976-08-10 | Gca Corporation | Article delivery and transport apparatus for evacuated processing equipment |
| US4064885A (en) * | 1976-10-26 | 1977-12-27 | Branson Ultrasonics Corporation | Apparatus for cleaning workpieces by ultrasonic energy |
| US4315705A (en) * | 1977-03-18 | 1982-02-16 | Gca Corporation | Apparatus for handling and treating wafers |
| US4278366A (en) * | 1977-03-18 | 1981-07-14 | Gca Corporation | Automatic wafer processing system and method |
| US4352607A (en) * | 1977-03-18 | 1982-10-05 | Gca Corporation | Automatic wafer processing system and method |
| US4178188A (en) * | 1977-09-14 | 1979-12-11 | Branson Ultrasonics Corporation | Method for cleaning workpieces by ultrasonic energy |
| US4132567A (en) * | 1977-10-13 | 1979-01-02 | Fsi Corporation | Apparatus for and method of cleaning and removing static charges from substrates |
| US4236851A (en) * | 1978-01-05 | 1980-12-02 | Kasper Instruments, Inc. | Disc handling system and method |
| US4282825A (en) * | 1978-08-02 | 1981-08-11 | Hitachi, Ltd. | Surface treatment device |
| US4217977A (en) * | 1978-09-15 | 1980-08-19 | The Silicon Valley Group, Inc. | Conveyor system |
| US4401131A (en) * | 1981-05-15 | 1983-08-30 | Gca Corporation | Apparatus for cleaning semiconductor wafers |
| JPS587830A (ja) * | 1981-07-08 | 1983-01-17 | Hitachi Ltd | 薄片状物品の洗浄方法及び装置 |
| FR2530942B1 (fr) * | 1982-07-29 | 1985-11-08 | Fast Lunch | Dispositif pour le lavage de plateaux |
| US4458704A (en) * | 1982-10-29 | 1984-07-10 | Xertronix, Inc. | Apparatus for processing semiconductor wafers |
| JPS6014244A (ja) * | 1983-07-06 | 1985-01-24 | Fujitsu Ltd | マスク洗浄装置 |
| US4532970A (en) * | 1983-09-28 | 1985-08-06 | Hewlett-Packard Company | Particle-free dockable interface for integrated circuit processing |
| US4534389A (en) * | 1984-03-29 | 1985-08-13 | Hewlett-Packard Company | Interlocking door latch for dockable interface for integrated circuit processing |
| DE3483828D1 (de) * | 1983-09-28 | 1991-02-07 | Hewlett Packard Co | Verarbeitungssystem fuer integrierte schaltkreise. |
| US4519846A (en) * | 1984-03-08 | 1985-05-28 | Seiichiro Aigo | Process for washing and drying a semiconductor element |
| JPS605530A (ja) * | 1984-04-25 | 1985-01-12 | Hitachi Ltd | 半導体ウエハ洗浄装置 |
| US4543130A (en) * | 1984-08-28 | 1985-09-24 | Rca Corporation | Megasonic cleaning apparatus and method |
| US4736758A (en) * | 1985-04-15 | 1988-04-12 | Wacom Co., Ltd. | Vapor drying apparatus |
| US4722355A (en) * | 1985-08-19 | 1988-02-02 | Rolf Moe | Machine and method for stripping photoresist from wafers |
| US4727896A (en) * | 1985-10-21 | 1988-03-01 | Masao Kanazawa | Ultrasonic washing machine for tableware |
-
1986
- 1986-05-16 US US06/864,633 patent/US4924890A/en not_active Expired - Fee Related
-
1987
- 1987-05-11 JP JP62503203A patent/JPH01502867A/ja active Pending
- 1987-05-11 WO PCT/US1987/001084 patent/WO1987007077A2/en not_active Application Discontinuation
- 1987-05-11 EP EP87903599A patent/EP0307409A1/en not_active Withdrawn
- 1987-05-16 CN CN198787103641A patent/CN87103641A/zh active Pending
- 1987-12-30 KR KR1019870701247A patent/KR880701454A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| US4924890A (en) | 1990-05-15 |
| CN87103641A (zh) | 1987-11-25 |
| EP0307409A1 (en) | 1989-03-22 |
| WO1987007077A2 (en) | 1987-11-19 |
| JPH01502867A (ja) | 1989-09-28 |
| WO1987007077A3 (en) | 1987-12-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19871230 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |