KR880700617A - Circuit panel assembly and its manufacturing method - Google Patents

Abstract

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Description

Circuit panel assembly and its manufacturing method

Since this is an open matter, no full text was included.

1 is a perspective view of a printed circuit panel embodying features of the present invention.

Claims (31)

An electrical circuit defined on a common panel for interconnecting the electrical components arranged thereon, the electrical traces 14 defined on the substrate 11 and at least one surface of the substrate 11 defining the electrical circuit In the pre-formed circuit panel assembly consisting of a pattern, a plurality of component connection regions 15 and discrete component contact member mounting elements 16 connected to corresponding conductive traces 14 in each component connection region 15, An anisotropic conductive adhesive layer 24 overlies the plurality of component contact member mounting elements 16 in each component connection region 15 and is electrically insulated between the component contact member mounting elements 16 in which the anisotropic conductive adhesion is discrete. And thus, a plurality of electrical components can be connected to an electrical circuit without the use of a soldering machine. 2. The circuit panel assembly of claim 1, wherein the anisotropic conductive adhesive consists of a plurality of conductive particles randomly dispersed in the nonconductive adhesive binder. 3. The circuit panel assembly of claim 2, wherein the conductive particles are dispersed to form a plurality of multiparticle clusters. 2. The anisotropic conductive adhesive layer of claim 1, wherein the anisotropic conductive adhesive layer completely overlaps at least one of the entire component connection regions 15, wherein the anisotropic conductive adhesive layer 24 mechanically secures the electrical component to the substrate and mounts discrete contacts. A circuit panel assembly characterized by electrically interconnecting electrical components to the device (16). 5. The device of claim 4, wherein the discrete component contact element carriage element (16) consists of a pad on the surface of the substrate in the component connection area (15), wherein an anisotropic conductive adhesive layer (24) is used to surface mount the electrical component on the panel assembly. Circuit panel assembly, characterized in that consisting of means. 6. Circuit panel assembly according to claim 1, 4 or 5, characterized in that the substrate (11) consists of a metal board. 7. A circuit panel assembly according to claim 6, wherein the substrate consists of an electrolytic aluminum board (11a). 6. A circuit panel assembly according to claim 1, 4 or 5, wherein the substrate is made of a flexible substrate (211). 9. The circuit panel assembly of claim 8, wherein the assembly (312) consists of a plurality of separate flexible plastic film layers. 9. A substrate according to claim 1, 4, 5, 6 or 8, wherein the substrate 11 has a coefficient of thermal expansion different from that of the electrical component to be mounted thereon, and the anisotropic conductive adhesive layers 24 are different from each other. A circuit panel assembly, characterized by forming a flexible interconnect to maintain electrical continuity despite relative movement due to coefficient of thermal expansion. 6. The substrate 11, a plurality of holes 27 extending through the electrically conductive solid polymers 28, 33 disposed in the holes 27, 30, Circuit panel assembly, characterized in that consisting of (30). 6. Circuit panel assembly according to claim 1, 4 or 5, characterized in that the trace (15) consists of an electrically conductive solid polymer. 9. An anisotropic conductor as claimed in claim 1 or 8, wherein the assembly is disposed through a plurality of separation substrate layers (111, 111a, 111b, 111c) and discrete component contact member mounting elements (122) on at least one separation substrate layer. Circuit panel assembly, characterized in that consisting of an adhesive layer (128). 14. A circuit according to claim 13, wherein the dielectric cover layer 124 is placed over each of the separation substrate layers 111, 111a, 111b, 111c, the circuit portion on the dielectric cover layer forming a substrate on which the circuits of each layer are defined. Panel assembly. 15. The circuit panel assembly of claim 14, wherein each dielectric cover layer (111,111a, 111b, 111c) is formed of a solid dielectric ink. 16. The circuit panel assembly of claim 15, wherein the solid conductive polymer on each of the separation substrate layers (111, 111a, 111b, 111c) defines a conductive trace (118a, 118b, 118c, 118d). The circuit panel assembly of claim 12, wherein the separation substrate layer is made of a flexible plastic film. 9. The circuit panel assembly of claim 8, wherein the assembly is interconnected in series with another of the assemblies. 13. The circuit panel assembly of claim 12, wherein the multilayer assembly is interconnected in series with another of the assemblies. A plurality of electrical components consisting of surface mounting components 20, 21 on a substrate 11 for electrically interconnecting conductive mounting elements 16 to component leads 22 over each mounting element 16. A method of interconnecting (20, 21), further comprising disposing an anisotropic conductive adhesive layer (24) over a plurality of discrete component connection areas (15) on a plate surface, the leads being matched with corresponding mounting elements. In which the anisotropic conductive adhesive layer is in an electrically conductive state only at right angles to the substrate and only between the leads 22 arranged in correspondence with the corresponding mounting element 16, wherein the anisotropic conductive adhesive is applied to the substrate A method for interconnecting multiple electrical components, characterized by mechanically securing the components (20, 21). 21. A method according to claim 20, further comprising forming a dielectric cover layer (18) via circuitry on the exterior of the component connection region (15) by disposing the dielectric ink. 21. The method of claim 20, further comprising forming multiple substrate layers by placing conductive traces on the continuous dielectric substrate layers 111a, 111b, and 111c formed by dielectric ink overlying circuits on adjacent layers in each order. And a plurality of electrical component interconnection methods. 23. The method of claim 22, further comprising defining holes 132 extending through the multiple substrate layers 111a, 111b, 111c to the substrate 111, and conductive traces 118W on the separation substrate layers 111a, 111b, 111c. And disposing conductive ink in the holes (132) to interconnect 118Y, 118Z. 24. The method of claim 23, comprising disposing conductive ink on substrate layers (111a, 111b, 111c) to form conductive traces (118W, 118Y, and 118Z). Advancing the substrate along the travel path, applying a liquid electrically conductive polymer in a pattern on at least one surface of the advancing substrate to define one apparent panel element upon mixing along the substrate, each component connection area (15) forming a plurality of electrically conductive traces 14 comprising component contact member mounting pads extending into and drying the polymer to define at least one component connection area on at least one panel element. In the method of manufacturing a circuit panel assembly, the components are dispersed in a non-conductive thermoplastic resin binder on an advancing substrate to form an anisotropic conductive adhesive layer 24 covering the component connection regions 15 and portions of the electrically conductive traces 14. Applying a liquid adhesive mixture of conductive particles, and then drying the liquid anisotropic conductive adhesive mixture; Further comprising arranging a cover layer 18 on the portion of the traveling substrate outside the respective component connection region portions to protectively cover the portion of the electrically conductive traces outside of each component connection region. A method of manufacturing a circuit panel assembly, wherein the electrical component is electrically connected to the contact member mounting pad without the use of a soldering machine. 26. The method of claim 25, wherein the cover layer (18) is a liquid dielectric polymer material. A method according to claim 25, wherein the cover layer (18) is a flexible plastic film. 28. The method of claim 26 or 27, further comprising: applying a liquid electrically conductive primer in a pattern on the surface of the cover layer, drying the polymer to form a plurality of conductive traces, and removing portions of the electrically conductive traces. Disposing an additional cover layer over a predetermined portion of the trace to cover it protectively, whereby the multilayer circuit panel assembly is formed by an electrical connection made without the use of a soldering machine. Circuit panel assembly manufacturing method. 28. The circuit panel assembly of claim 26 or 27, wherein the substrate is a continuous strip of flexible substrate and the circuit panel assemblies are interconnected in series and fabricated to form strips 310 of preformed assemblies. Manufacturing method. 30. The method of claim 29, further comprising: advancing a plurality of flexible plastic film substrates along parallel overlapping and spaced movement passages and at least opposite surfaces of the advancing substrate to form a conductive adhesive layer covering portions of the electrically conductive traces. Applying a liquid adhesive mixture of conductive particles dispersed in a non-conductive thermoplastic resin binder in part, and the multilayer circuit interconnected in series with the conductive adhesive electrically interconnecting the arranged traces of each adjacent pair of substrates And guiding the advancing substrate in superimposed adjacent relationship with the matched panel element to form a strip (334) of the panel assembly. 31. The method of claim 29 or 30, further comprising the step of strictly treating the substrate between repeated patterns to separate the panel elements and form a separate flexible panel assembly. ※ Note: The disclosure is based on the initial application.