JPH05160559A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH05160559A JPH05160559A JP32077291A JP32077291A JPH05160559A JP H05160559 A JPH05160559 A JP H05160559A JP 32077291 A JP32077291 A JP 32077291A JP 32077291 A JP32077291 A JP 32077291A JP H05160559 A JPH05160559 A JP H05160559A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- terminals
- heat seal
- seal connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 239000004416 thermosoftening plastic Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、可撓性フィルム上に導
体回路が形成され、プリント配線板と他のデバイスとを
電気的に接続するためのフィルム状接続部材との接続に
使用される複数の接続端子を備えたプリント配線板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a conductor circuit formed on a flexible film and is used for connecting a printed wiring board and a film-like connecting member for electrically connecting another device. The present invention relates to a printed wiring board having a plurality of connection terminals.
【０００２】[0002]
【従来の技術】従来、プリント配線板と液晶パネルある
いは他のプリント配線板等の他のデバイスとを接続する
手段として、ヒートシールコネクタが使用されている。
図５に示すように、ヒートシールコネクタ２０は、厚さ
２５μ〜４０μのポリエステルフィルムからなる基材２
１上に黒鉛、銀、銅等からなる導電層２２が印刷され、
さらにその導電層２２を覆うようにホットメルト樹脂に
金属粒子が含有された異方性導電層２３が積層されて構
成されている。2. Description of the Related Art Conventionally, a heat seal connector has been used as a means for connecting a printed wiring board to another device such as a liquid crystal panel or another printed wiring board.
As shown in FIG. 5, the heat seal connector 20 includes a base material 2 made of a polyester film having a thickness of 25 μm to 40 μm.
1 is printed with a conductive layer 22 made of graphite, silver, copper or the like,
Further, an anisotropic conductive layer 23 containing metal particles in hot melt resin is laminated so as to cover the conductive layer 22.
【０００３】ヒートシールコネクタ２０を使用して他の
デバイスと接続されるプリント配線板は図６に示すよう
に、複数の接続端子２５が所定間隔で配列されている。
そして、ヒートシールコネクタ２０の導電層２２の一端
が接続端子２５と対応する状態に配置され、加熱プレス
により熱圧着されてプリント配線板２４の接続端子２５
とヒートシールコネクタ２０の導電層２２とが電気的に
接続される。As shown in FIG. 6, a printed wiring board which is connected to another device by using the heat seal connector 20 has a plurality of connection terminals 25 arranged at predetermined intervals.
Then, one end of the conductive layer 22 of the heat seal connector 20 is placed in a state corresponding to the connection terminal 25, and thermocompression bonded by a heating press to connect the connection terminal 25 of the printed wiring board 24.
And the conductive layer 22 of the heat seal connector 20 are electrically connected.
【０００４】このように、ヒートシールコネクタ２０を
使用することによってハンダ付けによる電気的接続が不
可能な部分においても接続が可能となる。As described above, the use of the heat seal connector 20 enables connection even in a portion where electrical connection by soldering is impossible.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、プリン
ト配線板の接続端子２５の間隔が０．３ｍｍ以上ある場
合は、加熱プレスにてヒートシールコネクタ２０を熱圧
着した際、図７に示すように、ヒートシールコネクタ２
０の一部が接続端子２５間に入り込み、ヒートシールコ
ネクタ２０が波打つように変形した状態となる。However, when the space between the connection terminals 25 of the printed wiring board is 0.3 mm or more, when the heat seal connector 20 is thermocompression bonded by a heating press, as shown in FIG. Heat seal connector 2
A part of 0 enters between the connection terminals 25, and the heat seal connector 20 is in a wavy and deformed state.
【０００６】その結果、接続端子２５とヒートシールコ
ネクタ２０との間に隙間が生じ、接続端子２５とヒート
シールコネクタ２０の導電層２２との接続信頼性が低下
する。又、ヒートシールコネクタ２０が波打つことによ
って接続端子２５のピッチと導電層２２のピッチがず
れ、接続面積が小さくなって接続信頼性が低下する。As a result, a gap is created between the connection terminal 25 and the heat seal connector 20, and the connection reliability between the connection terminal 25 and the conductive layer 22 of the heat seal connector 20 is reduced. In addition, when the heat seal connector 20 is wavy, the pitch of the connection terminals 25 and the pitch of the conductive layers 22 are displaced, the connection area is reduced, and the connection reliability is reduced.
【０００７】前記の問題点を解決する方法として、ヒー
トシールコネクタ２０の熱圧着時に、ヒートシールコネ
クタ２０がプリント配線板２４の接続端子２５間に入り
込まないように、接続端子２５の幅を大きくして接続端
子２５の間隔を小さくすることが考えられる。しかし、
この場合ヒートシールコネクタ２０が多少位置ズレして
プリント配線板２４に熱圧着されたとき、隣接する接続
端子２５間が狭いためにヒートシールコネクタ２０の１
つの導電層２２が隣接する接続端子２５に渡って接続さ
れ、接続端子２５同士が短絡するおそれがある。又、フ
レキシブルプリント配線板をプリント配線板２４と他の
デバイスとの接続部材として使用する場合にも同様な問
題がある。As a method for solving the above-mentioned problems, the width of the connection terminal 25 is increased so that the heat seal connector 20 does not enter between the connection terminals 25 of the printed wiring board 24 during thermocompression bonding of the heat seal connector 20. It is conceivable to reduce the distance between the connection terminals 25. But,
In this case, when the heat seal connector 20 is slightly misaligned and thermocompression-bonded to the printed wiring board 24, the space between the adjacent connection terminals 25 is narrow, so
One conductive layer 22 may be connected across the adjacent connection terminals 25, and the connection terminals 25 may short-circuit. The same problem also occurs when the flexible printed wiring board is used as a connecting member between the printed wiring board 24 and another device.
【０００８】本発明は上記問題点を解消するためになさ
れたものであって、その目的はフィルム状接続部材を用
いてプリント配線板と他のデバイスとを接続する場合、
フィルム状接続部材の導体パターンとプリント配線板の
接続端子とを確実に接続できるとともに、フィルム状接
続部材が多少位置ズレしても回路の短絡を防止すること
ができるプリント配線板を提供することにある。The present invention has been made to solve the above problems, and an object thereof is to connect a printed wiring board and another device by using a film-like connecting member.
To provide a printed wiring board capable of reliably connecting a conductor pattern of a film-like connecting member and a connection terminal of a printed wiring board and preventing a short circuit of a circuit even if the film-like connecting member is slightly displaced. is there.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明では、可撓性フィルム上に導体回路が形成さ
れ、プリント配線板と他のデバイスとを電気的に接続す
るためのフィルム状接続部材との接続に使用される複数
の接続端子を備えたプリント配線板であって、前記接続
端子間に他の導体パターンと電気的に接続されないダミ
ー端子を等間隔で形成した。In order to achieve the above object, in the present invention, a film for forming a conductor circuit on a flexible film for electrically connecting a printed wiring board and another device. In the printed wiring board having a plurality of connection terminals used for connection with a strip-shaped connection member, dummy terminals which are not electrically connected to other conductor patterns are formed at equal intervals between the connection terminals.
【００１０】また、前記フィルム状接続部材としては、
熱可塑性フィルム上にカーボン等の導電材料で導体パタ
ーンを印刷したヒートシールコネクタが好ましい。Further, as the film-like connecting member,
A heat seal connector in which a conductive pattern is printed on a thermoplastic film with a conductive material such as carbon is preferable.
【００１１】[0011]
【作用】従って、本発明によると、プリント配線板の上
面に形成された複数の接続端子間に、他の導体パターン
と電気的に接続されないダミー端子を形成したことによ
って接続端子間の間隔が狭まり、フィルム状接続部材を
プリント配線板の接続端子と接続するときにフィルム状
接続部材の変形が防止されるとともに、フィルム状接続
部材が多少位置ズレしても回路の短絡が防止される。Therefore, according to the present invention, since the dummy terminals that are not electrically connected to other conductor patterns are formed between the plurality of connection terminals formed on the upper surface of the printed wiring board, the distance between the connection terminals is narrowed. The film-like connecting member is prevented from being deformed when the film-like connecting member is connected to the connecting terminal of the printed wiring board, and a short circuit is prevented even if the film-like connecting member is slightly displaced.
【００１２】[0012]
【実施例】以下、本発明を具体化した一実施例を図１〜
３に基づいて説明する。図１はプリント配線板１の一部
拡大平面図であって、このプリント配線板１上にはフィ
ルム状接続部材の導体回路と接続される幅０．５ｍｍの
接続端子２が所定間隔で複数個形成されている。また、
この隣接する接続端子２間には、０．１ｍｍの間隔を設
けて他の導体パターンと電気的に接続されない幅０．１
ｍｍのダミー端子３が形成されている。なお、ダミー端
子３は接続端子２を形成するときに同時に形成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment embodying the present invention will now be described with reference to FIGS.
It will be described based on 3. FIG. 1 is a partially enlarged plan view of a printed wiring board 1. On the printed wiring board 1, a plurality of connecting terminals 2 having a width of 0.5 mm to be connected to a conductor circuit of a film-like connecting member are arranged at predetermined intervals. Has been formed. Also,
A space of 0.1 mm is provided between the adjacent connection terminals 2 so that a width of 0.1 mm that is not electrically connected to another conductor pattern is provided.
mm dummy terminals 3 are formed. The dummy terminal 3 is formed at the same time when the connection terminal 2 is formed.
【００１３】このプリント配線板１をヒートシールコネ
クタ２０を用いて他のデバイスと接続する場合は、ヒー
トシールコネクタ２０を導電層２２と接続端子２とが対
応する状態に配置し、所定の圧力及び温度で加熱プレス
によって熱圧着する。When the printed wiring board 1 is connected to another device by using the heat seal connector 20, the heat seal connector 20 is arranged in a state where the conductive layer 22 and the connection terminal 2 correspond to each other, and a predetermined pressure and Thermocompression bonding is performed by a heat press at a temperature.
【００１４】このとき、隣接する接続端子２間には、電
子部品の接続端子と接続していないダミー端子３が存在
するため、従来とは異なり、ヒートシールコネクタ２０
がプリント配線板１の接続端子２間に入り込むことがな
くなる。従って、接続端子２とヒートシールコネクタ２
０との間に隙間が生じることがなくなるとともに、ピッ
チのズレ等も少なくなって、接続信頼性が向上する。At this time, since the dummy terminal 3 which is not connected to the connection terminal of the electronic component exists between the adjacent connection terminals 2, unlike the conventional case, the heat seal connector 20 is provided.
Will not enter between the connection terminals 2 of the printed wiring board 1. Therefore, the connection terminal 2 and the heat seal connector 2
A gap is not generated between 0 and 0, and a pitch deviation and the like are reduced, so that connection reliability is improved.
【００１５】また、仮にヒートシールコネクタ２０を接
続端子２に熱圧着した際、ヒートシールコネクタ２０が
多少位置ズレして接続端子２と、その接続端子２と隣接
するダミー端子３に渡って１つの導電層２２が接続され
ても、ダミー端子３は他の導体パターンと接続されてい
ないので、プリント配線板２４の接続端子２は短絡しな
い。If the heat-seal connector 20 is thermocompression-bonded to the connection terminal 2, the heat-seal connector 20 is slightly displaced and the connection terminal 2 and the dummy terminal 3 adjacent to the connection terminal 2 are separated by one. Even if the conductive layer 22 is connected, since the dummy terminal 3 is not connected to another conductor pattern, the connection terminal 2 of the printed wiring board 24 does not short-circuit.
【００１６】なお、前記ダミー端子３の代わりにダミー
端子３と同じ形状のものをソルダレジストで形成するこ
とも考えられるが、印刷法によるソルダレジストでは高
さの調整が難しく、ソルダレジスト高さを接続端子２の
高さと同等にするには、ソルダレジストをフィルム化し
たドライフィルムソルダレジストを使用する必要があ
る。また、これは高価となるので望ましくない。It is possible to form the dummy terminal 3 in the same shape as the dummy terminal 3 with solder resist, but it is difficult to adjust the height with the solder resist by the printing method, and the solder resist height is In order to make the height equal to the height of the connection terminal 2, it is necessary to use a dry film solder resist which is a film of the solder resist. Also, this is expensive and not desirable.
【００１７】（第２実施例）次に、第２実施例について
説明する。なお、本実施例では上記第１実施例で使用し
たヒートシールコネクタ２０に代えてフレキシブル配線
板を使用した。(Second Embodiment) Next, a second embodiment will be described. In this example, a flexible wiring board was used instead of the heat seal connector 20 used in the first example.
【００１８】フレキシブル配線板はヒートシールコネク
タ２０に比べてベースフィルムの肉厚が厚く形成されて
いる。従って、上記第１実施例のように接続端子２とダ
ミー端子３との間隔を０．１ｍｍ以上で形成してもよ
い。即ち、図４に示すように、例えば隣接する０．７ｍ
ｍの間隔を設けて接続端子２が形成された場合、その隣
接する接続端子２間に幅０．３ｍｍのダミー端子３を形
成し、その上面にてフレキシブル配線板Ｆを半田付けし
た結果、フレキシブル配線板Ｆが波打つことなくプリン
ト配線板１と接続された。The flexible wiring board has a base film thicker than that of the heat seal connector 20. Therefore, the distance between the connection terminal 2 and the dummy terminal 3 may be set to 0.1 mm or more as in the first embodiment. That is, as shown in FIG. 4, for example, 0.7m adjacent to each other
When the connection terminals 2 are formed with a space of m, a dummy terminal 3 having a width of 0.3 mm is formed between the adjacent connection terminals 2, and the flexible wiring board F is soldered on the upper surface of the dummy terminals 3, resulting in flexibility. Wiring board F was connected to printed wiring board 1 without waviness.
【００１９】（第３実施例）次に、第３実施例について
説明する。本実施例では上記第１実施例で使用したヒー
トシールコネクタ２０よりも肉厚の薄く形成されたヒー
トシールコネクタ２０を使用した。また、本実施例で使
用したプリント配線板１は、接続端子２の幅が０．２ｍ
ｍ、接続端子２の間隔及びダミー端子３の間隔が第１実
施例同様０．１ｍｍに形成されたものを使用した。そし
て、このプリント配線板１にヒートシールコネクタ２０
を熱圧着してもヒートシールコネクタ２０が波打つこと
なくプリント配線板１と接続された。(Third Embodiment) Next, a third embodiment will be described. In this embodiment, the heat seal connector 20 formed thinner than the heat seal connector 20 used in the first embodiment is used. The printed wiring board 1 used in this example has a connection terminal 2 having a width of 0.2 m.
m, the distance between the connection terminals 2 and the distance between the dummy terminals 3 were set to 0.1 mm as in the first embodiment. The heat seal connector 20 is attached to the printed wiring board 1.
The heat-seal connector 20 was connected to the printed wiring board 1 without waviness even when it was thermocompression bonded.
【００２０】従って、プリント配線板１に形成された接
続端子２及びダミー端子３の間隔は、ヒートシールコネ
クタ２０の厚さが薄くなるほど狭くしなくてもよい。な
お、本発明は上記実施例に限定されるものではなく、発
明の趣旨を逸脱しない範囲で例えばプリント配線板１上
に形成された接続端子とダミー端子３との間隔及び接続
端子２の幅、ダミー端子３の幅、さらにヒートシールコ
ネクタ２０の厚さを適宜変更してもよい。Therefore, the distance between the connection terminal 2 and the dummy terminal 3 formed on the printed wiring board 1 need not be narrowed as the thickness of the heat seal connector 20 becomes thinner. Note that the present invention is not limited to the above-described embodiment, and for example, the distance between the connection terminal formed on the printed wiring board 1 and the dummy terminal 3 and the width of the connection terminal 2 without departing from the spirit of the invention, The width of the dummy terminal 3 and the thickness of the heat seal connector 20 may be changed as appropriate.
【００２１】[0021]
【発明の効果】以上詳述したようにように、本発明のプ
リント配線板によればフィルム状接続部材を用いてプリ
ント配線板と他のデバイスとを接続する場合、フィルム
状接続部材の導体パターンとプリント配線板の接続端子
とを確実に接続できるとともに、フィルム状接続部材が
多少位置ズレしても回路の短絡を防止することができる
という優れた効果を奏する。As described above in detail, according to the printed wiring board of the present invention, when the printed wiring board is connected to another device by using the film-shaped connection member, the conductor pattern of the film-shaped connection member is used. And the connection terminal of the printed wiring board can be reliably connected, and a short circuit of the circuit can be prevented even if the film-shaped connection member is slightly displaced.
【図１】本発明を具体化した実施例のプリント配線板の
一部拡大平面図である。FIG. 1 is a partially enlarged plan view of a printed wiring board according to an embodiment of the present invention.
【図２】プリント配線板のパターン上にヒートシールコ
ネクタの導電層を一致させた状態の一部拡大平面図であ
る。FIG. 2 is a partially enlarged plan view showing a state in which a conductive layer of the heat seal connector is aligned with the pattern of the printed wiring board.
【図３】図２のＡ−Ａ線一部拡大断面図である。3 is a partially enlarged cross-sectional view taken along the line AA of FIG.
【図４】別例のフレキシブル配線板をプリント配線板に
接続したとき一部拡大断面図である。FIG. 4 is a partially enlarged cross-sectional view of another example of a flexible wiring board connected to a printed wiring board.
【図５】ヒートシールコネクタの一部拡大断面図であ
る。FIG. 5 is a partially enlarged sectional view of the heat seal connector.
【図６】従来技術のプリント配線板の一部拡大平面図で
ある。FIG. 6 is a partially enlarged plan view of a conventional printed wiring board.
【図７】ヒートシールコネクタが波打った状態でプリン
ト配線板に接続されたときの一部拡大断面図である。FIG. 7 is a partially enlarged cross-sectional view when the heat seal connector is connected to a printed wiring board in a wavy state.
１…プリント配線板、２…接続端子、３…ダミー端子 1 ... Printed wiring board, 2 ... Connection terminal, 3 ... Dummy terminal
Claims (2)
プリント配線板（１）と他のデバイスとを電気的に接続
するためのフィルム状接続部材との接続に使用される複
数の接続端子（２）を備えたプリント配線板であって、 前記接続端子（２）間に他の導体パターンと電気的に接
続されないダミー端子（３）を等間隔で形成したことを
特徴とするプリント配線板。1. A conductive circuit is formed on a flexible film,
A printed wiring board having a plurality of connection terminals (2) used for connecting a printed wiring board (1) and a film-like connecting member for electrically connecting another device, the connection terminal A printed wiring board, characterized in that dummy terminals (3) that are not electrically connected to other conductor patterns are formed between (2) at equal intervals.
ム上にカーボン等の導電材料で導体パターンを印刷した
ヒートシールコネクタである請求項１に記載のプリント
配線板。2. The printed wiring board according to claim 1, wherein the film-like connecting member is a heat seal connector in which a conductor pattern is printed on a thermoplastic film with a conductive material such as carbon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32077291A JPH05160559A (en) | 1991-12-04 | 1991-12-04 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32077291A JPH05160559A (en) | 1991-12-04 | 1991-12-04 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05160559A true JPH05160559A (en) | 1993-06-25 |
Family
ID=18125087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32077291A Pending JPH05160559A (en) | 1991-12-04 | 1991-12-04 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05160559A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100481239B1 (en) * | 2001-10-02 | 2005-04-07 | 엔이씨 엘씨디 테크놀로지스, 엘티디. | Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device |
| KR100545021B1 (en) * | 1999-12-31 | 2006-01-24 | 엘지.필립스 엘시디 주식회사 | LCD and its manufacturing method |
| KR100679514B1 (en) * | 2000-04-07 | 2007-02-07 | 엘지.필립스 엘시디 주식회사 | LCD Display |
| EP1951014A3 (en) * | 2007-01-26 | 2009-09-16 | Olympus Corporation | Junction structure of flexible substrate |
-
1991
- 1991-12-04 JP JP32077291A patent/JPH05160559A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100545021B1 (en) * | 1999-12-31 | 2006-01-24 | 엘지.필립스 엘시디 주식회사 | LCD and its manufacturing method |
| KR100679514B1 (en) * | 2000-04-07 | 2007-02-07 | 엘지.필립스 엘시디 주식회사 | LCD Display |
| KR100481239B1 (en) * | 2001-10-02 | 2005-04-07 | 엔이씨 엘씨디 테크놀로지스, 엘티디. | Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device |
| EP1951014A3 (en) * | 2007-01-26 | 2009-09-16 | Olympus Corporation | Junction structure of flexible substrate |
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