[go: up one dir, main page]

KR880014667A - Method and coating of semiconductor device coating by resin injection - Google Patents

Method and coating of semiconductor device coating by resin injection Download PDF

Info

Publication number
KR880014667A
KR880014667A KR1019880005249A KR880005249A KR880014667A KR 880014667 A KR880014667 A KR 880014667A KR 1019880005249 A KR1019880005249 A KR 1019880005249A KR 880005249 A KR880005249 A KR 880005249A KR 880014667 A KR880014667 A KR 880014667A
Authority
KR
South Korea
Prior art keywords
cavity
coating
semiconductor device
mold cavity
injection
Prior art date
Application number
KR1019880005249A
Other languages
Korean (ko)
Inventor
벨르렝 루씨앙
니즈보어 씨조르
Original Assignee
이반 밀러 레르너
엔.브이.필립스 글로 아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이반 밀러 레르너, 엔.브이.필립스 글로 아이람펜파브리켄 filed Critical 이반 밀러 레르너
Publication of KR880014667A publication Critical patent/KR880014667A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B29C45/345—Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음No content

Description

수지사출에 의한 반도체 장치 피복방법 및 주형Method and coating of semiconductor device coating by resin injection

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의한 방법을 실행하는 주형의 단면도, 제2도는 제1도에 도시된 주형의 중앙부분의 세부에 대한 평면도.1 is a cross-sectional view of a mold for carrying out the method according to the invention, and FIG. 2 is a plan view of the details of the central portion of the mold shown in FIG.

Claims (3)

금속도체의 단부는 주형공동으로부터 돌출되어 있고, 반도체 장치를 포함한 주형공동내에 수지를 사출함으로써 전기 접속된 금속 도체를 가진 상기 반도체 장치의 피복방법에 있어서, 주형공동과 이 공동까지 이르는 사출 채널은 수지사출이 있기 이전에 통기성 벽을 통해 주형공동안으로 연결된 진공 덕트에 의해 들어온 공기를 소개하고 또한 이 소개작용을 적어도 주형공동 안으로의 수지사출 작용시간 동안 지속된다는 것을 특징으로 하는 반도체 장치의 피복방법.An end portion of the metal conductor protrudes from the mold cavity, and in the coating method of the semiconductor device having the metal conductor electrically connected by injecting resin into the mold cavity including the semiconductor device, the injection cavity leading to the mold cavity and the cavity is made of resin. A method of coating a semiconductor device, characterized in that air is introduced by a vacuum duct connected through a breathable wall into a mold cavity prior to injection, and the introduction operation lasts at least for a resin injection action time into the mold cavity. 제1항에 있어서, 사출구가 통기성 벽에 인접한 위치에 있는 주형공동 안으로 돌출해 있으며 또한 사출흐름의 방향은 상기 공동을 둘러싼 통기성 벽의 표면에 거의 수직한다는 것을 특징으로 하고 상기 방법을 수행하는 주형.The mold according to claim 1, wherein the injection port protrudes into the mold cavity at a position adjacent the breathable wall and the direction of the injection flow is substantially perpendicular to the surface of the breathable wall surrounding the cavity. . 제2항에 있어서, 상기 공동에 인접한 통기성 벽의 표면은 금속도체의 단부가 돌출하여 있는 평면에 위치하며 또한 사출구는 두 인접 금속도체 사이에 있는 상기 평면에 돌출하여 있다는 것을 특징으로 하는 주형.3. The mold according to claim 2, wherein the surface of the breathable wall adjacent to the cavity is located in a plane in which the end of the metal conductor protrudes and the ejection opening projects in the plane between two adjacent metal conductors. ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019880005249A 1987-05-06 1988-05-06 Method and coating of semiconductor device coating by resin injection KR880014667A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8706395 1987-05-06
FR8706395A FR2615037B1 (en) 1987-05-06 1987-05-06 PROCESS AND MOLD FOR THE ENCAPSULATION OF A SEMICONDUCTOR DEVICE BY RESIN INJECTION

Publications (1)

Publication Number Publication Date
KR880014667A true KR880014667A (en) 1988-12-24

Family

ID=9350841

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880005249A KR880014667A (en) 1987-05-06 1988-05-06 Method and coating of semiconductor device coating by resin injection

Country Status (4)

Country Link
EP (1) EP0293954A1 (en)
JP (1) JPS63299349A (en)
KR (1) KR880014667A (en)
FR (1) FR2615037B1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2846773B2 (en) * 1992-09-01 1999-01-13 三菱電機株式会社 Resin sealing device and resin sealing method for semiconductor device
JP2524955B2 (en) * 1993-04-22 1996-08-14 トーワ株式会社 Method and apparatus for resin sealing molding of electronic parts
JP3214197B2 (en) * 1993-11-17 2001-10-02 トヨタ自動車株式会社 Gasket manufacturing method and gasket manufacturing apparatus
DE4340864C2 (en) * 1993-12-01 1996-08-01 Telefunken Microelectron Device and method for producing optoelectronic components
JP3956335B2 (en) * 2000-03-06 2007-08-08 シャープ株式会社 Semiconductor device manufacturing method using resin casting mold
US11318642B2 (en) 2019-12-20 2022-05-03 Eaton Intelligent Power Limited Permeable wall encapsulation mold

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1462622A (en) * 1973-02-20 1977-01-26 Clearex Plastics Ltd Vacuum moulding
GB2123334A (en) * 1982-07-14 1984-02-01 Coolmation Limited Mould cooling means
IE56790B1 (en) * 1983-06-29 1991-12-18 Motorola Inc Electronic device method using a leadframe with an integral mold vent means
DE3424742C1 (en) * 1984-07-05 1985-11-14 SKF GmbH, 8720 Schweinfurt Injection mould or casting mould for producing a plastics pocket-type bearing cage for radial cylindrical roller bearings and pocket-type bearing cage produced in this mould
JPS6185829A (en) * 1984-10-03 1986-05-01 Michio Osada Transfer resin molding process of semiconductor element
JPS61117842A (en) * 1984-11-14 1986-06-05 Hitachi Micro Comput Eng Ltd Molding equipment

Also Published As

Publication number Publication date
EP0293954A1 (en) 1988-12-07
JPS63299349A (en) 1988-12-06
FR2615037B1 (en) 1990-04-27
FR2615037A1 (en) 1988-11-10

Similar Documents

Publication Publication Date Title
US4801093B1 (en) Push-nipple for medical sprayer
KR890006331A (en) Mold outlet plug
KR900015878A (en) Molding equipment for molding
EP0357777A4 (en) Method of inserting piece into preform mouth forming mold
KR960031109A (en) Method and apparatus for resin molding
DE69021479D1 (en) Interconnects.
KR890012722A (en) Injection Molding Device
KR880014667A (en) Method and coating of semiconductor device coating by resin injection
KR900016774A (en) Optical fiber cross section processing method and device
ATE200641T1 (en) NEEDLE CLOSURE NOZZLE WITH INJECTION MOLD AND CLOSURE NEEDLE
KR910009529A (en) Packing device heating device
KR900011559A (en) Thermoplastic Pipe Manufacturing Equipment
KR940008163A (en) Electrical connector housing with contact insert
ATE34931T1 (en) DEVICE FOR FILLING EVACUATED CAVIES IN MATERIAL RESPECTIVELY. IN BODIES.
JPS6472821A (en) Platelike injection melded object
KR910011419A (en) Molded Parts and Molds
ES2143127T3 (en) CONNECTION DEVICE.
KR940002029A (en) Injection Molding Apparatus and Molds for Use in Injection Molding
ES8302353A1 (en) Metal-capped electrical insulator and method of making same
KR900700819A (en) Curing Device of Insulation Chute
JPS6423561A (en) Semiconductor package
GB961420A (en) Improvements in or relating to methods of manufacturing glass objects
KR860003363Y1 (en) Mold for Covering Electric Wire
JPH03167810A (en) Casting die equipment
JPH01132717U (en)

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19880506

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid