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KR870001334A - 반금속의 전극을 사용한 방전 가공에 의한 표면층의 형성방법 - Google Patents

반금속의 전극을 사용한 방전 가공에 의한 표면층의 형성방법 Download PDF

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Publication number
KR870001334A
KR870001334A KR1019860003307A KR860003307A KR870001334A KR 870001334 A KR870001334 A KR 870001334A KR 1019860003307 A KR1019860003307 A KR 1019860003307A KR 860003307 A KR860003307 A KR 860003307A KR 870001334 A KR870001334 A KR 870001334A
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South Korea
Prior art keywords
electric discharge
discharge machining
surface layer
semimetal
electrode
Prior art date
Application number
KR1019860003307A
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English (en)
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KR910003590B1 (ko
Inventor
마사히꼬 스즈끼
마사히고 스즈기
나가오 사이또
나가오 사이도
나오따께 모리
나오다게 모리
히데아끼 다까하시
히테아기 다가하시
데쯔오 쇼지
테즈오 쇼우지
Original Assignee
미쯔비시덴끼 가부시끼가이샤
시기 모리야
마사히꼬 스즈끼
미쓰비시덴기 가부시기가이샤
나오따께 모리
마사히고 스즈기
나오다게 모리
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쯔비시덴끼 가부시끼가이샤, 시기 모리야, 마사히꼬 스즈끼, 미쓰비시덴기 가부시기가이샤, 나오따께 모리, 마사히고 스즈기, 나오다게 모리 filed Critical 미쯔비시덴끼 가부시끼가이샤
Publication of KR870001334A publication Critical patent/KR870001334A/ko
Application granted granted Critical
Publication of KR910003590B1 publication Critical patent/KR910003590B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/04—Welding for other purposes than joining, e.g. built-up welding
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/06—Surface hardening
    • C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

내용 없음.

Description

반금속의 전극을 사용한 방전 가공에 의한 표면층의 형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예 1에 의한 시험 결과를 도시한 애노드 분극 곡선도.
제2도는 그 에너지 분산법에 의한 선분석도.
제3도는 실리콘 전극으로 방전 가공한 불수강(SUS304)의 금속 조직의 현미경 사진으로서,
(a)는 SEM상에서의 금속 조직의 현미경 사진,
(b)는 EMPA에 의한 선분석에서의 금속 조직의 현미경 사진.

Claims (3)

  1. 방전 가공의 전극으로서 반금속을 사용하여, 액체중 또는 까스중에 있어서 방전 가공을 행하고, 피가공물 표면에 어몰퍼스 합금층 혹은 미세한 결정 구조를 가진 표면층을 형성하는 것을 특징으로 하는 반금속의 전극을 사용한 방전 가공에 의한 표면층의 형성방법.
  2. 반금속은, 실리콘 또는 티타늄 카바이트인 것을 특징으로 하는 특허청구의 범위 제1항 기재의 반도체의 전극을 사용한 방전 가공에 의한 표면층의 형성방법.
  3. 피가공물은, 합금강, 합금 또는 순금속인 것을 특징으로 하는 특허청구의 범위 제1항 또는 제2항 기재의 반금속의 전극을 사용한 방전 가공에 의한 표면층의 형성방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860003307A 1985-07-22 1986-04-29 방전가공에 의한 표면층의 형성방법 KR910003590B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP161566 1985-07-22
JP60-161566 1985-07-22
JP60161566A JPS6224916A (ja) 1985-07-22 1985-07-22 放電加工による表面層の形成方法

Publications (2)

Publication Number Publication Date
KR870001334A true KR870001334A (ko) 1987-03-13
KR910003590B1 KR910003590B1 (ko) 1991-06-07

Family

ID=15737545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860003307A KR910003590B1 (ko) 1985-07-22 1986-04-29 방전가공에 의한 표면층의 형성방법

Country Status (5)

Country Link
US (1) US4948625A (ko)
EP (1) EP0211310B1 (ko)
JP (1) JPS6224916A (ko)
KR (1) KR910003590B1 (ko)
DE (1) DE3682718D1 (ko)

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JP2609342B2 (ja) * 1990-03-23 1997-05-14 長男 斎藤 放電加工方法及び放電加工装置並びに粉体
US5434380A (en) * 1990-07-16 1995-07-18 Mitsubishi Denki Kabushiki Kaisha Surface layer forming apparatus using electric discharge machining
JP2536676B2 (ja) * 1990-07-30 1996-09-18 日本電気株式会社 マイクロピン集合体及びその製造方法
US5585138A (en) * 1991-07-30 1996-12-17 Nec Corporation Micropin array and production method thereof
JP3393885B2 (ja) * 1992-11-02 2003-04-07 信之 高橋 粉末分散放電加工液および放電加工法
JP3002621B2 (ja) * 1993-10-15 2000-01-24 尚武 毛利 放電加工による表面処理方法およびその装置
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US20070104585A1 (en) * 2003-06-10 2007-05-10 Ishikawajima-Harima Heavy Industries Co., Ltd. Metal component, turbine component, gas turbine engine, surface processing method, and steam turbine engine
TWI258532B (en) * 2003-06-10 2006-07-21 Ishikawajima Harima Heavy Ind Turbine component, gas turbine engine, method for manufacturing turbine component, surface processing method, vane component, metal component, and steam turbine engine
CN1826431B (zh) * 2003-06-11 2011-12-28 石川岛播磨重工业株式会社 机械零件的修理和制造方法及修复机械零件的制造方法
RU2325257C2 (ru) 2003-06-11 2008-05-27 Исикавадзима-Харима Хэви Индастриз Ко., Лтд. Способ производства металлического изделия, металлическое изделие, способ соединения металлических деталей и конструкция с соединением
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Also Published As

Publication number Publication date
EP0211310A2 (en) 1987-02-25
JPH0513765B2 (ko) 1993-02-23
EP0211310B1 (en) 1991-12-04
KR910003590B1 (ko) 1991-06-07
US4948625A (en) 1990-08-14
DE3682718D1 (de) 1992-01-16
EP0211310A3 (en) 1988-03-02
JPS6224916A (ja) 1987-02-02

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