KR800000738Y1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- KR800000738Y1 KR800000738Y1 KR760001000U KR760001000U KR800000738Y1 KR 800000738 Y1 KR800000738 Y1 KR 800000738Y1 KR 760001000 U KR760001000 U KR 760001000U KR 760001000 U KR760001000 U KR 760001000U KR 800000738 Y1 KR800000738 Y1 KR 800000738Y1
- Authority
- KR
- South Korea
- Prior art keywords
- connector
- semiconductor element
- solder
- semiconductor device
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
내용 없음.No content.
Description
제1도는 종래의 반도체 장치의 땜납용융 전을 표시한 측면도.1 is a side view showing before solder melting of a conventional semiconductor device.
제2도는 본 고안에 관한 반도체 장치의 땜납용융 표시한 측면도.2 is a side view showing the solder melting of the semiconductor device according to the present invention.
제3도는 그 땜잡용융 표시한 측면도.3 is a side view showing the solder melting.
제4도는 그 중요부의 확대 사시도이다.4 is an enlarged perspective view of the important part.
본 고안은 반도체 장치, 특히 반도체 소자와 리이드선을 리본형상으로된 코넥터의 양단부를 납땜하는 것에 의하여, 접속되게한 반도체 장치의개량에 과과한 것이다.The present invention is excessive to the improvement of the semiconductor device which was made to be connected by soldering both ends of a semiconductor device, especially a semiconductor element and a lead wire-shaped connector.
종래 이 종류의 반도체 장치는, 제1도 표시한 것과 같이, 스템(1)에 설치된 리이드선(2)에, 한끝에 리이드선 삽통공(4)과 리이드선 압압면(5)을 설치한 코넥터(3)와 땜납제 예를 들면 링 땜납(6)을 순차로 삽통하여, 이 코넥터(3)의 타단에서, 스템(1)위에 고착되는 반도체 소자(7)를, 반도체 소자(7)와 스템(1) 및 코넥터(3)의 각각 사이에 땜납편(8), (9)을 사이에 두고 압압하고, 이것을 가열로 안에 넣어서, 땜납(6), (8), (9)을 용융시키느 것에 의하여 고착시켜서 제조하고 있다.Conventionally, this kind of semiconductor device has a connector in which a lead wire insertion hole 4 and a lead wire pressing surface 5 are provided at one end of a lead wire 2 provided in the stem 1, as shown in FIG. (3) and a soldering agent, for example, ring solder 6, are inserted in sequence, and at the other end of the connector 3, the semiconductor element 7 fixed onto the stem 1 is connected to the semiconductor element 7 and the stem. The solder pieces 8 and 9 are sandwiched between each one of the connector 1 and the connector 3 and placed in a heating furnace to melt the solders 6, 8 and 9. It adheres by and manufactures.
그렇지만 이와같이 하면, 땜납 특히 반도체 소자(7)와 코넥터(3) 사이에 개재되는 땜납편(8)은, 그 용융시, 코넥터(3)의 위쪽으로는 타고 올라가지 못하여, 코넥터(3)의 반도체 소자(7)에의 고착 면적이 적게 되어, 고착 강도가 증대되지 않고, 또 심할 경우, 특히 코넥터(3)의 압압력이 작게될 경우에는, 코넥터(3)가 반도체 소자(7)에 납땜되지 않는다고 하는 일이 있었다.However, if it does in this way, the solder piece 8 interposed between solder, especially the semiconductor element 7 and the connector 3, will not ride up the connector 3 at the time of the melting, and the semiconductor element of the connector 3 It is said that the connector 3 is not soldered to the semiconductor element 7 when the fixing area to (7) becomes small, the fixing strength does not increase, and when the pressing force of the connector 3 becomes small, especially when the pressing force of the connector 3 becomes small. There was a thing.
본 고안은 상기한 결점을 개선하기 위하여 제안된 것으로, 이하 그 1실시예를 도면에 의하여 설명한다.The present invention has been proposed to improve the above-described drawbacks, one embodiment of which will be described below with reference to the drawings.
즉 제2도는 땜납용융 전율, 제3도는 땜납용융 후를, 또 제4도는 땜납용융 후의 중요부를 표시한 것으로서, (1)은 유리를 사이에 두고 리이드선(2), (2)을 설치한 스템, (3)은 일단에 리이드선 삽통 구멍(4)고, 리이드선 압압편(5)을 설치한 리본 형상으로된 코넥터, (6)은 리이드선(2)에 삽통되고, 이것을 용융하는 것에 의하여, 코넥터(3)와 리이드선(2)을 고착시키는 링 땜납, (7)은 스템(1)위에 그들 사이에 개재하는 땜납편(9)을 용융하는 것에 의하여 고착되는 반도체 소자, (8)은 반도체 소자(7)와 코넥터(3) 사이에 개재되고, 이것을 용융하는 것에 의하여, 양자를 고착시키는 땜납편이다.FIG. 2 shows the solder melting rate, FIG. 3 shows the after solder melting, and FIG. 4 shows the important parts after the solder melting. (1) shows the lead wires (2) and (2) with the glass interposed therebetween. The stem, (3) has a lead wire insertion hole (4) at one end, and a ribbon-shaped connector in which the lead wire pressing piece (5) is provided, (6) is inserted into the lead wire (2), A ring solder for fixing the connector 3 and the lead wire 2 to each other, a semiconductor element 7 to be fixed by melting a solder piece 9 interposed therebetween on the stem 1, 8 Silver is interposed between the semiconductor element 7 and the connector 3, and melt | dissolves this, and is a solder piece which fixes both.
여기까지는 종래와 동일하지만, 본 고안에 있어서는, 코넥터(3)의 반도체 소자(7)에의 납땜 위치로부터, 길이 방향으로 연장되는 슬릿(10)을 형성시키고, 이 슬릿(10)에 의하여, 땜납편(8)의 용융물을 모관형상에 의하여, 코넥터(3)의 위쪽으로 올라가게 한다.Until now, although it is the same as before, in this invention, the slit 10 extended in the longitudinal direction from the soldering position of the connector 3 to the semiconductor element 7 is formed, and this slit 10 makes the solder piece The melt of (8) is raised above the connector 3 by the capillary shape.
본 고안은 이상과 같이 구성하는 것에 의하여, 코넥터의 반도체 소자에의 고착 면적이 증대되고, 고착 강도를 대폭적으로 증대시킬 수가 있으며, 또 코넥터의 반도체 소자에의 압압력이 낮아도, 완전히 고착을 할 수 있다.According to the present invention, the fixing area of the connector to the semiconductor element can be increased, and the bonding strength can be greatly increased, and even if the pressure of the connector to the semiconductor element is low, the fixing can be performed completely. have.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR760001000U KR800000738Y1 (en) | 1976-02-17 | 1976-02-17 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR760001000U KR800000738Y1 (en) | 1976-02-17 | 1976-02-17 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR800000738Y1 true KR800000738Y1 (en) | 1980-05-30 |
Family
ID=19202201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR760001000U Expired KR800000738Y1 (en) | 1976-02-17 | 1976-02-17 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR800000738Y1 (en) |
-
1976
- 1976-02-17 KR KR760001000U patent/KR800000738Y1/en not_active Expired
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