KR20240149708A - Photosensitive resin composition, photosensitive resin layer using the same and color filter - Google Patents

Abstract

The present disclosure relates to a photosensitive resin composition, a photosensitive resin film manufactured using the same, and a color filter. One embodiment provides a photosensitive resin composition comprising: (A) an additive; (B) a binder resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a colorant; and (F) a solvent, wherein the additive comprises a leveling agent, and the leveling agent is contained in an amount of 50 ppm to 1,000 ppm based on the total amount of the photosensitive resin composition.

Description

Photosensitive resin composition, photosensitive resin film and color filter manufactured using the same {PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND COLOR FILTER}

The present invention relates to a photosensitive resin composition, a photosensitive resin film manufactured using the same, and a color filter.

Image sensors are semiconductors that convert photons into electrons so that they can be displayed on a display or stored in a storage device.

The above image sensors are classified into charge coupled device (CCD) image sensors and complementary metal oxide semiconductor (CMOS) image sensors depending on the manufacturing process and application method.

The above complementary metal oxide semiconductor image sensor (CMOS Image Sensor, CIS) is a non-memory semiconductor that converts the image received by the camera into a digital signal, and is an assembly of pixels such as a color filter, photodiode, and amplifier.

The above color filter includes filter segments of additive primary colors of red, green, and blue. The above color filter can be manufactured by coating a photosensitive resin composition containing a coloring agent on a substrate or a lower photosensitive resin film, exposing a pattern of a desired shape to light, developing, and thermally curing through post-baking to form a photosensitive resin film, and repeating this series of processes.

The above coating generally uses spin coating, which has the advantage of forming a uniform thin film at low cost, but also causes phenomena that deteriorate the coating properties, such as an edge bead phenomenon in which the photosensitive resin composition clumps at the edge of the substrate or lower photosensitive resin film, and a phenomenon in which the photosensitive resin composition spreads on an uneven substrate or lower photosensitive resin film surface, resulting in defects.

In general, the above phenomena are prevented through pretreatment of the substrate or lower photosensitive resin film - the EBR (Edge bead Removal) process that removes the edge with a thinner, a cleaning process, etc. However, there is a problem that the process cost increases depending on the pretreatment of the substrate or lower photosensitive resin film, and there is a limit to improving the coating characteristics even if the pretreatment is performed regardless of the process cost.

One embodiment aims to improve the coating properties of a color filter by controlling the content of a leveling agent in a photosensitive resin composition rather than by preprocessing the wafer.

In one embodiment, a photosensitive resin composition is provided, which comprises (A) an additive; (B) a colorant; (C) a binder resin; (D) a photopolymerizable compound; (E) a photopolymerization initiator; and (F) a solvent, wherein the additive comprises a leveling agent, and the leveling agent is contained in an amount of 50 ppm to 1,000 ppm of the total amount of the photosensitive resin composition.

The above leveling agent may be included in an amount of 100 ppm to 400 ppm of the total amount of the photosensitive resin composition.

The above leveling agent may be a fluorinated surfactant.

The above fluorinated surfactant may be a nonionic fluorinated surfactant.

The above additives may further include a silane coupling agent, an antioxidant, a dispersant, or a combination thereof.

The above additive may include 1 to 50 wt% of the leveling agent, 30 to 80 wt% of the silane coupling agent, and 10 to 30 wt% of the antioxidant, out of the total amount of solid content excluding the dispersion medium.

The above binder resin may include an acrylic binder resin, an epoxy binder resin, or a combination thereof.

The weight average molecular weight of the above binder resin may be from 5,000 g/mol to 15,000 g/mol.

The weight ratio of the leveling agent and the colorant may be 0.01:100 to 1:100.

The above colorant may include a blue pigment, a purple pigment, or a combination thereof.

The above solvent may include two or more solvents having different boiling points.

The solvent may include two or more solvents selected from propylene glycol monomethyl ether acetate (PGMEA), n-butyl alcohol (n-BA), and diethylene glycol methyl ethyl ether (MEDG).

The photosensitive resin composition may include, based on the total amount of the photosensitive resin composition, 1,600 ppm to 3,000 ppm of the (A) additive; 30 wt% to 70 wt% of the (B) colorant; 1 wt% to 20 wt% of the (C) binder resin; 1 wt% to 20 wt% of the (D) photopolymerizable compound; 0.1 wt% to 5 wt% of the (E) photopolymerization initiator; and the remainder of the (F) solvent.

The above photosensitive resin composition may have a viscosity of 1.5 cP to 3.8 cP at 25°C.

In another embodiment, a photosensitive resin film manufactured using the photosensitive resin composition is provided.

In another embodiment, a color filter including the photosensitive resin film is provided.

In another embodiment, a CMOS image sensor including the color filter is provided.

Specific details of other aspects of the present invention are included in the detailed description below.

One embodiment has the effect of improving the coating properties of a color filter - the uniformity of the coating. Specifically, one embodiment can improve the uniformity of the coating while improving coating unevenness by controlling the content of a leveling agent in a photosensitive resin composition rather than pre-processing the wafer.

Accordingly, a photosensitive resin film and a color filter manufactured using the photosensitive resin composition of one embodiment have excellent surface smoothness and can contribute to realizing image quality of an image sensor at a constant level.

Figure 1 schematically illustrates an exposure pattern according to an evaluation example.
Figure 2 illustrates a thickness profile according to an evaluation example.

Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples, and the present invention is not limited thereby, and the present invention is defined only by the scope of the claims described below.

(Photosensitive resin composition)

One embodiment provides a photosensitive resin composition comprising: (A) an additive; (B) a colorant; (C) a binder resin; (D) a photopolymerizable compound; (E) a photopolymerization initiator; and (F) a solvent.

(A) Additive

The above additives include a leveling agent.

Here, the term “leveling agent” refers to an additive that improves the fluidity of the photosensitive resin composition by adjusting the evaporation rate of the solvent or preventing the aggregation of the colorant.

As previously pointed out, during the process of coating the photosensitive resin composition onto a substrate or an underlying photosensitive resin film, several phenomena occur that deteriorate the coating properties.

One embodiment aims to improve the coating properties of a color filter by controlling the content of a leveling agent in a photosensitive resin composition rather than by preprocessing the wafer.

It is generally known that adding a leveling agent to a photosensitive resin composition helps to uniformly coat a substrate or a lower photosensitive resin film. However, the uniformity of the coating may vary depending on the content of the leveling agent in the photosensitive resin composition.

In one embodiment, by using a leveling agent and optimizing its content, the photosensitive resin composition can be uniformly coated on a substrate or a lower photosensitive resin film. Accordingly, the photosensitive resin film and color filter manufactured using the photosensitive resin composition of one embodiment have excellent surface smoothness and can contribute to implementing the image quality of the image sensor at a constant level.

In one embodiment, the leveling agent defines only a solid state material.

As the content of the leveling agent increases, the surface tension of the resin composition of the photosensitive resin composition increases, so that the in-wafer thickness dispersion of the color filter specimen decreases, while the contact angle and unevenness increase. Here, the contact angle and unevenness of the color filter specimen and the in-wafer thickness dispersion are traded off.

Specifically, when the content of the leveling agent in the total amount of the photosensitive resin composition is less than 50 ppm, the in-wafer thickness dispersion of the color filter specimen is significantly high. In contrast, when the content of the leveling agent in the total amount of the photosensitive resin composition exceeds 1,000 ppm, the contact angle and unevenness of the color filter specimen significantly increase, thereby reducing the yield.

More specifically, the leveling agent is included in an amount of 50 ppm to 1,000 ppm, specifically 50 ppm to 800 ppm, for example 100 ppm to 400 ppm, of the total amount of the photosensitive resin composition.

Within the above range, as the content of the leveling agent increases, the in-wafer thickness distribution decreases and the anhydride increases, so that a pattern of an overall even thickness can be obtained.

A more detailed description will be given later, but one embodiment is a red photosensitive composition, which, when forming a pattern in which green, blue, and red colors are laminated in that order, can form a red photosensitive resin film having excellent surface smoothness in a state in which green and blue lower photosensitive resin films are formed.

Accordingly, the (red) photosensitive resin film and color filter manufactured using the photosensitive resin composition of one embodiment have excellent surface smoothness and can contribute to realizing the image quality of the image sensor at a constant level.

The above leveling agent may be a fluorinated surfactant.

The above fluorine-based surfactant may be manufactured by substituting a water-soluble reactive group at the terminal of a hydrophobic straight-chain molecule containing a fluorine atom, and may have better surface tension resistance than other surfactants.

Meanwhile, surfactants can generally be classified into ionic surfactants and nonionic surfactants depending on whether the hydrophilic portion is ionic. The fluorinated surfactant may be a nonionic fluorinated surfactant whose hydrophilic portion is not ionic.

For example, as the nonionic fluorinated surfactant, DIC's F-556, F-554, F-557, F-559, F-560, F-563, RS-72-K, R-40, R-41, R-43, etc. can be used.

The above additives may further include, in addition to the leveling agent, a silane coupling agent, an antioxidant, a dispersing medium, or a combination thereof.

The total additive may include the leveling agent in an amount of 1 wt% to 50 wt%, 3 wt% to 40 wt%, or 5 wt% to 25 wt%, of the total solid content excluding the dispersant; the coupling agent may include 30 wt% to 80 wt%, 40 wt% to 75 wt%, or 55 wt% to 70 wt%; and the antioxidant may include 10 wt% to 30 wt%, 15 wt% to 28 wt%, or 20 wt% to 25 wt%.

When the content of each component in the above overall additive satisfies the above range, the leveling agent is uniformly dispersed in the photosensitive resin composition, and further, the surface smoothness of the photosensitive resin film and color filter manufactured using the photosensitive resin composition can be increased.

The above coupling agent may have a reactive substituent to improve adhesion with a substrate or an underlying photosensitive resin film.

The above coupling agent may be a silane coupling agent, and examples of the silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy propyl trimethoxysilane, β-epoxycyclohexyl)ethyl trimethoxysilane, and the like, and these may be used alone or in combination of two or more.

The above antioxidant can remove acrylate radicals generated when operating a device such as CIS, and thus prevent a decrease in the operating life of the device at room temperature. In particular, the acrylate radicals are generated by heat, and the above antioxidant does not function as an antioxidant before heat curing and functions as an antioxidant only after heat curing. Therefore, it can prevent a decrease in the life characteristics of the device without significantly affecting other characteristics of the device.

Specifically, the antioxidants include hydroquinone, hydroquinone monomethyl ether, pyrogallol, t-butylcatechol, etc., and these may be used alone or in combination of two or more.

In one embodiment, the leveling agent as well as the colorant define only a solid-state material, and the weight ratio of the leveling agent and the colorant may be 0.01:100 to 1:100, specifically 0.1:100 to 0.8:100, or 0.3:100 to 0.6:100.

In the above range, the content of the leveling agent relative to the colorant is appropriately controlled so that the photosensitive resin composition can be uniformly coated on the substrate or the lower photosensitive resin film. However, as the content of the leveling agent relative to the colorant in the above range increases, the uniformity increases, and as it decreases, the uniformity may also decrease.

Considering this trade-off relationship, the weight ratio of the leveling agent and the colorant can be selected within the above range.

The above additive may further include an additive of malonic acid, 3-amino-1,2-propanediol, a surfactant, a radical polymerization initiator, or a combination thereof.

The above total additives may be included in an amount of 1,000 ppm to 3,000 ppm, specifically 1,500 ppm to 2,500 ppm, for example 1,600 ppm to 1,900 ppm, based on the total amount of the photosensitive resin composition. In this range, the photosensitive resin film and color filter manufactured using the photosensitive resin composition have excellent surface smoothness and can contribute to realizing the image quality of the image sensor at a constant level.

(B) Colorant

The photosensitive resin composition of one embodiment may include a pigment as a colorant.

The pigments that can be used include red pigment, purple pigment, green pigment, blue pigment, yellow pigment, black pigment, etc.

The above red pigment may be C.I. Red Pigment 254, C.I. Red Pigment 255, C.I. Red Pigment 264, C.I. Red Pigment 270, C.I. Red Pigment 272, C.I. Red Pigment 177, C.I. Red Pigment 89, etc. within the Color Index, and these may be used alone or in a mixture of two or more, but are not necessarily limited thereto.

The above purple pigment may be C.I. Violet Pigment 23 (V.23), C.I. Violet Pigment 29, Dioxazine Violet, First Violet B, Methyl Violet Lake, Indanthrene Brilliant Violet, etc. within the Color Index, and these may be used alone or in combination of two or more, but are not necessarily limited thereto.

The above green pigment may be C.I. Green Pigment 7, C.I. Green Pigment 36, C.I. Green Pigment 58, C.I. Green Pigment 59, etc. within the Color Index, and may be used alone or in combination of two or more, but is not necessarily limited thereto.

The above blue pigment may be a copper phthalocyanine pigment such as C.I. Blue Pigment 15:6, C.I. Blue Pigment 15, C.I. Blue Pigment 15:1, C.I. Blue Pigment 15:2, C.I. Blue Pigment 15:3, C.I. Blue Pigment 15:4, C.I. Blue Pigment 15:5, C.I. Blue Pigment 15:6, C.I. Blue Pigment 16 within the Color Index, and these may be used alone or in a mixture of two or more thereof, but are not necessarily limited thereto.

The above yellow pigment may be an isoindoline pigment such as C.I. Yellow Pigment 185, C.I. Yellow Pigment 139, etc. within the Color Index, a quinophthalone pigment such as C.I. Yellow Pigment 138, etc., a nickel complex pigment such as C.I. Yellow Pigment 150, etc., and these may be used alone or in a mixture of two or more, but are not necessarily limited thereto.

The above black pigment may be aniline black, perylene black, titanium black, carbon black, etc. within the Color Index, and may be used alone or in a mixture of two or more thereof, but is not necessarily limited thereto.

Specifically, the colorant may include a blue pigment, a purple pigment, or a combination thereof to realize a blue color. More specifically, the pigment may be a mixture containing a blue pigment and a purple pigment in a weight ratio of 95:5 to 60:40, 90:10 to 70:30, or 85:15 to 75:25.

The above pigment may be included in a near-infrared absorbent resin composition in the form of a dispersion. Such a pigment dispersion may be composed of the pigment, a solvent, a dispersant, a dispersion resin, etc.

As the above solvent, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, etc. can be used, and among these, propylene glycol methyl ether acetate can be preferably used.

The above dispersant helps the pigment to be uniformly dispersed in the dispersion, and any nonionic, anionic or cationic dispersant can be used. Specifically, polyalkylene glycol or its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkyl amide alkylene oxide adduct, alkyl amine, etc. can be used, and these can be used alone or in mixture of two or more.

The above dispersion resin can use an acrylic resin containing a carboxyl group, which can not only improve the stability of the pigment dispersion but also improve the patternability of the pixel.

The above colorant may further include a dye while including the pigment, and in this case, the resin composition of the above embodiment may be a hybrid composition. In addition, the dye may include, but is not particularly limited to, a metal complex dye.

The above metal complex dye can use a compound having maximum absorbance in the wavelength range of 200 nm to 650 nm, and in order to match the color coordinates to the combination of pigments, any color metal complex dye that dissolves in an organic solvent can be used as long as it is a compound having absorbance in the above range.

Specifically, the metal complex dye may be a green dye having maximum absorbance in a wavelength range of 530 nm to 680 nm, a yellow dye having maximum absorbance in a wavelength range of 200 nm to 400 nm, an orange dye having maximum absorbance in a wavelength range of 300 nm to 500 nm, a red dye having maximum absorbance in a wavelength range of 500 nm to 650 nm, or a combination thereof.

The above metal complex dye may be a direct dye, an acid dye, a basic dye, an acid mordant dye, a sulfur dye, a reduction dye, an azoic dye, a disperse dye, a reactive dye, an oxidation dye, an oil dye, an azo dye, an anthraquinone dye, an indigoid dye, a carbonium ion dye, a phthalocyanine dye, a nitro dye, a quinoline dye, a cyanine dye, a polymethine dye, or a combination thereof.

The above metal complex dye may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

The above metal complex dyes include C.I. solvent dyes such as C.I. solvent green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35; C.I. acid dyes such as C.I. acid green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109; C.I. C.I. direct dyes such as Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82; C.I. basic dyes such as C.I. Basic Green 1; C.I. mordant dyes such as C.I. mordant green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41, 43, 53; green pigments such as C.I. Pigment Green 7, 36, 58; A complex of at least one selected from the group consisting of Solvent Yellow 19, Solvent Yellow 21, Solvent Yellow 25, Solvent Yellow 79, Solvent Yellow 82, Solvent Yellow 88, Solvent Orange 45, Solvent Orange 54, Solvent Orange 62, Solvent Orange 99, Solvent Red 8, Solvent Red 32, Solvent Red 109, Solvent Red 112, Solvent Red 119, Solvent Red 124, Solvent Red 160, Solvent Red 132 and Solvent Red 218 and the metal ion may be used.

The dye including the metal complex may have a solubility of 5 or more, and specifically 5 to 10, in a solvent used in the photosensitive resin composition according to one embodiment, that is, a solvent described below. The solubility may be obtained by the amount (g) of the dye dissolved in 100 g of the solvent. When the solubility of the dye including the metal complex is within the above range, compatibility and coloring power with other components forming the photosensitive resin composition according to one embodiment can be secured, and precipitation of the dye can be prevented.

The solvent may be, for example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

As it has the above specific range, it can be usefully used in color filters such as LCDs and LEDs that exhibit high brightness and high contrast ratio at desired color coordinates.

The dye containing the metal complex may be included in an amount of 0.01 wt% to 1 wt%, for example, 0.01 wt% to 0.5 wt%, based on the total amount of the photosensitive resin composition. When the dye containing the metal complex is used in the above range, high brightness and contrast ratio can be exhibited at a desired color coordinate.

When the above dye and the above pigment are mixed and used, they can be mixed and used in a weight ratio of 0.1:99.9 to 99.9:0.1, specifically, in a weight ratio of 1:9 to 9:1. When mixed in the above weight ratio range, chemical resistance and maximum absorption wavelength can be controlled within an appropriate range, and high brightness and contrast ratio can be expressed at a desired color coordinate.

The colorant may be included in an amount of 30 wt% to 70 wt%, specifically 35 wt% to 65 wt%, for example 40 wt% to 50 wt%, based on the total amount of the photosensitive resin composition. When the colorant is included within the above range, the coloring effect and developability are excellent.

(C) Binder resin

The above photosensitive resin composition may include a binder resin, and the binder resin may include an acrylic binder resin.

The above acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

The above first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5 wt% to 50 wt%, for example, 10 wt% to 40 wt%, based on the total amount of the acrylic binder resin.

The above second ethylenically unsaturated monomer is selected from the group consisting of aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzyl methyl ether; unsaturated carboxylic acid ester compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxy butyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylic acid amino alkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; Examples thereof include cyanide vinyl compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; etc., and these may be used alone or in combination of two or more thereof.

Specific examples of the above acrylic resin include, but are not limited to, (meth)acrylic acid/benzyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene copolymer, (meth)acrylic acid/benzyl methacrylate/2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid/benzyl methacrylate/styrene/2-hydroxyethyl methacrylate copolymer, and the like. These may be used singly or in combination of two or more.

The above binder resin may include an epoxy-based binder resin.

The above binder resin can improve heat resistance by further including an epoxy-based binder resin. The epoxy-based binder resin may include, but is not limited to, phenol novolac epoxy resin, tetramethyl biphenyl epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, or a combination thereof.

Furthermore, the binder resin including the above epoxy-based binder resin ensures dispersion stability of a coloring agent such as a pigment, which will be described later, and helps form pixels of a desired resolution during the developing process.

The above epoxy-based binder resin may be included in an amount of 1 wt% to 10 wt%, for example, 5 wt% to 10 wt%, based on the total amount of the binder resin. When the epoxy-based binder resin is included in the above range, the film remaining rate and chemical resistance may be significantly improved.

The epoxy equivalent weight of the above epoxy binder resin may be 150 g/eq to 200 g/eq. When the epoxy binder resin having an epoxy equivalent weight within the above range is included in the binder resin, there is a beneficial effect on improving the hardening degree of the formed pattern and fixing the colorant within the structure in which the pattern is formed.

The above binder resin can be dissolved in a solvent described below in a solid form to form a photosensitive resin composition. In this case, the binder resin in a solid form can be about 10 wt% to 50 wt%, for example, 20 wt% to 40 wt%, based on the total amount of the binder resin solution dissolved in the solvent.

The above binder resin may be included in an amount of 1 wt% to 20 wt%, specifically 2 wt% to 15 wt%, for example 3 wt% to 10 wt%, based on the total amount of the photosensitive resin composition. When the binder resin is included within the above range, the developability is excellent during the manufacture of a color filter, and the crosslinking property is improved, thereby obtaining excellent surface smoothness.

(D) Photopolymerizable compound

As the above photopolymerizable compound, a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond can be additionally used.

The above photopolymerizable compound has the above ethylenically unsaturated double bond, and thus causes sufficient polymerization upon exposure to light in the pattern forming process, thereby forming a pattern having excellent heat resistance, light resistance, and chemical resistance.

Specific examples of the above photopolymerizable compounds include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol Examples thereof include penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylol propane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, and novolac epoxy (meth)acrylate.

Examples of commercially available products of the above photopolymerizable compound are as follows. Examples of the monofunctional ester of (meth)acrylic acid include Aronix M- ^101® , M-111®, M- ^114® from Toagosei Chemical ^Co. , Ltd.; KAYARAD TC- ^110S® , KAYARAD TC- ^120S® from Nihon Kayaku Co., Ltd.; V- ^158® , V- ^2311® from Osaka Yuki Chemical Co., Ltd. Examples of the bifunctional ester of (meth)acrylic acid include Aronix M- ^210® , M- ^240® , M- ^6200® from Toagosei Chemical Co., Ltd.; Examples thereof include KAYARAD HDDA ^® , HX-220 ^® , R-604 ^® from Nippon Kayaku Co., Ltd.; V-260 ^® , V-312 ^® , V-335 HP ^® from Osaka Yuki Kagaku Kogyo Co., Ltd. Examples of the trifunctional ester of (meth)acrylic acid include Aronix M-309 ^® , M-400 ® , M-405 ^® , M-450 ^® , M-710 ^® , M-8030 ^® , M-8060 ^® from Toagosei Kagaku Kogyo ^Co. , Ltd.; KAYARAD TMPTA ^® , DPCA-20 ^® , DPCA-30 ^® , DPCA-60 ^® , DPCA-120 ^® from Nippon Kayaku Co., Ltd.; Examples include V- ^295® , V- ^300® , V- ^360® , V- ^GPT® , V- ^3PA® , and V- ^400® from Osaka Yuki Kayaku Kogyo Co., Ltd. The above products can be used alone or in combination of two or more.

The above photopolymerizable compound may be treated with an acid anhydride or may use an ethylene oxide-modified compound to provide better developing properties.

The photopolymerizable compound may be included in an amount of 1 wt% to 20 wt%, specifically 1 wt% to 4 wt%, for example 1 wt% to 3 wt%, based on the total amount of the photosensitive resin composition. When the photopolymerizable compound is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, resulting in excellent reliability and excellent developability in an alkaline developer.

(E) Photopolymerization initiator

The above photopolymerization initiator is an initiator generally used in a photosensitive resin composition, and for example, an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a combination thereof can be used.

Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibuthoxy acetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloro acetophenone, p-t-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like.

Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

Examples of the above thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloro methyl)-s-triazine, 2-biphenyl 4,6-bis(trichloro methyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples thereof include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, and 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine.

Examples of the above oxime compounds include O-acyloxime compounds, 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. Specific examples of the above O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-oneoxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-oneoxime-O-acetate.

In addition to the above compound, the photopolymerization initiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, a fluorene compound, etc.

The above photopolymerization initiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy.

Examples of the above photosensitizer include tetraethylene glycol bis-3-mercapto propionate, pentaerythritol tetrakis-3-mercapto propionate, dipentaerythritol tetrakis-3-mercapto propionate, and the like.

The photopolymerization initiator may be included in an amount of 0.1 wt% to 5 wt%, specifically 0.3 wt% to 4 wt%, for example 0.5 wt% to 3 wt%, based on the total amount of the photosensitive resin composition. When the photopolymerization initiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process to obtain excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

(F) Solvent

The solvent may be a substance that is compatible with, but does not react with, the additive, the binder resin, the photopolymerizable compound, the photopolymerization initiator, and the colorant.

Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; alkyl acetates such as ethyl acetate and butyl acetate; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether. Propylene glycol alkyl ether acetates, such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons, such as toluene and xylene; ketones, such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters, such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactic acid esters, such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters, such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxy acetate alkyl esters, such as methyl methoxy acetate, ethyl methoxy acetate, butyl methoxy acetate, methyl ethoxy acetate, and ethyl ethoxy acetate; 3-oxypropionic acid alkyl esters, such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-Alkoxy propionic acid alkyl esters, such as methyl 2-methoxy propionic acid, ethyl 2-methoxy propionic acid, ethyl 2-ethoxy propionic acid, and methyl 2-ethoxy propionic acid; 2-oxy-2-methyl propionic acid esters, such as methyl 2-oxy-2-methyl propionic acid, ethyl 2-oxy-2-methyl propionic acid, and ethyl 2-alkoxy-2-methyl propionic acid alkyl esters, such as methyl 2-methoxy-2-methyl propionic acid, ethyl 2-ethoxy-2-methyl propionic acid; Esters, such as ethyl 2-hydroxy propionic acid, ethyl 2-hydroxy-2-methyl propionic acid, ethyl hydroxy acetate, and methyl 2-hydroxy-3-methyl butanoate; Ketone acid esters such as ethyl pyruvate, etc., and also high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can be mentioned.

Among these, taking compatibility and reactivity into consideration, preferred examples thereof include ketones such as cyclohexanone; glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; and ketones such as cyclohexanone.

Specifically, the solvent may include two or more solvents having different boiling points. The "boiling point" of a liquid substance is the temperature at which the vapor pressure of the liquid substance becomes equal to the external pressure and begins to boil, and changes depending on the external pressure. In the above embodiment, the boiling point under 1 atm is discussed.

Since the photosensitive resin composition of the above embodiment includes two solvents having different boiling points, the volatilization rate and volatilization location of the solvent can be harmoniously controlled during the process of coating the photosensitive resin composition on a substrate or a lower photosensitive resin film, and the volatilization of the solvent can be mainly performed on the surface rather than the lower portion of the coating, thereby improving filling characteristics, surface roughness, etc.

For example, the solvent may include two or more solvents from among propylene glycol monomethyl ether acetate (PGMEA), n-butyl alcohol (n-BA), and diethylene glycol methyl ethyl ether (MEDG). Of course, all three solvents may be included, in which case the synergistic effect is the highest.

The solvent may be included as a remainder, for example, 30 wt% to 70 wt%, for example, 40 wt% to 60 wt%, based on the total amount of the photosensitive resin composition. When the solvent is included within the above range, the photosensitive resin composition has excellent coatability and a coating film having excellent flatness can be obtained.

The above photosensitive resin composition can be applied to a photosensitive resin composition for a color filter of a CMOS image sensor, specifically, a photosensitive resin composition for a blue color filter of a CMOS image sensor.

(Photosensitive resin film, color filter and CMOS image sensor)

In another embodiment, a photosensitive resin film manufactured using the photosensitive resin composition is provided.

In another embodiment, a color filter manufactured using the photosensitive resin composition is provided.

In another embodiment, a CMOS image sensor including the color filter is provided.

The manufacturing method of the above color filter is as follows.

The photosensitive resin composition described above is applied to a glass substrate using an appropriate method such as spin coating, roller coating, or spray coating, for example, to an appropriate thickness to form a photosensitive resin composition layer.

Next, light is irradiated on the substrate on which the photosensitive resin composition layer is formed so as to form a pattern required for the color filter. UV, electron rays or X-rays can be used as a light source used for the irradiation, and for example, UV in the range of 190 nm to 450 nm, specifically 200 nm to 400 nm can be irradiated. The irradiation process can also be performed further using a photoresist mask. After performing the irradiation process as described above, the photosensitive resin composition layer irradiated with the light source is treated with a developer. At this time, the unexposed portion of the photosensitive resin composition layer is dissolved, thereby forming a pattern required for the color filter. By repeating this process according to the number of required colors, a color filter having a desired pattern can be obtained. In addition, if the image pattern obtained by the development in the above process is heated again or cured by irradiation with active rays, etc., crack resistance, solvent resistance, etc. can be improved.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples are only preferred embodiments of the present invention, and the present invention is not limited to the following examples.

(Preparation of photosensitive resin composition)

Examples 1 to 6 and Comparative Examples 1 to 4

A photosensitive resin composition was prepared by mixing the components shown in Tables 1 and 2.

Specifically, after dissolving the photopolymerization initiator in the solvent, the mixture was stirred at room temperature for 30 minutes, and then a binder resin was added thereto, followed by stirring at room temperature for 60 minutes. Subsequently, a photopolymerizable compound and a colorant (pigment dispersion) were added to the obtained reactant, followed by stirring at room temperature for 30 minutes. Additionally, an additive was added, followed by stirring at room temperature for 30 minutes. Subsequently, the product was filtered twice to remove impurities, thereby preparing a photosensitive resin composition.

(Unit: weight%) ingredient Material name Solids content
(weight%) Comparative Example 1 Comparative Example 2 Example 1 Example 2 Example 3 (A) Additive A-1 10 - 0.001 0.005 0.01 0.02 A-2 10 0.11 0.11 0.11 0.11 0.11 A-3 10 0.04 0.04 0.04 0.04 0.04 (B) Colorant B-1 30 43.15 43.15 43.15 43.15 43.15 (C) Binder
profit
C-1 100 3.73 3.75 3.75 3.75 3.74 (D) Photopolymerizable compound
D-1 100 1.45 1.45 1.45 1.45 1.45 (E) Photopolymerization initiator E-1 20 0.55 0.55 0.55 0.55 0.55 (F) Solvent F-1 - 15.53 15.509 15.505 15.50 15.50 F-2 - 26.58 26.58 26.58 26.58 26.58 F-3 - 8.86 8.86 8.86 8.86 8.86 Total amount 30 100 100 100 100 100

(Unit: weight%) ingredient Material name Solids content
(weight%) Example 4 Example 5 Example 6 Comparative Example 3 Comparative Example 4 (A) Additive A-1 10 0.04 0.08 0.1 0.3 0.5 A-2 10 0.11 0.11 0.11 0.11 0.11 A-3 10 0.04 0.04 0.04 0.04 0.04 (B) Colorant B-1 30 43.15 43.15 43.15 43.15 43.15 (C) Binder
profit
C-1 100 3.71 3.66 3.65 3.55 3.45 (D) Photopolymerizable compound
D-1 100 1.43 1.41 1.40 1.30 1.20 (E) Photopolymerization initiator E-1 20 0.55 0.55 0.55 0.55 0.55 (F) Solvent F-1 - 15.53 15.56 15.56 15.56 15.56 F-2 - 26.58 26.58 26.58 26.58 26.58 F-3 - 8.86 8.86 8.86 8.86 8.86 Total amount 30 100 100 100 100 100

The components used in Tables 1 and 2 above are as follows.

(A) Additive

(A-1) Diluted solution of fluorinated surfactant (product name: F-556, manufacturer: DIC) (dispersant: PGMEA)

(A-2) Silane coupling agent (Product name: KBM-503, Manufacturer: Shinetsu)

(A-3) Diluted solution of antioxidant (product name: MHQ, manufacturer: JHChem) (dispersing medium: PGMEA)

(B) Colorant

(B-1) Mixed pigment dispersion containing Pigment B 15:6 and Pigment V 23 in a weight ratio of 77:23 (dispersion solvent: PGMEA, manufacturer: Sanyo)

(C) Binder resin

(C-1) Dispersion of hydrophilic acrylic binder resin (weight average molecular weight measured by GPC method: 5,000 to 15,000 g/mol, acid value: 88 KOHmg/g) (solvent: PGMEA)

(D) Photopolymerizable compound

(D-1) Dipentaerythritol hexaacrylate (DPHA, viscosity: 5,500~8,000 cps@25℃, manufacturer: Nippon Gunyaku)

(E) Photopolymerization initiator

(E-1) Oxime initiator (OXE-01 series, product name: SPI-03, manufacturer: Samyang Corporation)

(F) Solvent

(F-1) Propylene glycol monomethyl ether acetate (PGMEA, boiling point: 146.4 ℃ @ 1 atm, manufacturer: Sigma-Aldrich)

(F-2) n-Butyl alcohol (n-BA, boiling point: 117.7　°C ℃ @ 1 atm, manufacturer: Sigma-Aldrich)

(F-3) Diethylene glycol methyl ethyl ether (MEDG, boiling point: 176 °C @ 1 atm, manufacturer: TOHO)

(Evaluation Example 1: Viscosity of photosensitive resin composition)

At 25℃, 4g of the photosensitive resin compositions according to Examples 1 to 6 and Comparative Examples 1 to 4 were applied, and the viscosity was evaluated using a rheometer. The evaluation results are shown in Table 3.

Content of leveling agent in photosensitive resin composition (ppm) Viscosity of photosensitive resin composition
(cps@25℃) Comparative Example 1 - 1.92 Comparative Example 2 10 1.91 Example 1 50 1.92 Example 2 100 1.92 Example 3 200 1.91 Example 4 400 1.91 Example 5 800 1.93 Example 6 1,000 1.92 Comparative Example 3 3,000 1.94 Comparative Example 4 5,000 1.95

(Evaluation Example 2: Surface characteristics of color filter)

The surface properties of the color filter specimens were evaluated using the following method, and the results are shown in Tables 3 and 4.

(1) In-wafer dispersion measurement and contact angle evaluation

On top of an 8-inch Si wafer with HMDS surface treatment, a photosensitive resin composition (blue photoresist, hereinafter referred to as “blue PR”) according to Examples 1 to 6 and Comparative Examples 1 to 4 is spin-coated to a thickness of 4500 Å. Thereafter, pre-baking (Sof-bake) is performed on a hot plate set to 100°C for 3 minutes.

Afterwards, the thickness of 20 points across the center of the pattern is measured using the ST-5000 (optical thickness measuring device).

After measuring the thickness and in-wafer dispersion, the reticle is removed using an I-line stepper under the conditions of Dose 750ms, Focus -0.2, and a square pattern (50 mm x 50 mm) is exposed. After exposure, development is performed using a TMAH solution to remove the PR except for the pattern part. After exposure, hard-bake for 5 minutes on a hot plate set to 200℃ to complete the formation of a pattern for contact angle measurement.

After fixing the pattern for contact angle measurement on the contact angle measuring device, the contact angle of the DI wafer on the blue PR patterned into a square is measured.

(2) Measurement of stain (coating stain) level

On top of an 8-inch Si wafer with HMDS surface treatment, a photosensitive resin composition according to Example 3 is spin-coated to a thickness of 5500Å. Thereafter, pre-baking (soft-bake; SB) is performed for 3 minutes on a hot plate set to 100°C. Afterwards, lower substrate barrier rib generation pattern exposure is performed under the conditions of Dose 800ms Focus -0.3 using an I-line stepper. After exposure, development (Develop) is performed using a TMAH solution to remove the PR except for the pattern portion. After exposure, baking (hard-bake; HB) is performed for 5 minutes on a hot plate set to 200°C to complete the production of a lower substrate to be used for Stain evaluation.

Thereafter, each photosensitive resin composition of Examples 1 to 6 is spin-coated to a thickness of 4500 Å using the lower substrate. Afterwards, pre-baking (soft-bake; SB) is performed for 3 minutes on a hot plate set to 100°C. The completed substrate is measured for stain stains using an optical microscope and Tencor equipment.

Comparative Example 1 Comparative Example 2 Example 1 Example 2 Example 3 In-wafer dispersion (Å) - 82.3 59.6 36.2 37 Contact angle (°) 74 72.5 73.3 79.0 75 Stain measurement area (㎛) - 18 23 52 35

Example 4 Example 5 Example 6 Comparative Example 3 Comparative Example 4 In-wafer dispersion (Å) 36.2 33.4 35.7 90.4 85.7- Contact angle (°) 79.0 82.2 83.1 82.5 81.9 Stain measurement area (㎛) 52 64 69 78 76

From the above Tables 3 to 5, it can be seen that the characteristics of the photosensitive resin composition and the color filter specimen containing the same change depending on the content of the leveling agent.

According to Table 3 above, as the content of the leveling agent increases, the viscosity of the photosensitive resin composition slightly increases.

Meanwhile, according to Tables 4 and 5 above, as the content of the leveling agent increases, the surface tension of the resin composition of the photosensitive resin composition increases, so that the in-wafer thickness distribution of the color filter specimen decreases while the contact angle and unevenness increase. Here, the contact angle and unevenness of the color filter specimen and the in-wafer thickness distribution are traded-off.

Specifically, when the content of the leveling agent in the total amount of the photosensitive resin composition is less than 50 ppm, the in-wafer thickness dispersion of the color filter specimen is significantly high. In contrast, when the content of the leveling agent in the total amount of the photosensitive resin composition exceeds 1,000 ppm, the contact angle and unevenness of the color filter specimen significantly increase, thereby reducing the yield.

However, within a range where the content of the leveling agent in the total amount of the photosensitive resin composition is 50 ppm to 1,000 ppm, as the content of the leveling agent increases, the in-wafer thickness distribution decreases and the anhydride increases, so that a pattern of an overall even thickness can be obtained.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications may be made within the scope of the claims, the detailed description of the invention, and the attached drawings, which also fall within the scope of the present invention.

Claims (17)

(A) Additive;
(B) Colorant;
(C) Binder resin;
(D) photopolymerizable compound;
(E) a photopolymerization initiator; and
(F) A photosensitive resin composition containing a solvent,
The above additive comprises a leveling agent,
The leveling agent is contained in an amount of 50 ppm to 1,000 ppm of the total amount of the photosensitive resin composition.
Photosensitive resin composition.
In the first paragraph,
A photosensitive resin composition wherein the leveling agent is contained in an amount of 100 ppm to 400 ppm of the total amount of the photosensitive resin composition.
In the first paragraph,
The above leveling agent is a photosensitive resin composition which is a fluorine-based surfactant.
In the third paragraph,
A photosensitive resin composition wherein the above fluorinated surfactant is a nonionic fluorinated surfactant.
In the first paragraph,
A photosensitive resin composition further comprising an additive selected from the group consisting of a silane coupling agent, an antioxidant, a dispersing medium, or a combination thereof.
In paragraph 5,
A photosensitive resin composition comprising, of the total amount of solids excluding the dispersion medium, 1 to 50 wt% of the leveling agent, 30 to 80 wt% of the silane coupling agent, and 10 to 30 wt% of the antioxidant.
In the first paragraph,
The above binder resin is a photosensitive resin composition including an acrylic binder resin, an epoxy binder resin, or a combination thereof.
In the first paragraph,
A photosensitive resin composition wherein the weight average molecular weight of the binder resin is 5,000 g/mol to 15,000 g/mol.
In the first paragraph,
A photosensitive resin composition wherein the weight ratio of the leveling agent and the colorant is 0.01:100 to 1:100.
In the first paragraph,
A photosensitive resin composition comprising the colorant comprises a blue pigment, a purple pigment, or a combination thereof.
In the first paragraph,
The above solvent is a photosensitive resin composition containing two or more solvents having different boiling points.
In Article 11,
A photosensitive resin composition comprising two or more solvents selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), n-butyl alcohol (n-BA), and diethylene glycol methyl ethyl ether (MEDG).
In the first paragraph,
The above photosensitive resin composition, with respect to the total amount of the photosensitive resin composition,
1,600 ppm to 3,000 ppm of the above (A) additive;
30 to 70 wt% of the colorant (B);
1 to 20 wt% of the above (C) binder resin;
1 to 20 wt% of the photopolymerizable compound (D);
0.1 wt% to 5 wt% of the above (E) photopolymerization initiator; and
A photosensitive resin composition containing the remainder of the solvent (F).
In the first paragraph,
The above photosensitive resin composition is a photosensitive resin composition having a viscosity at 25°C of 1.5 cP to 3.8 cP.
A photosensitive resin film manufactured using the photosensitive resin composition of any one of claims 1 to 14.
A color filter comprising a photosensitive resin film of claim 15.
A CMOS image sensor comprising a color filter according to claim 16.