KR20210021502A - Apparatus for checking mounting status of electronic component - Google Patents

Abstract

The present invention relates to an electronic component transfer device.
An electronic component conveying apparatus according to the present invention includes: a picker capable of holding or releasing an electronic component; A horizontal mover for moving the picker from a first area for gripping the electronic component to a second area for releasing the grip of the electronic component or moving the picker from the second area to the first area; A vertical mover for lowering the picker so as to be able to grip the electronic component by the picker or raising the picker so that the picker holding the electronic component can be horizontally moved by the horizontal mover; And a reflector for reflecting light from a light source toward the electronic component loaded in the second area to photograph the electronic component loaded in the third area with the camera, wherein the reflector is horizontally moved together with the picker.
According to the present invention, the degree of freedom in design for the installation position of a light source required for image acquisition by a camera is increased.

Description

Device to check the seating status of electronic components{APPARATUS FOR CHECKING MOUNTING STATUS OF ELECTRONIC COMPONENT}

The present invention relates to an electronic component transfer device that transfers an electronic component gripped in a first area to a second area different from the first area.

Electronic components such as SSDs (Solid State Drives) are produced and then loaded onto processing trays. And electronic components loaded in the process tray are moved to the test tray for testing. The electronic component is electrically connected to the tester while being loaded on the test tray, thereby performing a first test process for the electronic component.

The electronic component determined to be good in the first test process is completed into a shipment product through a casing process and a labeling process, and then a second test process proceeds. After the second test process, according to the test result, electronic components are classified into good products and defective products, and only good products are shipped.

In the past, productivity was low because a series of processes as described above except for the test process were performed by hand. Therefore, the applicant of the present invention, prior to the present invention, labeling equipment capable of performing a casing process and labeling process for electronic parts (Korean Application No. 10-2014-0041140, hereinafter referred to as'prior invention 1'), labeling Test equipment for performing the second test process on completed electronic parts (Korean Application No. 10-2014-0091798, hereinafter referred to as'Prior Invention 2'), classifying electronic parts that have completed the second test according to test results An electronic component sorting device (Korean Application No. 10-2014-0154576, hereinafter referred to as'Prior Invention 2') has been proposed.

In addition, the applicant of the present invention forms a system with the equipment according to the prior inventions 1 to 3 above, and loads electronic components loaded on the process tray into the test tray in order to perform the first test process. ) Equipment (Korean Application No. 10-2014-01909640, hereinafter referred to as'prior invention 4') and equipment that unloads electronic components that have completed the first test process from the test tray to an underfill jig (applied in Korea) No. 10-2015-0015600, hereinafter referred to as'prior invention 5') has been proposed.

The present invention relates to an electronic component transfer device that can be very preferably applied to the electronic component transfer operation made in the prior invention 5 above. In particular, the present invention relates to a technique for confirming whether or not the following operation can be properly performed by having an electronic component movably loaded by an electronic component transfer device having an appropriate loading state.

An object of the present invention is to provide an electronic component transfer device capable of supporting the operation of checking the loading state of an electronic component by a camera.

An electronic component conveying apparatus according to a first aspect of the present invention includes: a picker capable of gripping or releasing an electronic component; A horizontal mover for moving the picker from a first area for gripping the electronic component to a second area for releasing the grip of the electronic component or moving the picker from the second area to the first area; A vertical mover for lowering the picker so as to be able to grip the electronic component by the picker or raising the picker so that the picker holding the electronic component can be horizontally moved by the horizontal mover; And a reflector for reflecting light from a light source to the electronic component mounted in the third area to photograph the electronic component loaded in the third area with the camera, wherein the reflector is horizontally moved together with the picker.

The reflector may be positioned in the third area according to the operation of the horizontal mover, and the light source is positioned in a vertical direction with the reflector when the reflector is positioned in the third area.

The second region is between the first region and the third region.

The electronic component transfer device includes: the camera installed on the reflector; It may further include.

An electronic component conveying apparatus according to a second aspect of the present invention includes: a picker capable of gripping or releasing an electronic component; A horizontal mover for moving the picker from a first area for gripping the electronic component to a second area for releasing the grip of the electronic component or moving the picker from the second area to the first area; A vertical mover for lowering the picker so as to be able to grip the electronic component by the picker or raising the picker so that the picker holding the electronic component can be horizontally moved by the horizontal mover; An installation plate that is horizontally moved together with the picker according to the operation of the horizontal mover and protruded to a third area different from the second area according to the moving state; And a camera installed on the installation plate and provided for photographing electronic components loaded in the third area. Includes.

The electronic component transfer device includes a light source installed on the installation plate to irradiate light required for photographing by the camera; It may further include.

According to the present invention, there are the following effects.

First, the degree of freedom in design for installing the light source of the camera and the lighting device can be increased because light required to check the loading state of the electronic component with the camera can be indirectly supplied by the electronic component transfer device.

Second, since the camera's shooting distance can be shortened, an elaborate image can be obtained, so that the electronic component can be accurately checked.

1 is a schematic perspective view of a test tray applied to an electronic component unloading device.
2 is a schematic perspective view of an underfill jig applied to an electronic component unloading device.
3 is a conceptual plan view of an electronic component unloading device.
4 is a schematic perspective view of a second electronic component transfer device according to a first embodiment of the present invention.
5 is a schematic front view of the second electronic component transfer device of FIG. 4.
6 to 9 are reference diagrams for explaining the operation of the second electronic component transfer device of FIG. 4.
10 is a schematic perspective view of a second electronic component transfer device according to a second embodiment of the present invention.
11 is a reference diagram for explaining an example according to a modification of the first and second embodiments.

Hereinafter, preferred embodiments of the present invention as described above will be described with reference to the accompanying drawings, but redundant descriptions will be omitted or compressed as far as possible for the sake of brevity.

Prior to describing the electronic component transfer device according to the present invention, after examining the test tray and the underfill jig used in the electronic component unloading equipment (EDUE) according to the prior invention 5, first, the unloading equipment (EDUE) is outlined. Explain.

<Explanation of the test tray>

As shown in FIG. 1, the electronic component ED for which the first test is completed is loaded in the test tray TT. Since the first test is performed while the electronic component ED (for example,'SSD') is loaded in the test tray TT, the test tray TT includes a contact module CM. The contact module CM has an insertion groove IS into which an electronic component ED in a vertical state can be inserted and a connection terminal (not shown because it is configured at the lower portion). Here, the electronic component ED inserted into the insertion groove IS may be in electrical contact with the connection terminals, and the connection terminals may be in electrical contact with the tester. Therefore, the electronic component (ED) and the tester are electrically connected through the connection terminal to perform the first test.

Of course, the test tray TT may have structures other than the structure of FIG. 1.

<Explanation of the underfill jig>

As shown in FIG. 2, the electronic component ED unloaded from the test tray TT may be loaded in a horizontal state in an underfill jig (UJ). This underfill jig (UJ) is composed of an upper plate (JT) and a lower plate (JB). The electronic components ED are mounted on the lower plate JB in a horizontal state, and the upper plate JT is detachably coupled to the lower plate JB. Therefore, in order to load the electronic component ED on the underfill jig UJ, the upper plate JT must be separated from the lower plate JB.

For reference, the electronic component ED is loaded in the underfill jig UJ as described above and an underfill operation (an operation of firmly fixing the semiconductor element by scanning a filler in the bottom of the semiconductor element installed on the substrate) is performed. In the example of FIG. 2, although the underfill jig (UJ) has a structure capable of loading 6 electronic components (ED), it may have a structure capable of loading 6 to 20 electronic components depending on implementation. have.

<Overview of the composition of electronic component unloading equipment>

3 is a conceptual plan view of an electronic component unloading equipment (EDUE).

Electronic component unloading equipment (EDUE) is a tray transfer device 110, a tray transfer device 120, a tray support device 200, an electronic component rotation device 300, a first electronic component transfer device 400, a tray transfer device. 500, a second electronic component transfer device 600, a first jig transfer device 710, a second jig transfer device 720, a top plate removal device 730, a lower plate transfer device 740, a jig transfer device ( 750), a jig reversing device 760, a jig transfer device 770, a jig carrying device 780, a lighting device 800, and a control device 900.

Tray moving device 110 moves the test tray (TT) supplied to the supply position (SDP) to the standby position (WP). In addition, for discharging the empty test tray (TT), the tray moving device 110 moves the empty test tray (TT) in the standby position (WP) to the supply position (SDP) according to the type of the applied test tray (TT). You can also move it.

The tray transfer device 120 transfers the test tray (TT) in the standby position (WP) to the unloading position (UP) or transfers the empty test tray (TT) in the unloading position (UP) to the standby position (WP). Transfer to.

The tray support device 200 supports the test tray TT in the unloading position UP.

The electronic component rotating device 300 rotates the electronic component ED unloaded from the test tray TT by the first electronic component transfer device 400 and loaded in a vertical state in a horizontal state.

The first electronic component transfer device 400 unloads the electronic component ED from the test tray TT and then supplies the vertical electronic component ED to the electronic component rotating device 300.

The tray transport device 500 transports the empty test tray TT in the standby position WP to the tray ejection position TCP. The transport of the test tray (TT) by the tray transport device 500 may or may not be made according to the type of the applied test tray (TT). That is, when the test tray (TT) that must follow the path returned from the standby position (WP) to the supply/demand position (SDP) by the tray moving device 110 is applied, the operation of the tray transport device 500 is not required, and When the test tray TT, which must follow the path moving from the location WP to the tray carrying location TCP, is applied, the operation of the tray transportation device 500 is required.

The second electronic component transfer device 600 grips the electronic component ED rotated in a horizontal state by the electronic component rotation device 300, and then the lower plate JB of the underfill jig UJ at the loading position LP. To load. The present invention relates to such a second electronic component transfer device 600, and will be described in detail later by changing the table of contents.

The first jig moving device 710 moves the underfill jig (UJ) supplied to the moving start position (MSP) by the jig transport device 750 to the top plate removal position (TTP), and moves the top plate from the top plate removal position (TTP). (JT) moves the removed lower plate (JB) to the first movement end position (MEP ₁ ).

The second jig moving device 720 moves the lower plate (JB) at the loading position (LP) to the upper plate coupling position (TJP), and the underfill jig (UJ) in which the upper plate (JT) is coupled at the upper plate coupling position (TJP). To the second movement end position (MEP ₂ ).

The upper plate detachment device 730 removes the upper plate JT from the underfill jig UJ at the upper plate removal position TTP, and then couples the upper plate JT to the lower plate JB at the upper plate attachment position TJP. .

The lower plate transfer device 740 moves _{the lower plate JB in the first moving end position MEP 1} to the rear loading position LP.

The jig transport device 750 transports the empty underfill jig UJ at the jig supply position JSP to the transfer start position MSP. In addition, the jig transportation device 750 moves the underfill jig UJ filled with the electronic component ED _{in the second transfer end position MEP 2 to the reverse position JDP.}

The jig inversion device 760 rotates the underfill jig UJ in the inversion position JDP by 180 degrees with the left and right horizontal lines as a rotation axis.

The jig transfer device 770 transfers the underfill jig UJ in the reversing position JDP to the jig carrying position JCP.

The jig carrying device 780 carries out the underfill jig UJ at the jig carrying position JCP.

The lighting device 800 is provided to irradiate light to the lower plate JB in the upper plate coupling position TJP. The light sources 801 to 806 of the lighting device 800 are installed at the front and rear sides of the upper plate coupling position TJP. Therefore, the light irradiated from the light sources 801 to 806 cannot be directly irradiated to the lower plate JB in the upper plate coupling position TJP. Of course, the number and shape of light sources may be variously changed according to implementation. In addition, according to the second embodiment to be described later, since the light source is provided in the second electronic component transfer device 600, the lighting device 800 provided at the front and rear sides of the upper plate coupling position TJP may be omitted. Furthermore, if the interior of the electronic component unloading equipment (EDUE) is bright, it is not necessary to have a separate lighting device.

The control device 900 controls each of the above-described components. In particular, it is judged whether the electronic component (ED) is properly loaded on the lower panel (JB) at the upper panel bonding position (TJP), and if the electronic component (ED) is not properly loaded on the lower panel (JB), a jam (JAM) ).

<Description of the second electronic component transfer device according to the first embodiment>

The second electronic component transfer device 600 according to the first embodiment sucks and grips the electronic component ED in a horizontal state, and then places the gripped electronic component ED on the lower plate JB at the loading position LP. Move to and load. To this end, the second electronic component conveying device 600 includes two pickers 611 and 612, a first horizontal mover 620, and a second horizontal as shown in the schematic perspective view of FIG. 4 and the schematic front view of FIG. It includes a mover 630, a moving frame 640, a vertical mover 650, a reflector 660, and two cameras 671 and 672.

The two pickers 611 and 612 attract and hold the electronic component ED by vacuum pressure or release the gripping of the electronic component ED by releasing the vacuum pressure. In this embodiment, the electronic component ED is held by two pickers 611 and 612, but is implemented to hold the electronic component by one picker or three according to the size or shape of the electronic component ED. It may be implemented to hold the electronic component by the above picker.

The first horizontal mover 620 moves the two pickers 611 and 612 in the left-right direction, thereby moving the two pickers 611 and 612 from the first area S1 to the second area S2, or It is provided to move from the second area S2 to the first area S1. Here, the first area S1 is an area in which the electronic component ED is held by the pickers 611 and 612, and an area where the electronic component ED converted to a horizontal state by the electronic component rotating device 300 is supplied. to be. In addition, the second area S2 is an area for releasing the grip of the electronic component ED that has been moved from the first area S1, and the electronic component ED is removed from the lower plate JB of the underfill jig UJ by releasing the grip. This is the area to be loaded into.

The second horizontal mover 630 is provided to move the pickers 611 and 612 in the front-rear direction.

The moving frame 640 is moved in the front and rear directions by the second horizontal mover 630, and as the second horizontal mover 630 moves in the left and right direction by the operation of the first horizontal mover 630, Is moved.

The vertical mover 650 is fixedly installed on the moving frame 640 and lifts the pickers 611 and 612 so that the electronic component ED can be properly gripped or released.

The reflective plate 660 is fixedly installed on the moving frame 640 and reflects light irradiated from the lower side upward by the light sources 801 to 806 of the lighting device 800 downward. The reflector 660 has a shape of a square plate protruding from the moving frame 640 in the right direction, and moves together with the moving frame 640 to which the pickers 611 and 612 are coupled. Accordingly, the reflector 660 moves horizontally together with the pickers 611 and 612. Accordingly, when the pickers 611 and 612 are located in the second area S2, the reflector 660 protrudes to a third area S3 different from the second area S2 or is located in the third area S3. do. Here, the third area (S3) is the area where the lower plate (JB) moved from the loading position (LP) to the upper plate coupling position (TJP) by the second jig moving device 720 is located, and the upper plate coupling position (TJP) belongs. It is an area. Accordingly, the first area S1, the second area S2, and the third area S3 are sequentially located from left to right. And when the reflector 660 is positioned in the third area S3 by the operation of the first horizontal mover 620, it faces the light sources 801 to 806 in the vertical direction.

Cameras 671 and 672 are installed on the reflector 660. Accordingly, the cameras 671 and 672 also move between the second area S2 and the third area S3 together with the reflector 660. When these cameras 671 and 672 are positioned in the third area S3, the lower panel JB at the lower upper plate coupling position TJP is photographed. Of course, the number of cameras and the installation position of the camera in the reflector 660 may be variously changed as necessary.

Subsequently, the operation of the second electronic component transfer device 600 having the above configuration and the accompanying technology will be described.

6 is a state in which the electronic component ED, which is currently converted to a horizontal state by the electronic component rotating device 300, is located in the first area S1.

In the state of Fig. 6, when the vertical mover 650 is operated to lower the pickers 611 and 612, and the pickers 611 and 612 attract and hold the electronic component ED by vacuum pressure, the vertical mover as shown in Fig. 7 650 raises the pickers 611 and 612. Of course, as the pickers 611 and 612 rise, horizontal movement of the pickers 611 and 612 becomes possible.

In the state of FIG. 7, the first horizontal mover 620 operates to move the pickers 611 and 612 from the first area S1 to the second area S2 to which the loading position LP belongs. . At this time, the moving distance of the pickers 611 and 612 may vary somewhat depending on which part of the lower plate JB, which can load the six electronic components ED, to be loaded with the electronic component ED. In addition, since the electronic component ED can be loaded on the lower plate JB, each of the front and rear three parts, the second horizontal mover 630 may or may not operate as necessary. In the state of FIG. 8, since the pickers 611 and 612 are located in the second region S2, the reflector 660 protrudes toward the third region S3 to which the upper plate coupling position TJP belongs.

In the state of Fig. 8, the pickers 611 and 612 are lowered by the operation of the vertical mover 650, and then the pickers 611 and 612 release the gripping of the electronic component ED, so that the lower plate at the loading position LP Load electronic components (ED) in (JB).

When the electronic component (ED) is loaded on the lower plate (JB) in the loading position (LP) by repeating the processes of FIGS. 6 to 8 as described above, the second jig moving device 720 The lower plate (JB) in (LP) is moved to the upper plate bonding position (TJP). And a new empty lower plate (JB) is supplied to the loading position (LP) by the lower plate transfer device 740. Therefore, as shown in FIG. 9, a new empty lower plate (JBn) is placed in the loading position (LP) belonging to the second region (S2), and the upper plate engaging position (TJP) belonging to the third region (S3) has a loading position ( The lower plate (JBm) loaded with electronic components (ED) moved from LP) is placed.

On the other hand, the operation of moving and loading the electronic component (ED) to the lower plate (JBn) at the loading position (LP) is performed, or the reflector 660 is removed by a separate movement according to the operation of the first horizontal mover 620. When it is located in the 3 area S3, the plane of the lower plate JB at the upper plate coupling position TJP is photographed with the cameras 671 and 672. At this time, the light irradiated upwards (refer to arrows a, b, c) from the light sources 801 to 806 of the lighting device 800 is reflected downward by the reflector 660 (arrows a', b', c' Reference), thereby supporting the photographing operation of the cameras 671 and 672. Here, the light sources 801 to 806 so that the light reflected downwards by the reflector 660 (refer to arrows a', b', c') illuminates the electronic components ED loaded on the lower panel JB and their surroundings. ) Should be set. Then, the image captured by the cameras 671 and 672 is sent to the control device 900, and the control device 900 compares and analyzes the image stored in advance with the image received from the cameras 671 and 672, It is judged whether (ED) is properly loaded on the lower board (JB). If it is determined that the electronic component ED is loaded well, the control device 900 controls the upper plate detachment device 730 to couple the upper plate JT to the lower plate JB in the upper plate coupling position TJP. However, if it is determined that the loading of the electronic component ED is poor, the control device 900 generates a jam. Of course, the time point of confirmation by the cameras 671 and 672 may be variously adjusted or set as necessary.

On the other hand, in the first embodiment above, the reflecting plate 660 and the light sources 801 to 806 were implemented to face each other in the vertical direction, but the reflection angle of the reflecting plate 660 or the irradiation angle of the light sources 801 to 806 may be adjusted according to design conditions You can make various changes.

In addition, in the first embodiment, the cameras 671 and 672 are installed on the reflecting plate 660, but depending on the design conditions, it may be considered that the camera is properly installed in a position other than the reflecting plate.

<Description of the second electronic component transfer device according to the second embodiment>

The second electronic component conveying device 600' according to the second embodiment sucks and grips the electronic component ED in a horizontal state, and then places the gripped electronic component ED on the lower plate JB at the loading position LP. ) To move and load. To this end, the second electronic component transfer device 600' includes two pickers 611' and 612', a first horizontal mover 620', and a second horizontal mover 630 as shown in the schematic perspective view of FIG. '), a moving frame 640', a vertical mover 650', a mounting plate 660', three cameras 671', 672', 673', and light sources 681 to 686.

The above two pickers 611' and 612', the first horizontal mover 620', the second horizontal mover 630', the moving frame 640', and the vertical mover 650' are in the first embodiment. Since the two pickers 611 and 612, the first horizontal mover 620, the second horizontal mover 630, the moving frame 640, and the vertical mover 650 have the same function and structure, a description thereof will be omitted.

The mounting plate 660' is fixedly installed on the moving frame 640', and three cameras 671', 672', 673' and light sources 681 to 686 are installed. This installation plate 660' has a shape of a square plate protruding from the moving frame 640' in the right direction, and moves together with the moving frame 640' to which the pickers 611' and 612' are coupled. Therefore, the installation plate 660' is horizontally moved together with the pickers 611' and 612'. Accordingly, when the pickers 611 ′ and 612 ′ are located in the second region S2, the mounting plate 660 ′ protrudes to the third region S3 or is located in the third region S3. Similarly, the third area (S3) is the area where the lower plate (JB) moved from the loading position (LP) to the upper plate coupling position (TJP) by the second jig moving device 720 is located, and the upper plate coupling position (TJP) belongs. It is an area. Therefore, when the mounting plate 660' is located in the third area S3, the cameras 671', 672', 673' and the light sources 681 to 686 installed on the mounting plate 660' are also located in the third area S3. By being positioned at, the plane of the lower plate JB placed at the upper plate coupling position TJP belonging to the third area S3 can be photographed by the cameras 671', 672', and 673'.

Cameras 671', 672', 673' are provided to photograph the plane of the lower plate JB placed in the upper plate coupling position TJP, and the light sources 681 to 686 are cameras 671', 672', 673' It is provided to irradiate the light required for shooting of) downward.

Since the operation of the second electronic component transfer device 600 ′ according to the present embodiment is substantially the same as the second electronic component transfer device 600 according to the first embodiment, a description thereof will be omitted.

In the above embodiments, the second region S2 is positioned between the first region S1 and the third region S3 as an example. However, depending on implementation, the third region is not separated from the first region with the second region interposed therebetween, and the first region S1 and the third region S3 may be the same as in FIG. 11. In this case, the first area S1 for gripping the electronic component becomes a third area S3 that is photographed by the camera. In addition, a separate second area S2 is positioned on one side of the first area S1 and the third area S3. That is, the present invention can be used as many times as possible to confirm in advance whether the posture of the electronic component to be gripped is appropriate for proper gripping before gripping the electronic component.

Of course, in the above embodiments, the electronic component transfer device according to the present invention has been described as an example in which the electronic component unloading device is applied, but the electronic component transfer device according to the present invention has various types of movement of electronic components such as a test handler. It could be applied to all equipment.

Therefore, a specific description of the present invention has been made by an embodiment with reference to the accompanying drawings, but the above-described embodiment is only described with reference to a preferred example of the present invention, so that the present invention is limited to the above embodiment. It should not be understood, and the scope of the present invention should be understood as the following claims and equivalent concepts.

600: second electronic component transfer device
611, 612, 611', 612: Picker
620, 620': first horizontal mover
630, 630': 2nd horizontal mover
640, 640': moving frame
650, 650': vertical mover
660: reflector 660': installation plate
671, 672, 671', 672', 673': Camera
681 to 686: light source

Claims (3)

A plate on which electronic components can be mounted;
At least one camera for checking the seating state of the electronic component seated on the plate;
An installation plate on which the camera can be installed;
A horizontal mover for moving the installation plate in a horizontal direction;
A light source installed on the installation plate and irradiating downwardly the light required for photographing by the camera; Containing
A device to check the seating state of electronic parts. The method of claim 1,
The camera is installed to be located between the light source and the light source,
A vertical mover that raises or lowers the camera and the light source; Further comprising
A device to check the seating state of electronic parts. The method of claim 1,
A transfer means integrally provided on the installation plate so as to be horizontally moved together with the camera and the light source, and capable of holding the plate or releasing the holding plate to transfer the plate; Containing more
A device to check the seating status of electronic components.

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