KR20070010017A - Test device for image sensor - Google Patents

Abstract

A test device for an image sensor for testing an optical characteristic of an image sensor (DUT) by inputting and outputting an electrical signal from a contact portion to an input / output terminal of an image sensor while irradiating a light receiving surface of the image sensor (DUT), the contact arm 315 The image sensor (DUT) held in the state is picked up by the first camera 326, the relative position with respect to the contact portion of the image sensor (DUT) is recognized by image processing, and the light source calculated in advance in this relative position. The amount of misalignment of the light source of the image sensor DUT with respect to the optical axis is calculated to calculate the alignment amount of the image sensor DUT, and the driving unit 322 is driven based on this, so that the lock-and-free mechanism 318 is non-conformed. In the state of being restrained, the holding | gripping side arm 317 which abuts on the movable stage 321 is moved.

Description

TEST EQUIPMENT FOR IMAGE SENSOR}

The present invention electrically contacts an input / output terminal of an image sensor, such as a CCD sensor or a CMOS sensor, to a contact portion of a test head, and radiates an electric signal to the input / output terminal of the image sensor while irradiating light from a light source to the light receiving surface of the image sensor. The present invention relates to a test apparatus for an image sensor that tests the optical characteristics of the image sensor by inputting and outputting.

The electronic component test apparatus called a handler accommodates many electronic components, such as a semiconductor integrated circuit element, in a tray and conveys them in a handler, electrically contacts each test electronic component to a test head, and an electronic component test apparatus. The test is carried out on a body (hereinafter referred to as a tester). Then, when the test is completed, each electronic component is taken out from the test head, and transferred to the tray according to the test result, whereby the classification of the good or defective product is performed.

Among such electronic components, in the testing of image sensors such as CCD sensors and CMOS sensors, similarly to the above, each image sensor is electrically contacted with a test head, and classification is performed according to the test results. By irradiating light from the light source to the light receiving surface of the image sensor while making electrical contact with the test head, an optical characteristic test such as a pupil inspection for checking whether the light receiving amount of the image sensor is constant is performed.

In the test of such an image sensor, for example, when the variety of image sensors is changed, for example, the lot of the image sensor to be tested is changed, the relationship between the optical axis having the image sensor positioned above the light source and the optical axis of the light source is changed. The optical axis of the image sensor is adapted to coincide with the optical axis of the light source with respect to the optical axis of the image sensor after the varietal change in the state located above the light source when the test after the varietal change is performed. It is necessary to perform the axis alignment of the optical axis of the light source and the light source in advance.

In order to perform such an axis alignment, in the conventional image sensor test apparatus, a fine adjustment mechanism for moving the light source itself in the XY direction is provided so that this fine adjustment is performed so that the optical axis of the light source is positioned with respect to the optical axis of the image sensor. The light source itself was moved by the mechanism.

For this reason, in this image sensor test apparatus, a space for disposing the fine adjustment mechanism or allowing the movement of the light source is required around the light source, and the image sensor test apparatus cannot be miniaturized sufficiently.

The present invention relates to an image sensor test apparatus for testing the optical characteristics of an image sensor such as a CCD sensor or a CMOS sensor, and in particular, an object thereof is to provide a test apparatus for an image sensor that can be miniaturized. .

(1) In order to achieve the above object, according to the first aspect of the present invention, the contact of the test head while irradiating light to the light receiving surface of the image sensor by bringing the input and output terminals of the image sensor into contact with the contact portion of the test head An image sensor test apparatus for performing an optical characteristic test on at least one image sensor by inputting and outputting an electrical signal from an input unit to an input / output terminal of the image sensor, wherein the image sensor is gripped to hold an image sensor in a contact portion of a test head. A contact arm for contacting the light source, a moving means provided on the base side and moving the contact arm, a light source for irradiating light to the light receiving surface of the image sensor, and a light receiving surface of the image sensor with respect to the optical axis of the light source. Calculation means for calculating a relative shift amount of the optical axis of Group image based on the relative displacement of the optical axis of the sensor, a correction means for the at least one image sensor having measuring apparatus for correcting the position of the contact arm of the gripping state of the image sensor is provided (see claim 1).

According to the first aspect of the present invention, the calculation means calculates a relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source, and the correction means grips the image sensor based on the relative shift amount of the optical axis of the image sensor. Correct the position of the contact arm in the state.

In this way, when the optical axis of the light source is aligned with the optical axis of the image sensor, the position of the contact arm in the state of holding the image sensor is corrected so that a fine adjustment mechanism for moving the light source itself in the XY direction is unnecessary on the light source side. In addition, the image sensor test apparatus can be miniaturized and the cost of the image sensor test apparatus can be reduced.

In particular, in a test apparatus including a plurality of light sources and capable of testing a plurality of image sensors, a fine adjustment mechanism for moving the light source itself in the XY direction is unnecessary on the light source side, so that the pitch between the plurality of light sources is easy. It becomes possible to arrange | position narrowly so that the test apparatus which can test a some image sensor can be miniaturized and the cost of the said test apparatus can be reduced.

Although it does not specifically limit in the said invention, The contact arm is based on the 1st imaging means which image | photographs the said image sensor held by the said contact arm from the said light receiving surface side, and the image information picked up by the said 1st imaging means. Image processing means for recognizing a relative position of said image sensor with respect to said contact portion held in the state, wherein said correction means is provided on said expectation side, and said image sensor calculated by said calculating means. It is preferable to correct the position of the contact arm in the state of holding the image sensor based on the relative shift amount of the optical axis and the relative position of the image sensor recognized by the image processing means (see claim 2).

In addition to the calculation of the shift amount by the calculation means, the first imaging means picks up the image sensor held by the contact arm from the light receiving surface side, and the image processing means is held by the contact arm based on the captured image information. Recognizing the relative position with respect to the contact part of the image sensor of a state, and the correction means of the contact arm which grasped the image sensor based on the relative shift amount of the optical axis of an image sensor and the relative position of the image sensor with respect to a contact part, Correct the position.

Thus, when the correction means provided in the base side correct | amends the position of a contact arm based on the relative position of the image sensor with respect to a contact part, each image adds the relative shift amount of the optical axis of an image sensor with respect to the optical axis of a light source. By performing alignment of the position of the sensor, the alignment means of the optical axis of the light source and the axis of the light source of the image sensor can be given to the correction means for aligning the position of the contact arm based on the relative position of the image sensor relative to the contact portion, Since there is no need to provide a dedicated fine adjustment mechanism in the light source, the size of the image sensor test apparatus can be reduced and the cost of the image sensor test apparatus can be reduced.

In particular, in a test apparatus capable of testing a plurality of image sensors with a plurality of light sources, a fine adjustment mechanism for moving the light source itself in the XY direction is unnecessary on the light source side, so that the pitch between the plurality of light sources is easy. It can be arrange | positioned narrowly so that the test apparatus which can test a some image sensor can be miniaturized and the cost of the said test apparatus can be reduced.

Moreover, as the space | interval of several light sources narrows, the space | interval of the some contact arm arrange | positioned with respect to this also narrows, and the weight of the movable head part moved by a moving means can be reduced, and the high speed movement of a moving means is possible. At the same time, it is possible to prevent contact failure between the contact portion and the image sensor input / output terminal.

Although it does not specifically limit in the said invention, The said calculation means is made from the input / output terminal of the said image sensor to the contact part of the said test head, irradiating light from the said light source toward the light receiving surface of the said image sensor in the state which contacted the said contact part. Based on the output electrical signal, it is preferable to calculate the relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source (see claim 3).

In practice, by calculating the relative amount of deviation of the optical axis of the image sensor based on the electrical signal output from the image sensor irradiated with light from the light source, it is possible to accurately grasp this amount of deviation.

Although it does not specifically limit in the said invention, The said image processing means recognizes the relative position of the said image sensor with respect to the said contact part based on the chip | tip of the said image sensor in the image information image | photographed by the said 1st imaging means. (See claim 4), or the image processing means is based on the contact of the image sensor with respect to the contact portion based on the input / output terminal of the image sensor in the image information picked up by the first imaging means. It is preferable to recognize the location (see claim 5).

In this way, the image processing means recognizes the relative position of the image sensor relative to the contact portion based on the chip itself or the input / output terminal of the image sensor on the image information picked up by the first imaging means. Even when the package is misaligned with the chip itself or with the input / output terminal, contact failure can be prevented.

Although not specifically limited in the above invention, the image sensor further includes a transparent mounting surface on which the image sensor is mounted, and the contact arm electrically connects an input / output terminal guided to the surface opposite to the light receiving surface by the image sensor. It is preferable to have an upper contact to be formed, and the mounting surface is movable to an arbitrary position in the XY plane substantially parallel to the contact portion (see claim 6).

Since the contact arm has the upper contact, it becomes possible to test the image sensor of the type in which the input / output terminals are led to the opposite side to the light receiving surface. Further, by placing the image sensor held by the contact arm on the transparent mounting surface, the mounting surface is driven and positioned so that the input / output terminal of the image sensor is connected to the upper contact of the contact arm, thereby preventing contact failure. It becomes possible.

Although it does not specifically limit in the said invention, It further includes the 2nd imaging means which image | photographs the said contact part, The said image processing means is based on the image information imaged by the said 1st imaging means and the said 2nd imaging means, The said It is preferable to recognize the relative position of the image sensor with respect to the contact portion held by the contact arm (see claim 7).

In this manner, the contact portion is picked up by the second imaging means, and the relative position with respect to the contact portion of the image sensor held by the contact arm is recognized based on the image information and the image information picked up by the first imaging means. It is possible to accurately grasp the relative position of the image sensor.

Although it does not specifically limit in the said invention, The said contact arm is provided between the holding | gripping side arm holding the said image sensor, the base side arm fixed to the said moving means, and the said holding side and the base side arm, It is preferred to have lock and free means capable of constraining or unrestricting the plane motion of the gripping side arm with respect to the base arm in an XY plane substantially parallel to the contact portion (see claim 8).

When the contact arm is corrected by the correction means, the lock-and-free means is restrained and the gripping arm can be relatively moved relative to the base arm. When this correction is completed, the lock-and-free means is restrained and the base arm is restrained. Hold the gripping arm relative to the. As a result, the correction means can be provided on the base side instead of each contact arm, and the weight of the contact arm is reduced, so that the moving means can be moved at high speed and the contact failure can be prevented.

Although it does not specifically limit in the said invention, It is preferable that the said contact arm further has planar matching means which can rotate the said image sensor about the arbitrary axis parallel to the said X-Y plane (refer Claim 9).

Even when the contact portion is inclined when the image sensor is in contact with the contact portion, the planar matching means makes it possible to align and operate the image sensor with respect to the contact portion, thereby preventing contact failure.

Although it does not specifically limit in the said invention, It is preferable that the said correction means has a drive part which moves the holding | gripping side arm which became non-constrained by the said lock and free means to arbitrary positions in the XY plane (refer claim 10). The drive unit further includes a first drive unit for moving the gripping side arm in the X direction in the XY plane, a second drive unit for moving the gripping side arm in the Y direction, and any gripping arm in the XY plane. It is preferable to include a third driving unit for rotating around the point of (see claim 11).

And although it does not specifically limit in the said invention, It is preferable that the said mounting surface is moved in the said X-Y plane by the drive part which the said correction means has (refer Claim 12).

By driving the placement surface by the drive portion of the correction means, it is not necessary to provide a dedicated drive portion for driving the placement surface, which makes it possible to reduce the size of the image sensor test apparatus and at the same time the cost of the image sensor test apparatus. It can be reduced.

Although it does not specifically limit in the said invention, It is preferable that the said holding | gripping side arm has one or two or more contact members which contact | connect the said correction means (refer Claim 13), The said contact member is a tip part of the said contact member It is preferable that it has one formed convex part or concave part, and the said correction means has the other concave part or convex part which can engage with the said convex part or one concave part (refer Claim 14).

Since the holding arm of the contact arm and the correction means drive the correction means in a state where the contact member is engaged, the contact arm can be precisely followed by the movement of the correction means, so that the position of the contact arm by the correction means Alignment can be performed accurately.

Although it does not specifically limit in the said invention, It is preferable that the reflecting means which reflects an image is provided on the optical axis of the said 1st imaging means (refer Claim 15).

By fitting the reflecting means on the optical axis of the first imaging means, the first imaging means can be placed horizontally on the base, whereby the height of the image sensor test apparatus can be lowered to achieve miniaturization.

(2) In order to achieve the above object, according to the second aspect of the present invention, the input and output terminals of the image sensor are brought into contact with the contact portion of the test head by a contact arm, and the light receiving surface of the image sensor is irradiated with light from the light source. And inputting and outputting an electrical signal from the contact portion of the test head to the input / output terminal of the image sensor, thereby performing an optical property test on at least one of the image sensors. A calculation step of calculating a relative shift amount of the optical axis of the image sensor and a position of correcting the position of the contact arm in the state of holding the image sensor based on the relative shift amount of the optical axis of the image sensor calculated in the calculation step. A test method for an image sensor having at least one correction step is provided (claim 16). Reference).

According to the second aspect of the present invention, in the calculating step, the relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source is calculated, and in the first correction step, the relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source is calculated. Based on this, the position of the contact arm in the state of holding the image sensor is corrected.

When the optical axis of the light source is aligned with the optical axis of the image sensor in this way, the position of the contact arm holding the image sensor is corrected so that a fine adjustment mechanism for moving the light source itself in the XY direction on the light source side is unnecessary. In addition, the image sensor test apparatus can be miniaturized and the cost of the image sensor test apparatus can be reduced.

In particular, in the test method for testing a plurality of image sensors using a plurality of light sources, a fine adjustment mechanism for moving the light source itself in the XY direction is unnecessary on the light source side, so that the pitch between the plurality of light sources is easy. It can be arrange | positioned narrowly so that the test apparatus which can test a some image sensor can be miniaturized, and the cost of the said test apparatus can be reduced.

Although it does not specifically limit in the said invention, Although it captures in the said contact arm based on the 1st imaging step which image | photographs the said image sensor held by the said contact arm from the said light-receiving surface side, and the image information imaged in the said 1st imaging step, And a first recognition step of recognizing a relative position of the image sensor in the closed state with respect to the contact portion, wherein, in the first correction step, the relative shift amount of the optical axis of the image sensor calculated in the calculation step and the It is preferable to correct the position of the contact arm in the state of holding the image sensor based on the relative position of the image sensor recognized in the first recognition step (see claim 17).

In addition to the above calculation step, in the first imaging step, the image sensor held by the contact arm is imaged from the light receiving surface side, and in the first recognition step, the image is held by the contact arm based on the captured image information. Recognize the relative position of the image sensor relative to the contact portion, and grasp the image sensor based on the relative shift amount of the optical axis of the image sensor relative to the optical axis of the light source and the relative position of the image sensor relative to the contact portion in the first correction step. The position of the contact arm in one state is corrected.

In this way, when correcting the position of the contact arm based on the relative position of the image sensor with respect to the contact portion, by performing a position alignment of each image sensor by adding a relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source, It is possible to carry out alignment of the position of the contact arm based on the relative position of the image sensor relative to the contact portion, and at the same time to align the optical axis of the light source with the image sensor, and it is necessary to install a dedicated fine adjustment mechanism in the light source. As a result, the size of the image sensor test apparatus can be reduced, and the cost of the image sensor test apparatus can be reduced.

Although not specifically limited in the said invention, In the said calculation step, it irradiates light from the said light source toward the light-receiving surface of the said image sensor in the state which contacted the said contact part, From the input / output terminal of the said image sensor to the contact part of the said test head. Based on the output electrical signal, it is preferable to calculate the relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source (see claim 18).

In fact, by calculating the relative amount of deviation of the optical axis of the image sensor based on the electrical signal output from the image sensor irradiated with light from the light source, it is possible to accurately determine the amount of deviation.

Although not specifically limited in the said invention, in the said 1st recognition step, based on the chip | tip which has the said image sensor in the image information image | photographed in the said 1st imaging step, the relative position of the said image sensor with respect to the said contact part is recognized. (See claim 19), or in the first recognition step, based on the input / output terminals of the image sensor in the image information picked up in the first imaging step, the relative position of the image sensor with respect to the contact. It is preferable to recognize this (see claim 20).

As described above, in the first recognition step, the image sensor detects the relative position of the image sensor relative to the contact portion based on the chip itself or the input / output terminal of the image sensor on the image information captured in the first imaging step. Even when the package is misaligned with respect to itself or an input / output terminal, contact failure can be prevented.

Although it does not specifically limit in the said invention, The 2nd imaging step which picks up the contact arm of the state which is not holding the said image sensor, and the 3rd image picking up the said image sensor of the state which is not held by the said contact arm from the light-receiving surface side A second recognition step of recognizing a relative position of the image sensor with respect to the contact arm based on an imaging step, the image information picked up in the second imaging step, and the image information picked up in the third imaging step; And further comprising a second correction step of correcting the position of the image sensor in a state not held by the contact arm, based on the relative position of the image sensor with respect to the contact arm recognized in the second recognition step. (See claim 21).

By recognizing the relative position of the image sensor relative to the contact arm and correcting the position of the image sensor based on this, contact failure can be prevented even as a test object for an image sensor of the type in which the input / output terminals are led to the opposite side of the light receiving surface. Can be.

Although it does not specifically limit in the said invention, It is preferable to recognize the relative position with respect to the said contact part of the said image sensor gripped by the said contact arm based on the image information which imaged the said contact part further at the said 1st recognition step. (See claim 22).

In this manner, in addition to the image information obtained by capturing the image sensor in the gripped state of the contact arm described above, the relative position of the image sensor gripped by the contact arm is recognized based on the image information captured by the contact arm. This makes it possible to accurately recognize the relative position of the image sensor with respect to the contact portion.

Although it does not specifically limit in the said invention, The said 1st correction step makes the said base side contact arm into the state which restrained the XY plane substantially parallel to the said contact part of the base side contact arm which the said contact arm has. It is preferable to include the step of restraining the base side contact arm with respect to the gripping side contact arm after moving and correcting the grip side contact arm relative to the contact arm (see claim 23).

As a result, correction means for correcting the position of the contact arm in the state of holding the image sensor is provided on the expected side instead of being installed in each contact arm, and the weight of the contact arm is reduced, so that the high speed movement of the moving means is achieved. At the same time, it is possible to prevent contact failure.

1A is a plan view showing an image sensor as a test object of a test apparatus for an image sensor according to a first embodiment of the present invention.

1B is a cross-sectional view of the image sensor taken along line II of FIG. 1A.

2 is a schematic plan view showing a test apparatus for an image sensor according to a first embodiment of the present invention.

3 is a cross-sectional view of a test apparatus for an image sensor taken along line II-II in FIG. 2.

4 is a schematic cross-sectional view showing a contact arm and a test head of a test apparatus for an image sensor according to a first embodiment of the present invention.

5 is a schematic cross-sectional view showing a contact arm and an alignment device of the test device for an image sensor according to the first embodiment of the present invention.

6 is a schematic cross-sectional view showing a contact arm and an alignment device of a test device for an image sensor in another example of the first embodiment of the present invention.

Fig. 7 is a top plan view showing the lock and free mechanism used for the contact arm in the first embodiment of the present invention.

8 is a cross-sectional view of the lock and free mechanism according to line III-III of FIG. 7.

FIG. 9 is a cross-sectional view of the lock and free mechanism according to line IV-IV of FIG. 7.

Fig. 10 is a schematic side view showing a contact arm in still another example of the first embodiment of the present invention.

FIG. 11 is a view for explaining the matching operation of the image sensor (DUT) by the contact arm shown in FIG. 10. FIG.

FIG. 12 is an exploded perspective view of the planar mating mechanism used for the contact arm shown in FIG. 10. FIG.

FIG. 13A is a diagram for explaining the matching operation around the X axis in the matching operation by the contact arm shown in FIG. 10, showing a state before the matching operation; FIG.

FIG. 13B is a diagram for explaining the matching operation around the X-axis in the matching operation by the contact arm shown in FIG. 10 and showing a state after the matching operation. FIG.

FIG. 14A is a diagram for explaining the matching operation around the Y axis in the matching operation by the contact arm shown in FIG. 10, showing a state before the matching operation; FIG.

FIG. 14B is a diagram for explaining the matching operation around the Y axis in the operation by the contact arm shown in FIG. 10 and showing a state after the matching operation.

Fig. 15 is a top plan view showing a drive unit of the alignment device in the first embodiment of the present invention.

FIG. 16 is a sectional view of a driving unit taken along line VV of FIG. 15;

FIG. 17 is a cross-sectional view of a driving unit taken along line VI-VI of FIG. 15.

Fig. 18 is a block diagram showing an overall configuration of a control system of the test apparatus for image sensor according to the first embodiment of the present invention.

Fig. 19 is a diagram showing the relationship between the optical axis of the light source and the optical axis of the image sensor in the preliminary test by the image sensor test apparatus according to the first embodiment of the present invention.

Fig. 20 is a diagram showing the relationship between the optical axis of the light source and the optical axis of the image sensor in this test by the image sensor test apparatus according to the first embodiment of the present invention.

Fig. 21 is a diagram showing a state where the contact portion is picked up by the second camera when the variety is changed in the first embodiment of the present invention.

Fig. 22 is a view showing a state where two image sensors of two rows, one column and two rows and two columns are positioned upward of the alignment device in the alignment operation by the image sensor test apparatus according to the first embodiment of the present invention.

FIG. 23 is a view showing a state where an image sensor is inserted into an alignment device from the state of FIG. 22;

Fig. 24 is a flowchart showing position alignment processing of the image sensor in the first embodiment of the present invention.

Fig. 25A is a diagram showing an example of an image before alignment in the first embodiment of the present invention.

Fig. 25B is a diagram showing an example of the image in the state after alignment in the first embodiment of the present invention.

FIG. 26 is a view showing a state in which alignment of two image sensors of two rows, one column and two rows and two columns is completed from the state of FIG. 23; FIG.

FIG. 27 is a view showing a state in which four image sensors are raised from the state of FIG. 26;

FIG. 28 is a view showing a state where two image sensors of one row, one column, and one row, two columns are positioned above the alignment device from the state shown in FIG. 27;

 FIG. 29 shows a state where an image sensor is inserted into an alignment device from the state of FIG. 28;

30 is a view showing a state in which alignment of two image sensors of one row, one column, and one row, two columns is completed from the state of FIG. 29;

FIG. 31 shows a state where four image sensors are raised from the state of FIG. 30;

FIG. 32 shows a state in which four image sensors are being tested from the state of FIG. 31;

33A and 33B illustrate a centering operation of a contact arm by a lock and free mechanism in the first embodiment of the present invention.

34A is a top plan view of an image sensor as a test object of the test device for image sensors according to the second embodiment of the present invention.

34B is a bottom plan view of the image sensor shown in FIG. 34A.

34C is a cross sectional view of the image sensor taken along the line VII-VII of FIG. 34A;

Fig. 35 is a schematic cross sectional view showing a contact arm and a test head of a test apparatus for an image sensor according to a second embodiment of the present invention.

36 is a schematic cross-sectional view showing a contact arm and an alignment device of the test apparatus for an image sensor according to the second embodiment of the present invention.

37 is an enlarged schematic cross-sectional view of an upper contact of the contact arm shown in FIGS. 35 and 36.

FIG. 38 is a plan view of the upper contact shown in FIG. 37; FIG.

Fig. 39 is a flowchart showing processing of position alignment of the image sensor in the second embodiment of the present invention.

Fig. 40 is a diagram showing a state in which an image sensor mounted on the mounting surface of the alignment device is picked up by the first camera in the second embodiment of the present invention.

FIG. 41 is a view showing a state where an image sensor is positioned with respect to an upper contact from the state of FIG. 40; FIG.

FIG. 42 illustrates a state in which the contact arm holds an image sensor positioned from the state of FIG. 41; FIG.

FIG. 43 is a detailed view showing the positional relationship of a contact arm, an image sensor, and an alignment device in the state of FIG. 42; FIG.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1A is a plan view showing an image sensor that is a test object of a test apparatus for an image sensor according to a first embodiment of the present invention, and FIG. 1B is a cross-sectional view of the image sensor along the line I-I of FIG. 1A.

First, the image sensor to be tested in the first embodiment of the present invention will be described. In this image sensor DUT, as shown in Fig. 1A, a chip CH having a microlens is disposed approximately in the center. As the input / output terminal HB is led to the outer circumferential portion thereof, and the chip CH and the input / output terminal HB are packaged as a CCD sensor or a CMOS sensor, as shown in FIG. 1B. An image sensor of the type which is led to the same plane as the light receiving surface RL on which the microlenses are formed in the chip CH.

2 is a schematic plan view showing a test apparatus for an image sensor according to a first embodiment of the present invention, and FIG. 3 is a cross-sectional view of the test apparatus for an image sensor according to II-II in FIG. 2.

The test apparatus 1 for an image sensor according to the first embodiment of the present invention is an apparatus in which an image sensor (DUT) of the type shown in FIGS. 1A and 1B described above is a test target, and is shown in FIGS. 2 and 3. As shown, a handler 10 having a test unit 30, a sensor storage unit 40, a loader unit 50, and an unloader unit 60, and a test head 300 and a tester 20 are provided. It is possible to test four image sensors (DUT) at the same time.

Then, the image sensor test apparatus 1 tests the image sensor DUT before the test supplied from the sensor storage unit 40 of the handler 10 to the test unit 30 via the loader unit 50. The alignment is performed with respect to the contact portion 301 of the head 300 and the axis alignment is performed with respect to the light source 340, and then pushed to the contact portion 301 so that the image sensor DUT is moved from the light source 340. While irradiating light to the light-receiving surface RL, the tester 20 inputs and outputs an electrical signal to the image sensor DUT, executes a test, and then unloads the image sensor DUT after the test is completed. The sensor is classified and stored in the sensor storage unit 40 according to the test result.

Below, each part of this image sensor test apparatus 1 is demonstrated in detail.

Sensor storage unit (40)

The sensor storage unit 40 is a means for storing the image sensor (DUT) before and after the test, the supply tray stocker 401, the sorting tray stocker 402, and the empty tray stocker 403. And the tray conveying apparatus 404.

The supply tray stocker 401 has a plurality of supply trays on which a plurality of image sensors (DUTs) are mounted before storage, and is accommodated. In the present embodiment, as shown in FIG. 2, two supply tray stockers are provided. 401 is provided.

The sorter tray stocker 402 includes a plurality of sorting trays on which a plurality of tested image sensors (DUTs) are mounted and accommodated. In this embodiment, as shown in FIG. 2, four sorter stockers. 402 is provided.

By providing these four sorting tray stockers 402, the image sensor DUT can be classified and stored in up to four sorting according to the test results. That is, not only the classification of good and defective products, but also the classification of high quality, high speed, medium speed, low speed, or retesting among defective products are required. On the other hand, for example, in the four sorting tray stockers 402 of FIG. 2, the two sorting tray stockers 402 close to the test unit 30 are classified with an image sensor DUT having a relatively infrequent test result. The two sorting tray stockers 402 remote from the test head 300 may classify the image sensor DUT having a relatively high frequency of test results.

The empty tray stocker 403 stores the empty tray after all of the pre-test image sensor DUT mounted on the stock tray 401 for supply tray is supplied to the test unit 30.

The tray conveying apparatus 404 is a conveying means which can move to an X-axis and a Z-axis direction in FIG. 2, and is comprised from the X-axis direction rail 404a, the movable head part 404b, and four suction pads 404c. The range which includes the supply tray stocker 401, some sorting tray stocker 402, and the empty tray stocker 403 is made into the operation range.

And this tray conveyance apparatus 404 supports and supports one side of the movable head part 404b so that the X-axis direction rail 404a fixed on the base 12 of the handler 10 can move to an X-axis direction. The movable head portion 404b is provided with a Z-axis actuator, not particularly shown, and four suction pads 404c at the tip portion.

This tray conveying apparatus 404 adsorb | sucks and holds the empty tray empty by the feeder stocker 401 by the adsorption pad 404c, raises it with a Z-axis direction actuator, and moves it on the X-axis direction rail 404a. By sliding the movable head portion 404b, it is transferred to the stocker 403 for an empty tray.

Similarly, when the image sensor (DUT) after testing is full on the sorting tray stocker 402 on the sorting tray, the empty tray is attracted and held by the stocking tray stocker 403, and is lifted by the Z-axis actuator. , The movable head 404b is slid over the X-axis direction rail 404a to be transferred to the stocker 402 for the splitter tray.

In addition, although illustration is abbreviate | omitted, each stocker 401-403 is equipped with the elevator which can raise and lower a tray to a Z-axis direction, and the tray conveyance apparatus 404 is shown in FIG. Since the operation range is provided so that it does not overlap in the Z-axis direction with any operation range of the 1st and 2nd XYZ moving apparatuses 501 and 601 mentioned later, operation | movement of the tray conveying apparatus 404, and 1st And the operations of the second XYZ mobile devices 501 and 601 do not interfere.

In addition, the number of stockers in this invention is not specifically limited to the above-mentioned number, It is possible to set suitably as needed.

Loader 50

The loader part 50 is a means for supplying the image sensor DUT to the test part 30 from the stock tray 401 of the sensor storage part 40, The 1st XYZ moving apparatus 501, It consists of two loader buffers 502 and a heat plate 503.

The 1st XYZ moving apparatus 501 moves the image sensor DUT mounted on the supply tray of the stocker 401 for a supply tray of the sensor storage part 40 to the heat plate 503, and this heat plate 503 Is a means for moving the image sensor (DUT), to which the predetermined thermal stress is applied, to the loader buffer portion 502 on the Y-axis direction rail 501a, the X-axis direction rail 501b, and the movable head part. 501c and adsorption pad 501d, the range which includes the supply tray stocker 401, the heat plate 503, and the two loader buffer parts 502 is made into the operation range.

As shown in FIG. 2, the two Y-axis direction rails 501a of the first XYZ moving device 501 are fixed on the base 12 of the handler 10, and the X-axis direction rails therebetween. 501b is slidably supported in the Y-axis direction. Moreover, this X-axis direction rail 501b is supported so that the movable head part 501c which has a Z-axis direction actuator (not shown) can be slidable to an X-axis direction. Moreover, this movable head part 501c has four adsorption pads 501d in a lower end part, and can drive the said 4 adsorption pads 501d up and down in a Z-axis direction by driving the said Z-axis direction actuator. It is supposed to be done.

The 1st XYZ moving apparatus 501 places four adsorption pads 501d on four image sensors DUT mounted in a supply tray, attracts four image sensors DUT at once, and heat plate 503 ) To position the concave portion 503a formed on the surface to release the image sensor DUT.

The heat plate 503 is a heating means for applying a predetermined thermal stress to the image sensor DUT. For example, the heat plate 503 is a metal plate provided with a heat source (not shown) at the bottom. On the surface of the upper side of this heat plate 503, a plurality of recesses 503a for dropping the image sensor DUT are formed, and the image sensor DUT before the test is the first XYZ moving device 501. Is moved from the stocker 401 for supply trays to this recessed part 503a. After the image sensor DUT is heated to the predetermined temperature in the heat plate 503, the image sensor DUT is moved to the loader buffer unit 502 by the first XYZ moving device 501. .

On the other hand, as will be described later, since the alignment of the image sensor DUT is performed by the alignment device 320 before the test, the heat plate (not having the recess 503a on the heat plate 503) is provided. The surface of 503 may be a simple plane, and the first XYZ moving device 501 may mount the image sensor DUT on this plane. Moreover, the surface of the heat plate 503 is made into the plane provided with the adsorption pad which the adsorption surface faces perpendicularly upward, The 1 XYZ moving apparatus 501 places the image sensor DUT on this adsorption pad, The image sensor DUT may be sucked by the suction pad provided in the heat plate 503.

The loader buffer unit 502 reciprocates the image sensor DUT between the operating range of the first XYZ moving device 501 and the operating range of the YZ moving device 310 (described later) of the test unit 30. As a means for making it, it consists of the movable part 502a and the X-axis direction actuator 502b.

The movable part 502a is supported by one end of the X-axis actuator 502b fixed on the base 12 of the handler 10, and the image sensor DUT is dropped in the upper surface of this movable part 502a. Four concave portions 502c which can be formed are formed. The first XYZ moving device 501 holds and moves four image sensors (DUTs) before the test heated to a predetermined temperature on the heat plate 503 at once, thereby moving them to hold the recesses of the loader buffer part 502 ( 502c to release the image sensor (DUT). The loader buffer unit 502 holding four image sensors DUT extends the X-axis direction actuator 502b to operate the YZ moving device 310 from the operating range of the first XYZ moving device 501. Move the image sensor (DUT) within range.

On the other hand, without providing the recessed part 502c on the movable part 502a, the surface of the said movable part 502a may be made into the plane provided with the adsorption pad which the adsorption surface was perpendicularly upward, for example. In this case, when the first XYZ moving device 501 mounts the image sensor DUT on the suction pad, and the suction pad adsorbs the image sensor DUT, the X-axis direction actuator 502b is extended to YZ movement. When the movement into the operating range of the device 310 is completed, the adsorption of the suction pad is released, and the YZ moving device 310 holds the image sensor DUT.

By providing the loader buffer unit 502 as described above, the first XYZ moving device 501 and the YZ moving device 310 can operate simultaneously without mutual interference.

In addition, by providing two loader buffer sections 502 as in the present embodiment, the image sensor DUT is efficiently supplied to the test head 300 to increase the operation rate of the image sensor test apparatus 1. Can be.

In the present invention, the number of the loader buffer units 502 is not particularly limited to two, and is based on the time required for position alignment of the image sensor DUT described later, the time required for the test of the image sensor DUT, and the like. Can be set appropriately.

Test section (30)

4 is a schematic cross-sectional view showing a contact arm and a test head of the test apparatus for an image sensor according to the first embodiment of the present invention, and FIG. 5 is a contact arm of the test apparatus for an image sensor according to the first embodiment of the present invention. Schematic sectional drawing which shows the alignment apparatus, FIG. 6: Schematic sectional drawing which shows the contact arm and the alignment apparatus of the test apparatus for image sensors in the other example of 1st Embodiment of this invention.

The test unit 30 performs position alignment of the image sensor DUT, and then electrically contacts the input / output terminal HB of the image sensor DUT with the contact pin 302 of the contact unit 301. The image sensor by inputting an electrical signal from the tester 20 to the image sensor DUT through the contact unit 301 of the test head 300 while irradiating light to the light receiving surface RL of the image sensor DUT. As a means for testing the optical characteristics of the image sensor (DUT), such as whether or not the amount of received light of the (DUT) is constant, the YZ moving device 310, four alignment devices 320 (correction means), and four light sources ( 340).

First, the test head 300 used in the test unit 30 will be described. As shown in FIG. 4, the test head 300 includes four contact portions 301 arranged in two rows and two columns on the board. It arrange | positions and is arrange | positioned in the arrangement substantially corresponded with the arrangement | positioning of the four contact arm 315 which the movable head part 312 of the YZ movement apparatus 310 mentioned later has.

Each contact portion 301 is provided with a plurality of contact pins 302, and these contact pins 302 are arranged to substantially match the arrangement of the input / output terminals HB of the image sensor DUT to be tested. It is.

As shown in FIG. 3, the test head 300 is detachably provided with respect to the handler 10 so as to close the opening 11 formed in the base 12 of the handler 10. The unit 301 is electrically connected to the tester 20 via the cable 21 as shown in the figure.

In addition, as shown in FIG. 4, the test apparatus 1 for an image sensor according to the present embodiment includes a test head so that light can be irradiated to the light receiving surface RL of the image sensor DUT from below. Openings 303 are formed in substantially central portions of the contact portions 301 of 300, respectively. Each of the openings 303 has a size such that the light receiving surface of the image sensor DUT can be identified from below.

When the shape of the image sensor DUT and the arrangement of the input / output terminals HB are changed by the change of the type of the image sensor DUT, the test head 300 is suitable for another test suitable for the image sensor DUT after the change. By replacing with the head 300, it is possible to perform testing of various kinds of image sensors DUT with one test apparatus 1 for image sensors.

As shown in FIG. 3 and FIG. 4, the test section 30 of the image sensor test apparatus 1 according to the present embodiment is vertically below the openings 303 formed in the contact sections 301. A light source 340 capable of irradiating light upward is fixed relatively to the base 12 of the handler 10. And it is possible to irradiate light simultaneously to the light receiving surface RL of the four image sensors DUT tested simultaneously through the opening part 303 formed in the four contact part 301 from each light source 340. It is supposed to be done.

The YZ moving device 310 of the test unit 30 is a means for moving the image sensor DUT between the alignment device 320 and the test head 300. While performing position alignment support of the DUT, test support of the image sensor DUT by the test head 300 is performed.

As shown in FIGS. 2 and 3, the YZ moving device 310 is slidable in the Y-axis direction on a pair of Y-axis rails 311 fixed on the base 12 of the handler 10. Two X-axis direction supporting members 311a are supported. Moreover, the movable head part 312 is supported by the substantially center part of each X-axis direction supporting member 311a, and includes the range which includes the alignment apparatus 320 and each contact part 301 of the test head 300. As shown in FIG. The operating range is set.

Since this YZ moving apparatus 310 has two movable head parts 312, while the other movable head part 312 is carrying out a test, the other movable head part 312 is, By performing position alignment of the image sensor DUT, it is possible to increase the operation rate of the test head 300. On the other hand, at this time, the movable head parts 312 supported by the two X-axis direction supporting members 311a which operate simultaneously on a pair of Y-axis direction rails 311 are controlled so that operation | movement may not interfere with each other.

As shown in Figs. 4 and 5, each of the movable head portions 312 includes a camera support member 312a, a second camera 312b (second image pickup means), and one Z-axis direction actuator 313. ), One base portion 314, and four contact arms 315 corresponding to the arrangement of the contact portions 301, and four image sensors (DUTs) held by the contact arms 315. It is possible to move in the Y-axis direction and the Z-axis direction. Each contact arm 315 has a grip side arm 317, a lock and free mechanism 318, and a base side arm 316. On the other hand, the four image sensors (DUT) in the present embodiment, two contact arms 315 located in the Y-axis forward direction in FIG. 2, two contact arms 315a positioned in the Y-axis negative direction in the first row. 2nd row, two contact arms 315a positioned in the X-axis negative direction, the first row, and two contact arms 315 positioned in the X-axis positive direction, the second row. .

One end of the main body portion 313a of the Z-axis actuator 313 of the movable head portion 312 is fixed to the X-axis direction supporting member 311a, and the other end thereof is supported by the camera supporting member 312a. At the end of the camera support member 312a on the test head 330 side, a second camera 312b for imaging the contact portion 301 of the test head 300 has an optical axis whose Z axis is in a negative direction. It is installed to face.

In addition, although the 2nd camera installation position in this invention is not specifically limited to said installation position, For example, you may provide the 2nd camera 312b in the edge part of the test head 300 side of the base part 314. As a result, since the second camera 312b can be moved in the Z-axis direction by the Z-axis actuator 313, the focus of the second camera 312b is changed in accordance with the drive of the Z-axis actuator 313. When the second camera 312b has a lighting function, the illuminance can be adjusted.

The base part 314 is fixed to the front-end | tip of the movable rod part 313b of the Z-axis actuator 313 of the movable head part 312, and according to the drive of this Z-axis actuator 313, the base part 314 is Ascending and descending in the Z-axis direction. In addition, four base side arms 316 are fixed to the base part 314 at a pitch corresponding to the four contact parts 301 of the test head 300, and the bottom surface of each base side arm 316 is fixed. The holding arm 317 is provided in the lock and free mechanism 318.

Each grip side arm 317 has an adsorption pad 317c for adsorbing an image sensor DUT at the center of its bottom face. In addition, a heater 317a and a temperature sensor 317b are embedded in this holding side arm 317, and the high temperature thermal stress applied from the heat plate 503 is maintained as the heater 317a, and the temperature sensor ( 317b indirectly detects the temperature of the image sensor DUT by detecting the temperature of the gripping arm 317 and is provided to ON / OFF control of the heater 317a and the like.

Moreover, the contact member 317d which protrudes in the Z-axis negative direction is provided in the bottom end part of each holding side arm 317. As shown in FIG. Thus, the holding | gripping side arm 317 has the contact member 317d, When the movable head part 312 applies predetermined pressure to the alignment movable stage 321, it is grasped by this contact member 317d. When the side arm 317 is supported by the alignment device 320 and the lock-and-free mechanism 318 is in a non-constrained state, the holding side arm 317 is movable stage 321 of the alignment device 320 (to be described later). ), So as to be able to follow the motion (see FIG. 26).

On the other hand, as shown in FIG. 6, the recessed part 317e is formed in the front-end | tip of the contact member 317d, and this recessed around the 1st opening part 321a of the movable stage 321 of the alignment apparatus 320. As shown in FIG. By providing the convex part 321d corresponding to the part 317e and engaging the concave part 317e and the convex part 321d, the followability in the position alignment of the image sensor DUT may be improved. Moreover, the periphery of the periphery of the opening of the recessed part 317d and the outer periphery of the front end of the convex part 321d are formed in a taper shape, so that the positioning of the holding arm 317 relative to the movable stage 321 can be facilitated. Also good. In addition, for example, a suction pad, a magnet, or the like is provided at the front end of the contact member 317d and the circumference of the first opening 321a of the movable stage 321 to further follow the followability of the alignment of the image sensor DUT. You may improve.

7 is a top plan view showing a lock and free mechanism used for a contact arm in a first embodiment of the present invention, FIG. 8 is a cross-sectional view of a lock and free tool taken along line III-III of FIG. It is sectional drawing of the lock-and-free mechanism along the IV-IV line | wire 7.

The lock-and-free mechanism 318 used for the contact arm 315 according to the present embodiment has a grip side arm 317 in a state where the image sensor DUT is attracted and held with respect to the base arm 316. Is a means for non-restricting or restraining the plane motion on a plane substantially parallel to the contact portion 301, that is, the motion of θ rotation about the X-axis, the Y-axis direction and the Z-axis. 33A and 33B, after the image sensor DUT is released, the center line CL _H of the gripping arm 317 is substantially at the center line CL _R of the base arm 316. In order to coincide, the gripping arm 317 is provided with a centering function for returning to the origin.

As shown in FIGS. 7-9, this lock and free mechanism 318 includes a fixed portion 3181, a movable portion 3322, a restraining piston 3183, a centering piston 3184, It is comprised by the ball 3185 for centering.

The fixed part 3141 of the lock-and-free mechanism 318 has the outline of a quadrangular pillar, and the hollow part is formed in the lower side inside in order to accommodate a part of movable part 3322. In addition, in order to hold | maintain the movable part 3142 accommodated in the hollow part so that planar movement is possible, the circular opening part 3141a is provided in the center part of the lower surface of the fixed part 3141. As shown in FIG.

Further, inside the fixed portion 3151, a receiving portion for accommodating two restraining pistons 3183, two centering pistons 3184, and two centering balls 3185 is formed, respectively. . A restraining air supply port 3181b for supplying air to the restraining piston 3183 is formed at one side surface of the fixing part 3151, and two restraining air supply ports are provided from the restraining air supply port 3181b. A restraining air passage 3311c is formed between the pistons for piston 3183.

In addition, a centering air supply port 3181d for supplying air to the centering piston 3184 is formed on one side of the fixing part 3151, and two air supply ports 3181d are provided from the centering air supply port 3181d. A centering air passage 3181e is formed between the centering piston 3184. On the other hand, the restriction air passage 3151c and the centering air passage 3151e do not cross each other.

The movable part 3222 of the lock-and-free mechanism 318 has a roughly circumferential shape in which the lateral middle part is concave in the center part, and the hollow part in the lower side of the fixing part 3181 is located above the concave part in the center part. The movable part 3222 is held in the fixing part 3181 by the part accommodated as a part and the center part is cut off in the opening 3181a, and the movement of a Z-axis direction is controlled, and the X-axis, Y-axis direction, The motion of the rotation of θ about the Z axis is permitted.

Moreover, this movable part 3222 has two arcuate accommodating parts 3142a with an upper surface concave in order to support the centering ball 3185, and this accommodating part 3322a provides a centering ball ( 3185) can be supported. These accommodating parts 3222a are provided on the upper surface of the movable part 3142 so that the center of the concave arc shape coincides with the center line of the centering piston 3184 at the time of centering.

The restraining piston 3183 of the lock-and-free mechanism 318 is accommodated in a receiving portion in which the fixing portion 3181 is formed, and a lower end surface of the restraining piston 3183 contacts the upper surface of the movable part 3322. It is.

In addition, the centering piston 3184 is accommodated in the housing portion formed in the fixed portion 3181, and abuts with the centering ball 3185 below.

The centering ball 3185 of the lock-and-free mechanism 318 has a substantially spherical shape, and its motion in the X-axis and Y-axis directions is on the inner wall surface of the receiving portion formed in the fixing portion 3181. Bound by The centering ball 3185 is in contact with the centering piston 3184 at the upper portion thereof, and is in contact with the housing portion 3322a provided at the upper surface of the lock and free movable portion 3322 at the lower portion thereof.

When the lock-and-free mechanism 318 is made non-constrained, the movable part 3222 is not supplied with air to all the pistons, that is, the two restraining pistons 3183 and the two centering pistons 3184. It is set to the state which can be planar motion with respect to the fixing part 318.

When the lock-and-free mechanism 318 is brought into a restrained state, air is supplied to the two restraining pistons 3183 to fix the movable part 3222 to the fixed part 3181. On the other hand, air supply to the two centering pistons 3184 is not performed.

When centering the lock-and-free mechanism 318, the air supply to the two restraining pistons 3183 is stopped, the movable part 3142 is once unbound, and the two centering pistons 3184 are next. Air is supplied to press the centering ball 3185 to match the arc shape of the concave portion formed on the upper surface of the accommodating portion 3322a, and to move to the center of the concave arc shape. By the operation of these two centering balls 3185, the movable part 3222 is centered so that the center of the fixed part 3151 may be centered.

This lock-and-free mechanism 318 is provided on the lower end surface of the base side arm 316 as the upper end surface of the fixing part 3181, and the holding side arm 317 as the lower end surface of the movable part 3318. The lock and free mechanism 318 is provided between the base side arm 316 and the grip side arm 317 to form the contact arm 315.

By providing the above-described lock and free mechanism 318 between the base arm 316 and the grip arm 317, the driving means for position alignment of the image sensor DUT is provided for each grip side arm 317. FIG. ), The weight of the movable head portion 312 of the YZ moving device 310 can be reduced, enabling high-speed movement of the movable head portion 312, and at the same time an image sensor (DUT). It is possible to reduce the frequency of occurrence of contact failure of the contact portion 301.

In addition, as shown in FIG. 10, each contact arm 315 may include a planar matching mechanism 330 between the base portion 314 and the base side arm 316. Thus, even when the contact portion 301 is slightly inclined, the contact arm 315 is matched with the contact portion 301 so that the image sensor DUT can be brought into contact with the contact portion 301 without difficulty. do.

The plane matching mechanism 330 hangs the image sensor DUT held by the suction pad 317c of the gripping arm 317 to perform a matching operation with respect to the XY plane parallel to the contact portion 301. 11 is a planar matching means of a type, as shown in FIG. 11, in the image sensor DUT, α rotation about an X axis substantially parallel to the XY plane parallel to the contact portion 301, and the plane Β rotation about the Y-axis which is substantially parallel to is enabled.

As shown in FIG. 12, the planar registration mechanism 330 includes a Y-axis rotation accommodating member 331 and a Y-axis rotation matching member 332 which perform a matching operation about the Y axis, and an X axis. An X-axis rotation accommodating member 333 and an X-axis rotation accommodating member 334 performing a matching operation, bolts 335 and nuts 336 slidably fixed to each other, and an appropriate elastic force to give centering Spring 337 for performing this, and the connecting member 338 for connecting the base member 340 and the planar matching mechanism 330.

As shown in FIG. 12, the Y-axis rotation accommodating member 331 has the 1st concave circular arc shape 331a formed in the lower surface along the circumferential direction centering on the Y-axis, and is substantially center part. The first through hole 331b through which the bolt 335 penetrates is formed. On the other hand, the Y-axis rotation matching member 332 is formed with the first convex arc shape 332a of the shape corresponding to the 1st concave arc shape 331a of the Y-axis rotation accommodating member 331 on the upper surface. At the same time, a second through hole 332b through which the bolt 335 penetrates is formed in the substantially center portion thereof.

The first concave arc shape 331a of the Y-axis rotation accommodating member 331 and the first convex arc shape 332a of the Y-axis rotation accommodating member 332 are used to rotate the center of the image sensor DUT. 14A and 14B, the center C _O2 of the circle C ₂ , which is an extension of these arc shapes, is set to substantially coincide with the center position of the image sensor DUT.

The first through hole 331b of the Y-axis rotation accommodating member 331 has a diameter smaller than the inner diameter of the spring 337, and the bolt 335 and the Y-axis rotation accommodating member (inserted into the through hole 331b) It is possible to sandwich the spring 337 between the 331.

Between the Y-axis rotation housing member 331 and the Y-axis rotation registration member 332, a flexible spacer 332c made of synthetic resin, such as Teflon, and a plurality of bearings 332d, for example, for smooth sliding operation. Is installed. In a substantially central portion of the spacer 332c, a third through hole 332e is formed to allow the bolt 335 to pass therethrough.

As shown in FIG. 12, a plurality of grooves 332f are formed on the upper surface of the Y-axis rotational matching member 332 along the circumferential direction of the first convex arc shape 332a. In the spacer 332c, a plurality of small diameter holes 332g into which the plurality of bearings 332d are inserted are formed at positions corresponding to the plurality of grooves 332f formed in the Y-axis rotational matching member 332. have. Moreover, the some groove 331c is formed in the lower surface of the Y-axis rotation accommodating member 331 in the position which opposes the some groove 332f of the Y-axis rotation accommodating member 332.

And when the circular arc shape 331a, 332a of the Y-axis rotation accommodating member 331 and the Y-axis rotation accommodating member 332 join together, the groove 331c of the Y-axis rotation accommodating member 331, and the Y-axis Between the grooves 332f of the rotational matching member 332, a plurality of bearings 332d inserted into the small diameter holes 332g of the spacer 332c are fitted, and along each of the grooves 332f, each bearing ( By rotating 332d, the Y-axis rotation matching member 332 smoothly slides with respect to the Y-axis rotation accommodation member 331. As described above, the first circular arcs 331a and 332a of these members 331 and 332 have the same center of rotation as the center of rotation CO ₂ and the image sensor DUT. By the sliding operation, β rotation of the image sensor DUT about the Y axis is achieved.

As shown in FIG. 12, the X-axis rotation accommodating member 333 is provided in the lower surface of the Y-axis rotation registration member 332 mentioned above. The X-axis rotation accommodating member 333 has a second concave arc shape 333a along the circumferential direction centered on the X-axis, and a bolt 335 penetrates substantially at the center thereof. The fourth through hole 333b is formed. On the other hand, the X-axis rotation matching member 334 has the 2nd convex arc shape 334a of the shape corresponding to the 2nd concave arc shape 333a of the X-axis rotation accommodating member 333 on the upper surface. At the same time, a fifth through hole 334b through which the bolt 335 penetrates is formed in a substantially central portion thereof.

The second concave arc shape 333a of the X-axis rotation accommodating member 333 and the second convex arc shape 334a of the X-axis rotation accommodating member 334 rotate the center of the image sensor DUT. 13A and 13B, the center C _O1 of the circle C ₁ , which is an extension of these arc shapes, is set to substantially coincide with the center position of the image sensor DUT.

Between the X-axis rotation accommodating member 333 and the X-axis rotation mating member 334, the flexible spacer 334c which consists of synthetic resins, such as Teflon, for example, and the some bearing 334d, in order to make sliding operation smooth. Is installed. In the substantially center portion of the spacer 334c, a sixth through hole 334e is formed to allow the bolt 335 to pass therethrough.

As shown in FIG. 12, a plurality of grooves 334f are formed on the upper surface of the X-axis rotational matching member 334 along the circumferential direction of the second convex arc shape 334e. In the spacer 334c, a plurality of small diameter holes 334g into which the plurality of bearings 334d are inserted are formed at positions corresponding to the plurality of grooves 334f formed in the X-axis rotational matching member 334. have. Moreover, the some groove 333c is formed in the lower surface of the X-axis rotation accommodating member 333 in the position which opposes the some groove 334f of the X-axis rotation accommodating member 334. As shown in FIG.

And when the circular arc shape (333a, 334a) of the X-axis rotation accommodating member 333 and the X-axis rotation accommodating member 334 joins, the groove 333c of the X-axis rotation accommodating member 333, and X Between the grooves 334f of the axial rotational matching member 334, a plurality of bearings 334d inserted into the small diameter holes 334g of the spacer 334c are inserted, and each bearing 334d along the grooves 334f. By this rotation, the X-axis rotational matching member 334 smoothly slides with respect to the X-axis rotation accommodating member 333. As described above, the second circular arc shape 333a of these members 333, 334, Since 334a coincides with the center of rotation (C _O1 ) and the center of the image sensor DUT, α rotation about the X axis of the image sensor DUT is achieved by the sliding operation described above. .

In the planar registration mechanism 330 having such a configuration, an upper surface of the base arm 316 is provided on the bottom surface of the X-axis rotational matching member 334, and is provided on the contact arm 315. In addition, you may provide this planar matching mechanism 330 between the lock-and-free mechanism 318 and the holding | gripping side arm 317. FIG. In addition, in this embodiment, the Y-axis rotation matching member 332 and the X-axis rotation accommodating member 333 are comprised independently from each other, and are mutually fixed by a method, such as a bolt fastening, for example, Based on processing constraints, the Y-axis rotation matching member 332 and the X-axis rotation housing member 333 may be integrally formed without being limited thereto.

As for each member 331, 332, 333, and 334 comprised as mentioned above, the 1st circular arc shape 331a, 332a, and the 2nd circular arc shape 333a, 334a mutually mutually The springs 337 are fitted to the upper surface of the Y-axis rotation accommodating member 321 by joining the circular arc shafts 90 degrees apart, and the bolts 335 in the through holes 331b, 332b, 333b, and 334b. Is inserted into the lower surface of the X-axis rotational matching member 334, and is assembled by fastening with a nut 336. On the other hand, the bolt 335 protrudes from the upper surface of the Y-axis rotation accommodating member 331 to such an extent that sufficient elastic force can be applied to the spring 337.

In addition, a connection member having an inner space of a size sufficient to accommodate the bolt 335 and the spring 337 protruding from the upper surface of the Y-axis rotation housing member 331 is formed on the top surface of the Y-axis rotation housing member 331. 338 is provided on the Y-axis rotation accommodating member 331 by, for example, a bolt, etc., and the connecting member 338 is installed on the base 340 of the movable head 312 by, for example, a bolt. The contact arm 315 is connected to the movable head portion 312.

Referring to the plane matching operation by α rotation about the X axis of the plane matching mechanism 330, as shown in FIG. 13A, the image sensor DUT is connected to the contact unit 301 as shown in FIG. Since no external force is applied to the image sensor DUT in the state that is not in contact with the X-axis, the X-axis rotational matching member 334 with respect to the X-axis rotation housing member 333 is caused by the elastic force of the spring 337. They are centered to align their axes with each other. In this state, the centerline CL of the gripping arm 317 coincides with the vertical direction (Z-axis direction in FIGS. 13A and 13B).

On the other hand, as shown in Figure 13B, at the time of a test run, α ₀ ˚ inclined plane (PL) when the contact part image sensor (DUT) to (301) above the contact, in substantially the pressing force at the time of contact In an even way, the X-axis rotational matching member 334 is slid relative to the X-axis rotation accommodating member 333. By this sliding operation, the base arm 316, the lock-and-free mechanism 318, and the grip arm 317 provided on the X-axis rotational matching member 334 are located at the center position C of the image sensor DUT. _o1 ), and the matching operation of the image sensor (DUT) with respect to the inclined contact portion 301 is performed. In this state, the center line (CL _H) of the side gripping arm 317 is inclined with respect to α ₀ ˚ vertical direction. In this state, the spring 337 is contracted by the sliding operation of the X-axis rotational matching member 334, and when the image sensor DUT and the contact portion 301 are in a non-contact state after the test execution, The spring 337 extends by the elastic force, so that centering of the X-axis rotational matching member 334, that is, home return, is performed.

Next, the plane matching operation by β rotation about the Y axis of the plane matching mechanism 330 will be described. As shown in Fig. 14A, the image sensor DUT is connected to the contact portion (before the test execution). Since the external force is not applied to the image sensor DUT similarly to the case of FIG. 13A described above, the Y-axis rotational matching member 332 is caused by the elastic force of the spring 337 in the state where it is not in contact with 301. Is centered with respect to the Y-axis rotation accommodating member 331 so as to align the axes mutually. In this state, the centerline CL of the gripping arm 317 coincides with the vertical direction (Z-axis direction in FIGS. 14A and 14B).

On the other hand, as shown in Fig. 14B, at the time of a test run, β ₀ ˚ inclined plane (PL) when the contact part image sensor (DUT) to (301) above the contact, in substantially the pressing force at the time of contact In the equalizing direction, the Y-axis rotational matching member 332 is slid relative to the Y-axis rotation accommodation member 331. By this sliding operation, the X-axis rotation housing member 333, the X-axis rotation registration member 334, the base arm 316, the lock-and-free mechanism 318 provided on the Y-axis rotation registration member 332, and The gripping arm 317 rotates about the center position _{CO 2} of the image sensor DUT, and a matching operation of the image sensor DUT with respect to the inclined contact portion 301 is performed. In this state, the centerline CL _H of the gripping arm 317 is inclined β ₀ degrees with respect to the vertical direction. In this state, when the spring 337 is contracted by the sliding operation of the Y-axis rotational matching member 332, and the image sensor DUT and the contact portion 301 are in a non-contact state after the test is executed, The spring 337 is extended by the elastic force, and the centering of the Y-axis rotational matching member 332 is performed.

When the image sensor DUT is in contact with the contact portion 301 on the plane PL inclined α ₀ ° about the X axis and β ₀ ° about the Y axis, the Y-axis rotation accommodating member 331 While the Y-axis rotational matching member 332 is relatively sliding relative to the X axis rotation matching member 332 with respect to the X-axis rotational receiving member 333 installed in the sliding Y-axis rotational matching member 332 Relatively sliding, matching operation of the image sensor DUT with respect to a plane substantially parallel to the contact portion 301 is performed.

The alignment device 320 in the test unit 30 of the image sensor test apparatus 1 according to the present embodiment performs position alignment of the gripping arm 317 to thereby adjust the position alignment of the image sensor DUT. As a means to perform, as shown in FIG. 2, in this embodiment, one set of two alignment apparatus 320 is provided with respect to one movable head part 312, and the handler 10 has a total of two sets Four alignment devices 320 are provided. Accordingly, among the four image sensors (DUT) held in one movable head portion 312, alignment of two image sensor (DUT) positions is performed simultaneously, and as a result, four image sensors (DUT) are performed in two alignments. Alignment is performed.

For example, while one movable head portion 312 of the YZ moving device 310 is performing a test, one set of two alignment devices 320 are two rows 1 by the other movable head portion 312. To the test head 300 by performing position alignment of two image sensors (DUTs) in columns and two rows and two columns, and then performing alignment of two image sensors (DUTs) in one row, one column and one row and two columns. It is possible to supply the image sensor (DUT) whose alignment has been completed efficiently, and increase the operation rate of the test head 300. In addition, the number of the alignment apparatus in this invention is not specifically limited to the number of said apparatuses, It can set suitably from the time required for alignment of an image sensor, the time required for the test of an image sensor, the number of contact parts, etc. Do.

As shown in FIG. 5, the alignment device 320 includes a movable stage 321, a driver 322, a sensor side light 323, a reflector 324 (reflecting means), and a camera side light. 325 and a first camera 326 (first imaging means).

The first camera 326 of the alignment device 320 is a CCD camera or the like for imaging the image sensor DUT from the light receiving surface side when aligning the position of the image sensor DUT.

The first camera 326 is provided such that the optical axis OL _C of the camera 326 is reflected by the reflector 324 to face the Z-axis positive direction. In this way, by providing the reflector 324 on the optical axis OL _{C of} the first camera 326, the first camera 326 can be arranged horizontally with respect to the base 12, thereby providing a handler ( 10) It is possible to lower the height of itself.

In addition, on the optical axis OL _C of the first camera 326, the annular camera side illumination 325, like the annular sensor side illumination 323, does not interfere with the progress of the optical axis OL _C. In addition, the first camera 326 is provided to identify at least all the input and output terminals (HB) of the image sensor (DUT). Thereby, the illumination intensity sufficient for the 1st camera 326 to identify the input-output terminal HB of the image sensor DUT is ensured.

On the other hand, the first camera 326 and the second CCD camera 312b described above are being calibrated with the cameras or the like during the manufacture of the handler 10.

As a specific method of the calibration, the calibration device 320 is placed on the alignment device 320 so that the first camera 326 can identify a transparent calibration gauge in which the X and Y coordinate axes having the shape of an image sensor (DUT) are displayed. Is captured by the first CCD camera 326 to read the XY coordinate axis and its center position displayed on the calibration gauge. Next, the second camera 312b is positioned above the gauge, imaged by the second camera 312b of the gauge, and the XY coordinate axis and center position of the calibration gauge are read. The XY coordinate axis of this calibration gauge becomes a reference X-Y coordinate system between two cameras 326 and 312b.

Above the sensor side illumination 323 of the alignment apparatus 320, the movable stage 321 which has the 1st opening part 321a is provided. The first opening 321a formed in the movable stage 321 is large enough for the image sensor DUT to pass through, i.e., at the bottom end of each holding side arm 317 of the movable head 312 described above. It has a size which does not let the contact member 317d provided pass. The movable stage 321 is configured such that the first opening 321a does not interfere with the progress of the optical axis OL _C , and the first camera 326 has at least all input / output terminals HB of the image sensor DUT. ) Can be identified.

This movable stage 321 is provided in the movable plane 3224 (described later) of the drive unit 322 via the stage support member 321b, and is centered on the X-axis, the Y-axis movement, and the Z-axis. It is possible to rotate the θ rotation. On the stage support member 321b, the first camera 326 does not disturb the progress of the optical axis OL _C of the first camera 326, and the first camera 326 connects at least all input / output terminals HB of the image sensor DUT. The second opening 321c having an identifiable size is formed.

On the other hand, the sensor side illumination 323, the reflector 324, the camera side illumination 325, and the 1st camera 326 are movable stage 321 and the stage support member so that it may not be moved by the drive of the drive part 322. It is supported by the base 12 side of the handler 10 independently of 321b and the movable plane 3224. In contrast, the holding arm 317 holding the image sensor DUT is operated by the Z-axis actuator 313 of the movable head 312 while the lock-and-free mechanism 318 is not restrained. In a state in which a predetermined pressure is applied to the stage 321, it is possible to rotate in the X-axis and the Y-axis direction and in the θ rotation around the Z-axis along the driving operation of the drive unit 322.

As shown in FIG. 15, the driving unit 322 of the alignment device 322 is a means for moving the movable stage 321 in the X-axis and Y-axis directions on the XY plane, and rotating the θ about the Z-axis. It consists of three drive motors 3221, 3222, 3223, a movable plane 3224, a planar support member 3225, and a base 3262.

Three driving motors 3221, 3222, and 3223 are provided in the base 3262, and the first driving motor 3221 has a first eccentric shaft 3221 a. The center (x ₀ , y ₀ ) on the eccentric side of the eccentric shaft 3221a is located at a distance L from the center (x _a , y _a ) of the drive shaft of the first driving motor 3221.

Similarly, the second drive motor (3222) for, the first and second has an eccentric shaft (3222a), the second center (x _1, y ₁₎ of the eccentric side of the eccentric shaft (3222a), the second drive motor It is located at a distance L from the center (x _b , y _b ) of the drive shaft of 3322.

Similarly, the third drive motor (3223) for a third has an eccentric shaft (3223a), the third center (x _2, y ₂₎ of the eccentric side of the eccentric shaft (3223a), the third driving motor It is located at a distance L from the center (x _c , y _c ) of the drive shaft of 3223.

The movable plane 3224 of this drive part 322 is a flat plate member of rectangular shape, for example, and the rectangular 2nd opening 3322b which has a long side in the X-axis direction is provided in the center part. Moreover, the rectangular 1st opening 3221b which has a long side in a Y-axis direction is provided in the one edge part along the Y-axis direction of this movable plane 3224. Further, a third third opening 3223b having a long side in the Y-axis direction is provided at the other end along the Y-axis direction of the movable plane 3224.

As can be seen from FIG. 16, the first eccentric shaft 3221 a of the first driving motor 3221 is inserted in the center of the first opening 3321 b so as to be movable and rotatable.

Similarly, the 2nd eccentric shaft 3322a of the 2nd drive motor 3222 is inserted in the center part of the 2nd opening part 3322b so that a movement and rotation are possible.

Similarly, the 3rd eccentric shaft 3223a of the 3rd drive motor 3223 is inserted in the center part of the 3rd opening part 3223b so that a movement and rotation are possible.

In this way, the three eccentric shafts 3321 a, 3322 a, and 3223 a are inserted to be movable and rotatable, thereby enabling movement in the X-Y plane of the movable plane 3224.

The planar support members 3225 of the drive unit 322 are members that support the movable plane 3224 to enable X-Y-θ motion, and are provided at three locations in the drive unit 322 as shown in FIG. As shown in FIG. 17, at the position where each planar support member 3225 is provided in the movable plane 3224, the opening part 3224a of the circumference smaller than the outer periphery of the planar support member 3225 is formed, The opening portion 3224a is configured such that a portion where the central portion of the planar support member 3225 is cut off is located. Thereby, it becomes possible to stably support the movable plane 3224 which moves and rotates by drive of the drive motors 3321,3222,3223.

In FIG. 15, when the movable plane 3224 of the drive unit 322 of the alignment device 320 is moved in the X-axis positive direction, the first driving motor 3221 is driven to rotate in the -θ direction and the third The driving motor 3223 is rotationally driven in the + θ direction, and the second driving motor 3322 is not driven.

In addition, when the movable plane 3224 is operated in the negative X-axis direction, the first driving motor 3221 is driven to rotate in the + θ direction and the third driving motor 3223 is rotated in the -θ direction. It is good to drive. Also in this case, the second driving motor 3222 is not driven.

In FIG. 15, when the movable plane 3224 of the drive unit 322 of the alignment device 320 is moved in the Y-axis forward direction, the first driving motor 3221 and the third driving motor 3223 are not driven. Instead, only the second drive motor 3222 may be driven to rotate in the + θ direction.

In addition, when moving the movable plane 3224 in the negative Y-axis direction, only the second driving motor 3222 is driven without driving the first driving motor 3221 and the third driving motor 3223. What is necessary is just to drive rotation to (theta) direction.

In FIG. 15, when the movable plane 3224 of the drive unit 322 of the alignment device 320 is rotated in the + θ direction around the second eccentric shaft 3322a, the first driving motor 3221 is rotated. While rotationally driving in the + θ direction, the third driving motor 3223 is rotationally driven in the + θ direction, and the second driving motor 3322 is not driven.

In addition, when the movable plane 3224 is rotated in the -θ direction about the second eccentric shaft 3322a, the first drive motor 3221 is driven to rotate in the -θ direction and the third drive is used. The motor 3223 is rotationally driven in the -θ direction, and the second driving motor 3322 is not driven.

On the other hand, by rotating-driving the 1st driving motor 3221, the 2nd driving motor 3222, and the 3rd driving motor 3223 according to (theta) ₀ , (theta) ₁ , (theta) ₂ calculated by the following formula | equation, The movable plane 3224 can be moved to the target position (x, y) and rotated to the target posture (θ). On the other hand, the rotational center of the target position (θ) is a second center (x _1, y ₁₎ of the eccentric shaft (3222a).

When θ = 0, in the first driving motor 3221,

In the second driving motor 3222,

In the third drive motor 3223,

It is good to drive the rotation of.

In addition, when (theta)> 0, in the 1st drive motor 3221,

In the second driving motor 3222,

In the third drive motor 3223,

It is good to drive the rotation of.

In addition, when (theta) <0, the 1st drive motor 3221 is,

In the second driving motor 3222,

In the third drive motor 3223,

It is good to drive the rotation of. However, in said formula, a, b, c, n are

to be.

For example, in FIG. 15, the centers of the drive shafts of the three driving motors 3221, 3222, and 3223 are (x _a , y _a ) = (0, 50), (x _b , y _b ) = (-10, 0), (x _c , y _c ) = (0, -50), the center of rotation (θ) of the movable plane 3224 is the center of the second eccentric axis (x ₁ , To move from y ₁ ) = (0, 0) to (10, 10), (x _a , y _a ) = (-10, 40), (x _b , y _b ) = (-20, -10) By substituting the above equation as (x _c , y _c ) = (-10, -60), the XY-θ motion in the case where the rotation center of the movable plane 3224 is set to (10, 10) is possible. do.

By using the drive unit 322 of the alignment device 320 as described above, it becomes possible to move the position of the grip side arm 317 holding the image sensor DUT, so that the position alignment of the image sensor DUT Is achieved.

The base 3326 supporting the three drive motors 3221, 3222, and 3223 of the drive unit 322 of the alignment device 320 is fixed to the base 12 side of the handler 10. It is. In addition, the movable plane 3224 is connected to the movable stage 321 via the stage support member 321b, and in the initial state as shown in FIG. 15, the center and the center of the central axis of the second drive shaft 2222 are formed. The optical axis OL _C of one camera 326 is provided so as to match.

In addition, the 1st drive part, the 2nd drive part, and the 3rd drive part which were mentioned in the Claim are corresponded to the X-axis direction operation, the Y-axis direction operation, and the (theta) rotation operation centering on the Z axis of the movable plane 3224, respectively, mentioned above. As a functional expression, it does not correspond to the 1st drive motor 3221, the 2nd drive motor 3222, and the 3rd drive motor 3223.

It is a flowchart which shows the whole structure of the control system of the test apparatus for image sensors which concerns on 1st Embodiment of this invention.

Next, the overall configuration of the control system in the image sensor test apparatus 1 according to the present embodiment will be described. As shown in FIG. 18, the system includes the first and second cameras 326 described above. , 312b, the tester 20, the centralized control device 70 having the shift amount calculating part 71 (calculation means) and the image processing part 72 (image processing part), and the YZ moving device 310 The control apparatus 80 for YZ mobile apparatus which performs control, and the control apparatus 90 for alignment apparatus which performs control of the alignment apparatus 320 are comprised.

The first and second cameras 326 and 312b are connected to the centralized control device 70 so that the captured image information can be transmitted to the centralized control device 70. In addition, the centralized control device 70 controls the tester 20, the control device 80 for the YZ moving device, and the alignment device for the alignment device so that it is possible to collectively perform the control of the entire test device 1 for the image sensor. It is connected to 90, respectively, and it is especially possible to receive the output signal acquired from the image sensor DUT at the time of test from the tester 20. FIG.

As described above, in the test for the image sensor, when the type of the image sensor is changed, a preliminary test is executed to perform an optical axis of the image sensor DUT after the type change in the state located above the light source 340. with respect to (OL _D), the axial alignment of the optical axis (OL _L) of the light source 340, the optical axis, the image sensor such that the (OL _L) match on same axis (DUT), an optical axis (OL _D), the light source 340 of the It needs to be done in advance.

In contrast, the deviation amount calculation unit 71 of the centralized control device 70 according to the present embodiment is obtained by the tester 30 from the image sensor DUT in a preliminary test immediately after the variety exchange of the image sensor DUT. A light source as shown in FIG. 19 is received by receiving an output signal, deriving a distribution of light incident on the image sensor DUT from this received signal, and extracting the optical axis OL _L of the light source 340 from this distribution. It is possible to calculate the shift amount _{D of the} optical axis OL _{D of the} image sensor DUT with respect to the optical axis OL _L of 340.

The shift amount D calculated as described above is fed back to this test following this preliminary test. Specifically, in the present test, the image sensor with the shift amount D added so that the shift amount D is canceled at the time of the position alignment of the image sensor DUT by the above-described alignment device 320. Position alignment of the DUT is performed, and as shown in FIG. 20, the optical axis OL _L of the optical axis 340 and the optical axis OL _D of the image sensor DUT substantially coincide with each other in the test. High accuracy testing of the sensor (DUT) can be performed.

The image processing unit 72 of the centralized control device 70 according to the present embodiment has, for example, an image processing processor and the like for image information captured by the first camera 326 and the second camera 312b. By performing the image processing, it is possible to recognize the position and attitude of the contact unit 301 and the image sensor DUT on the image, and calculate the alignment amount of the image sensor DUT.

And when the kind of image sensor DUT is changed, the position of the some contact pin 302 of each contact part 301 is made into the image information image picked up by the 2nd camera 312b by the image processing part 72 Performing the image processing to extract and calculating the center position of the contact portion 301 and the XY coordinate axis at the contact portion 301 from the extracted position, thereby making contact on the image captured by the CCD camera 312b. The position and attitude of the unit 301 are calculated. This makes it possible to recognize a change in the position of the contact portion 301 generated due to the change of the test head 300 or the like.

In this test, the image processing unit 72 performs image processing on the image information captured by the first camera 326, and recognizes the position and attitude of the image sensor DUT on the image. And centering on the necessary X-axis, Y-axis direction and Z-axis of the image sensor DUT to match the position and posture of the image sensor DUT on the image with the position and posture of the recognized contact portion 301. The alignment amount of one θ rotation is calculated. On the other hand, the coordinate system on the image picked up by the first camera 326 and the second camera 312b corresponds to the calibration of the cameras 326 and 312b as described above.

The alignment amount calculated in this manner is transmitted to the YZ moving device control device 80 and the alignment device control device 90 by the centralized control device 70. The alignment device control device 90 performs control of each actuator of the drive unit 322 of the alignment device 320 based on the transmitted amount of alignment, and position alignment of the image sensor DUT is performed. At this time, when the amount of deviation D is known in the preliminary test as described above, the amount of deviation D corresponds to the amount of alignment transmitted from the centralized control device 70 to the alignment device control device 90. It is added.

frozen Loader (60)

The unloader unit 60 is a means for carrying out the image sensor DUT, which has been tested from the test unit 30, to the sensor storage unit 40, and includes a second XYZ moving device 601 and two unloaders. The buffer unit 602 is provided.

The unloading buffer unit 602 is a means capable of reciprocating between the operating range of the YZ moving device 310 and the operating range of the second XYZ moving device 601, and the movable unit 602a and the X-axis direction actuator. 602b. The movable part 602a is supported by the front-end | tip of the X-axis direction actuator 602b fixed on the base 12 of the handler 10, and the image sensor DUT is dropped in the upper surface of the said movable part 602a. Four concave portions 602c are formed.

Then, the YZ moving device 310 has been tested with the concave portion 602c of the movable part 602a of the unloading buffer part 602 located within the operating range of the YZ moving device 310. When the DUT is dropped, the unloader buffer portion 602 reduces the X-axis direction actuator 602b, thereby making it possible to move the movable portion 602a within the operating range of the second XYZ moving device 601. It is.

On the other hand, without providing the recessed part 602c on the movable part 602a, for example, the surface of the said movable part 602a may be made into the plane provided with the adsorption pad which the adsorption surface is perpendicularly upward. In this case, the YZ moving device 310 mounts the image sensor DUT on the adsorption pad, and the adsorption pad adsorbs the image sensor DUT to reduce the X-axis direction actuator 602b, thereby reducing the second XYZ. When the movement into the operating range of the moving device 601 is completed, the adsorption of the suction pad is released, and the second XYZ moving device 601 holds the image sensor DUT which has been completed for this test.

By providing the unloading buffer unit 602 as described above, the second XYZ moving device 601 and the YZ moving device 310 can operate simultaneously without interfering with each other. In addition, by providing two unloading buffer sections 602, the image sensor DUT can be efficiently carried out from the test head 300, and the operation rate of the image sensor test apparatus 1 can be increased. In addition, in the present invention, the number of unloading buffer parts is not particularly limited to two, and it can be appropriately set from the time required for alignment of the image sensor, the time required for testing the image sensor (DUT), and the like.

The second XYZ moving device 601 is a means for moving and mounting the image sensor DUT on the unloading buffer 602 to the sorting tray of the stocker 402 for sorting trays, and the Y-axis direction rail 601a. And an X-axis direction rail 601b, a movable head portion 601c, and a suction pad 601d, and include two unloader buffer portions 602 and a splitter stocker 402. Has a range of motion.

As shown in FIG. 2, the two Y-axis rails 601a of the second XYZ moving device 601 are fixed on the base 12 of the handler 10, and the X-axis rails therebetween. 601b is slidably supported in the Y-axis direction. In addition, this X-axis direction rail 601b supports the movable head part 601c provided with a Z-axis direction actuator (not shown) so that sliding to the X-axis direction is possible. Moreover, this movable head part 601c has four adsorption pads in the lower end part, and it is possible to raise and lower the said four adsorption pads 601d in a Z-axis direction by driving the provided Z-axis direction actuator. have.

The second XYZ moving device 601 places the four adsorption pads 601d on the image sensor DUT on the unloading buffer unit 602 to adsorb the four image sensors DUT at once. By moving over the sorting tray of the sorting tray stocker 402, it is possible to release the image sensor DUT on the sorting tray after positioning.

Hereinafter, with reference to FIGS. 21-33B, the test method of the image sensor DUT by the image sensor test apparatus 1 which concerns on this embodiment is demonstrated.

On the other hand, in the test by the image sensor test apparatus 1 according to the present embodiment, in addition to the present test in which the image sensor DUT is actually tested, the optical axis of the light source 340 after the variety of image sensors is exchanged as described above. There is also a preliminary test for the purpose of coinciding (OL _L ) with the optical axis (OL _D ) of the image sensor (DUT). Explain separately.

FIG. 21 is a view showing a state where a contact portion is picked up by a second camera when a variety is changed in the first embodiment of the present invention, and FIG. 22 is a view of the test apparatus for an image sensor according to the first embodiment of the present invention. In the alignment operation, a diagram showing a state in which two image sensors of two rows, one column and two rows and two columns are positioned above the alignment device, and FIG. 23 illustrates a state in which the image sensor is inserted into the alignment device from the state of FIG. 22. 24 is a flowchart showing the position alignment processing of the image sensor in the first embodiment of the present invention, and FIG. 25A is a view showing an example of the image before the alignment in the first embodiment of the present invention. 25B is a diagram showing an example of the image in the post-alignment state in the first embodiment of the present invention, and FIG. 26 is an alignment of two image sensors of two rows, one column and two rows and two columns from the state of FIG. Is a state in which four image sensors are raised from the state of FIG. 26, and FIG. 28 shows two image sensors of one row, one column, and one row and two columns from the state of FIG. Is a view showing a state where the positioning is above the alignment device, FIG. 29 shows a state where the image sensor is inserted into the alignment device from the state of FIG. 28, and FIG. 30 shows one row, one column, and one column from the state of FIG. FIG. 31 shows a state where alignment of two image sensors in a row 2 column is completed, FIG. 31 shows a state in which four image sensors are raised from the state of FIG. 30, and FIG. 32 shows four image sensors from the state of FIG. 31. 33A and 33B are diagrams showing the centering operation of the contact arm by the lock and free mechanism in the first embodiment of the present invention.

21-23 and 26-32 are schematic sectional drawing which looked at the test part 30 toward the X-axis negative direction in FIG. 2, and the movable head part 312 is movable in the Y-axis positive direction in FIG. The head part 312 is shown, and the alignment apparatus 320 has shown one set of two alignment apparatus 320 of the Y-axis forward direction in FIG. 21 to 23 and 25 to 32, the image sensor DUT shown in the middle right side shows the image sensor DUT in one row, one column, and one row and two columns, and is shown in the middle left of the figure. The image sensor (DUT) shows the image sensor (DUT) in two rows, one column and two rows and two columns (as for the contact arm 315). However, the image sensors DUT of one row, one column, and two rows and one column are not shown because they overlap one row, two columns, and two rows and two columns. Similarly, another alignment device 320 is provided on the opposite side of the illustrated alignment device 320, but is not shown because they overlap.

First, the first XYZ moving device 501 uses four suction pads 501d to provide four image sensors on the supply tray located at the top of the stocker 401 for the supply tray of the sensor storage unit 40. Adsorb and hold the DUT).

Next, the first XYZ moving device 501 holds the four image sensors DUT by the Z-axis actuator provided in the movable head 501c while holding the four image sensors DUT. It raises, slides the X-axis direction rail 501b on the Y-axis direction rail 501a, and slides the movable head part 501c on the X-axis direction rail 501b, and moves to the loader part 50. As shown in FIG. And the 1st XYZ moving apparatus 501 positions above the recessed part 503a of the heat plate 503, extends the Z-axis actuator of the movable head part 501c, and adsorbs the pad 501d. Is released to drop the image sensor DUT into the recess 503a. When the heat plate 503 heats the image sensor DUT to a predetermined temperature, the first XYZ moving device 501 again holds the four image sensors DUT heated and waits for one loader buffer. Move up 502. Then, when the first XYZ moving device 501 is positioned above the movable part 502a of one of the loader buffer parts 502, the Z-axis actuator of the movable head part 501c is extended. By releasing the suction pad 501d, four image sensors DUT are dropped into the recess 502c formed on the upper surface of the movable portion 502a.

Next, the loader buffer unit 502 extends the X-axis direction actuator 502b while holding four image sensors (DUTs) to operate the first XYZ device 501 of the loader unit 50. The four image sensors DUT are moved from the range to the operating range of the YZ moving device 310 of the test unit 30.

On the other hand, when the variety of the image sensor DUT to be tested is changed, before or at the same time as the above operation, as shown in FIG. 21, in the test unit 30, the movable head of the YZ moving device 310. The part 312 is moved to the contact part 301, and the contact part 301 is imaged with the 2nd camera 312b. The image information picked up by the second camera 312b is image-processed by the image processing unit 72 of the centralized control device 70, and the position and attitude of the contact unit 301 on the image are recognized from the image information. do.

Next, the Z-axis direction actuator 313 provided in one movable head portion 312 of the YZ moving device 310 located above the loader buffer portion 502 extends, and the movable head portion 312 is extended. The four adsorption pads 317c included in the) absorb and hold the four image sensors DUT positioned in the recess 502c of the movable portion 502a of the loader buffer portion 502. At this time, the image sensor DUT adsorb | sucks the surface opposite to the light receiving surface RL by the adsorption pad 317c of the YZ moving apparatus 310. FIG.

Next, the movable head part 312 is raised in the state which hold | maintained four image sensors DUT by the Z-axis direction actuator 313 with which the movable head part 312 was equipped.

Next, as shown in FIG. 22, the YZ moving apparatus 310 slides the X-axis direction supporting member 311a which supports the movable head 312 on the Y-axis direction rail 311, and is 2 rows 1 Two gripping side arms 317 in columns and two rows and two columns are positioned above the alignment device 320.

Next, as shown in FIG. 23, the movable head portion 312 extends the Z-axis direction actuator 313 to the first opening 321a formed in the movable stage 321 of the alignment device 320. Inserting the image sensor (DUT) held in each of the holding arms 317, and bringing the contact member 317d of the holding arms 317 into contact with the movable stage 321 of the alignment device 320, Press at a predetermined pressure.

 Next, in step S100 of FIG. 24, the first camera 326 of the alignment device 320 performs two rows, one column, and two rows while the predetermined pressure is maintained by the Z-axis actuator 313. Two image sensors (DUT) in two rows are taken. The image information picked up by the first camera 326 is transmitted to the image processing unit 72 of the centralized control device 70.

Next, in step S110 of FIG. 24, the image processing unit 72 of the centralized control device 70 extracts the position of each input / output terminal HB of the image sensor DUT by image processing from the image information.

Next, in step S120 of FIG. 24, the image processing unit 72 determines the sensor center position DC of the image sensor DUT and XY at the image sensor DUT from the extracted positions of the input / output terminals HB. One coordinate axis DA of the coordinate axes is calculated to calculate the position and attitude of the image sensor DUT on the image picked up by the first camera 326. In addition, in this invention, it is not limited only to the method of calculating the position and attitude | position of the image sensor DUT based on the input-output terminal HB, You may calculate based on the chip CH which the image sensor DUT has. .

In this way, the image processing unit 72 contacts the contact unit 301 based on the chip CH and the input / output terminal HB of the image sensor DUT on the image information captured by the first camera 326. By recognizing the relative position of the image sensor DUT with respect to), even when the package is misaligned with the chip CH or the input / output terminal HB in the image sensor DUT, contact failure can be prevented.

As a calculation method of one coordinate axis DA of the image sensor DUT, for example, an approximate straight line passing through the center of the input / output terminal HB forming a long column among the input / output terminals HB extracted in step S110 is calculated for each column. By calculating an average straight line of the plurality of approximated straight lines. On the other hand, in order to improve the position and attitude information of the image sensor DUT with respect to the positional disturbance of the input / output terminal HB generated in the manufacturing of the image sensor DUT, and the like, the method similar to the above-described method of calculating the coordinate axis DA is described. By this means, the calculation of the other coordinate axis may be performed.

In the case where the test is the present test, the deviation amount _D of the optical axis OL _D of the image sensor DUT with respect to the optical axis OL _L of the light source 340 is canceled in this step S120. The position and attitude of the image sensor DUT are calculated by adding the shift amount D. FIG.

On the other hand, when the said test is a preliminary test, since the shift | offset | difference amount D after the varieties exchange | exchange of the image sensor DUT is not yet calculated, the shift | offset | difference amount D of the image sensor DUT is not added. Position and posture are calculated.

In this way, in the position alignment of the image sensor DUT, by adding the relative shift amount _D of the optical axis OL _D of the image sensor DUT to the optical axis OL _L of the light source 340, the contact portion ( The optical axis OL _L of the light source 340 and the light source of the image sensor DUT to the alignment device 320 that aligns the position of the contact arm 315 based on the relative position of the image sensor DUT with respect to 301. Since it is possible to give the axis alignment function of OL _D and to eliminate the need for providing a dedicated fine adjustment function to the light source 340, the test apparatus 1 for the image sensor (DUT) can be miniaturized. At the same time, the cost of the test apparatus 1 for image sensor DUT can be reduced.

In particular, in the present embodiment, since the four image sensors (DUT) are tested at the same time, the light sources 340 can be arranged in close proximity, whereby the distance between the contact portions 301 can be narrowed, and furthermore, Since the space | interval of the contact arm 315 corresponding to this contact part 301 can be narrowed, the size of the test apparatus 1 for image sensors (DUT) can be further miniaturized.

In addition, as the distance between the contact arms 315 as described above becomes narrower, the weight of the contact arms 315 itself is reduced, so that the high speed movement of the YZ moving device 310 is possible, and at the same time as the contact portions 301. Contact failure of the input / output terminal HB of the image sensor DUT can be prevented.

Next, in step S130 of FIG. 24, the image processing unit 72 compares the position and attitude of the contact unit 301 on the image with the position and attitude of the image sensor DUT. In the comparison of the step S130, when the position and the attitude coincide (YES in the step S130), the position alignment of the image sensor DUT is terminated.

On the other hand, the position and attitude of the contact portion 301 on the image to be compared in this step S130 are previously captured by the second CCD camera 312b when the variety of image sensors DUT is changed as described above. The position and attitude of the contact unit 301 on the image recognized by the image processing of the imaging processing unit 72 correspond to the position and attitude on the image of the first camera 326. FIG. 25A shows an example of an image in which each extracted input / output terminal HB of the image sensor DUT before alignment, the calculated sensor center position DC, and one coordinate axis DA of the image sensor DUT are conveniently displayed. (Same in Figure 25B). On the other hand, the central position and the XY coordinate axis of the contact portion 301 of the above image, for convenience of description, the zero point on the image, that is consistent with the optical axis (OL _C) and the XY coordinate axis of the first camera (326).

When the position and attitude of the contact unit 301 on the image and the position and attitude of the image sensor DUT do not coincide (NO in step S130 of FIG. 24), the image processing unit ( 72 calculates the required amount of alignment in rotation about the X-axis, Y-axis direction and Z-axis so that the position and attitude of the image sensor DUT match the position and attitude of the contact portion 301. .

For example, the necessary alignment amount in FIG. 25A is a movement of + x in the X-axis direction, -y in the Y-axis direction, and rotation of -γ in the θ rotation direction around the Z axis.

Next, in step S150 of FIG. 24, the centralized control device 70 holds the lock-and-hold of the image sensor DUT in two rows and one column and two rows and two columns with respect to the control device 80 for the YZ moving device. The instruction which makes the free mechanism 318 into a non-binding state is transmitted. The control apparatus 80 for YZ moving devices performs control which stops the air supply to the restraining piston 3183 of the lock-and-free mechanism 318 based on this instruction | command, and the lock-and-free mechanism 318 is non-locking. When the state is restricted, the completion signal is transmitted to the centralized control device 70.

On the other hand, when the recessed part 317e is formed in the contact member 317d in embodiment other than this invention, for example, and the convex part 321c is formed in the movable stage 321, the said recessed part 317e. And lock-free mechanism 318 may be left unrestrained prior to engagement in order to facilitate engagement of the protrusions 321c with each other.

Next, when the centralized control device 70 receives the completion signal from the YZ mobile control device 80 in step S160 of FIG. 24, the alignment amount calculated in step S140 is transferred to the control device for alignment device 90. Send. And the alignment apparatus control device 90, as shown in Fig. 26, based on the alignment amount, the first drive motor 3221 and the second drive of the drive unit 322 of the alignment device 320 The motor 3222 and the third driving motor 3223 are driven to perform position alignment of the image sensor DUT. When the drive is completed, the alignment device control device 90 transmits the completion signal to the centralized control device 70.

When the alignment by the alignment device 320 is completed, in step S170 of FIG. 24, the centralized control device 70 again compares the position and attitude of the image sensor DUT with the position and attitude of the contact unit 301. If it is determined that there is no match (NO in step S170), the process returns to step S140 to calculate the required alignment amount. In addition, you may advance from step S160 to step S180, without performing the comparison in step S170, and the processing speed of the flowchart shown in FIG. 24 can be improved by this.

In the comparison of step S170 in FIG. 24, when it is determined that the position and attitude of the image sensor DUT and the position and attitude of the contact unit 301 match (YES in step S170), in step S180 of FIG. 24. The centralized control device 70 is configured to restrain the lock and free mechanism 318 holding the image sensors DUT in two rows, one row and two rows and two columns with respect to the control device 80 for the YZ mobile device. Send the command. The control apparatus 80 for YZ moving devices performs control which supplies air to the restraining piston 3183 of the lock-and-free mechanism 318 based on this instruction | command, and the position alignment of the image sensor DUT is It ends. Meanwhile, in the above alignment operation, two alignment apparatuses 320 are substantially simultaneously performed on two image sensors DUTs having two rows, one column, and two rows and two columns.

When the alignment of the two image sensors (DUT) of the 2 rows 1 column and the 2 rows 2 columns by the alignment device 320 is completed, as shown in FIG. 27, the Z-axis actuator ( By 312, the four image sensors DUT are raised in a held state. When the image sensor DUT is separated from the alignment device 320 by the driving of the Z-axis actuator 313 and moves away from the alignment device 320, the movable stage 321 returns to the initial state by the driving unit 3322.

Next, as shown in FIG. 28, the YZ moving device 310 moves the movable head part 312 between the base side arms 316 in one row and one column and the base side arms 316 in two rows and one column. The grip side arm 317, which is moved in the negative direction of the Y axis by the pitch of, and holds the two image sensors (DUT) of the first row, first column, and the first row, second column, where the alignment is not completed, above the alignment device 320. Determine your location.

Next, as shown in FIG. 29, the movable head portion 312 extends the Z-axis direction actuator 313 to the first opening 321a formed in the movable stage 321 of the alignment device 320. And inserting an image sensor (DUT) respectively held in each gripping arm 317 so that the contact member 317d of the gripping arm 317 abuts on the movable stage 321 of the alignment device 320. Press with a pressure of.

Next, as shown in FIG. 30, with the predetermined pressure maintained by the Z-axis actuator 313, the centralized control device 70, the YZ moving device control device 80 and the alignment device control. By the apparatus 90, the process of step S100-step S180 of the flowchart of FIG. 24 mentioned above is performed, and the two image sensors DUT of 1 row 1 column and 1 row 2 column by the alignment apparatus 320 are performed. Position alignment is performed. On the other hand, in the alignment operation, two alignment devices 320 are performed substantially simultaneously on two image sensors (DUTs) in one row, one column, and one row and two columns.

Also, when the test is the present test, the shift so that the shift amount D of the optical axis of the image sensor DUT with respect to the optical axis OL _L of the light source 340 is canceled in step S120 of FIG. 24. In addition to the amount D, the position and attitude of the image sensor DUT are calculated.

On the other hand, when the said test is a preliminary test, since the shift | offset | difference amount D after the varieties exchange | exchange of the image sensor DUT is not yet calculated, it does not add the said shift | offset amount D, and does not add the image sensor DUT. The position and posture of are calculated.

When the alignment of the two image sensors (DUT) of the first row, the first column, and the first row, the second column by the alignment device 320 is completed, as illustrated in FIG. 31, the Z-axis actuator ( 313 raises the four image sensors DUT in a holding state. When the image sensor DUT is separated from the alignment device 320 by the driving of the Z-axis actuator 313 and moves away from the alignment device 320, the movable stage 321 is returned to the initial state by the driving unit 322.

As described above, two sets of alignment are performed on the four image sensors DUT by the two sets of alignment devices 320.

On the other hand, in this test, the one movable head part 312 of the YZ moving device 310 is tested by the test head 300 between the alignment of four image sensors DUT. The improvement of the operation rate of the test apparatus 1 for image sensors is aimed at.

Next, the YZ moving device 310 slides the X-axis direction supporting member 311a supporting the movable head portion 312 onto the Y-axis direction rail 311, so that the suction of the tip of the movable head portion 312 is performed. The four image sensors DUT held in the pad 317c are positioned above the four contact portions 301 of the test head 300.

32, the movable head part 312 extends the Z-axis direction actuator 313, and connects the input / output terminals HB of the four image sensors DUT to the four contact parts. Each contact pin 302 of 301 is contacted.

Then, the input / output terminal HB of each image sensor DUT is brought into contact with the contact portion 301, and at the same time, the light is irradiated from the light source 340 to the light receiving surface RL of the image sensor DUT while being contacted. By inputting and outputting an electrical signal from the tester 20 to the input / output terminal HB of the image sensor DUT from the unit 301, the four image sensors DUT are simultaneously tested.

Here, when the test is a preliminary test, the shift amount calculation unit 71 of the centralized control device 70 receives an output signal obtained by the tester 30 from the image sensor DUT at the time of the test, and this output is output. The optical axis of the light source 340, as shown in FIG. 19, is derived by deriving the distribution of light incident on the image sensor DUT from the signal and deriving the optical axis OL _L of the light source 340 from the distribution of the incident light. The shift amount _D of the optical axis OL _D of the image sensor DUT with respect to OL _L is calculated. In this way, the deviation is calculated by calculating the relative shift amount _D of the optical axis OL _D of the image sensor DUT based on the electrical signal actually output from the image sensor DUT irradiated with light from the light source 340. The quantity D can be grasped accurately.

On the other hand, in the case where the test is the present test, as described above, since the shift amount D is added to the position alignment of the image sensor DUT, as shown in FIG. The optical axis OL _L and the optical axis OL _D of the image sensor DUT substantially coincide with each other, and a test of the accuracy of the image sensor DUT can be performed.

When the test of the four image sensors DUT is completed, the YZ moving device 310 is tested by the Z-axis direction actuator 313 included in the movable head 312, and the four image sensors DUT are tested. , The X-axis supporting member 311a supporting the movable head 312 is slid onto the Y-axis rail 311 to move the held four image sensors DUT in the YZ movement. Positioned above the movable part 602a of the one unloader buffer part 602 waiting in the operating range of the apparatus 310.

Next, the movable head portion 312 extends the Z-axis actuator 313 and releases the suction pad 317c so that the four image sensors (3) are formed by the recessed portions 602c formed on the upper surface of the movable portion 602a. Drop the DUT).

33A and 33B, after carrying out the tested image sensor DUT, the movable head 312 of the YZ moving device 310 is the centerline of each holding side arm 317. As shown in FIG. The air supply to the restraining piston 3183 of the lock-and-free mechanism 318 is stopped to match CL _{H with} the center line CL _R of the base arm 316, and the centering piston 3184 is provided. The holding side contact arm 317 is centered by supplying air to the air.

Next, the unloading buffer unit 602 drives the X-axis actuator 602b while holding the four image sensors (DUTs) that have been tested, and the YZ moving device 310 of the test unit 30. ), The image sensor (DUT) is moved to the operation range of the second XYZ moving device 601 of the unloader unit 60.

Next, the Z-axis direction actuator provided in the movable part 602c of the 2nd XYZ moving apparatus 601 located above the unloading butter part 602 is extended, and four movable parts 602c were provided. The adsorption pad 601d adsorbs and holds the tested four image sensors DUT positioned in the recess 602c of the movable portion 602a of the unloading buffer portion 602.

Next, the 2nd XYZ moving apparatus 601 raises by the Z-axis direction actuator with which the movable head part 601c was equipped in the state which hold | maintained four image sensors DUT which were tested, and Y-axis direction Sliding the X-axis direction rail 601b over the rail 601a, sliding the movable head portion 601c over the X-axis direction rail 601b, the four image sensors (DUT) of the sensor storage unit 40 Move on stocker 402 for sorting tray. Here, according to the test result of each image sensor DUT, each image sensor DUT is mounted on the classification tray located in the uppermost part of the stocker 402 for each classification tray.

Second Embodiment

Fig. 34A is a top plan view showing an image sensor subjected to a test of the image sensor test apparatus according to the second embodiment of the present invention, Fig. 34B is a bottom plan view of the image sensor shown in Fig. 34A, and Fig. 34C is Fig. 34A. Fig. 35 is a schematic cross-sectional view showing a contact arm and a test head of a test apparatus for an image sensor according to a second embodiment of the present invention, and Fig. 36 is a second embodiment of the present invention. Fig. 37 is a schematic cross-sectional view showing a contact arm and an alignment device of the test apparatus for an image sensor according to the form, Fig. 37 is a schematic cross-sectional view showing an enlarged upper contact of the contact arm shown in Figs. 35 and 36, and Fig. 38 is shown in Fig. 37. Top view of the top contact.

First, the image sensor to be tested in the second embodiment of the present invention will be described. In this image sensor DUT ', as shown in Figs. 34A to 34C, the chip CH is disposed at a substantially center portion. A CCD sensor or a CMOS sensor in which an input / output terminal HB is disposed at an outer circumference thereof is similar to the image sensor DUT 'in the first embodiment. However, the input / output terminal HB is a microlens on a chip CH. It differs from the image sensor DUT in 1st Embodiment in that it is led to the opposite surface to the formed light receiving surface.

Accordingly, in the image sensor test apparatus according to the second embodiment of the present invention, as shown in Figs. 35 and 36, the structure of the contact arm 315 'and the movable stage of the alignment device 320' are shown. Although the structure of 321 'is different from the image sensor test apparatus 1 which concerns on 1st Embodiment mentioned above, the other structure is the same as that of the image sensor test apparatus 1 which concerns on 1st Embodiment. Do. Below, only the difference with the image sensor test apparatus 10 which concerns on 1st Embodiment is demonstrated about the image sensor test apparatus which concerns on 2nd Embodiment.

The contact arm 315 'of the image sensor test apparatus according to the present embodiment is an upper contact for electrically connecting the input / output terminal HB of the image sensor DUT' of the above type to the contact 301 '. 317f is different from the contact arm 315 in the first embodiment.

37 and 38, the upper contact 317f is provided around the suction pad 317c and is connected to the sensor side connected to correspond to the input / output terminal HB of the image sensor DUT '. An extension connecting line 317f2 electrically connected to the line 317f1 and the sensor-side connecting line 317f2, and arranged to extend the gap toward the outer peripheral side of the contact arm 315 ', and this extension; It is electrically connected to the connecting connection line 317f2, and has the contact side connection line 317f3 arrange | positioned so that it may correspond to the contact pin 302 of the contact part 301 '. Any connection line 317f1-317f3 is comprised with the material excellent in electroconductivity, for example, a metal material.

The image sensor DUT 'of the type in which the input / output terminal HB is led to the opposite surface of the light receiving surface RL as described above cannot be brought into direct contact with the contact portion 301' during the test. On the other hand, in the image sensor test apparatus according to the present embodiment, such an upper contact 317f is provided on the contact arm 315 ', whereby it is adsorbed by the suction pad 317c of the contact arm 315'. The input / output terminal HB of the image sensor DUT 'contacts the tip of the sensor side connection line 317f1 of the upper contact 317f, and as shown in FIG. 37, the contact of the contact portion 301'. When the tip of the contact side connection line 317f3 of the upper contact 317f contacts the pin 302, the sensor side connection line 317f1, the expansion connection line 317f2, and the contact side connection line 317f3. The input / output terminal HB of the image sensor DUT 'and the contact pin 302 of the contact portion 301' are electrically connected.

On the other hand, in the image sensor test apparatus 1 according to the first embodiment, the optical axis OL _D of the image sensor DUT 'with respect to the optical axis OL _L of the light source 340 from the viewpoint of preventing contact failure. The shift amount D is allowed to be equal to or smaller than the diameter of the contact pin 302 of the contact portion 301, but in the image sensor test apparatus according to the present embodiment, as shown in FIG. 38, the contact pin 302 The distance between the contact side connection lines 317f3 of the upper contact 317f in contact with each other is significantly wider than that between the input / output terminals HB of the image sensor DUT ', and the contact portion 301 Since the diameter of the contact pin 302 itself can be made large, it is possible to allow a large shift amount D.

As shown in FIG. 36, the movable stage 321 'of the alignment apparatus 320' of the image sensor test apparatus concerning this embodiment has the image sensor DUT 'with respect to the upper contact 317f mentioned above. In order to position the input / output terminal HB, a transparent placing surface 321e 'made of, for example, glass or synthetic resin is inserted into the first opening 321a', and the image placed on the placing surface 321e '. It is possible to image the sensor DUT 'by the first camera 326 via the mounting surface 321e', and the image sensor DUT 'mounted on the mounting surface 321e'. By driving the drive unit 322, it is possible to move in the X-axis and Y-axis directions on the XY plane, and rotate the θ about the Z-axis. In addition, an adsorption line etc. may be embedded in this mounting surface 321e ', and the mounted image sensor DUT' may be hold | maintained reliably.

Below, with reference to FIG. 39 and FIG. 43, the test method of the image sensor DUT by the image sensor test apparatus which concerns on this embodiment is demonstrated.

FIG. 39 is a flowchart showing processing of position alignment of an image sensor in the second embodiment of the present invention, and FIG. 40 shows an image sensor mounted on the mounting surface of the alignment device as the first camera in the second embodiment of the present invention. 41 shows a state in which an image sensor is positioned with respect to the upper contact from the state of FIG. 40, and FIG. 42 shows an image sensor positioned from the state of FIG. FIG. 43 is a detailed view showing the positional relationship of the contact arm, the image sensor, and the alignment device in the state of FIG. 42. FIG.

In the test method of the image sensor DUT 'by the image sensor test apparatus according to the present embodiment, the input / output terminal HB of the image sensor DUT' is derived from the surface opposite to the light receiving surface RL. The first embodiment described above has a step (steps S10 to S80 in FIG. 39) for positioning the image sensor DUT 'with respect to the upper contact 317f of the contact arm 315'. Although it differs from the test method of the image sensor DUT by the image sensor test apparatus 1 concerning this, other steps (steps S100-S180 in FIG. 24 and FIG. 39) in the said test method are 1st Embodiment. It is the same as the test method in the form. Hereinafter, only the differences of the test method in the first embodiment will be described with respect to the test method of the image sensor DUT 'in the second embodiment.

As in the first embodiment, an image sensor DUT 'to which a predetermined thermal stress is applied from the sensor storage unit 40 of the handler 10 via the heat plate 503 is loaded by the loader buffer 502. It is supplied to the test unit 30.

The contact arm 315 'of the movable head portion 312 of the YZ moving device 310 is adsorbed and held by the suction pad 317c to the image sensor DUT' supplied to the test section 30. .

When the four contact arms 315 'of the movable head portion 412 hold the image sensor DUT', respectively, the two holding side arms 317 in two rows and one column and two rows and two columns align the device 320 Position at the top of ').

Next, the movable head portion 312 extends the Z-axis direction actuator 313 to release the suction pad 317c, so that the movable stage 321 of the alignment device 320 'is shown in FIG. The image sensor DUT 'is placed on the mounting surface 321e' of ').

Next, in step S10 of FIG. 39, the first camera 326 captures the image sensor DUT 'placed on the mounting surface 321e' of the movable stage 321 '. The image information picked up by the first camera 326 is transmitted to the image processing unit 72 of the centralized control device 70.

Next, in step S20 of FIG. 39, the image processing unit 72 of the centralized control device 70 extracts the position of the chip CH of the image sensor DUT 'from the image information by image processing. In step S30 of 39, the position and attitude of the image sensor DUT 'are calculated based on the position of the extracted chip CH. In addition, in this invention, it is not limited only to the method of calculating the position and attitude | position of the image sensor DUT 'based on the chip CH, It may calculate based on the external shape (package) of the image sensor DUT'. good.

Next, in step S40 of FIG. 39, the image processing unit 72 compares the position and attitude of the upper contact 317f on the image with the position and attitude of the image sensor DUT '. In the comparison of this step S40, when the position and attitude match (YES in step S40), the positioning with respect to the upper contact 317f of the image sensor DUT 'ends, and it moves to S100 of FIG. The position alignment of the image sensor DUT 'is performed.

On the other hand, the position and attitude of the upper contact 317f on the image to be compared in this step S40 are different from each contact arm of the movable head 312 before the main test by the image sensor test apparatus is started. 315 'is positioned above the alignment device 320', and the upper contact 317f is picked up by the first camera 326 while the image sensor DUT 'is not held, and the image processing unit 72 It is calculated by the image processing of.

When the position and attitude of the upper contact 317f on the image and the position and attitude of the image sensor DUT 'do not coincide (NO in step S40 of FIG. 39), the image processing unit is performed in step S50 of FIG. 39. 72 indicates the necessary correction amount in the θ rotation about the X-axis, Y-axis direction and Z-axis so that the position and attitude of the image sensor DUT 'matches the position and attitude of the upper contact 317f. Calculate.

Next, in step S60 of FIG. 39, the centralized control device 70 transmits this correction amount to the alignment device control device 90. As shown in FIG. 41, the alignment device control device 90 includes a first drive motor 3221 and a second drive of the drive unit 322 of the alignment device 320 'based on the correction amount. The image sensor DUT 'is positioned relative to the upper contact 317f by driving the driving motor 3222 and the third driving motor 3223. When the drive is completed, the alignment device control device 90 transmits the completion signal to the centralized control device 70.

As such, the light receiving surface RL is recognized by recognizing the relative position of the image sensor DUT 'relative to the upper contact 317f of the contact arm 315' and correcting the position of the image sensor DUT 'based on this. Contact failure can be prevented even when the image sensor DUT 'of the type where the input / output terminal HB is led to the other side of the test target.

Also, in order to position the image sensor DUT 'with respect to the upper contact 317f, the mounting surface 321e' is driven by the driving unit 322 of the alignment device 320 to drive the mounting surface 321e '. In order to eliminate the need for providing a dedicated drive unit, it becomes possible to reduce the size of the image sensor test apparatus and to reduce the cost of the image sensor test apparatus.

When the alignment by the alignment device 320 is completed, in step S70 of FIG. 39, the centralized control device 70 again determines the position and attitude of the image sensor DUT 'and the position and attitude of the upper contact 317f. If it is determined that the comparison is not made (NO in step S70), the process returns to step S50 to calculate the necessary correction amount. In addition, you may progress from step S60 to step S80, without performing the comparison in this step S70, by which the process speed of the flowchart shown in FIG. 39 can always be made.

In the comparison of step S70 of FIG. 39, when it is determined that the position and attitude of the image sensor DUT 'and the position and attitude of the upper contact 317f do not match (YES in step S70), step S80 of FIG. 39. The centralized control device 70 transmits a command to the YZ moving device 310 to hold the image sensor DUT 'whose positioning has been completed by the contact arm 315' of the movable head portion 312. do. On the basis of this command, the YZ moving device 310 extends the Z-axis actuator 313 and moves the contact arm 315 'to the image sensor DUT' as shown in FIG. The image sensor DUT 'is attracted to the pad 317c and held.

On the other hand, since the image sensor DUT 'is positioned with respect to the upper contact 317f by the process of step S10-S70 mentioned above, in the adsorbed state, in the image sensor test apparatus which concerns on this embodiment, The input / output terminal HB of the image sensor DUT 'is in contact with each sensor side connection line 317f1 of the upper contact 317f.

As described above, when the positioning of the upper contact 317f of the image sensor DUT 'is finished, the position alignment of the image sensor DUT' is started next, but the contact arm 315 'is shown in step S80 of FIG. In the state where the adsorption pad 314c of () absorbs the image sensor (DUT '), as shown in FIG. 43, the alignment device 320' is positioned from the tip of the contact member 317d of the contact arm 315 '. The distance L1 to the movable stage 321 'and the distance L2 from the light receiving surface RL of the absorbed image sensor DUT' to the movable stage 321 'are substantially the same (L1 = L2). In this state, the contact member 317 can be brought into contact with the alignment device 320 'by lowering the contact arm 315' by the distance L1 minute.

Step S100-S180 of FIG. 24 in 1st Embodiment is made to contact the contact member 317 of the contact arm 315 'to the movable stage 321' of the alignment apparatus 320 ', and to press it at predetermined pressure. Similarly, the processing of steps S100 to S180 in FIG. 39 is performed to perform position alignment of the image sensor DUT '.

When the alignment of the positions of the four image sensors DUT 'is completed, the YZ moving device 310 moves the X-axis direction supporting member 311a supporting the movable head portion 312 onto the Y-axis direction rail 311. By sliding, the four image sensors DUT 'held on the suction pad 317c at the tip of the movable head 312 are positioned above the four contact portions 301' of the test head 300. . Next, the movable head part 312 extends the Z-axis direction actuator 313, and contacts the contact side connection part 317f3 of each contact arm 315 ', and the contact pin 302 of the contact part 301'. Respectively, the input / output terminals HB of the four image sensors DUT 'are electrically connected to the contact pins 302 through the connection portions 317f1 to 317f3.

The tester 20 is applied to the input / output terminal HB of the image sensor DUT 'from the contact portion 301' while irradiating light to the light receiving surface RL of the image sensor DUT 'from the light source 340. By inputting an electrical signal from the four image sensors DUT 'are tested simultaneously.

When the test of the four image sensors DUT 'is completed, the YZ moving device 310 exports the image sensor DUT' to the unloader unit 60, and the sensor storage unit 40 performs the test result. Are classified according to

In addition, embodiment described above was described in order to make understanding of this invention easy, and was not described in order to limit this invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents falling within the technical scope of the present invention.

Although the test object of the test apparatus for image sensors according to the above-described embodiment has been described as an image sensor having a microlens, the present invention is not particularly limited, and relates to, for example, receiving image information from a chip and calculating data for automatic focusing. A lens module including a circuit and combined with optical means such as a lens may be used as a test object.

Claims (23)

Contacting the input / output terminal of the image sensor with the contact portion of the test head, and inputting and outputting an electrical signal from the contact portion of the test head to the input / output terminal of the image sensor while irradiating light to the light-receiving surface of the image sensor. A test apparatus for an image sensor that performs an optical characteristic test on an image sensor, A contact arm for holding the image sensor to contact the image sensor with a contact portion of a test head; A moving means provided on the base side to move the contact arm; A light source for irradiating light to the light receiving surface of the image sensor; Calculating means for calculating a relative shift amount of the optical axis of the light receiving surface of the image sensor with respect to the optical axis of the light source; And at least correction means for correcting the position of the contact arm in a state in which the image sensor is held based on the relative amount of displacement of the optical axis of the image sensor calculated by the calculation means. Device. The method of claim 1, First imaging means for imaging the image sensor held by the contact arm from the light receiving surface side; Further comprising image processing means for recognizing a relative position of said image sensor with respect to said contact portion in a state held by said contact arm, based on the image information picked up by said first imaging means, The correction means is provided on the base side and is based on the relative shift amount of the optical axis of the image sensor calculated by the calculation means and the relative position of the image sensor recognized by the image processing means. And correcting the position of the contact arm in the state of holding. The method according to claim 1 or 2, The calculating means is based on an electrical signal output from the input / output terminal of the image sensor to the contact portion of the test head while irradiating light from the light source toward the light receiving surface of the image sensor in contact with the contact portion. And a relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source. The method of claim 2 or 3, And said image processing means recognizes a relative position of said image sensor relative to said contact portion, based on a chip of said image sensor in image information picked up by said first imaging means. tester. The method of claim 2 or 3, And said image processing means recognizes a relative position of said image sensor with respect to said contact portion based on input / output terminals of said image sensor in image information picked up by said first imaging means. tester. The method according to any one of claims 2 to 5, It further comprises a transparent mounting surface on which the image sensor is mounted, The contact arm has an upper contact for electrically connecting an input / output terminal, which is led from the image sensor to a surface opposite to the light receiving surface, to the contact portion, The placing surface is movable to an arbitrary position in the X-Y plane substantially parallel to the contact portion. The method according to any one of claims 2 to 6, Further comprising second imaging means for imaging the contact portion, And said image processing means recognizes a relative position with respect to said contact portion of said image sensor held by said contact arm on the basis of image information picked up by said first imaging means and said second imaging means. A test apparatus for an image sensor, characterized in that. The method according to any one of claims 1 to 7, The contact arm is provided between a gripping side arm that holds the image sensor, a base side arm fixed to the moving means, and the gripping side and the base side arm and is substantially parallel to the contact portion. And a lock-and-free means capable of restraining or unconstraining the plane motion of the gripping side arm with respect to the base side arm in an XY plane. The method of claim 8, And said contact arm further comprises plane matching means capable of rotating said image sensor about any axis parallel to said X-Y plane. The method according to claim 8 or 9, The correction means has a drive unit for moving the gripping-side arm, which is in an unconstrained state by the lock-and-free means, to an arbitrary position in the X-Y plane. The method of claim 10, The driving unit may include a first driving unit for moving the gripping arm in the X direction in the XY plane, a second driving unit for moving the gripping arm in the Y direction, and an arbitrary point in the XY plane for the gripping arm. And a third driving unit rotating to the center. The method according to claim 10 or 11, wherein The placing surface is moved in the X-Y plane by a drive unit included in the correction means. The method according to any one of claims 8 to 12, The gripping side arm has one or two or more contact members in contact with the correcting means. The method of claim 13, The contact member has one of the convex portions or the concave portion formed at the distal end of the contact member, and the correction means has the other of the concave portion or the convex portion that can engage with the one of the convex portion or the concave portion. Test device for an image sensor. The method according to any one of claims 1 to 14, The reflecting means for reflecting an image is provided on the optical axis of the said 1st imaging means, The test apparatus for image sensors characterized by the above-mentioned. The input and output terminals of the image sensor are brought into contact with the contact portion of the test head by a contact arm, and an electrical signal is input and output from the contact portion of the test head to the input and output terminals of the image sensor while irradiating light from a light source to the light receiving surface of the image sensor. As a result, a test method of an image sensor which performs a test of an optical characteristic with respect to at least one said image sensor, A calculation step of calculating a relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source; And a first correction step of correcting the position of the contact arm in the state of holding the image sensor, based on the relative shift amount of the optical axis of the image sensor calculated in the calculation step. Way. The method of claim 16, A first imaging step of imaging the image sensor held by the contact arm from the light receiving surface side; A first recognition step of recognizing a relative position of said image sensor relative to said contact portion of the image sensor held by said contact arm on the basis of the image information picked up in said first imaging step, In the first correction step, the state of holding the image sensor based on the relative shift amount of the optical axis of the image sensor calculated in the calculation step and the relative position of the image sensor recognized in the first recognition step. A method for testing an image sensor, comprising correcting the position of a contact arm. The method according to claim 16 and 17, In the calculating step, based on an electrical signal output from the input / output terminal of the image sensor to the contact portion of the test head while irradiating light from the light source toward the light receiving surface of the image sensor in contact with the contact portion, And calculating a relative shift amount of the optical axis of the image sensor with respect to the optical axis of the light source. The method of claim 17 or 18, In the first recognition step, on the basis of a chip having the image sensor in the image information picked up in the first imaging step, the relative position of the image sensor with respect to the contact portion is recognized. Test Methods. The method of claim 17 or 18, In the first recognition step, a relative position of the image sensor relative to the contact is recognized based on the input / output terminal of the image sensor in the image information picked up in the first imaging step. Way. The method according to any one of claims 17 to 20, A second imaging step of imaging the contact arm in a state of not holding the image sensor; A third imaging step of imaging the image sensor in a state not held by the contact arm from a light receiving surface side; A second recognition step of recognizing a relative position of the image sensor with respect to the contact arm based on the image information picked up in the second imaging step and the image information picked up in the third imaging step; And a second correction step of correcting the position of the image sensor without being held by the contact arm, based on the relative position of the image sensor with respect to the contact arm recognized in the second recognition step. The test method of the image sensor characterized by the above-mentioned. The method according to any one of claims 17 to 21, And in the first recognition step, further recognize a relative position of the image sensor held by the contact arm with respect to the contact portion, based on the image information obtained by imaging the contact portion. The method according to any one of claims 16 to 22, The first correction step is a grip side contact having the base side contact arm in the state where the contact arm has an unconstrained XY plane that is substantially parallel to the contact portion of the base side contact arm that the contact arm has. And restraining the base side contact arm with respect to the gripping side contact arm after moving and correcting relative to the arm.

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