KR20200096607A - 활성 가스 생성 장치 - Google Patents
활성 가스 생성 장치 Download PDFInfo
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Abstract
Description
도 2는 도 1에서 나타낸 활성 가스 생성용 전극군의 단면 구성을 나타내는 설명도이다.
도 3은 실시 형태의 활성 가스 생성 장치의 주요 구성부를 분해한 상태로 나타내는 설명도이다.
도 4는 전제 기술의 활성 가스 생성 장치의 단면 구조를 모식적으로 나타내는 설명도이다.
도 5는 전제 기술의 활성 가스 생성 장치의 주요 구성부를 분해한 상태로 나타내는 설명도이다.
2X: 접지측 전극 구성부
11, 12: 커버
13: 냉각대
2m, 11h, 12h, 13h, 13m: 원료 가스 유로
11e: 퍼지 가스 배출구
11p: 퍼지 가스 공급구
11w, 12w, 13w: 냉각수 경로
300: 활성 가스 생성용 전극군
Claims (4)
- 제1 전극 구성부(1X)와 상기 제1 전극 구성부의 하방에 마련되는 제2 전극 구성부(2X)를 갖는 활성 가스 생성용 전극군(300)과, 상기 제1 및 제2 전극 구성부에 상기 제1 전극 구성부가 고전압이 되도록 교류 전압을 인가하는 교류 전원부(5)를 갖는 활성 가스 생성 장치로서,
상기 제1 전극 구성부는, 제1 유전체 전극(110)과 상기 제1 유전체 전극의 상면 상에 형성되는 제1 금속 전극(100H, 100L)을 갖고, 상기 제2 전극 구성부는, 제2 유전체 전극(210)과 상기 제2 유전체 전극의 하면 상에 형성되는 제2 금속 전극(200H, 200L)을 갖고, 상기 교류 전압의 인가에 의해 상기 제1 및 제2 유전체 전극이 대향하는 유전체 공간 내에 있어서, 상기 제1 및 제2 금속 전극이 평면으로 보아 중복되는 영역인 방전 공간 형성 영역을 방전 공간으로서 포함하고,
상기 교류 전원부에 의한 상기 교류 전압의 인가에 의해, 상기 방전 공간에 방전 현상을 발생시켜, 상기 방전 공간에 공급된 원료 가스를 활성화하여 얻어지는 활성 가스가 상기 제2 전극 구성부에 마련된 가스 분출구(25)로부터 분출되고,
상기 활성 가스 생성 장치는,
상기 활성 가스 생성용 전극군의 측면 및 상면을 둘러싸도록 설치되는 제1 보조 부재(11, 12)와,
상부의 주요면 상에 상기 활성 가스 생성용 전극군 및 상기 제1 보조 부재를 배치하는 제2 보조 부재(13)를 구비하고,
상기 제1 및 제2 보조 부재에 의해, 상기 활성 가스 생성용 전극군과의 사이에 상기 방전 공간과 분리하여 교류 전압 인가 공간(R11)이 형성되고, 상기 제2 보조 부재는, 상기 가스 분출구로부터 분출되는 활성 가스를 통과시키는 보조 부재용 가스 배출구(13k)를 갖고, 상기 제1 및 제2 보조 부재는 일체적으로 연결되고,
상기 활성 가스 생성 장치는,
상기 활성 가스 생성용 전극군 및 상기 제2 보조 부재의 모두와, 상기 제1 보조 부재의 적어도 일부를 수용하는 공동부를 갖는 금속제 하우징(14)를 더 구비하고, 상기 하우징은 상기 보조 부재용 가스 배출구를 통과하는 활성 가스를 외부로 배출하는 하우징용 가스 배출구(14k)를 갖고, 상기 하우징과 상기 제1 및 제2 보조 부재 사이에 하우징 접촉 공간(R14)이 마련되고,
상기 제1 및 제2 보조 부재는, 상기 교류 전압 인가 공간과 독립적으로, 외부로부터 공급되는 원료 가스를 상기 방전 공간으로 유도하는, 원료 가스 공급 경로용 원료 가스 유로(11h, 12h, 13h, 13m)를 가짐으로써, 상기 방전 공간과 상기 교류 전압 인가 공간의 가스의 흐름을 분리하고,
상기 활성 가스 생성 장치는, 추가로 이하의 특징 (1) 내지 (5)를 가지며,
(1) 상기 제2 전극 구성부가 상기 제1 전극 구성부를 지지하는 양태로 상기 활성 가스 생성용 전극군이 구성되고,
(2) 상기 제1 유전체 전극은, 상기 방전 공간 형성 영역 이외의 방전 공간외 영역에 있어서 하방으로 돌출되는 단차부(115H, 115M, 115L)를 갖고, 상기 단차부의 형성 높이에 의해 상기 방전 공간의 갭 길이가 규정되고,
(3) 상기 제1 및 제2 유전체 전극은 각각 상기 방전 공간 형성 영역의 두께를, 상기 방전 공간외 영역보다 얇게 형성하고,
(4) 상기 하우징은 공동부외의 상면에 있어서만, 상기 제1 보조 부재와 체결됨으로써, 상기 제1 보조 부재의 측면 및 상기 제2 보조 부재의 저면에 접촉하지 않고, 공동부 내에 상기 하우징 접촉 공간을 형성하며,
(5) 상기 제1 및 제2 보조 부재는 모두 금속 재료로 구성되는,
활성 가스 생성 장치. - 제1항에 있어서, 상기 제1 및 제2 보조 부재는, 외부로부터 공급되는 냉각수를 상기 제2 보조 부재로 유도하는, 냉각수 유통 경로용 냉각수 경로(11w, 12w, 13w)를 갖는 것을 특징으로 하는,
활성 가스 생성 장치. - 제1항에 있어서, 상기 제1 보조 부재는 외부로부터 원료 가스 이외의 제2 가스를 상기 교류 전압 인가 공간에 공급하는 제2 가스 공급구(11p)를 추가로 갖고, 상기 제2 가스 공급구는 상기 원료 가스 유로와 독립적으로 마련되는,
활성 가스 생성 장치. - 제1항 내지 제3항 중 어느 한 항에 있어서, 상기 방전 공간의 압력에 비하여, 상기 교류 전압 인가 공간의 압력을 높게 설정한 것을 특징으로 하는,
활성 가스 생성 장치.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12327711B2 (en) | 2020-12-07 | 2025-06-10 | Tmeic Corporation | Active gas generation apparatus |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112166650B (zh) * | 2018-05-30 | 2023-06-20 | 东芝三菱电机产业系统株式会社 | 活性气体生成装置 |
JP6873588B1 (ja) | 2019-11-12 | 2021-05-19 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
US11839014B2 (en) * | 2019-11-27 | 2023-12-05 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Active gas generating apparatus |
JP7080575B1 (ja) * | 2020-12-24 | 2022-06-06 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置 |
US20240297024A1 (en) * | 2022-05-18 | 2024-09-05 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Active gas generation apparatus |
US20250016904A1 (en) | 2022-10-20 | 2025-01-09 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Active gas generation apparatus |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5328685B2 (ko) | 1974-09-30 | 1978-08-16 | ||
JP2006302623A (ja) * | 2005-04-19 | 2006-11-02 | Matsushita Electric Works Ltd | プラズマ処理装置及びプラズマ処理方法 |
KR20070038800A (ko) * | 2005-10-07 | 2007-04-11 | 주식회사 피에스엠 | 대기압 플라즈마 샤워유닛 이를 이용한 와이어본딩 장치 및방법 |
WO2008123142A1 (ja) * | 2007-03-27 | 2008-10-16 | Sekisui Chemical Co., Ltd. | プラズマ処理装置 |
WO2008132901A1 (ja) * | 2007-04-19 | 2008-11-06 | Sekisui Chemical Co., Ltd. | プラズマ処理装置 |
JP5694543B2 (ja) | 2011-09-08 | 2015-04-01 | 東芝三菱電機産業システム株式会社 | プラズマ発生装置、cvd装置およびプラズマ処理粒子生成装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101765902B (zh) * | 2007-08-31 | 2011-09-21 | 东芝三菱电机产业系统株式会社 | 介质阻挡放电气体的生成装置 |
WO2009069204A1 (ja) * | 2007-11-28 | 2009-06-04 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | 誘電体バリア放電装置 |
JP2010108665A (ja) * | 2008-10-29 | 2010-05-13 | Sekisui Chem Co Ltd | プラズマ処理装置 |
JP5437715B2 (ja) * | 2009-07-06 | 2014-03-12 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置およびリモートプラズマ型成膜処理装置 |
KR101236397B1 (ko) * | 2009-12-31 | 2013-02-25 | 엘아이지에이디피 주식회사 | 기판 처리 장치 |
JP5328685B2 (ja) | 2010-01-28 | 2013-10-30 | 三菱電機株式会社 | プラズマ処理装置及びプラズマ処理方法 |
CN102814109B (zh) * | 2012-08-29 | 2014-07-02 | 西安交通大学 | 一种基于介质阻挡电晕放电等离子体处理废气的装置 |
KR101503906B1 (ko) * | 2013-08-01 | 2015-03-19 | 주식회사 다원시스 | 유전체 장벽 방전 플라스마 반응기 |
CN105246241B (zh) * | 2015-10-30 | 2018-06-26 | 西安交通大学 | 一种产生大面积冷等离子体的装置 |
JP6440871B2 (ja) * | 2016-01-18 | 2018-12-19 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置及び成膜処理装置 |
US10418226B2 (en) * | 2016-05-27 | 2019-09-17 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Activated gas generation apparatus |
WO2018003002A1 (ja) * | 2016-06-28 | 2018-01-04 | 東芝三菱電機産業システム株式会社 | 活性ガス生成装置及び成膜処理装置 |
-
2018
- 2018-01-10 CN CN201880084691.4A patent/CN111527796B/zh active Active
- 2018-01-10 JP JP2019565101A patent/JP6821281B2/ja active Active
- 2018-01-10 EP EP18900159.7A patent/EP3740045B1/en active Active
- 2018-01-10 KR KR1020207019582A patent/KR102465845B1/ko active Active
- 2018-01-10 US US16/764,898 patent/US11239059B2/en active Active
- 2018-01-10 WO PCT/JP2018/000254 patent/WO2019138456A1/ja unknown
- 2018-05-29 TW TW107118297A patent/TWI675121B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5328685B2 (ko) | 1974-09-30 | 1978-08-16 | ||
JP2006302623A (ja) * | 2005-04-19 | 2006-11-02 | Matsushita Electric Works Ltd | プラズマ処理装置及びプラズマ処理方法 |
KR20070038800A (ko) * | 2005-10-07 | 2007-04-11 | 주식회사 피에스엠 | 대기압 플라즈마 샤워유닛 이를 이용한 와이어본딩 장치 및방법 |
WO2008123142A1 (ja) * | 2007-03-27 | 2008-10-16 | Sekisui Chemical Co., Ltd. | プラズマ処理装置 |
WO2008132901A1 (ja) * | 2007-04-19 | 2008-11-06 | Sekisui Chemical Co., Ltd. | プラズマ処理装置 |
JP5694543B2 (ja) | 2011-09-08 | 2015-04-01 | 東芝三菱電機産業システム株式会社 | プラズマ発生装置、cvd装置およびプラズマ処理粒子生成装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US12327711B2 (en) | 2020-12-07 | 2025-06-10 | Tmeic Corporation | Active gas generation apparatus |
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