KR20180118530A - 검사 방법 - Google Patents
검사 방법 Download PDFInfo
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- KR20180118530A KR20180118530A KR1020180043101A KR20180043101A KR20180118530A KR 20180118530 A KR20180118530 A KR 20180118530A KR 1020180043101 A KR1020180043101 A KR 1020180043101A KR 20180043101 A KR20180043101 A KR 20180043101A KR 20180118530 A KR20180118530 A KR 20180118530A
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- 238000007689 inspection Methods 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 60
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- 239000007787 solid Substances 0.000 claims description 13
- 238000013461 design Methods 0.000 claims description 10
- 239000000284 extract Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 230000006870 function Effects 0.000 description 25
- 238000003384 imaging method Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 15
- 230000007547 defect Effects 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 12
- 230000004907 flux Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000012552 review Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
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- Computer Vision & Pattern Recognition (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
도 2a 및 도 2b는 제1 실시 형태의 피검사 시료(마스크)의 검사 방법을 설명하는 모식도이다.
도 3은, 제1 실시 형태의 검사 방법의 흐름도이다.
도 4의 (a) 내지 (c)는 제1 실시 형태의 오토 포커스 기능 좌표이다.
도 5는 제2 실시 형태의 검사 방법의 흐름도이다.
도 6은 제3 실시 형태의 검사 방법의 흐름도이다.
도 7은 제4 실시 형태의 검사 방법의 흐름도이다.
Claims (12)
- 피검사 시료에 조명광을 조사하고,
상기 피검사 시료에 의해 반사된 상기 조명광을 이용하는 오토 포커스 기구를 사용하여, 상기 피검사 시료의 제1 화상을 취득하고,
상기 제1 화상을 취득할 때에 상기 오토 포커스 기구를 사용하여 취득한, 오토 포커스 기능 좌표를 보존하고,
상기 오토 포커스 기능 좌표의 2차원 다항식 근사식을 계산하고,
상기 2차원 다항식 근사식을 사용하여, 상기 피검사 시료의 제2 화상을 취득할 때의 포커스를 제어하는
검사 방법. - 제1항에 있어서, 상기 피검사 시료의 상기 제1 화상을 취득할 때의 제1 개구수를, 상기 피검사 시료의 상기 제2 화상을 취득할 때의 제2 개구수보다도 크게 하는,
검사 방법. - 제1항에 있어서, 상기 제1 화상을 취득할 때에 상기 오토 포커스 기구를 사용하여 취득한 상기 오토 포커스 기능 좌표를 보존할 때에,
상기 제1 화상의 참조가 되는 참조 화상과 상기 제1 화상의 비교를 행하고,
상기 비교로부터, 상기 제1 화상의 유효 부분을 추출하고,
상기 유효 부분의 상기 오토 포커스 기능 좌표를 보존하는,
검사 방법. - 제3항에 있어서, 상기 유효 부분은 동종 패턴인, 검사 방법.
- 제4항에 있어서, 상기 동종 패턴은 솔리드 패턴인, 검사 방법.
- 제1항에 있어서, 상기 피검사 시료에 의해 반사된 상기 조명광을 이용하는 상기 오토 포커스 기구를 사용하여, 상기 피검사 시료의 상기 제1 화상을 취득할 때에,
상기 피검사 시료의 설계 패턴 데이터를 사용하여, 상기 2차원 다항식 근사식을 계산하기 위한 필요 부분을 추출하고,
상기 피검사 시료에 의해 반사된 상기 조명광을 이용하는 상기 오토 포커스 기구를 사용하여, 상기 피검사 시료의 상기 필요 부분의 상기 제1 화상을 취득하는,
검사 방법. - 제6항에 있어서, 상기 필요 부분은 동종 패턴인, 검사 방법.
- 제7항에 있어서, 상기 동종 패턴은 솔리드 패턴인, 검사 방법.
- 제1항에 있어서, 상기 제2 화상을 취득하는, 검사 방법.
- 제9항에 있어서, 상기 피검사 시료를 투과한 상기 조명광을 사용하여 상기 제2 화상을 취득하는, 검사 방법.
- 제10항에 있어서, 상기 피검사 시료에 상기 조명광의 100%의 광을 투과시키고 상기 제2 화상을 취득하는, 검사 방법.
- 제1항에 있어서, 상기 제1 화상으로부터, 소정의 패턴 주기를 구하고,
상기 소정의 패턴 주기를 갖는 부분의 좌표, 상기 오토 포커스 기능 좌표를 보존하는,
검사 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2017-084618 | 2017-04-21 | ||
JP2017084618A JP7079569B2 (ja) | 2017-04-21 | 2017-04-21 | 検査方法 |
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KR20180118530A true KR20180118530A (ko) | 2018-10-31 |
KR102024112B1 KR102024112B1 (ko) | 2019-09-30 |
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KR1020180043101A Active KR102024112B1 (ko) | 2017-04-21 | 2018-04-13 | 검사 방법 |
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US (1) | US10267749B2 (ko) |
JP (1) | JP7079569B2 (ko) |
KR (1) | KR102024112B1 (ko) |
TW (1) | TWI686673B (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019117293B3 (de) | 2019-06-27 | 2020-11-05 | Carl Zeiss Smt Gmbh | Vorrichtung zur Vermessung von Masken für die Mikrolithographie und Autofokussierverfahren |
Citations (3)
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JP2005530997A (ja) * | 2002-06-24 | 2005-10-13 | マットソン テクノロジイ インコーポレイテッド | 熱処理チャンバ内で温度測定装置を較正するシステムおよび方法 |
KR20050109925A (ko) * | 2003-01-15 | 2005-11-22 | 네거브테크 리미티드 | 웨이퍼 결함 검출 시스템 |
KR20160028954A (ko) * | 2014-09-04 | 2016-03-14 | 가부시키가이샤 뉴플레어 테크놀로지 | 검사 방법 |
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EP0532927B1 (en) * | 1991-08-22 | 1996-02-21 | Kla Instruments Corporation | Automated photomask inspection apparatus |
US6107637A (en) * | 1997-08-11 | 2000-08-22 | Hitachi, Ltd. | Electron beam exposure or system inspection or measurement apparatus and its method and height detection apparatus |
JP2001061096A (ja) | 1999-08-23 | 2001-03-06 | Olympus Optical Co Ltd | 電子カメラ |
JP3903889B2 (ja) | 2001-09-13 | 2007-04-11 | 株式会社日立製作所 | 欠陥検査方法及びその装置並びに撮像方法及びその装置 |
JP2007322482A (ja) * | 2006-05-30 | 2007-12-13 | Nuflare Technology Inc | フォーカス合わせ装置、フォーカス合わせ方法及び検査装置 |
JP2012078164A (ja) | 2010-09-30 | 2012-04-19 | Nuflare Technology Inc | パターン検査装置 |
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US9110039B2 (en) | 2013-07-25 | 2015-08-18 | Kla-Tencor Corporation | Auto-focus system and methods for die-to-die inspection |
JP6513951B2 (ja) | 2015-01-08 | 2019-05-15 | 株式会社ニューフレアテクノロジー | 検査方法 |
JP6543070B2 (ja) * | 2015-04-01 | 2019-07-10 | 株式会社ニューフレアテクノロジー | 検査方法および検査装置 |
JP6633918B2 (ja) * | 2016-01-18 | 2020-01-22 | 株式会社ニューフレアテクノロジー | パターン検査装置 |
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JP6759053B2 (ja) * | 2016-10-26 | 2020-09-23 | 株式会社ニューフレアテクノロジー | 偏光イメージ取得装置、パターン検査装置、偏光イメージ取得方法、及びパターン検査方法 |
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- 2017-04-21 JP JP2017084618A patent/JP7079569B2/ja active Active
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- 2018-03-09 TW TW107107988A patent/TWI686673B/zh active
- 2018-03-20 US US15/926,004 patent/US10267749B2/en active Active
- 2018-04-13 KR KR1020180043101A patent/KR102024112B1/ko active Active
Patent Citations (3)
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JP2005530997A (ja) * | 2002-06-24 | 2005-10-13 | マットソン テクノロジイ インコーポレイテッド | 熱処理チャンバ内で温度測定装置を較正するシステムおよび方法 |
KR20050109925A (ko) * | 2003-01-15 | 2005-11-22 | 네거브테크 리미티드 | 웨이퍼 결함 검출 시스템 |
KR20160028954A (ko) * | 2014-09-04 | 2016-03-14 | 가부시키가이샤 뉴플레어 테크놀로지 | 검사 방법 |
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Publication number | Publication date |
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US20180306733A1 (en) | 2018-10-25 |
TW201839519A (zh) | 2018-11-01 |
JP2018179942A (ja) | 2018-11-15 |
KR102024112B1 (ko) | 2019-09-30 |
JP7079569B2 (ja) | 2022-06-02 |
US10267749B2 (en) | 2019-04-23 |
TWI686673B (zh) | 2020-03-01 |
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