KR20160034096A - Touch panel - Google Patents

Abstract

The touch panel of the present invention includes a first sensing electrode formed on one surface of a substrate and a substrate and sensing a touch input, a second sensing electrode formed on the other surface of the substrate to sense a touch input, A second wiring electrode formed on the other surface of the substrate and electrically connected to the second sensing electrode, an IC module for controlling the first sensing electrode and the second sensing electrode, And a pad having a first terminal portion electrically connected to the first wiring electrode and a second terminal portion electrically connected to the first wiring electrode, wherein the first terminal portion is electrically connected to the first wiring electrode and the second terminal portion is electrically connected to the first wiring electrode, A second pad formed with a first terminal and a second terminal electrically connected to the second wiring electrode, and a connection pad electrically connected to the IC module, It is formed from a.
The touch panel of the present invention can implement a touch panel that can control the electrodes formed on both sides of the substrate through one IC module without further having an IC module and can reduce the process cost by simplifying the process of manufacturing the touch panel So that the unit price of the touch panel can be lowered.

Description

Touch panel {Touch panel}

The present invention relates to a touch panel, in which modules provided with an IC chip for controlling electrodes when electrodes are formed on upper and lower sides of a substrate are electrically connected to electrodes of a substrate, And an electrode formed on the lower part is electrically connected to the module part provided with one IC chip at the same time.

The touch panel is a panel that can control the device by directly pressing the position where the text and pictures are displayed by combining with the CRT or LCD. The input method of the touch panel is largely classified into a resistance film type, a capacitance type, an electromagnetic resonance type (or an electromagnetic type) according to a method of detecting a position indicated by a user.

The resistance film method is a method in which a position pressed by a pressure in the state of applying a direct current voltage is detected by a change of an amount of current, and a thin conductive layer of two layers is contacted by a pressure by an electronic pen such as a finger or a stylus pen Is a way to detect what is happening. The capacitive method is a method of sensing capacitance coupling by applying an AC voltage. The object to be sensed must be a conductor and a contact area of more than a certain level is required to change the sensible capacitance.

Meanwhile, the touch panel senses a touch input by forming a sensor electrode on the substrate. At this time, the touch input signal sensed by the sensor electrode is transmitted to the IC module through the wiring electrode electrically connected to the sensor electrode, do. These sensor electrodes and wiring electrodes can be formed on both sides of the substrate. In the case where sensor electrodes and wiring electrodes are formed on both surfaces of a substrate, conventionally, two or more IC modules are provided in order to control sensor electrodes and wiring electrodes formed on both sides of the substrate on both sides.

Since the conventional touch panel needs to further include an IC module for controlling the electrodes on both sides, there is a problem that the substrate and the IC module must be bonded twice in the touch panel manufacturing process.

In addition, bonding the substrate and the IC module twice may complicate the process, which increases the cost of the process and ultimately increases the unit cost of the touch panel.

10-2013-0054664

SUMMARY OF THE INVENTION It is an object of the present invention to provide a touch panel capable of controlling electrodes formed on both sides of a substrate through a single IC module without further providing an IC module.

It is another object of the present invention to electrically connect an IC module and electrodes formed on both sides of a substrate in one process.

Further, the present invention has a purpose of simplifying the process of manufacturing the touch panel, thereby lowering the process cost, thereby lowering the unit cost of the touch panel.

According to another aspect of the present invention, there is provided a touch panel including a substrate, a first sensing electrode formed on a first surface of the substrate and sensing a touch input, a second sensing electrode formed on a second surface of the substrate, A first wiring electrode formed on one surface of the substrate and electrically connected to the first sensing electrode, a second wiring electrode formed on the other surface of the substrate and electrically connected to the second sensing electrode, An IC module for controlling the second sensing electrode, and a pad having a terminal portion, one end of which is electrically connected to the first wiring electrode and the second wiring electrode, and the other end of which is electrically connected to the IC module, A first pad having a first terminal portion electrically connected to the first wiring electrode and a second terminal portion electrically connected to the second wiring electrode A second pad to be formed, and a connection pad electrically connected to the IC module, wherein the pad may be integrally formed.

The pad may be an FPCB substrate.

The first sensing electrode and the second sensing electrode may be formed of one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), copper oxide, tin oxide, zinc oxide, (Titanium Oxide), or a mesh-type metal.

The first wiring electrode and the second wiring electrode may be formed of one selected from the group consisting of ITO (indium tin oxide), IZO (indium zinc oxide), copper oxide, tin oxide, zinc oxide, Titanium nanoparticles, titanium oxide, a metal, a nanowire, a photosensitive nanowire film, a carbon nanotube (CNT), a graphene, and a conductive polymer.

The first pad may be ACF (Anisotropic Conductive Film) bonded to the first terminal portion, and the second pad may be ACF (Anisotropic Conductive Film) bonded to the second terminal portion.

The first pad and the second pad may be simultaneously pressed and ACF (Anisotropic Conductive Film) bonding with the first terminal portion or the second terminal portion.

The first terminal portion and the second terminal portion may be formed with grooves on different surfaces of the pad.

The present invention has the effect of realizing a touch panel capable of controlling electrodes formed on both sides of a substrate through one IC module without further having an IC module.

In addition, the present invention simplifies the manufacturing process of the touch panel, thereby lowering the process cost, thereby reducing the cost of the touch panel.

1 is a plan view of a conventional touch panel,
2 is a plan view of a touch panel according to an embodiment of the present invention,
3 is a plan view of one surface of a touch panel according to an embodiment of the present invention,
4 is a plan view of another surface of a touch panel according to an embodiment of the present invention.
5 is a side view of a touch panel according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The above-described objects, technical features and effect of the present invention will be more clearly understood from the following detailed description.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

1 is a plan view of a conventional touch panel. As shown in FIG. 1, an IC module 1 (130) formed on one surface of a substrate 100 and an IC module 2 (140) for controlling electrodes formed on the other surface of the substrate 100 are provided. In the related art, pads 110 and 120 electrically connected to the IC modules 130 and 140 are electrically connected to electrodes (not shown) formed on the substrate 100 and the IC modules 130 and 140, The terminal portions 111, 112 and 121 are exposed at one end to connect electrodes (not shown) formed on the substrate 100 with the terminal portions 111, 112 and 121.

At this time, in order to control an electrode (not shown) formed on one surface of the substrate 100, an electrode (not shown) formed on one surface of the IC module 130 must be electrically connected. For this, a first pad 110 is provided and the first terminals 111 and 112 are exposed to the first pad 110 to electrically connect the electrodes (not shown) formed on one surface with the first terminals 111 and 112 To be connected.

An IC module 2 140 is further provided to control an electrode (not shown) formed on the other surface of the substrate 100 so as to be electrically connected to an electrode (not shown) formed on the other surface of the substrate 100. To this end, the second pad 120 is provided. The second terminal part 121 and the second terminal part 122 are exposed to the second pad 120 to electrically connect the electrodes (not shown) formed on the other surface with the second terminal parts 121 and 122, .

The conventional touch panel includes IC modules 130 and 140 for controlling the electrodes when electrodes for sensing touch input are formed on both sides of the substrate 100. In the conventional touch panel, separate processes are performed to connect the electrodes formed on both sides of the substrate 100 to the IC modules 130 and 140.

2 is a plan view of a touch panel according to an embodiment of the present invention. 2, the touch panel according to an exemplary embodiment of the present invention includes an electrode 250 and 251 formed on one surface of a substrate 200, an IC module 240 disposed on the other surface of the substrate 200, And the electrodes 260 and 261 to be formed can all be controlled.

In order to control the electrodes 250 and 251 formed on one surface of the substrate 200 and the electrodes 260 and 261 formed on the other surface of the substrate 200, The electrodes 250 and 251 and the electrodes 260 and 261 formed on the other surface of the substrate 200 should be electrically connected. For this, in an embodiment of the present invention, the terminals 300 are provided and the terminal portions 311, 321 and 331 are exposed on the pad 300 to form the terminal portions 311, 321 and 331 on one surface of the substrate 200 The electrodes 250 and 251 and the electrodes 260 and 261 formed on the other surface of the substrate 200 are electrically connected. The electrodes 250 and 251 formed on one surface of the substrate 200 are connected to the terminal portions 321 exposed on the pad 300 and the electrodes 260 and 261 formed on the other surface of the substrate 200 are connected to the pad 300 And the terminal portions 311 and 331 are exposed.

A first sensing electrode 250 for sensing a touch input signal is formed on one surface 201 of the substrate 200 and a first wiring electrode 251 electrically connected to the first sensing electrode 250 is formed . The first wiring electrode 251 is electrically connected to one side of the pad 300 electrically connected to the IC module 240. The pad 300 exposes the first terminal portions 311 and 331 so that the first wiring electrode 251 and the first terminal portions 311 and 331 are electrically connected to each other. A second sensing electrode 260 is formed on the other surface 202 of the substrate 220 to sense a touch input signal and a second wiring electrode 261 electrically connected to the second sensing electrode 260 . The second wiring electrode 261 is electrically connected to the other side of the pad 300 electrically connected to the IC module 240. For this purpose, the pad 300 exposes the second terminal portion 321 and exposes the second wiring electrode 261 And the second terminal portion 321 are electrically connected to each other.

The pad 300 of the touch panel according to an exemplary embodiment of the present invention is formed as a "∃" so that one end of the pad 300 is bonded to one surface 201 of the substrate 200 and the other surface 202 of the substrate 200, do. However, '∃' is a form according to one embodiment, and one pad 300 is provided in one IC module 240 so that electrodes formed on one surface and the other surface of the substrate 200 are electrically The shape of the pad 300 is not limited.

FIG. 3 is a plan view of one surface of a touch panel according to an embodiment of the present invention, and FIG. 4 is a plan view of another surface of a touch panel according to an embodiment of the present invention. 3 and 4, a touch panel according to an embodiment of the present invention includes a substrate 200 and a first sensing electrode (not shown) formed on one surface 201 of the substrate 200 to sense a touch input 250 formed on one surface 201 of the substrate 200 and a second sensing electrode 260 formed on the other surface 202 of the substrate 200 for sensing a touch input and electrically connected to the first sensing electrode 250, A first wiring electrode 251 connected to the first sensing electrode 260 and a second wiring electrode 261 formed on one surface 202 of the substrate 200 and electrically connected to the second sensing electrode 260, An IC module 240 for controlling the second sensing electrode 260 and terminal portions 311, 321 and 331 electrically connected to the first wiring electrode 251 and the second wiring electrode 261 at one end are formed And the other end of the pad 300 includes a pad 300 electrically connected to the IC module 240. In this case, the pad 300 includes first terminal portions 311 and 331 electrically connected to the first wiring electrode 351 A second pad formed with a second terminal portion 321 electrically connected to the first pad and the second wiring electrode 261 and a connection pad 340 electrically connected to the IC module, And is integrally formed.

The present invention has a purpose to electrically connect the electrodes formed on both sides of the substrate 200 with one IC module 240 by having one IC module 240. That is, it has a purpose to connect the IC module 240 to electrodes formed on both sides of the substrate 200 in one process.

For this, a pad 300 is provided to expose the terminal portions 311, 321, and 331 to the pad 300, and electrodes formed on both surfaces of the substrate 200 and the exposed terminal portions 311, 321, and 331 are electrically connected . The pad 300 of the embodiment of the present invention is formed in a '?' Shape. The pad 300 of one embodiment is electrically connected to the first pad 320 and the second wiring electrode 261 in which the first terminal portion 321 is formed to be electrically connected to the first wiring electrode 251 Second pads 310 and 330 on which the second terminal portions 311 and 311 are formed and a connection pad 340 electrically connected to the IC module 240. The first pad 320, the second pad 310, and the connection pad 340 are integrally formed to be the pad 300.

At this time, the first terminal portions 311 and 331 and the second terminal portion 321 are formed with grooves on different surfaces of the pad 300. If the first terminal portions 311 and 331 are formed on one side of the pads 310 and 330, the second terminal portion 321 is formed on the other side of the pad 320. The first terminal portions 311 and 331 and the second terminal portion 321 provided with grooves in the pads 310, 320 and 330 are preferably u-cut, but the shape is not limited.

 The first pad 320 is bonded to the substrate 200 on one side 201 of the substrate 200 while the second pad 310 and 330 are bonded to the substrate 200 on the other side 202 of the substrate 200. [ The IC module 240 electrically connected to the pad 300 may be electrically connected to the electrodes 250, 251, 260, and 261 formed on both sides 201 and 202 of the substrate 200.

The first sensing electrode 250 and the second sensing electrode 260 may be transparent electrodes such as indium tin oxide (ITO), indium zinc oxide (IZO) ), A copper oxide (Oxide), a tin oxide, a zinc oxide, a titanium oxide, and a mesh-type metal.

The first wiring electrode 251 and the second wiring electrode 261 may be transparent or opaque electrodes such as ITO (indium tin oxide), IZO (indium zinc oxide), copper oxide, tin oxide ), Zinc oxide, titanium oxide, a mesh metal, a nanowire, a photosensitive nanowire film, a carbon nanotube (CNT), a graphene, or a conductive polymer .

5 is a side view of a touch panel according to an embodiment of the present invention. 5, the touch panel according to the embodiment of the present invention is exposed to the terminals 300, 311, 321, and 331 and attached to the substrate 200 of the touch panel. At this time, the terminal portions 311, 321, and 331 are preferably bonded by ACF (Anisotropic Conductive Film) bonding. At this time, the first pad 320 is contacted at one surface 201 of the substrate 200 and the second pad 310 and 330 are contacted at the other surface 202 of the substrate, It is preferable that the first pad 320 and the second pads 310 and 330 are simultaneously pressed so that the substrate 200 and the first pad 320 and the second pads 310 and 330 are simultaneously bonded .

Thus, those skilled in the art will appreciate that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive.

100: substrate 110: first pad
111, 112, 121: terminal portion 120: second pad
130: IC module 1 140: IC module 2
200: substrate 240: IC module
250: first sensing electrode 251: first wiring electrode
260: second sensing electrode 261: second wiring electrode
300: pad 320: first pad
321: first terminal part 310, 330: second pad
311, 331: second terminal part 340: connection pad

Claims (7)

Board;
A first sensing electrode formed on one surface of the substrate and sensing a touch input;
A second sensing electrode formed on the other surface of the substrate to sense a touch input;
A first wiring electrode formed on one surface of the substrate and electrically connected to the first sensing electrode;
A second wiring electrode formed on the other surface of the substrate and electrically connected to the second sensing electrode;
An IC module for controlling the first sensing electrode and the second sensing electrode;
A pad having a terminal portion, one end of which is electrically connected to the first wiring electrode and the second wiring electrode, and the other end electrically connected to the IC module;
Lt; / RTI >
The pad includes:
A first pad having a first terminal portion electrically connected to the first wiring electrode;
A second pad having a second terminal portion electrically connected to the second wiring electrode; And
A connection pad electrically connected to the IC module;
, ≪ / RTI &
Wherein the pad is integrally formed.
The method according to claim 1,
Wherein the pad is an FPCB substrate.
The method according to claim 1,
The first sensing electrode and the second sensing electrode are connected to each other,
A metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), Copper Oxide, Tin Oxide, Zinc Oxide, Titanium Oxide, The touch panel comprising:
The method according to claim 1,
The first wiring electrode and the second wiring electrode are electrically connected to each other,
(ITO), indium zinc oxide (IZO), copper oxide, tin oxide, zinc oxide, titanium oxide, mesh-type metal, nano- Wherein the touch panel is made of one of a wire, a photosensitive nanowire film, a carbon nanotube (CNT), a graphene, and a conductive polymer.
The method according to claim 1,
Wherein the first pad is ACF (Anisotropic Conductive Film) bonded to the first terminal portion, and the second pad is ACF (Anisotropic Conductive Film) bonded to the second terminal portion.
6. The method of claim 5,
Wherein the first pad and the second pad are simultaneously pressed and bonded to the first terminal portion or the second terminal portion by ACF (Anisotropic Conductive Film) bonding.
The method according to claim 1,
Wherein the first terminal portion and the second terminal portion are formed with grooves on different surfaces of the pad.

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