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KR20150111313A - 표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법 - Google Patents

표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20150111313A
KR20150111313A KR1020150040628A KR20150040628A KR20150111313A KR 20150111313 A KR20150111313 A KR 20150111313A KR 1020150040628 A KR1020150040628 A KR 1020150040628A KR 20150040628 A KR20150040628 A KR 20150040628A KR 20150111313 A KR20150111313 A KR 20150111313A
Authority
KR
South Korea
Prior art keywords
group
copper foil
layer
resin
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020150040628A
Other languages
English (en)
Korean (ko)
Inventor
마사후미 이시이
데루마사 모리야마
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 filed Critical 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Publication of KR20150111313A publication Critical patent/KR20150111313A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
KR1020150040628A 2014-03-25 2015-03-24 표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법 Ceased KR20150111313A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014061259A JP5826322B2 (ja) 2014-03-25 2014-03-25 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
JPJP-P-2014-061259 2014-03-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020170129963A Division KR101902128B1 (ko) 2014-03-25 2017-10-11 표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법

Publications (1)

Publication Number Publication Date
KR20150111313A true KR20150111313A (ko) 2015-10-05

Family

ID=54158563

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020150040628A Ceased KR20150111313A (ko) 2014-03-25 2015-03-24 표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법
KR1020170129963A Active KR101902128B1 (ko) 2014-03-25 2017-10-11 표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020170129963A Active KR101902128B1 (ko) 2014-03-25 2017-10-11 표면 처리 동박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 반도체 패키지용 회로 형성 기판, 반도체 패키지 및 프린트 배선판의 제조 방법

Country Status (4)

Country Link
JP (1) JP5826322B2 (zh)
KR (2) KR20150111313A (zh)
CN (2) CN104943255A (zh)
TW (1) TWI610599B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112423982A (zh) * 2018-07-18 2021-02-26 昭和电工材料株式会社 覆铜层叠板、印刷线路板、半导体封装体及覆铜层叠板的制造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP6605271B2 (ja) * 2015-09-24 2019-11-13 Ｊｘ金属株式会社 離型層付き電解銅箔、積層体、半導体パッケージの製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6588290B2 (ja) * 2015-09-25 2019-10-09 Ｊｘ金属株式会社 離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器、積層体の製造方法及びプリント配線板の製造方法
WO2017085849A1 (ja) * 2015-11-19 2017-05-26 三井金属鉱業株式会社 誘電体層を有するプリント配線板の製造方法
KR102462505B1 (ko) 2016-04-22 2022-11-02 삼성전자주식회사 인쇄회로기판 및 반도체 패키지
JP2018122590A (ja) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP2018171899A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6550196B2 (ja) * 2017-07-24 2019-07-24 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
CN110055560B (zh) * 2019-04-24 2021-02-09 福建清景铜箔有限公司 电解铜箔的生箔装置及阴极辊的制备方法
WO2020230870A1 (ja) * 2019-05-15 2020-11-19 パナソニックＩｐマネジメント株式会社 銅張積層板、樹脂付銅箔、および、それらを用いた回路基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647755A (ja) * 1992-07-28 1994-02-22 Matsushita Electric Works Ltd 銅張り積層板の製造方法
JPH1027960A (ja) * 1996-07-09 1998-01-27 Mitsui Mining & Smelting Co Ltd 多層プリント配線板の製造方法
SG101924A1 (en) * 1998-10-19 2004-02-27 Mitsui Mining & Smelting Co Composite material used in making printed wiring boards
CN100591193C (zh) * 2005-07-15 2010-02-17 松下电器产业株式会社 布线基板、布线材料、覆铜层压板以及布线基板的制造方法
ES2405979T3 (es) * 2007-04-06 2013-06-04 Taisei Plas Co., Ltd. Material compuesto de aleación de cobre y procedimiento para fabricarlo
JP4998356B2 (ja) * 2008-04-07 2012-08-15 大日本印刷株式会社 医療用離型フィルム
KR20170034947A (ko) * 2012-06-04 2017-03-29 제이엑스금속주식회사 캐리어 부착 금속박
TWI627876B (zh) * 2012-08-06 2018-06-21 Jx Nippon Mining & Metals Corp Metal foil with carrier
TWI551436B (zh) * 2012-09-24 2016-10-01 Jx Nippon Mining & Metals Corp A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like
CN104685980B (zh) * 2012-10-04 2018-11-23 Jx日矿日石金属株式会社 多层印刷配线基板的制造方法及基底基材
JP5457594B2 (ja) * 2013-07-29 2014-04-02 Ｊｘ日鉱日石金属株式会社 プリント配線板用樹脂、プリント配線板、半導体パッケージ基板及びプリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112423982A (zh) * 2018-07-18 2021-02-26 昭和电工材料株式会社 覆铜层叠板、印刷线路板、半导体封装体及覆铜层叠板的制造方法
US12363826B2 (en) 2018-07-18 2025-07-15 Resonac Corporation Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate

Also Published As

Publication number Publication date
CN110099518A (zh) 2019-08-06
JP5826322B2 (ja) 2015-12-02
KR101902128B1 (ko) 2018-09-27
TWI610599B (zh) 2018-01-01
JP2015183240A (ja) 2015-10-22
CN104943255A (zh) 2015-09-30
TW201540144A (zh) 2015-10-16
KR20170118001A (ko) 2017-10-24

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