KR20150109596A - Solar cell module - Google Patents

Abstract

The present invention relates to a solar cell module.
An example of a solar cell module according to the present invention includes a semiconductor substrate, a first solar cell and a second solar cell which are disposed adjacent to each other and include a plurality of first electrodes and a second electrode spaced apart from each other on the rear surface of the semiconductor substrate, ; And a plurality of conductive wirings provided on one surface of each of the first and second solar cells, wherein the plurality of conductive wirings are connected to the first and second electrodes of the first and second solar cells, Is embedded on one side of the member.

Description

Solar cell module {SOLAR CELL MODULE}

The present invention relates to a solar cell module.

A typical solar cell has a substrate made of different conductivity type semiconductors, such as p-type and n-type, an emitter, and an electrode connected to the substrate and the emitter, respectively. At this time, a p-n junction is formed at the interface between the substrate and the emitter.

Particularly, research and development on a back electrode type solar cell having an n-electrode and a p-electrode formed only on the back surface of a silicon substrate without forming an electrode on the light receiving surface of a silicon substrate for increasing the efficiency of the solar cell is underway. A modularization technique of connecting a plurality of such back electrode type solar cell cells and electrically connecting them is also under way.

The module and the technique are typical of a method of electrically connecting a plurality of solar cells with a metal interconnection, and a method of electrically connecting a plurality of solar cells with a metal interconnection using a wiring board on which wiring is previously formed.

An object of the present invention is to provide a solar cell module.

An example of a solar cell module according to the present invention includes a semiconductor substrate, a first solar cell and a second solar cell which are disposed adjacent to each other and include a plurality of first electrodes and a second electrode spaced apart from each other on the rear surface of the semiconductor substrate, ; And a plurality of conductive wirings provided on one surface of each of the first and second solar cells, wherein the plurality of conductive wirings are connected to the first and second electrodes of the first and second solar cells, Is embedded on one side of the member.

Here, the insulating member may include a wiring substrate layer on which a plurality of conductive wirings are disposed on one surface, and a polymer layer disposed between each of the plurality of conductive wirings on one surface of the wiring substrate layer.

At this time, the polymer layer may be in contact with the rear surfaces of the first and second solar cells, respectively.

In addition, the wiring substrate layer and the polymer layer may include the same or different materials from each other among the polymer-based materials.

For example, the wiring substrate layer may include at least one of PET (Polyethylene phthalate), PA (polyamide), polyimide, epoxy-glass, polyester, and bismaleimide triazine poly-olefin.

In addition, the wiring substrate layer may be opaque and may include a light reflective material.

Here, the light reflecting material may be provided in the form of a film on one surface of the wiring substrate layer, or may be provided in the form of a filler inside the wiring substrate layer, and the material of the light reflecting material may include at least one of white phosphor or TiO2 .

In addition, the plurality of conductive wirings may be provided in the form of a plurality of wires.

At this time, the plurality of conductive wirings may electrically connect the first electrode of the first solar cell and the second electrode of the second solar cell.

At this time, the first and second electrodes of the plurality of conductive wirings and the first and second solar cells may be connected to each other by a conductive adhesive.

The first and second solar cells are arranged in a direction crossing the longitudinal direction of the first and second electrodes of the first and second solar cells, And may be formed in a direction crossing the longitudinal direction of the first and second electrodes.

As described above, in the solar cell module according to the present invention, the plurality of conductive wirings provided on the insulating member connected to the back surface of each solar cell are formed so as to be embedded in one surface of the insulating member so that the surface connected to the electrodes of the solar cell is exposed, The manufacturing process of the battery module can be further facilitated.

1 is a view for explaining a first embodiment of a solar cell module according to the present invention.
FIG. 2A is a partial perspective view of a solar cell applicable to the solar cell module shown in FIG. 1. FIG.
FIG. 2B is a view for explaining patterns of the first and second electrodes C141 and C142 formed on the rear surface of the semiconductor substrate 110 of the solar cell shown in FIG. 2A.
3 is a view for explaining an example of the insulating member P of the solar cell module shown in Fig.
4A and 4B are enlarged views of a portion K in FIG. 3B for explaining various examples of the cross-sectional structure of the conductive wiring.
Fig. 5 shows an example in which the insulating member P shown in Fig. 3 is connected to the rear surface of the solar cell shown in Figs. 2A and 2B.
FIG. 6A is a sectional view taken along line 6a-6a in FIG. 5. FIG.
6B is a cross-sectional view taken along line 6b-6b in FIG.
FIG. 6C is a cross-sectional view taken along line 6c-6c in FIG.
7 is a view for explaining a second embodiment of a solar cell module according to the present invention.
8 is a view for explaining an example of an insulating member P 'applicable to the solar cell module shown in FIG.
Fig. 9 is a view for explaining an example in which the insulating member P 'shown in Fig. 8 is connected to the rear surface of the solar cell shown in Figs. 2A and 2B.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention in the drawings, portions not related to the description are omitted, and like reference numerals are given to similar portions throughout the specification.

Hereinafter, the front surface may be one surface of the semiconductor substrate to which the direct light is incident, and the rear surface may be a surface opposite to one surface of the semiconductor substrate where direct light is not incident or reflected light other than direct light may be incident.

Hereinafter, a solar cell module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a view for explaining a first embodiment of a solar cell module according to the present invention.

1, the solar cell module according to the present invention includes first and second solar cells C1 and C2 and an insulating member P connected to the rear surface of each solar cell, (IC) for electrically connecting the batteries C1 and C2 to each other in series.

Here, the first and second solar cells C1 and C2 may be arranged immediately adjacent to each other, and the first and second solar cells C1 and C2 may be separated from each other on the back surface of the semiconductor substrate (not shown) And a plurality of first and second electrodes (not shown). One example of the solar cell applicable to the solar cell module shown in FIG. 1 will be described in detail with reference to FIGS. 2A and 2B.

The insulating member P may be integrally connected to each of the rear surfaces of the first and second solar cells C1 and C2 as shown in Fig. Therefore, the solar cell and the insulating member P may be individually connected to each other and formed as one discrete element.

However, unlike FIG. 1, a plurality of solar cells may be connected to one insulating member P. This will be described in more detail with reference to FIG.

The insulating member P may be provided with a plurality of conductive wirings (not shown) for electrically connecting the first and second solar cells C1 and C2 electrically in series. An example of such an insulating member P will be described in more detail in Figs. 3 to 4B.

1, an interconnector (IC) includes an insulating member P connected to the rear surface of the first solar cell C1 and a first surface edge of the insulating member P connected to the rear surface of the second solar cell C2 P to electrically connect the first solar cell C1 and the second solar cell C2 to each other by electrically connecting the conductive wirings provided in the respective insulating members P to each other, .

1 shows an example in which an interconnection IC is separately provided. However, such a separate interconnection IC may be omitted. In the case where a separate interconnection IC is omitted, the insulating member P May be formed so that the first and second solar cells C1 and C2 are connected in series with each other.

In such a case, it is also possible to connect the first and second solar cells C1 and C2 in series with each other only by the conductive wiring provided in the insulating member P. An example of such a case will be described in detail with reference to FIG.

FIG. 2A is a partial perspective view of a solar cell applicable to the solar cell module shown in FIG. 1, and FIG. 2B is a cross-sectional view illustrating a first and second electrodes C141 and C142 formed on the rear surface of the semiconductor substrate 110 of the solar cell shown in FIG. Fig.

2A and 2B, an example of a solar cell according to the present invention includes a semiconductor substrate 110, an antireflection film 130, an emitter 121, a back surface field (BSF) 172, One electrode C141 and a second electrode C142.

Here, the antireflection film 130 and the backside electrical part 172 may be omitted. Hereinafter, the antireflection film 130 and the backside electrical part 172 will be described as an example, as shown in FIG. 2A.

The semiconductor substrate 110 may be a semiconductor substrate 110 of a first conductivity type, for example, n-type conductivity type silicon. The semiconductor substrate 110 may be formed by doping a first conductivity type impurity into a semiconductor wafer formed of a crystalline silicon material.

The emitter portions 121 may be spaced apart from each other in the rear surface of the semiconductor substrate 110 facing the front surface, and may be elongated in a first direction x. The plurality of emitter portions 121 may include a second conductive type, for example, a p-type conductive type impurity opposite to the conductive type of the semiconductor substrate 110. [

Accordingly, a p-n junction can be formed by the semiconductor substrate 110 and the emitter section 121.

A plurality of emitter regions 121 may be formed on the rear electric field portion 172. The emitter region 121 may have a plurality of emitter regions 121 and a plurality of emitter regions 121, ). ≪ / RTI > Thus, as shown in FIGS. 2A and 2B, a plurality of emitter sections 121 and a plurality of rear electric sections 172 may be alternately arranged on the rear surface of the semiconductor substrate 110.

The plurality of rear electric field sections 172 may be an impurity having the same conductivity type as the semiconductor substrate 110 and containing impurities at a higher concentration than the semiconductor substrate 110, for example, an n ++ part.

The plurality of first electrodes C141 may be physically and electrically connected to the emitter section 121 and may be formed on the rear surface of the semiconductor substrate 110 along the emitter section 121. [

The plurality of second electrodes C142 are formed on the rear surface of the semiconductor substrate 110 along the plurality of rear electric sections 172 and electrically connected to the semiconductor substrate 110 through the rear electric section 172, .

Here, on the rear surface of the semiconductor substrate 110, the first electrode C141 and the second electrode C142 are physically and spatially separated from each other and electrically isolated.

More specifically, each of the plurality of first electrodes C141 may extend in a first direction (x) as shown in FIG. 2B, and each of the plurality of first electrodes C141 may extend in a first direction x in a second direction y that intersects the first direction x.

Each of the plurality of second electrodes C142 may extend in a first direction x as shown in FIG. 2B, and each of the plurality of second electrodes C142 may intersect the first direction x, (Y) in the second direction (y).

In addition, the plurality of first and second electrodes C141 and C142 may be spaced apart from each other and arranged alternately.

The holes collected through the first electrode (C141) and the electrons collected through the second electrode (C142) in the solar cell according to the present invention manufactured using the above structure are used as electric power of the external device through the external circuit device .

The solar cell applied to the solar cell module according to the present invention is not necessarily limited to FIG. 2A except that the first and second electrodes C141 and C142 provided in the solar cell are formed only on the rear surface of the semiconductor substrate 110 Any other component can be changed.

For example, each of the first and second electrodes C141 and C142 does not extend in the first direction x and can be arranged in a dot shape in the first direction x, And a first bus bar (not shown) extending in a second direction y so as to be commonly connected to all of the plurality of first electrodes C141 is provided at an end of the first direction x on the rear surface A second bus bar (not shown) extends in the second direction (y) so as to be commonly connected to all of the plurality of second electrodes (C142) at the other end of the first direction (x) (Not shown) may be further provided.

Next, an example of the specific structure of the insulating member P in Fig. 1 is as follows.

FIG. 3 is a view for explaining an example of the insulating member P of the solar cell module shown in FIG. 1. FIGS. 4A and 4B are views for explaining various examples of the cross- b is an enlarged view of the K portion.

3 (a) shows one side of the insulating member P connected to the rear surface of the semiconductor substrate 110, and FIG. 3 (b) 3 (b). Fig.

3 (a) and 3 (b), the insulating member P according to the present invention may be provided with a plurality of conductive wirings P141 and P142 on one surface thereof connected to the semiconductor substrate 110 .

Here, the plurality of conductive wirings P141 and P142 may include a metal material having excellent conductivity. For example, each of the plurality of conductive wirings P141 and P142 may include at least one of a metal material of Cu, Au, Ag, and Al.

The plurality of conductive wirings P141 and P142 include a first conductive wiring P141 connected to the first electrode C141 of each solar cell and a second conductive wiring P142 connected to the second electrode C142 .

Here, the first conductive interconnection P141 includes a plurality of first connecting portions PC141 and a first pad portion PP141, and as shown in Fig. 3 (a), a plurality of first connecting portions PC141, The first pad portion PP141 may be elongated in the first direction x and the first pad portion PP141 may be elongated in the second direction y. Therefore, the ends of the plurality of first connection parts PC141 are commonly connected to the first pad part PP141, and the interconnector IC is connected to one surface of the first pad part PP141.

The second conductive wiring P142 also includes a plurality of second connecting portions PC142 and a second pad portion PP142. As shown in FIG. 3 (a), the plurality of second connecting portions PC142, The second pad portion PP142 may be formed to be long in the first direction x and the second pad portion PP142 may be formed to be long in the second direction y. Therefore, the ends of the second connection portions PC 142 are commonly connected to the second pad portion PP 142, and another interconnection ICs may be connected to one surface of the second pad portion PP 142.

The first and second conductive wirings P141 and P142 are formed on one surface of the insulating member P such that the surfaces connected to the first and second electrodes C141 and C142 are exposed, Lt; / RTI >

The insulating member P according to the present invention is formed such that the first and second conductive wirings P141 and P142 are buried in one surface of the insulating member P and the first and second conductive wirings P141 and P142 The surfaces to be connected to the first and second electrodes C141 and C142 are exposed so that the first and second electrodes C141 and C142 are electrically connected to the first and second electrodes C141 and C142 when the insulating member P is connected to the rear surface of the semiconductor substrate 110. [ , And the alignment of the two conductive wirings (P141 and P142) can be further facilitated.

When the first and second conductive wirings P141 and P142 are embedded in one surface of the insulating member P as shown in Fig. 3, when the insulating member P is connected to the rear surface of the solar cell, C141, C142, or between the first and second conductive wirings (P141, P142) can be omitted, and the manufacturing process of the solar cell module can be further simplified.

Such an insulating member P may include a wiring substrate layer 200 and a polymer layer 210, as shown in FIG. 3 (b).

A plurality of conductive wirings P141 and P142 are disposed on one surface of the wiring substrate layer 200 and a polymer layer 210 is provided between each of the plurality of conductive wirings P141 and P142 on one surface of the wiring substrate layer 200 .

Here, the wiring substrate layer 200 and the polymer layer 210 may include the same or different materials from each other in the polymer-based material. That is, the wiring substrate layer 200 and the polymer layer 210 may be formed of the same material among the polymer-based materials, but they may be formed to include different materials as follows.

For example, the wiring substrate layer 200 may include at least one material selected from the group consisting of polyethylene phthalate (PET), polyamide (PA), polyimide, epoxy-glass, polyester, and bismaleimide triazine 210 may be formed to include at least one of ethylene-vinyl acetate copolymer (EVA) and poly-olefin.

In addition, the wiring substrate layer 200 may be already cured before the insulating member P is connected to the back surface of the semiconductor substrate 110 of the solar cell, and the polymer layer 210 may not be cured . The polymer layer 210 can be cured during the heat treatment process for connecting the insulating member P to the back surface of the semiconductor substrate 110. [

The thickness of the polymer layer 210 formed on one side of the wiring substrate layer 200 may be thicker than the thickness of the first and second conductive wirings P141 and P142 as shown in FIG.

The difference between the thickness of the polymer layer 210 and the thickness of the first and second conductive wirings P141 and P142 may be smaller than the thickness of the first and second electrodes C141 and C142 formed on the rear surface of the semiconductor substrate 110 have.

When the thickness of the polymer layer 210 is thicker than the thickness of the first and second conductive wirings P141 and P142, the polymer layer 210, which is relatively thicker in the process of manufacturing the solar cell module, Electrodes C141 and C142, so that the alignment process can be further facilitated.

In addition, since the wiring substrate layer 200 of the insulating member P according to the present invention is located on the rear surface of the semiconductor substrate 110, it does not need to be transparent and may be opaque.

At this time, the wiring substrate layer 200 includes a light reflecting material, and can reflect the light transmitted through the semiconductor substrate 110 toward the semiconductor substrate 110 again.

At this time, the light reflecting material may be provided in a film form on one side of the wiring substrate layer 200, or may be provided in the form of a filler inside the wiring substrate layer 200. The material of the light reflecting material may be a white phosphor, And may include at least one.

Thus, the degree of reflection of the wiring substrate layer 200 can be improved, and the light absorptivity of the semiconductor substrate 110 can be further improved.

3B, the first and second conductive wirings P141 and P142 provided in the insulating member P are formed as one layer. However, the first and second conductive wirings P141 and P142 may be formed of a single layer, P142 may be formed of a plurality of layers. A variety of examples are described as follows.

FIGS. 4A and 4B are views for explaining various examples of the portion corresponding to the K portion in FIG. 3B. FIG.

4A, each of the first and second conductive wirings P141 and P142 includes first and second seed layers P141S and P142S formed on the wiring substrate layer 200, The first and second metal layers P141M and P142M may be formed on the first and second metal layers P141S and P142S.

Here, each of the first and second seed layers P141S and P142S and the first and second metal layers P141M and P142M may include at least one of Cu, Au, Ag and Al.

At this time, the thicknesses and the densities of the first and second seed layers P141S and P142S and the first and second metal layers P141M and P142M may be different from each other.

For example, the thickness of the first and second metal layers P141M and P142M may be greater than the thickness of the first and second seed layers P141S and P142S, and the density of the first and second metal layers P141M and P142M may be greater than the first, 2 seed layer (P141S, P142S).

The first and second seed layers P141S and P142S may be formed by any one of printing, dispensing and sputtering methods. The first and second metal layers P141M and P142M may be formed by printing, dispensing, sputtering, plating Method or the like.

For example, the first and second seed layers P141S and P142S may be formed by any one of printing, dispensing, and sputtering methods, and the first and second metal layers P141M and P142M may be formed by a plating method.

In such a case, the densities of the first and second metal layers P141M and P142M may be greater than the densities of the first and second seed layers P141S and P142S. Therefore, the volume of voids included in the first and second seed layers P141S and P142S per unit volume can be larger than the volume of voids contained in the first and second metal layers P141M and P142M per unit volume.

Each of the first and second conductive wirings P141 and P142 according to the present invention includes first and second seed layers P141S and P142S and first and second metal layers P141M and P142M, The first and second conductive adhesive layers P141C and P142C may be further disposed on the first and second metal layers P141M and P142M, respectively.

The first and second conductive adhesive layers (P141C and P142C) are not particularly limited as long as they are conductive materials, but a conductive material having a melting point at a relatively low temperature of 130 ° C to 250 ° C is more preferable. For example, a conductive adhesive including metal particles, a carbon nano tube (CNT), a conductive particle including carbon, a wire, a needle, and the like can be used.

When the first and second conductive wires P141 and P142 are connected to the first and second electrodes C141 and C142 of the first and second conductive adhesive layers P141C and P142C, Thereby minimizing the contact resistance between the wirings and improving the contact force.

4B, when the first and second conductive adhesive layers P141C and P142C are formed in advance, the first and second conductive wirings P141 and P142 are connected to the first and second electrodes C141 and C142 of the solar cell , It is possible to omit the step of applying a separate conductive adhesive (not shown) on the first and second electrodes C141 and C142, thereby making it easier to manufacture the solar cell module.

4B, an example in which the first and second conductive adhesive layers P141C and P142C are provided in advance in the insulating member P has been described as an example. However, the first and second conductive adhesive layers P141C and P142C may be an insulating member P between the first and second electrodes C141 and C142 and the first and second conductive wirings P141 and P142 when the insulating member P is connected to the rear surface of the semiconductor substrate 110 They can be electrically connected to each other through a conductive adhesive agent having the same function as the first and second conductive adhesive layers P141C and P142C.

3 to 4B may be connected to the rear surface of the semiconductor substrate 110 of the solar cell described above with reference to FIGS. 2A and 2B.

An example of the case where the insulating member P is connected to the rear surface of the solar cell will be described as follows.

5 shows an example in which the insulating member P shown in Fig. 3 is connected to the rear surface of the solar cell shown in Figs. 2A and 2B. Fig. 6A is a sectional view taken along the line 6a-6a in Fig. FIG. 6B is a sectional view taken along line 6b-6b in FIG. 5, and FIG. 6C is a sectional view taken along line 6c-6c in FIG.

As shown in FIG. 5, one semiconductor substrate 110 may be overlapped on one insulating member P to form one solar cell individual element.

At this time, a plurality of first connecting portions PC141 included in the first electrode C141 and the first conductive wiring P141 on the rear surface of the semiconductor substrate 110 are connected and connected to each other in the first direction x And a plurality of second connection portions PC142 included in the second electrode C142 and the second conductive wiring P142 may be connected and connected to each other in the first direction x.

6A, a plurality of first electrodes C141 formed on the rear surface of the semiconductor substrate 110 and a plurality of first connection portions PC141 formed on the entire surface of the insulating member P are overlapped with each other, And can be electrically connected to each other by a conductive adhesive (CA).

The plurality of second electrodes C142 formed on the rear surface of the semiconductor substrate 110 and the plurality of second connection portions PC142 formed on the front surface of the insulating member P are also overlapped with each other by the conductive adhesive CA, And can be electrically connected.

6A to 6C, the polymer layer 210 may be filled in the spaces separated from each other between the first electrode C141 and the second electrode C142, and the first conductive wiring P141 may be filled with the polymer layer 210, And the second conductive wiring P142 may be filled with the polymer layer 210 as well.

Therefore, as shown in FIG. 6B, the polymer layer 210 can be insulated between the second connection part PC 142 and the first pad part PP 141, and furthermore, as shown in FIG. 6C, The connection part (PC 141) and the second pad part (PP 142) can be also insulated by the polymer layer 210.

The polymer layer 210 is adhered to the back surface of the semiconductor substrate 110 of the solar cell so that the adhesion between the first and second electrodes C141 and C142 and the first and second conductive wirings P141 and P142 It can play a role of improving.

Before the insulating member P is connected to the back surface of the semiconductor substrate 110 of the solar cell, the polymer layer 210 is not cured and is connected to the rear surface of the semiconductor substrate 110 The polymer layer 210 can be filled up to the empty space between the first and second electrodes C141 and C142 and the polymer layer 210 can be cured.

Unlike the polymer layer 210, the wiring substrate layer 200 is provided beforehand in a cured state. Therefore, when the insulating member P is connected to the rear surface of the semiconductor substrate 110, the first and second insulating wirings P141, P142 can be prevented from being disturbed.

Each of the first pad portion PP141 and the second pad portion PP142 includes a first region PP141-S1 and a second conductive pattern PP142-S1 overlapping the semiconductor substrate 110, And a second area (PP141-S2, PP142-S2).

Here, the first area PP141-S1 of the first pad part PP141 is connected to the plurality of first connection parts PC141, and the second area PP141-S2 is connected to the interconnection IC The semiconductor substrate 110 can be exposed to the outside without overlapping with the semiconductor substrate 110 in order to secure the semiconductor substrate 110.

The first area PP142-S1 of the second pad part PP142 is connected to the plurality of second connection parts PC142 and the second area PP142-S2 is connected to the interconnection IC The semiconductor substrate 110 can be exposed to the outside without overlapping with the semiconductor substrate 110 in order to secure the semiconductor substrate 110.

Since the first pad portion PP141 and the second pad portion PP142 according to the present invention include the second regions PP141-S2 and PP142-S2, the interconnector IC can be connected more easily, In addition, thermal stress stress on the semiconductor substrate 110 can be minimized when the interconnector (IC) is connected to the solar cell.

Therefore, the first and second pad portions PP141 and PP142 are formed such that the second regions PP141-S2 and PP142-S2 that do not overlap the semiconductor substrate 110 are exposed to the outside of the semiconductor substrate 110 And an interconnection (IC) can be connected to the second area (PP141-S2, PP142-S2).

7 is a view for explaining a second embodiment of a solar cell module according to the present invention.

Up to now, the insulating member P 'is connected to the rear surface of each solar cell, and a plurality of solar cells are connected to a conductive wiring provided in the insulating member P' 7, the solar cell module according to the present invention can be connected in series with only conductive wirings (not shown) provided in the insulating member P 'without a separate interconnection IC have.

In this case, the same solar cell as described in FIGS. 2A and 2B can be applied to the solar cell module. The detailed description thereof is the same as that described above, and thus will be omitted.

However, in the case of the insulating member P ', the area of the insulating member P' may be formed at least twice as large as that of the solar cell, and the pattern of the conductive wiring (not shown) Since the first and second solar cells C1 and C2 are directly connected in series without an interconnection IC, they can be formed differently from those described above.

The insulating member P 'applicable to Fig. 7 is described in more detail in Fig.

8 is a view for explaining an example of an insulating member P 'applicable to the solar cell module shown in Fig. 7, and Fig. 9 is a cross-sectional view of the insulating member P' shown in Fig. 8 on the rear surface of the solar cell shown in Figs. Is a view for explaining an example in which the member P 'is connected.

8A is a view for explaining another example of the insulating member P 'according to the present invention, and FIG. 8B is a cross-sectional view taken along the line K1-K1 in FIG. 8A. FIG.

8A, the first and second conductive wirings P141 and P142 in the insulating member P 'according to the present invention may be provided in the form of a plurality of wires, The first and second conductive wirings P141 and P142 provided in advance may be formed on the entire surface of the insulating member P '.

Here, each of the first and second conductive wirings P141 and P142 provided in the form of a plurality of wires includes first and second electrodes C141 and C142 (see FIG. 8A) formed on the rear surface of the solar cell, (Y), which is a direction intersecting with the longitudinal direction of the light emitting diode (LED). However, the longitudinal direction of each of the first and second conductive wirings P141 and P142 is not necessarily limited to this.

3, the insulating member P 'may include a wiring substrate layer 200 and a polymer layer 210, as shown in FIG. 8 (b).

At this time, first and second conductive wirings P141 and P142 are disposed on one surface of the wiring substrate layer 200 and a polymer layer (not shown) is formed between the first and second conductive wirings P141 and P142 on one surface of the wiring substrate layer 200 210 may be formed.

Here, the cross-sectional structure of the first and second conductive wirings P141 and P142 may be the same as that described in FIGS. 4A and 4B, and the first and second conductive wirings P141 and P142, the wiring substrate layer 200, The material of the polymer layer 210 may be the same as that described in FIGS. 3 to 4B. Therefore, detailed description thereof will be omitted.

As described above, the solar cells described in FIGS. 2A and 2B can be disposed on the AC1 to AC4 regions in the insulating member P 'provided with the first and second conductive wirings P141 and P142.

For example, as shown in FIG. 8, the solar cell module according to the present invention includes the above-described regions AC1 to AC3 on the insulating member P 'provided with the first and second conductive wirings P141 and P142, Each of the first and second conductive wirings P141 and P142 may electrically connect a plurality of solar cells to each other in series.

Concretely, any one of the first and second conductive wirings P141 and P142 electrically connects the first electrode C141 of the first solar cell C1 and the second electrode C142 of the second solar cell C2 to each other Can be connected in series.

More specifically, for example, as shown in Fig. 9, a first conductive wiring P141 is connected to a plurality of first electrodes C141 provided in the first solar cell C1, And a second conductive wiring P142 may be connected to the plurality of second electrodes C142 provided in the first capacitor C1.

The first conductive wiring P141 is connected to the plurality of second electrodes C142 provided in the second solar cell C2 for series connection between the first solar cell C1 and the second solar cell C2, Lt; / RTI >

In this case, each of the plurality of first and second electrodes C141 and C142 included in each solar cell is formed to be long in the first direction x, and a plurality of solar cells are arranged in the second direction (x) y. < / RTI > In addition, each of the first and second conductive wirings P141 and P142 provided in the form of a plurality of wires may be located long in the second direction y.

Therefore, the first and second conductive wirings P141 and P142 and the first and second electrodes C141 and C142 are connected to each other or insulated from each other at a necessary portion for series connection of a plurality of solar cells among the overlapping portions of the first and second electrodes C141 and C142 .

At this time, the connection between the first and second conductive wirings P141 and P142 and the first and second electrodes C141 and C142 may be formed by a conductive adhesive CA. Here, the material of the conductive adhesive (CA) may be the same as that described above in Figs. 6A to 6C.

Further, between the first and second conductive wirings P141 and P142 and between the first and second electrodes C141 and C142 can be insulated by the insulating layer IL. Here, the material of the insulating layer IL may be the same as the material of the polymer layer 210, for example.

Specifically, a portion where the first conductive wiring P141 crosses the second electrode C142 of the first solar cell C1 is electrically connected to the first conductive wiring P141 and the first conductive wiring P141 by an insulating layer IL of an insulating material. A portion where the second electrode C142 of the solar cell C1 is insulated from each other and the second conductive wiring P142 intersects with the first electrode C141 of the first solar cell C1 is connected to the insulating layer IL The second conductive wiring P142 and the first electrode C141 of the first solar cell C1 can be insulated from each other.

 It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

Claims (14)

1. A solar cell comprising: a semiconductor substrate; a first solar cell and a second solar cell including a plurality of first electrodes and a second electrode spaced apart from each other on a rear surface of the semiconductor substrate and disposed adjacent to each other;
And an insulating member having a plurality of conductive wires connected to the first and second electrodes of the first and second solar cells,
Wherein the plurality of conductive wirings are embedded in one surface of the insulating member so that a surface connected to the first and second electrodes is exposed. The method according to claim 1,
The insulating member
A wiring board layer on which the plurality of conductive wirings are arranged on one surface thereof;
And a polymer layer disposed between each of the plurality of conductive wirings on one side of the wiring substrate layer. 3. The method of claim 2,
Wherein the polymer layer is in contact with the rear surface of each of the first and second solar cells. 3. The method of claim 2,
Wherein the wiring substrate layer and the polymer layer include the same or different materials from each other in the polymer-based material. 3. The method of claim 2,
Wherein the wiring substrate layer comprises at least one of PET (Polyethylene phthalate), PA (polyamide), polyimide, epoxy-glass, polyester and BT (bismaleimide triazine). 3. The method of claim 2,
Wherein the polymer layer comprises at least one of ethylene-vinyl acetate copolymer (EVA) and poly-olefin. 3. The method of claim 2,
Wherein the wiring substrate layer is opaque. 3. The method of claim 2,
Wherein the wiring substrate layer comprises a light reflecting material. 9. The method of claim 8,
The light reflecting material
A wiring board layer formed on one surface of the wiring board,
Wherein the wiring substrate layer is provided in a form of a filler. 9. The method of claim 8,
Wherein the light reflecting material comprises at least one of a white phosphor or TiO2. The method according to claim 1,
Wherein the plurality of conductive wirings are provided in a form of a plurality of wires. 12. The method of claim 11,
The plurality of conductive wirings
And a first electrode of the first solar cell is electrically connected to a second electrode of the second solar cell. 13. The method of claim 12,
Wherein the plurality of conductive wirings and the first and second electrodes of the first and second solar cells are connected to each other by a conductive adhesive. 13. The method of claim 12,
Wherein the first and second solar cells are arranged in a direction crossing the longitudinal direction of the first and second electrodes of the first and second solar cells,
Wherein the longitudinal direction of the plurality of conductive wirings is formed in a direction crossing the longitudinal direction of the first and second electrodes of the first and second solar cells.

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