KR20150015375A - 레지스트 조성물, 산 발생제, 고분자 화합물 및 레지스트 패턴 형성 방법 - Google Patents
레지스트 조성물, 산 발생제, 고분자 화합물 및 레지스트 패턴 형성 방법 Download PDFInfo
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- KR20150015375A KR20150015375A KR1020140093721A KR20140093721A KR20150015375A KR 20150015375 A KR20150015375 A KR 20150015375A KR 1020140093721 A KR1020140093721 A KR 1020140093721A KR 20140093721 A KR20140093721 A KR 20140093721A KR 20150015375 A KR20150015375 A KR 20150015375A
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Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F224/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- G—PHYSICS
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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Abstract
[화학식 1]
Description
Claims (15)
- 하기 일반식 (m0) 으로 나타내는 화합물을 함유하는 것을 특징으로 하는 레지스트 조성물.
[화학식 1]
[식 (m0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X0- 는 1 가의 유기 아니온을 나타낸다.] - 제 1 항에 있어서,
산의 작용에 의해 현상액에 대한 용해성이 변화하는 기재 성분 (A) 및 노광에 의해 산을 발생하는 산 발생제 성분 (B) 를 함유하는 레지스트 조성물로서,
상기 산 발생제 성분 (B) 가 하기 일반식 (b0) 으로 나타내는 화합물을 포함하는 레지스트 조성물.
[화학식 2]
[식 (b0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X1- 는 강산을 발생할 수 있는 1 가의 유기 아니온을 나타낸다.] - 제 2 항에 있어서,
추가로 산 확산 제어제 성분 (D) 를 함유하는 레지스트 조성물. - 제 3 항에 있어서,
상기 산 확산 제어제 성분 (D) 가 하기 일반식 (d0) 으로 나타내는 화합물을 포함하는 레지스트 조성물.
[화학식 3]
[식 (d0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X2- 는 약산을 발생할 수 있는 1 가의 유기 아니온을 나타낸다.] - 제 1 항에 있어서,
노광에 의해 산을 발생하고, 또한, 산의 작용에 의해 현상액에 대한 용해성이 변화하는 레지스트 조성물로서,
산 확산 제어제 성분 (D) 로서, 하기 일반식 (d0) 으로 나타내는 화합물을 함유하는 레지스트 조성물.
[화학식 4]
[식 (d0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X2- 는 약산을 발생할 수 있는 1 가의 유기 아니온을 나타낸다.] - 제 5 항에 있어서,
추가로 노광에 의해 산을 발생하는 산 발생제 성분 (B) 를 함유하는 레지스트 조성물. - 제 6 항에 있어서,
상기 산 발생제 성분 (B) 가 하기 일반식 (b0) 으로 나타내는 화합물을 포함하는 레지스트 조성물.
[화학식 5]
[식 (b0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X1- 는 강산을 발생할 수 있는 1 가의 유기 아니온을 나타낸다.] - 하기 일반식 (M1) 로 나타내는 화합물로 이루어지는 산 발생제.
[화학식 6]
[식 (M1) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X- 는 술폰산 아니온, 카르복실산 아니온, 이미드 아니온, 또는 메티드 아니온을 나타낸다.] - 제 1 항에 있어서,
산의 작용에 의해 현상액에 대한 용해성이 변화하고, 또한, 노광에 의해 산을 발생하는 기재 성분을 함유하는 레지스트 조성물로서,
상기 기재 성분이 노광에 의해 산을 발생하는 아니온기와 하기 일반식 (m1) 로 나타내는 카티온으로 이루어지는 카티온부를 갖는 고분자 화합물을 포함하는 레지스트 조성물.
[화학식 7]
[식 (m1) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다).] - 제 9 항에 있어서,
추가로 노광에 의해 산을 발생하는 산 발생제 성분 (B) 를 함유하는 레지스트 조성물. - 제 10 항에 있어서,
상기 산 발생제 성분 (B) 가 하기 일반식 (b0) 으로 나타내는 화합물을 포함하는 레지스트 조성물.
[화학식 8]
[식 (b0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X1- 는 강산을 발생할 수 있는 1 가의 유기 아니온을 나타낸다.] - 제 9 항에 있어서,
추가로 산 확산 제어제 성분 (D) 를 함유하는 레지스트 조성물. - 제 12 항에 있어서,
상기 산 확산 제어제 성분 (D) 가 하기 일반식 (d0) 으로 나타내는 화합물을 포함하는 레지스트 조성물.
[화학식 9]
[식 (d0) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 알킬기 또는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 알케닐기 또는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다). X2- 는 약산을 발생할 수 있는 1 가의 유기 아니온을 나타낸다.] - 노광에 의해 산을 발생하는 아니온기를 측사슬에 포함하고, 또한, 하기 일반식 (m1) 로 나타내는 카티온으로 이루어지는 카티온부를 갖는 구성 단위 (am0) 을 갖는 고분자 화합물.
[화학식 10]
[식 (m1) 중, R1 및 R2 는 각각 독립적으로 치환기를 갖고 있어도 되는 아릴기, 치환기를 갖고 있어도 되는 알킬기, 또는 치환기를 갖고 있어도 되는 알케닐기를 나타내고, 상호 결합하여 식 중의 황 원자와 함께 고리를 형성해도 된다. R3 은 치환기를 갖고 있어도 되는 방향족 탄화수소기, 치환기를 갖고 있어도 되는 알케닐기, 또는 치환기를 갖고 있어도 되는 알키닐기를 나타낸다. V1 은 단결합 또는 알킬렌기를 나타낸다 (단, R3 이 치환기를 갖고 있어도 되는 방향족 탄화수소기인 경우, 알킬렌기이다).] - 지지체 상에, 제 1 항에 기재된 레지스트 조성물을 사용하여 레지스트막을 형성하는 공정, 상기 레지스트막을 노광하는 공정, 및 상기 노광 후의 레지스트막을 현상하여 레지스트 패턴을 형성하는 공정을 포함하는 레지스트 패턴 형성 방법.
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TW201518860A (zh) | 2015-05-16 |
US9354515B2 (en) | 2016-05-31 |
KR102248945B1 (ko) | 2021-05-06 |
US20150037734A1 (en) | 2015-02-05 |
TWI646390B (zh) | 2019-01-01 |
JP6249664B2 (ja) | 2017-12-20 |
JP2015031760A (ja) | 2015-02-16 |
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