KR20130036244A - 유로 부재, 이것을 사용한 열교환기, 및 전자 부품 장치 - Google Patents
유로 부재, 이것을 사용한 열교환기, 및 전자 부품 장치 Download PDFInfo
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- KR20130036244A KR20130036244A KR1020127032111A KR20127032111A KR20130036244A KR 20130036244 A KR20130036244 A KR 20130036244A KR 1020127032111 A KR1020127032111 A KR 1020127032111A KR 20127032111 A KR20127032111 A KR 20127032111A KR 20130036244 A KR20130036244 A KR 20130036244A
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- Prior art keywords
- flow path
- side wall
- path member
- gap
- ceramic green
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L9/00—Rigid pipes
- F16L9/003—Rigid pipes with a rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
도 2는 본 실시형태의 유로 부재의 다른 일례를 나타내고, 도 2(a)는 유로의 길이 방향에 수직인 단면을 나타내는 사시도이며, 도 2(b)는 도 2(a)의 파선으로 둘러싼 원 안의 부분 확대도이다.
도 3은 본 실시형태의 유로 부재의 간극의 일례를 나타내는 단면도이며, 도 3(a)는 직사각형상이며, 도 3(b)는 사다리꼴 형상이며, 도 3(c)는 간극이 측벽부측으로 연장되는 방향을 향해 상하로 개구하는 방향의 높이가 낮아지는 형상을 나타내는 도면이다.
도 4는 본 실시형태의 유로 부재의 덮개체부의 외면에 금속판을 설치한 열교환기의 일례를 나타내는 사시도이다.
도 5는 본 실시형태의 열교환기에 전자 부품을 적재한 전자 부품 장치의 일례를 나타내는 사시도이다.
도 6은 본 실시형태의 유로 부재의 측벽부를 구성하기 위한 세라믹 그린시트에 유로가 되는 관통 구멍을 가공하기 위한 방법의 예를 나타내고, 도 6(a)는 금형을 사용했을 때의 단면 모식도이며, 도 6(b)는 레이저광을 사용했을 때의 단면 모식도이며, 도 6(c) 및 도 6(d)는 각각의 가공법을 사용했을 때의 세라믹 그린시트의 절단면에 수직인 면의 부분 단면도이다.
도 7은 본 실시형태의 유로 부재를 나타내고, 도 7(a)는 측면도이며, 도 7(b)는 단면도이다.
1b: 저판부 1c: 측벽부
1d: 접합부 1e: 모따기
1f: 버 1g: 끝면
3: 유로 4: 간극
4a: 간극의 깊이 4b: 간극의 최고값
5: 금속판 6: 전자 부품
7, 8: 가공한 세라믹 그린시트 7b', 8b': 끝면
7c', 8c': 모따기 20: 열교환기
30: 전자 부품 장치
Claims (8)
- 덮개체부와 측벽부와 저판부로 구성되고, 내부에 유체가 흐르는 유로를 가짐과 아울러 상기 덮개체부와 상기 측벽부 사이에 상기 유로로 연결되는 간극을 갖는 것을 특징으로 하는 유로 부재.
- 제 1 항에 있어서,
상기 측벽부는 상기 유로를 형성하기 위한 구멍을 갖는 판상체를 복수 구비해서 이루어지는 적층체로서, 상기 적층체를 구성하는 판상체 사이에 상기 유로로 연결되는 간극이 있는 것을 특징으로 하는 유로 부재. - 제 1 항 또는 제 2 항에 있어서,
상기 유체가 흐르는 방향에 대하여 직교하도록 단면으로 보았을 때 상기 간극은 직사각형상 또는 사다리꼴 형상인 것을 특징으로 하는 유로 부재. - 제 1 항 또는 제 2 항에 있어서,
상기 유체가 흐르는 방향에 대하여 직교하도록 단면으로 보았을 때 상기 간극은 상기 측벽부측으로 연장되는 방향을 향해서 상하로 개구하는 방향의 높이가 낮아지는 것을 특징으로 하는 유로 부재. - 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,
상기 유체가 흐르는 방향에 대하여 직교하도록 단면으로 보았을 때 상기 간극은 상기 측벽부측으로 연장되는 방향의 깊이를 a로 하고 상하로 개구하는 방향의 최대 높이를 b로 했을 때 a>b의 관계인 것을 특징으로 하는 유로 부재. - 제 5 항에 있어서,
상기 깊이는 0.03㎜ 이상 0.08㎜ 이하인 것을 특징으로 하는 유로 부재. - 제 1 항 내지 제 6 항 중 어느 한 항에 기재된 유로 부재의 상기 덮개체부의 외면에 금속판을 설치해서 이루어지는 것을 특징으로 하는 열교환기.
- 제 7 항에 기재된 열교환기의 상기 금속판 상에 전자 부품을 탑재해서 이루어지는 것을 특징으로 하는 전자 부품 장치.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-132103 | 2010-06-09 | ||
JP2010132103 | 2010-06-09 | ||
PCT/JP2011/063250 WO2011155562A1 (ja) | 2010-06-09 | 2011-06-09 | 流路部材およびこれを用いた熱交換器ならびに電子部品装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130036244A true KR20130036244A (ko) | 2013-04-11 |
KR101503824B1 KR101503824B1 (ko) | 2015-03-18 |
Family
ID=45098166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127032111A Active KR101503824B1 (ko) | 2010-06-09 | 2011-06-09 | 유로 부재, 이것을 사용한 열교환기, 및 전자 부품 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130088837A1 (ko) |
EP (1) | EP2582213B1 (ko) |
JP (2) | JP5073104B2 (ko) |
KR (1) | KR101503824B1 (ko) |
CN (1) | CN102934528B (ko) |
WO (1) | WO2011155562A1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2582213B1 (en) * | 2010-06-09 | 2021-01-20 | Kyocera Corporation | Flow channel member, heat exchanger using same, and electronic component device |
JP6005930B2 (ja) * | 2011-07-28 | 2016-10-12 | 京セラ株式会社 | 流路部材、これを用いた熱交換器および電子部品装置ならびに半導体製造装置 |
US20130306293A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Extruded matching set radiators |
US20130308273A1 (en) * | 2012-05-21 | 2013-11-21 | Hamilton Sundstrand Space Systems International | Laser sintered matching set radiators |
JP6154248B2 (ja) * | 2012-08-24 | 2017-06-28 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
JP6290635B2 (ja) * | 2014-01-23 | 2018-03-07 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
JP2017044363A (ja) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | 流路部材 |
JP6909126B2 (ja) * | 2017-10-13 | 2021-07-28 | 京セラ株式会社 | 半導体装置の製造方法 |
CN109819603B (zh) * | 2017-11-20 | 2022-05-27 | Tvs电机股份有限公司 | 用于机动车辆的主控制单元组件 |
CN108036668B (zh) * | 2017-12-07 | 2024-03-15 | 程向锋 | 换热管、包括它的换热器和换热管的制造方法 |
JP7087715B2 (ja) * | 2018-06-21 | 2022-06-21 | 株式会社デンソー | 電力変換装置及び冷却システム |
JP7238635B2 (ja) * | 2019-06-27 | 2023-03-14 | 株式会社デンソー | 電力変換装置及び冷却システム |
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EP2582213B1 (en) * | 2010-06-09 | 2021-01-20 | Kyocera Corporation | Flow channel member, heat exchanger using same, and electronic component device |
-
2011
- 2011-06-09 EP EP11792519.8A patent/EP2582213B1/en active Active
- 2011-06-09 CN CN201180028161.6A patent/CN102934528B/zh active Active
- 2011-06-09 WO PCT/JP2011/063250 patent/WO2011155562A1/ja active Application Filing
- 2011-06-09 US US13/702,948 patent/US20130088837A1/en not_active Abandoned
- 2011-06-09 KR KR1020127032111A patent/KR101503824B1/ko active Active
- 2011-06-09 JP JP2011543023A patent/JP5073104B2/ja active Active
-
2012
- 2012-04-23 JP JP2012097816A patent/JP5502133B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20130088837A1 (en) | 2013-04-11 |
EP2582213A1 (en) | 2013-04-17 |
KR101503824B1 (ko) | 2015-03-18 |
CN102934528B (zh) | 2015-07-01 |
JP2012165006A (ja) | 2012-08-30 |
CN102934528A (zh) | 2013-02-13 |
EP2582213A4 (en) | 2014-01-15 |
JP5073104B2 (ja) | 2012-11-14 |
WO2011155562A1 (ja) | 2011-12-15 |
JPWO2011155562A1 (ja) | 2013-08-01 |
EP2582213B1 (en) | 2021-01-20 |
JP5502133B2 (ja) | 2014-05-28 |
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