KR20110135815A - Component mounting method and component mounting device of component mounting device - Google Patents

Abstract

Provided are a component mounting method and a component mounting apparatus of a component mounting apparatus capable of reducing the manufacturing cost and operating cost of the apparatus, and shortening the mounting time, and correcting the lifting of the components. In the component mounting method of the component mounting apparatus which mounts a component to a board | substrate in a predetermined order, after mounting a component in a predetermined 1st position of the said board | substrate by an adsorption nozzle or a mechanical chuck, the component of every mounting step is carried out. The floating of the part is corrected by pressing the predetermined second position into the suction nozzle, the mechanical chuck, or the pressing member.

Description

Component mounting method of component mounting device and component mounting device {COMPONEMT MOUNTING METHOD OF COMPONENT PLACEMENT APPARATUS AND COMPONENT PLACEMENT APPARATUS}

The present invention relates to a component mounting method and a component mounting apparatus of a component mounting apparatus for mounting components on a printed board.

As a conventional component mounting technique, there is a technique described in Patent Document 1. Patent Literature 1 describes a technique of measuring after mounting the height position of the upper surface of a component having a mounting position coordinate, detecting whether the component is mounted in a predetermined posture, and detecting that one side of the component is lifted up. When tilting or lifting is detected, a technique for correcting and releasing tilting and lifting of a part is disclosed by a pressure assisting pressing operation without removing the part.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2002-176292

In the prior art as described in Patent Literature 1, measurement means for detecting the lifting of a component mounted on a printed board is required, so that the manufacturing cost and the operating cost of the device may be increased. In addition, once the mounting of all parts is finished, the lifting of the mounted parts is detected, and when the lifting is detected in the parts, the pressing operation is performed by the pressing assist means, so that the mounting time increases. . In addition, when the projection area (planar area) of the component to be mounted is large, when the plane shape is a special shape (for example, a U-shape, a ring shape, or a long shape), or a part or the like that is easily bent partially or entirely. For the case, the response was difficult.

The present invention, in view of the above problems, can reduce the manufacturing cost and operating cost of the device, and the mounting time can be shortened, and the component mounting method and component mounting apparatus of the component mounting apparatus that can correct the lifting of the components The purpose is to provide.

MEANS TO SOLVE THE PROBLEM In order to achieve said subject, the component mounting method of the component mounting apparatus of this invention is a component mounting method of the component mounting apparatus which mounts a component to a board | substrate in a predetermined order, WHEREIN: A component is a predetermined 1st position of the said board | substrate. After mounting in the suction nozzle or mechanical chuck, the second predetermined position of the mounted component is press-fitted into the suction nozzle, the mechanical chuck or the press-fitting member at every component mounting step.

Moreover, the component mounting method of the component mounting apparatus of the said invention is characterized by determining the coordinate of the said 2nd position by the relative position coordinate from the coordinate of the said 1st position.

In the component mounting method of the component mounting apparatus of the present invention, the coordinates of the first position and the coordinates of the second position are X, Y, Z, and θ coordinates.

Preferably, in the component mounting method of the component mounting apparatus of the present invention, a pin hole in which the pin of the component is inserted is provided directly below the second position of the substrate.

More preferably, in the component mounting method of the component mounting apparatus of the present invention, the order in which the component is mounted on the substrate and the first position are registered in the NC data in the component mounting step order, and the second position is determined. The plurality of positions and numbers to be press-fitted are registered in the part data for each of the parts, and the NC is pressurized when the second position of the part is press-fitted into the suction nozzle, the mechanical chuck, or the press-fitting member for each part mounting step. The part name is read from the data, and the part is press-fitted based on the data registered in the part data based on the read part name.

Moreover, the component mounting apparatus of the said invention WHEREIN: The component mounting apparatus which mounts components to a board | substrate in predetermined order WHEREIN: The adsorption nozzle or mechanical chuck which mounts a board | substrate in the state which sucked or chucked a component, and the said adsorption nozzle or mechanical chuck A moving mounting means for moving and mounting to a first position for mounting a component, and at least one predetermined second position of the mounted component, each time the movable mounting means mounts the component, a suction nozzle and a mechanical chuck. Or a component press means for press-fitting into the press-fit member, and a control part for controlling the operation of the component mounting apparatus.

Moreover, the component mounting apparatus of the said invention is characterized by determining the coordinate of the said 2nd position by the relative position coordinate from the coordinate of the said 1st position.

Moreover, in the component mounting apparatus of the said invention, the said coordinate of the said 1st position in the said control part, and the said coordinate of the said 2nd position are the X, Y, Z, and (theta) coordinates, It is characterized by the above-mentioned.

Preferably, in the component mounting apparatus of the present invention, a pin hole in which the pin of the component is inserted is immediately below the second position of the substrate.

More preferably, in the component mounting apparatus of the present invention, a plurality of pieces of NC data registered in the order of mounting the component on the substrate, NC data in which the first position is registered in the order of the component mounting step, and the second position are press-fitted. And a storage section for storing the part data whose positions and numbers are registered for each of the parts, and the control unit presses the second position of the parts with the suction nozzle, the mechanical chuck, or the press-fitting member for each of the parts mounting steps. In this case, it is characterized in that the part name of the NC data is read from the storage unit, and a part is press-fitted based on the data registered in the part data based on the read part name.

According to this invention, it becomes possible to provide the component mounting apparatus and component mounting method which can correct the lifting of a component. Moreover, manufacturing cost and operating cost of a component mounting apparatus can be reduced, and mounting time can be shortened.

1 is a schematic plan view of one embodiment of a component mounting apparatus of the present invention.
FIG. 2 is a control block diagram of the component mounting device of FIG. 1.
3 is a view for explaining an embodiment of press fitting of the component mounting apparatus of the present invention.
4 is a view for explaining an embodiment of NC data of the component mounting apparatus of the present invention.
5 is a diagram for explaining an embodiment of component data of the component mounting apparatus of the present invention.
6 is a flowchart for explaining the operation procedure of an embodiment of the press-fitting of the component mounting apparatus of the present invention.
7 is a flowchart for explaining the operation procedure of an embodiment of the press-fitting of the component mounting apparatus of the present invention.
8 is a view for explaining an embodiment of press fitting of the component mounting apparatus of the present invention.

EMBODIMENT OF THE INVENTION Below, one Embodiment of this invention is described with reference to FIGS. In addition, embodiment described below is for description, and does not limit the scope of the present invention. Therefore, the person skilled in the art can employ | adopt embodiment which replaced each element or all these elements with equivalent to this, These embodiment is also included in the scope of this invention.

1 is a schematic plan view of one embodiment of a component mounting apparatus of the present invention. 2 is a control block diagram of the component mounting apparatus 1 of FIG. In FIG. 2, only one X-axis motor 12, Y-axis motor 9, θ-axis motor 15, vertical shaft motor 14, and the like are shown in FIG. 2. In addition, although the component shown by the control block diagram of FIG. 2 is mostly omitted in FIG. 1, it is couple | bonded with each component of the component mounting apparatus 1 by the interface 34. As shown in FIG. The interface 34 is also coupled to a higher level control device such as an external host computer to transmit and receive data and signals.

On the apparatus main body 2 of the component mounting apparatus 1, the component supply unit 3 which supplies various components is provided in parallel. The supply conveyor 4, the positioning part 5, and the discharge conveyor 6 are provided between the parts supply unit 3 groups which are parallel and oppose. The supply conveyor 4 carries in the positioning part 5 the board | substrate P received from the upstream. The board | substrate P is positioned by the positioning mechanism which is not shown in the positioning part 5, and is carried out by the discharge conveyor 6 after a component is mounted.

Predetermined parts are accommodated in each of the component supply units 3, and the CPU (Central Processing Unit) 31 or the like can be recognized by an arrangement number indicating the storage position. The component supply unit 3 supplies each component one by one to the component ejection unit (component adsorption position), and the adsorption nozzle 17 adsorbs the component specified by the mounting data at the component adsorption position and takes out the component. Going.

The beams 8-1 and 8-2 elongated in the X direction form a pair of beams 8 facing each other, and rotate the screw shaft 10 by driving the Y-axis motor 9, respectively. Along the pair of left and right guides 11, the component adsorption positions above the substrate P and the component supply unit 3 are individually moved in the Y direction.

Each of the beams 8-1 and 8-2 is provided with a movable head 7 moving along a guide (not shown) by the X-axis motor 12 in its longitudinal direction, that is, in the X direction.

The movable head 7 includes a vertical axis motor 14 for moving the mounting head 13 including the suction nozzle 17 in the vertical direction (Z axis) and a θ axis for rotating around the vertical axis (Z axis). The motor 15 is mounted. Therefore, each suction nozzle 17 of the two mounting heads 13 can move in the X direction and the Y direction, can rotate around the vertical line (angle?), And can also move up and down (Z-axis direction movement). have.

The component position recognition unit 16 includes a strobe light emitting unit 24 for illumination composed of a light source (strobo light source) 24a, an optical fiber cable 24b, and a ring light illuminating unit 24c, and a component recognition camera 20. Consists of The component position recognizing section 16 is provided in correspondence with each of the adsorption nozzles 17 one by one, and how much the amount of deviation of rotation of the components relative to the XY direction and the nozzle shaft has been adsorbed and held. In order to recognize, the component A is imaged from below.

The nozzle stockers 18-1 and 18-2 accommodate a plurality of various adsorption nozzles.

The board | substrate recognition camera 19 is respectively provided in the two movable heads 7, and in order to recognize the position of the mark M1 attached to the board | substrate P, the board | substrate recognition camera 19 surface of the board | substrate P vicinity of mark M1 is carried out. Image is taken from above. Moreover, the mark formation body M2 is attached to the apparatus main body 2 of the component mounting apparatus 1, and this mark formation body M2 is made possible with the board | substrate recognition camera 19. In addition, the mark M1 may differ in position, size, or pattern by the board | substrate P. FIG.

On the other hand, the observation optical axis of the part recognition camera 20 and the center axis of the mark forming body M2 are disposed at substantially the same position in the X direction, the actual attachment position is measured and corrected in advance, and stored as known data. It is stored in (32). In addition, the axis center of the suction nozzle 17 and the observation optical axis of the board | substrate recognition camera 19 are located in substantially the same position as the observation optical axis of the component recognition camera 20 in the XY direction, and the center axis of the mark formation body M2. It is deployed.

In addition, although not shown, the board | substrate recognition camera 19 and the component recognition camera 20 are equipped with the focusing mechanism for adjusting a focus position, respectively.

Next, the control block configuration and basic operation shown in FIG. 2 will be outlined.

The control device of the component mounting apparatus 1 is a CPU 31 and a storage unit (control unit) which access each other through the components of the component mounting apparatus 1 and the interface 34 or the like to collectively control the operations related to component mounting. 32). In the storage unit 32, the X direction, the Y direction, the up and down (Z) direction, and the angular position (θ rotation angle) information in the substrate P for each mounting order of the parts, The program data for each model, such as the mounting data which consists of arrangement number information, the position of the mark M1 attached to the board | substrate P, etc. are stored.

The CPU 31 collectively controls the operation relating to the component mounting operation of the component mounting apparatus 1 in accordance with the program stored in the storage unit 32. That is, the CPU 31 drives the X-axis motor 12 through the drive control circuit 26, drives the Y-axis motor 9 through the drive control circuit 27, and drives the drive control circuit 28. The drive of the θ-axis motor 15 is controlled through the control panel θ, and the drive of the vertical axis (Z-axis) motor 14 is controlled via the drive control circuit 29.

The storage unit 32 is a nonvolatile memory such as a hard disk. In the storage unit 32, for example, NC data and part data are stored in association with registered model names, program names, and the like. When the model switching operation is performed, the CPU 31 performs the component mounting operation based on the NC data and the component data corresponding to the corresponding model.

In the component mounting apparatus, the image recognition processing unit 30 is coupled to the CPU 31 via the interface 34. The CPU 31 has a main station, and the image recognition processing unit 30 has a final relationship.

In other words, the CPU 31 controls the imaging operation of the substrate recognition camera 19 and the component recognition camera 20, and the image recognition processing unit 30 so as to recognize the captured image (calculate the amount of position deviation, etc.). Control signals are outputted to them, and their recognition processing results are received. In contrast, the image recognition processing unit 30 executes the processing instructed by the CPU 31 and outputs the processing result to the CPU 31.

For example, the image recognition processing part 30 outputs a control signal to the board | substrate recognition camera 19, the image of the mark M1 on the board | substrate P, and the apparatus main body 2 of the component mounting apparatus 1 mentioned above. The mark formation body M2 on () is instructed to image. The board | substrate recognition camera 19 image | photographs the image of the mark M1 on the board | substrate P, and the mark formation body M2 on the apparatus main body 2 of the above-mentioned component mounting apparatus 1, and image | photographed the image which imaged It outputs to the recognition processing part 30.

For example, the image recognition processing part 30 outputs a control signal to the component recognition camera 20, and instructs the adsorption nozzle 17 to image the component A adsorb | sucked. The component recognition camera 20 picks up the component A adsorbed, and outputs the picked-up image to the image recognition processing part 30.

The image recognition processing part 30 calculates the position deviation amount and rotation deviation amount of the XY direction of the board | substrate P from the image of the mark M1 which the board | substrate recognition camera 19 picked up. Moreover, the image recognition processing part 30 calculates the relative position deviation amount of the optical axis of the board | substrate recognition camera 19 with respect to the optical axis of the component recognition camera 20 from the image of the mark formation body M2.

In addition, the image recognition processing unit 30 uses the image recognition processing unit 30 to determine the positional deviation amount and the rotational deviation amount in the XY direction of the component A from the image of the component A captured by the component recognition camera 20. Calculate.

As described above, the recognition processing unit 30 grasps these positional deviation amounts by the recognition processing, and outputs the result to the CPU 31. The CPU 31 derives the information to be corrected from the input result and instructs the corresponding component to mount the component at the position to be mounted on the actual printed board P based on the derived correction information. Serve

For example, the CPU 31 outputs a control signal to the drive control circuit 27, and the drive control circuit 27 controls the Y-axis motor 9 on the basis of the control signal, thereby providing a beam 8. (Beam 8-1 or beam 8-2) is moved in the Y direction. Thereby, the position correction of the Y direction is performed.

For example, the CPU 31 outputs a control signal to the drive control circuit 26, and the drive control circuit 26 controls the X-axis motor 12 based on the control signal to move the movable head. Move (7) in the X direction. As a result, position correction in the X direction is performed.

For example, the CPU 31 outputs a control signal to the drive control circuit 28, and the drive control circuit 28 controls the θ-axis motor 15 on the basis of the control signal to move the movable head. Rotate (7) by θ. Thereby, correction of the rotation angle position around a vertical axis is performed.

In addition, the board | substrate recognition processing operation | movement among the above-mentioned is performed only before the initial component attachment by each beam 8-1, 8-2. This is to reflect not only the characteristics of the printed board P but also the characteristics of each beam, each mounting head 13, etc. in the position correction of component mounting.

In addition, in FIG. 2, the input device 35 is a UI (User Interface), such as a keyboard and a pointing device which an operator inputs from the exterior of the component mounting apparatus 1 (preferably GUI operation is possible). ), The monitor 36 displays various mounting data (NC data and component data) assembled in the component mounting apparatus 1, mounting condition data, or an input image or processing result of a recognized component image.

In addition, in the Example of FIG. 1, FIG. 2, the adsorption nozzle 17 is used for taking out a component from the component adsorption position of the component supply unit 3, and attaching it to the board | substrate P (for holding | maintenance of a component). Doing. However, it is not necessary to adsorb the components with the adsorption nozzle, and of course, the components may be chucked using a mechanical chuck.

3 is a view for explaining an embodiment of the present invention. FIG. 3A is a partial cross-sectional view when the component 302 is attached to the substrate 301. FIG. 3B is a cross-sectional view when further press-fitting the substrate 301 on which the component 302 is mounted. FIG. 3C is a plan view for describing positions 321 to 324 of the central portion of the pins 302-1 to 302-4 of the component 302.

First, as shown in Fig. 3A, the component 302 is attached to the substrate 302 by the suction nozzle 303 by a generally known technique. At this time, the mounting head (adsorption nozzle 303) is moved to the component mounting position in which the centerline 304 of the suction nozzle 303 is registered in the NC data (to be described later), thereby moving the component 302 to the substrate 301. Mount on.

In this case, the part 302 and the board | substrate 301 just under the centerline 304-0 of the adsorption nozzle 303 are the position 302-0 of XYZ coordinate (a horizontal position coordinate and a vertical position (height) coordinate). Contact at). However, the inclination and lifting of the component 302 increases with respect to the board | substrate 301 as it goes to the end surface of the component 302. As shown to FIG. In particular, when the projection area (planar area) of the part is large, or when the plane shape is a special shape such as a U-shape, a ring shape, or an elongate shape, or a part that is easily bent partially or entirely, Tilting or lifting increases.

Therefore, as shown in FIGS. 3B and 3C, after mounting the component 302, for example, four pins 302-1 to 302-4 formed on the lower surface of the component 302 are provided. ), The suction nozzle 303 is press-fitted to the positions 321 to 324 respectively, and the component 302 is press-fitted to the substrate 301 at each point (positions 321 to 324 of the pinholes). As a result, in the centerline 304-1, the height of the component 302 can be modified from the height Z1d to the height Z0d, and can be modified from the height Z1u to the height Z0u.

The press-in operation of the suction nozzle 303 is performed for each pin (positions 321 to 324 of the pin holes) as shown in Fig. 3C, and the position coordinates for the press-in when The relative position coordinates from the component mounting position. For example, in the pin 321 of FIG. 3C, the X coordinate is spaced apart from the component mounting position 320 by x11 (for example, the lower direction in the drawing is the positive coordinate and the upper direction is the negative coordinate). The place and the Y coordinate are the coordinates of the press-in at a place away from the component mounting position 320 at y11 (for example, the right direction in the drawing is the positive coordinate and the left direction is the negative coordinate).

In addition, when the contact surface shape of the adsorption nozzle 303 to be used is not square, the adsorption nozzle 303 (mounting head) is rotated by the angle (theta) 11 adapted to press fitting. In addition, 304x is a horizontal (X) direction of a board | substrate surface, and 304y is a vertical (Y) direction of a board | substrate surface.

In addition, the adsorption nozzle used for a press-in operation may be the adsorption nozzle used at the time of component installation, and may be performed by converting into another adsorption nozzle. Moreover, you may provide the press fitting member dedicated to press fitting in a mounting head.

In addition, when the mechanical chuck is used instead of the suction nozzle for holding the parts, the mounting head is rotated at an angle adapted to the press fitting (for example, the angle at the time of mounting and press-fitting) to press the parts. Of course). In addition, at the time of indentation, which part of the mechanical chuck is pressed against the part can be arbitrarily determined.

4, the Example of NC data of the component mounting apparatus of this invention is demonstrated. 4 is an embodiment of a registration list of NC data for component mounting used in the present invention.

In Fig. 4, the order of mounting the parts 302 is 1 to 5,. to be. Moreover, the data of mounting position coordinates X, Y, Z, (theta), and the part number of the component to mount are registered for each step which shows a mounting order.

5, the Example of the component data of the component mounting apparatus of this invention is demonstrated. Fig. 5 is an embodiment of a registration list of parts data for component mounting used in the present invention.

In Fig. 5, for each component to be mounted, corresponding part numbers (see Fig. 4) are 1 to 5,. The list is up, and the press-in score (number of press-in positions) and press-in data are registered for each part number.

Indentation data is a coordinate value which can be calculated based on the mounting coordinates of a component, and is usually the same as the component position used as the nozzle position at the time of component mounting. The indentation data is a sequence in which the indentation operation is performed. Register with

It is also possible to change the indentation amount of the suction nozzle at each indentation point. Although not shown in the parts data of FIG. 5, as described above, the adsorption nozzles used for the press-fitting operation may be the adsorption nozzles used at the time of mounting the parts, or may be replaced with other adsorption nozzles.

It is needless to say that the part data need not be created and operated separately from the NC data, and of course, it may be added to the NC data as data for press fitting.

6 and 7, the operation procedure of one embodiment of the component mounting apparatus of this invention is demonstrated. 6 is a flowchart for explaining an embodiment of a component mounting procedure including a substrate press-fitting operation of the component mounting apparatus of the present invention. 7 is a flowchart for explaining an embodiment of the substrate press-fitting operation procedure in the mounting procedure of the component mounting apparatus of the present invention. These flowcharts are executed by the CPU (see FIG. 2) controlling the component mounting apparatus. In addition, in this specification, the operation | movement which mounts a component is made into "mounting" operation | movement, the operation | movement which presses in a component is made into the "press-in" operation, and the operation | movement which combined the "mounting" operation | movement and the "press-in" operation is referred to as "mounting" operation | movement. Will be explained.

In FIG. 6, in step 600, the mounting operation of one substrate is started.

In step 601, one step of data is read from the NC data.

In step 602, it is determined whether the mounting data of the step exists in the NC data. If there is no data, the part mounting procedure 600 is terminated (step 609), and if data exists, the procedure proceeds to step 603. Hereinafter, according to the data, the following steps 603 to 608 are executed. In addition, detailed operation | movement, such as the adsorption | suction on-off operation | movement of the adsorption nozzle in procedures 603-608, is well known, and description is abbreviate | omitted.

In step 603, the adsorption nozzle performs the component takeout operation.

In step 604, the adsorption nozzle that has adsorbed the component is moved to the mounting coordinate XY position of the read step. For example, the Z position is the same as the standby position coordinate.

In step 605, the suction nozzle which has completed the movement of the XY position is rotated to the mounting coordinate θ position of the read step.

In step 606, the suction nozzle is moved to the mounting coordinate Z position of the read step. This operation completes the mounting of the component.

In step 607, the suction nozzle is moved to the Z position of the standby position.

In step 608, the component pressing operation is performed in accordance with the flowchart described in Fig. 7, and the process returns to step 601 (the adsorption nozzle is in the suction off state).

In FIG. 7, in step 608, the press-in operation of one component is started.

In step 701, the indentation score p of the part is read from the part data to determine whether p = 0. If p = O, this means that there is no press-in operation for this part, and the procedure is returned to the procedure 601 of FIG. 6. If p ≠ 0, the procedure proceeds to step 702.

In step 702, the counter value i is set to i = 0, and the procedure proceeds to step 703.

In step 703, the suction nozzle is moved to the XY position of the indentation point i of the read part data.

In step 704, the suction nozzle is rotated to the θ position at the indentation point i of the read part data.

In step 705, the suction nozzle is moved (falled) to the Z position of the indentation point i of the read part data.

In step 706, the suction nozzle is moved to the Z position of the standby position.

In step 707, the counter value i is incremented by 1 (i = i + 1), and the procedure proceeds to step 708.

In step 708, the counter value i is compared with the indentation score p, and it is determined whether the counter value i is equal to or larger than the indentation score p. If i <p, the procedure returns to step 703, and if i? p, the press-in operation of the single part is completed. Therefore, the procedure returns to step 601 of FIG.

The outline of the procedure performed by the flowchart of FIG. 6 and FIG. 7 is further demonstrated in the schematic diagram of FIG. 8 is a view for explaining the component mounting operation of the embodiment of the component mounting apparatus of the present invention.

FIG. 8A is a partial cross-sectional view showing a state in which the procedure 605 in FIG. 6 is executed.

FIG. 8B is a partial cross-sectional view showing a state in which the procedure 606 in FIG. 6 is executed.

FIG. 8C is a partial cross-sectional view showing the state in which the procedure 705 is executed at the first point (i = 1) in FIG. 7. FIG. 8D is a partial cross-sectional view showing the state in which the procedure 705 is executed at the second point (i = 1) in FIG. 7.

In FIG. 8A, the adsorption nozzle 303 which adsorbs and holds the component 302 is the component registered in NC position (see FIG. 4) and the position of the center line 304-0 of the adsorption nozzle 303 in advance. The suction nozzle 303 moves in the X direction, the Y direction, and the θ direction so that the mounting positions coincide. That is, at this time, the center line 304-0 of the suction nozzle 303 is at the mounting position of the mounting coordinates (X, Y) of the NC data of the component 302, and the Z coordinate is the height before mounting the component (generally, , Height common to all substrates). The positions of the pins 302-1 to 302-2 of the component 302 substantially correspond to the corresponding positions 321 to 322 of the substrate 301.

In FIG. 8B, the adsorption nozzle 303 moves downward in the Z-axis direction from the state of FIG. 8A to press the component 302 onto the substrate 301. At this time, the pins 302-1 to 302-2 of the component 302 are attached to the corresponding positions 321 to 322 of the substrate 301. However, the suction nozzle 303 holds down the component center part (center line 304-0). For this reason, it is not pressurized directly from the nozzle 303 to the other part. Therefore, the inclination and lifting of the component 302 increases with respect to the board | substrate 301 as it goes to the end surface of the component 302. As shown to FIG. In FIG. 8B, both ends are lifted up, and the pins 302-1 to 302-2 of the component 302 are not sufficiently inserted into the positions 321 to 322.

Therefore, in one embodiment of the component mounting operation of the component mounting apparatus of the present invention, the pins 302-1 to 302-2 of the component 302 as shown in FIGS. By lowering the adsorption nozzle 303 from the top, the component 302 and the substrate 301 are pressed to bring the substrate 301 and the component 302 into close contact with each other. In addition, the moving height (Z coordinate value) of the suction nozzle 303 is registered in the component data (refer FIG. 5).

That is, as shown in Fig. 8C, the suction nozzle 303 is lowered (moved in the Z direction), and the component 302 is press-fitted on the axis of the center line 302-1 (indentation of component data 1). Point data). Similarly, the data at the second press-in point of the component data (Fig. 8 (d)),... Continue indenting

According to the said embodiment, it becomes possible to provide the component mounting apparatus and component mounting method which can correct the lifting of a component. In addition, the manufacturing cost and operating cost of the component mounting apparatus can be reduced, and the mounting time can be shortened.

1: parts mounting device
2: device body
3: parts supply unit
4: feed conveyor
5: positioning unit
6: discharge conveyor
7: movable head
8-1, 8-2: beam
9: Y-axis motor
10: screw shaft
11: guide
12: X axis motor
13: mounting head
14: up and down shaft motor
15: θ axis motor
16: part position recognition unit
17: adsorption nozzle
18-1, 18-2: Nozzle Stocker
19: substrate recognition camera
20: parts recognition camera
21: height measurement sensor
22: control circuit
24: strobe light emitting unit
24a: light source
24b: fiber optic cable
24c: ring light lighting unit
25 lighting control unit
26 to 29: drive control circuit
30: image processing unit
31: CPU
32: memory
34: interface
35: keyboard
36: monitor
A: parts
M1: mark
M2: Mark Forming Body
P: Substrate
301: Substrate
302: parts
302-0: location
302-1 to 302-4: pin
303: adsorption nozzle
321 to 324: pin position

Claims (9)

In the component mounting method of the component mounting apparatus which mounts a component to a board | substrate in a predetermined order, after mounting a component in a predetermined 1st position of the said board | substrate by an adsorption nozzle or a mechanical chuck, the component is attached to every component mounting step. A component mounting method of a component mounting apparatus, wherein a predetermined second position is press-fitted into said suction nozzle, said mechanical chuck, or a press-fit member. The method of claim 1,
The component mounting method of the component mounting apparatus characterized by determining the coordinate of a said 2nd position by the relative position coordinate from the coordinate of a said 1st position. The method of claim 1,
And said coordinates of said first position and said coordinates of said second position are X, Y, Z, and θ coordinates. The method of claim 1,
Directly below the second position of the substrate, there is a pin hole into which the pin of the component is inserted. The method of claim 1,
The order of mounting the component on the substrate and the first position are registered in the NC data in the order of the component mounting step, and a plurality of positions and the number of indenting the second position are registered in the component data for each of the components, In the case where the second position of the part is press-fitted into the suction nozzle, the mechanical chuck or the press-fitting member at each component mounting step, the part name is read from the NC data, and the part name is read based on the read part name. A component mounting method of a component mounting apparatus, wherein the component is press-fitted based on data registered in the component data. A component mounting apparatus for mounting a component on a substrate in a predetermined order, comprising: a suction nozzle or a mechanism chuck for mounting the component on a substrate while the component is sucked or chucked, and the suction nozzle or mechanism chuck to a first position for mounting the component. A press-fitting component for press-fitting a moving mounting means for moving and mounting, and a predetermined one or more second positions of the mounted parts, each time the moving-mounting means mounts the parts with a suction nozzle, a mechanical chuck or a press-fitting member. Means and a control unit for controlling the operation of the component mounting apparatus. The method of claim 6,
The said control part sets the coordinate of the said 2nd position by the relative position coordinate from the coordinate of the said 1st position, The component mounting apparatus characterized by the above-mentioned. The method of claim 6,
The coordinates of the first position and the coordinates of the second position in the controller are X, Y, Z, and θ coordinates. The method of claim 6,
NC data in which the order of mounting the component on the substrate, the first position is registered in the order of the component mounting step, and a plurality of positions and the number of the indentation of the second position, for which the component data is registered for each component are stored. A storage unit is further provided, and the control unit, when pressing the second position of the part with the suction nozzle, the mechanical chuck, or the press-fit member at every component mounting step, stores the NC data from the storage unit. A part mounting apparatus, characterized in that the part name is read and the part is press-fitted based on the data registered in the part data based on the read part name.

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