JP7524127B2 - Component Mounting Equipment - Google Patents

Description

This invention relates to a component mounting device, and in particular to a component mounting device equipped with an imaging unit having an inclined optical axis.

Conventionally, component mounting devices equipped with an imaging unit having an inclined optical axis are known (see, for example, Patent Document 1).

The above-mentioned Patent Document 1 discloses a component mounting device that includes a mounting head that mounts components on a board, and an imaging unit that has an optical axis tilted so as to image the area below the mounting head. In the component mounting device of Patent Document 1, the imaging unit is configured so that the subject, lens, and imaging surface satisfy the Scheimpflug condition.

Japanese Patent Application Publication No. 5-180622

In the component mounting device of Patent Document 1, the imaging unit is configured so that the subject, lens, and imaging surface satisfy the Scheimpflug condition, and is therefore configured to focus along the horizontal direction even when imaging with an imaging unit with a tilted optical axis. However, because the imaging unit captures images from a tilted direction, if the subject's position in the vertical direction shifts, the subject may not be included in the imaging unit's angle of view or it may be difficult to focus compared to when imaging from the vertical direction (vertical direction). For this reason, when imaging from a tilted direction with the imaging unit, it may not be possible to capture a clear image of the entire subject.

This invention was made to solve the above problems, and one objective of the invention is to provide a component mounting device that can capture a clear image of the entire subject even when the imaging unit captures the image from an inclined direction.

A component mounting device according to a first aspect of the present invention comprises: a mounting head which mounts components on a board; an imaging unit which includes an optical element and an imaging element arranged so that its optical axis is inclined to image an area below the mounting head, and which includes an optical element and an imaging element having an image surface on which an image of a subject is formed via the optical element, and which is arranged so that the image surface of the optical element or the imaging element is inclined with respect to the optical axis, and which is arranged so that the optical element, the image surface and the subject surface satisfy the Scheimpflug condition, and the imaging unit includes a vertical movement unit which moves the imaging height position in the vertical direction and is configured to be able to image the subject from a plurality of mutually different imaging height positions in the vertical direction , and further comprises a control unit which controls the movement of the vertical movement unit, and a component supply unit which supplies components to the mounting head, and the control unit is configured to move the imaging unit to a component supply imaging height position in the vertical direction which is set based on the height of the component supply position of the component supply unit when imaging the component supply unit with the imaging unit .

In the component mounting device according to the first aspect of the present invention, as described above, the imaging unit is arranged so that the optical member, the image plane on which the image of the subject is formed, and the subject plane satisfy the Scheimpflug condition, so that the entire subject, such as a horizontally extending board, can be focused on even when imaging from an inclined direction. In addition, the imaging unit is configured to be able to image the subject from a plurality of different imaging height positions in the vertical direction. As a result, even if the vertical position of the subject is not constant, the imaging height position of the imaging unit can be adjusted to match the vertical position of the subject, so that the subject can be prevented from going out of the angle of view of the imaging unit even when imaging from an inclined direction. In addition, since the focal position in the vertical direction can be adjusted, the subject can be clearly imaged. As a result, even when imaging from an inclined direction by the imaging unit, the entire subject can be clearly imaged. As a result, in the component mounting device, when the imaging unit images a subject, such as a component or a mounting position of the component, to determine the state of the subject, the state of the subject can be accurately determined. In addition, since there is no need to increase the angle of view to prevent the subject from going out of the angle of view, it is possible to prevent the image quality from deteriorating for an imaging range of the same size. Furthermore, since there is no need to increase (narrow) the aperture value in order to increase the vertical range of the focus (depth of field), it is possible to prevent the captured image from becoming dark.

A component mounting device according to a second aspect of the present invention comprises: a mounting head which mounts components on a board; an imaging unit which includes an optical element and an imaging element arranged so that its optical axis is inclined to image an area below the mounting head, and which includes an image plane on which an image of a subject is formed via the optical element, and which is arranged so that the image plane of the optical element or the imaging element is inclined with respect to the optical axis, and which is arranged so that the optical element, the image plane and the subject plane satisfy the Scheimpflug condition, wherein the imaging unit includes a vertical movement unit which moves the imaging height position in the vertical direction and is configured to be able to image the subject from a plurality of mutually different imaging height positions in the vertical direction, and further comprises a control unit which controls the movement of the vertical movement unit, and the control unit is configured to move the imaging unit to a component mounting imaging height position in the vertical direction which is set based on the height of the mounting position and the size of the component when imaging the mounting position of the component on the board with the imaging unit.

In the component mounting device according to the first or second aspect, preferably , the control unit moves the imaging unit so as to adjust the imaging height position in the up-down direction of the imaging unit so that the subject is included within the imaging range of the imaging unit and the imaging unit is focused on the subject surface. With this configuration, even when imaging from an inclined direction by the imaging unit, it is possible to more reliably capture a clear image of the entire subject.

In the component mounting device configured to move the imaging unit to the component mounting imaging height position , preferably , a component supply unit that supplies components to the mounting head is further provided, and the control unit is configured to move the imaging unit to a component supply imaging height position in the vertical direction set based on the height of the component supply position of the component supply unit when imaging the component supply unit with the imaging unit. With this configuration, imaging can be performed by moving the imaging height position to the component supply imaging height position set based on the height of the component supply position of the component supply unit in response to changes in the height position of the component supply unit and the thickness of the components, so that the state of the component supply unit can be accurately imaged by the imaging unit.

In the component mounting device having the component supply unit, the control unit is preferably configured to move the imaging unit to the component supply imaging height position in the vertical direction after the timing at which the component to be picked up is determined and before the mounting head completes moving to the horizontal position at which the component is picked up. With this configuration, adjustment of the height position of the imaging unit can be completed before the component is picked up, thereby suppressing the occurrence of a waiting time until the vertical movement of the imaging unit is completed.

In the component mounting device according to the first aspect , the control unit is preferably configured to move the imaging unit to a component mounting imaging height position in the vertical direction set based on the height of the mounting position and the size of the component when imaging the mounting position of the component on the board with the imaging unit. With this configuration, the imaging height position can be moved to the component mounting imaging height position set based on the height of the mounting position and the size of the component in response to changes in the height of the mounting position of the component, the size of the component, etc. , to perform imaging, so that the state of the mounting position of the component can be accurately imaged by the imaging unit.

In the component mounting device configured to move the imaging unit to the component mounting imaging height position, the control unit is preferably configured to move the imaging unit to the component mounting imaging height position in the vertical direction after a movement command for moving the mounting head to the mounting position is issued and before the mounting head has completed moving to the horizontal position where the component is mounted. With this configuration, adjustment of the height position of the imaging unit can be completed before the component is mounted, thereby suppressing the occurrence of a waiting time until the vertical movement of the imaging unit is completed.

In the component mounting device according to the first or second aspect, the control unit is preferably configured to move the imaging unit to a vertical transfer imaging height position set based on the transfer height of the mounting head when imaging the component transferred by the mounting head. With this configuration, the imaging unit can be moved to the set transfer imaging height position, so that imaging of the transfer position located above the component suction position and mounting position can be performed using a common imaging unit that images the suction position and mounting position.

In this case, the control unit is preferably configured to move the imaging unit in the vertical direction to the transfer imaging height position after the mounting head has picked up the component and before the mounting head has completed rising to the transfer height position. With this configuration, the adjustment of the height position of the imaging unit can be completed before the mounting head is transferred, thereby reducing the wait time until the vertical movement of the imaging unit is completed.

In the component mounting device according to the first or second aspect , the control unit is preferably configured to move the imaging unit to the imaging height position prior to, and not in synchronization with, the movement of the mounting head. With this configuration, the vertical movement of the imaging unit is performed prior to the movement of the mounting head, so that it is possible to effectively suppress the occurrence of a waiting time until the vertical movement of the imaging unit is completed. In addition, since the imaging unit moves in the vertical direction independently of the movement of the mounting head, the imaging unit can capture an image of a subject that is not related to the operation of the mounting head in parallel with the movement of the mounting head.

In the component mounting device according to the first or second aspect, the horizontal position and orientation of the subject are preferably measured based on the imaging height position of the imaging unit and the height of the subject. With this configuration, the horizontal position and orientation of the subject can be measured with higher accuracy based on an image in which the entire subject is clearly captured.

In the component mounting device according to the first or second aspect, preferably, the device further comprises a reference calibration member disposed at a predetermined height position and imaged by the imaging unit, and the imaging range, scale, and height position at which the imaging unit is in focus are calibrated based on the imaging result of imaging the reference calibration member by the imaging unit. With this configuration, even if the vertical height position of the imaging unit changes due to aging, thermal expansion, or the like, the height position of the imaging unit can be calibrated to an appropriate position at which the imaging range, scale, and focus of the imaging unit are achieved by imaging the reference calibration member.

According to the present invention, as described above, the entire subject can be captured clearly even when the imaging unit captures images from an inclined direction.

1 is a plan view showing an outline of a component mounting apparatus according to an embodiment of the present invention; 1 is a side view showing an outline of a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a block diagram showing a control configuration of the component mounting apparatus according to the embodiment of the present invention. 1 is a side view showing a state monitoring camera of a component mounting apparatus according to an embodiment of the present invention. 11A and 11B are diagrams for explaining height adjustment when imaging the component supply position of the component mounting apparatus according to the embodiment of the present invention. 11A and 11B are diagrams for explaining height adjustment when imaging the mounting position of a component in the component mounting apparatus according to the embodiment of the present invention. 11A and 11B are diagrams for explaining height adjustment when imaging a component being transferred by the component mounting apparatus according to the embodiment of the present invention. 4 is a first flowchart for explaining a component mounting process by a CPU of the component mounting device according to the embodiment of the present invention. 10 is a second flowchart for explaining the component mounting process by the CPU of the component mounting device according to the embodiment of the present invention. 1 is a side view showing an outline of a component mounting apparatus according to a first modified example of an embodiment of the present invention. FIG. 11 is a side view showing an outline of a component mounting apparatus according to a second modified example of an embodiment of the present invention.

The following describes an embodiment of the present invention with reference to the drawings.

(Configuration of component mounting device)
The configuration of a component mounting apparatus 100 according to an embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 1, the component mounting device 100 is a component mounting device that transports a substrate P in the X direction using a pair of conveyors 2 and mounts components 31 on the substrate P at a mounting work position M.

The component mounting device 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, and a component recognition camera 7. As shown in FIG. 3, the component mounting device 100 includes, as a control configuration, a CPU (Central Processing Unit) 81, a storage device 82, a memory 83, a display unit 84, an input device 85, a motor controller 86, a camera I/F 87, a lighting controller 88, a laser displacement meter controller 89, a motor amplifier 90, and a motor 91. The CPU 81 is an example of a "control unit" in the claims.

As shown in FIG. 1, the pair of conveyors 2 are installed on a base 1 and are configured to transport a substrate P in the X direction. The pair of conveyors 2 are provided with a holding mechanism that holds the substrate P stopped at the mounting work position M during transportation. The pair of conveyors 2 are also configured so that the distance between them in the Y direction can be adjusted to match the dimensions of the substrate P. A reference calibration member 11 is also provided on the base 1 for calibrating the various cameras (condition monitoring camera 43 and substrate recognition camera 45).

The component supply unit 3 is disposed on the outer side (Y1 side and Y2 side) of the pair of conveyors 2. The component supply unit 3 also has a plurality of tape feeders 3a disposed therein. The component supply unit 3 also has a tray device 3b disposed therein that supplies components 31 using trays 30b. The component supply unit 3 is configured to supply components 31 to a mounting head 42, which will be described later.

The tape feeder 3a holds a reel (not shown) on which a tape 30a (see FIG. 5) is wound, which holds a number of components 31 at a predetermined interval. The tape feeder 3a is configured to feed the tape 30a holding the components 31, thereby rotating the reel and supplying the components 31 from the tip of the tape feeder 3a. Here, the components 31 include electronic components such as ICs, transistors, capacitors, and resistors. The tape 30a has a number of storage sections (carrier pockets) in which the components 31 to be supplied to the mounting head 42 are stored.

The tray device 3b is configured to supply a tray 30b on which a plurality of parts 31 are placed to a part supply position. The tray device 3b is configured to supply new parts 31 to the part supply position by replacing the tray 30b.

As shown in FIG. 1, the head unit 4 is disposed above the pair of conveyors 2 and the component supply unit 3, and includes a mounting head 42 with a nozzle 41 (see FIG. 2) attached to its lower end, a condition monitoring camera 43, a laser displacement meter 44, and a board recognition camera 45. The condition monitoring camera 43, the laser displacement meter 44, and the board recognition camera 45 are configured to move horizontally (XY directions) together with the mounting head 42. The condition monitoring camera 43 is an example of an "imaging unit" in the claims.

The mounting head 42 is configured to mount the components 31 on the substrate P. Specifically, the mounting head 42 is configured to pick up the components 31 supplied by the component supply unit 3, and mount (attach) the picked up components 31 on the substrate P arranged at the mounting work position M. The mounting head 42 is also configured to be liftable (movable in the Z direction), and is configured to pick up and hold the components 31 supplied from the tape feeder 3a or tray device 3b by the negative pressure generated at the tip of the nozzle 41 by a negative pressure generator (not shown), and to attach the components 31 to the mounting position on the substrate P.

The status monitoring camera 43 is configured to capture images to monitor the status of the component supply position, the status on the board P, the status of the components 31 being transferred by the mounting head 42, and the like. In addition, a light 431 (see FIG. 3) is provided near the status monitoring camera 43. The light 431 is configured to irradiate the subject O with visible light when the status monitoring camera 43 captures an image. This allows the status monitoring camera 43 to capture a clear image of the subject O. The light 431 may irradiate light along the optical axis of the status monitoring camera 43, or may irradiate light along the up-down direction (vertical direction) in which the mounting head 42 moves.

As shown in FIG. 4, the status monitoring camera 43 includes an image sensor 432 on which an image surface 432a on which an image of the subject O is formed is disposed, and an optical member 433 that forms an image on the image sensor 432. The image sensor 432 includes an image sensor such as a CCD image sensor or a CMOS image sensor. The optical member 433 includes a lens. Here, in this embodiment, as shown in FIG. 2, the status monitoring camera 43 is disposed so that the optical axis is inclined so as to image the lower side of the mounting head 42. Also, the optical member 433 is disposed so as to be inclined (not perpendicular) to the optical axis of the status monitoring camera 43. As shown in FIG. 4, the status monitoring camera 43 is disposed so that the optical member 433, the image surface 432a on which the image of the subject O is formed, and the subject surface satisfy the Scheimpflug condition. In other words, the condition monitoring camera 43 is configured so that the extensions of the subject plane, the lens principal plane of the optical member 433, and the image plane 432a intersect at one point A, and the entire image plane is in focus. The condition monitoring camera 43 is also configured to be able to capture tilt images using the Scheimpflug principle.

In addition, in this embodiment, as shown in FIG. 2, the condition monitoring camera 43 is configured to be able to capture images of the subject O from a plurality of different imaging height positions in the vertical direction. Specifically, the condition monitoring camera 43 includes a vertical movement unit 43a that moves the imaging height position in the vertical direction. The vertical movement unit 43a has a motor and a ball screw mechanism, and moves the condition monitoring camera 43 in the vertical direction (Z direction) to move the optical axis of the condition monitoring camera 43 in the vertical direction. During this vertical movement, the inclination angle of the optical axis of the condition monitoring camera 43 is approximately constant.

The laser displacement meter 44 is configured to measure the height of each part. Specifically, the laser displacement meter 44 is configured to measure the height of the surface of the substrate P. The laser displacement meter 44 is also configured to measure the height of the components 31 and tape 30a at the component supply position. The laser displacement meter 44 is also configured to measure the height of the components 31 mounted on the substrate P and the height of the top surface of the substrate P.

The board recognition camera 45 is configured to capture an image of the fiducial mark F of the board P in order to recognize the position and posture of the board P. Then, by capturing an image of the position of the fiducial mark F and recognizing it, it is possible to accurately obtain the mounting position of the component 31 on the board P. The board recognition camera 45 is also configured to be able to capture an image of each part of the board P. Specifically, the board recognition camera 45 is configured to capture an image of the mounting position of the component 31 on the board P. Also, a light 451 (see FIG. 3) is provided near the board recognition camera 45. The light 451 is configured to irradiate the image target with visible light when the board recognition camera 45 captures an image. This allows the board recognition camera 45 to capture a clear image of the image target.

The support portion 5 includes a motor 51. The support portion 5 is configured to move the head unit 4 in the X direction along the support portion 5 by driving the motor 51. The support portion 5 is supported at both ends by a pair of rail portions 6.

The pair of rail portions 6 are fixed onto the base 1. The rail portion 6 on the X1 side includes a motor 61. The rail portion 6 is configured to move the support portion 5 in the Y direction perpendicular to the X direction along the pair of rail portions 6 by driving the motor 61. The head unit 4 is movable in the X direction along the support portion 5, and the support portion 5 is movable in the Y direction along the rail portions 6, so that the head unit 4 can move horizontally (XY direction).

The component recognition camera 7 is fixed on the upper surface of the base 1. The component recognition camera 7 is arranged on the outer side (Y1 side and Y2 side) of the pair of conveyors 2. The component recognition camera 7 is configured to capture an image of the component 31 adsorbed to the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the adsorption state (adsorption posture) of the component 31 prior to mounting the component 31. This allows the CPU 81 to acquire the adsorption state of the component 31 adsorbed to the nozzle 41 of the mounting head 42. In addition, a light 71 (see FIG. 3) is provided near the component recognition camera 7. The light 71 is configured to irradiate the component 31 adsorbed to the nozzle 41 with visible light when the component recognition camera 7 captures an image. This allows the component recognition camera 7 to clearly capture an image of the component 31 adsorbed to the nozzle 41.

The CPU 81 is configured to control the component mounting operation by the mounting head 42. Specifically, the CPU 81 is configured to control the overall operation of the component mounting device 100, such as the transport operation of the substrate P by the pair of conveyors 2, the mounting operation by the head unit 4, the imaging operation by the status monitoring camera 43, the substrate recognition camera 45, and the component recognition camera 7, the height measurement operation by the laser displacement meter 44, and the three-dimensional shape measurement operation.

The storage device 82 stores information about the substrate P, information about the components 31, and programs for performing mounting operations. The storage device 82 includes, for example, a hard disk drive (HDD) and a solid state drive (SSD).

The memory 83 is configured to store information when the CPU 81 is operating. The display unit 84 is configured to display the status of the component mounting device 100 and information about the board P being produced. The input device 85 is configured to input operations by the user for the component mounting device 100. The input device 85 includes, for example, a mouse, a keyboard, a switch, a touch panel, etc.

The motor controller 86 is configured to drive various motors 91 (motor 51, motor 61, lifting motor (Z-axis motor) of mounting head 42, rotation motor (R-axis motor) of mounting head 42, etc.) via a motor amplifier 90 under the control of the CPU 81. The component recognition camera 7, status monitoring camera 43, and board recognition camera 45 are connected to the camera I/F (interface) 87. The camera I/F 87 is also connected to the CPU 81. This is configured to connect the CPU 81 to the component recognition camera 7, status monitoring camera 43, and board recognition camera 45, respectively.

The lighting controller 88 is configured to drive the lights 71, 431, and 451 under the control of the CPU 81. The laser displacement meter controller 89 is configured to control the signals input and output to the CPU 81. The laser displacement meter 44 is connected to the laser displacement meter controller 89. This is configured to connect the CPU 81 and the laser displacement meter 44.

The laser displacement meter 44 is configured to measure the three-dimensional shape by scanning the laser along the X direction. The laser displacement meter 44 also irradiates the laser in a line and measures the height of each line of reflected laser light based on the reflected light.

In this embodiment, the CPU 81 is configured to control the movement of the vertical movement unit 43a. The CPU 81 is also configured to move the status monitoring camera 43 so as to adjust the vertical imaging height position of the status monitoring camera 43 so that the subject O is included within the imaging range of the status monitoring camera 43 and the focus of the status monitoring camera 43 is on the subject plane.

The CPU 81 also measures the horizontal position and orientation of the subject O based on the imaging height position of the status monitoring camera 43 and the height of the subject O.

5, when the state monitoring camera 43 captures an image of the component supply unit 3, the CPU 81 is configured to move the state monitoring camera 43 to first imaging height positions H11, H12 in the vertical direction that are set based on the height of the supply position of the components 31 in the component supply unit 3. The first imaging height positions H11, H12 are examples of the "component supply imaging height positions" in the claims.

Specifically, the CPU 81 sets the imaging height when a component is being picked up based on the component pick-up height position stored in advance in the storage device 82. The CPU 81 adjusts the height of the status monitoring camera 43 so that the focus of the status monitoring camera 43 is on the component 31. The CPU 81 adjusts the height of the status monitoring camera 43 so that the height of the top surface of the component 31 (component pick-up height), the height of the bottom surface of the component 31, or the middle height of the component 31 is the center of the focal height of the status monitoring camera 43. Note that these heights of the component 31 are calculated from the component pick-up height and the thickness of the component 31.

As shown in FIG. 5(A), when imaging the components 31 supplied from the tape 30a, the component suction height used is the component suction height common to the tape feeder 3a that has been measured and stored in advance. The component suction height is calculated by measuring the reference height of the component supply bank using the laser displacement meter 44 of the head unit 4. Then, when the CPU 81 is to image the component supply position of the tape 30a using the status monitoring camera 43, it moves the status monitoring camera 43 to the first imaging height position H11.

As shown in FIG. 5(B), when imaging the components 31 supplied from the tray 30b, a component suction height that is different for each component type and that has been measured and stored in advance is used. The component suction height is calculated from the pallet height, tray thickness, and component thickness of the tray device 3b. Alternatively, the top surface height of the component 31 is measured and calculated by the laser displacement meter 44 of the head unit 4. Then, when the CPU 81 uses the status monitoring camera 43 to image the component supply position of the tray 30b, it moves the status monitoring camera 43 to the first imaging height position H12.

The CPU 81 is also configured to move the status monitoring camera 43 to the first vertical imaging height positions H11 and H12 after the component 31 to be picked up is determined and before the mounting head 42 has completed moving to the horizontal position where the component 31 will be picked up.

When imaging the component supply position (component suction position) of the component supply unit 3, at least one of the following is performed: imaging the component 31 at the component supply position (measuring the component supply position, determining the component supply posture, and determining the component type), imaging the posture of the component when the nozzle 41 is lowered to pick up the component 31 (determining the posture during component suction), imaging the component 31 when the nozzle 41 begins to rise after the component is picked up (determining the posture after component suction), and imaging the vacant component supply position after the component is picked up (determining the state after the component is supplied).

The timing of imaging when a component is picked up is any timing after the completion of component supply and before the completion of component pickup. Also, imaging may be performed at more than one of these timings. For example, imaging of the component 31 at the component supply position is performed at a timing between the completion of component supply and the lowering of the mounting head 42 (nozzle 41). Also, imaging of the component posture when the nozzle 41 is lowered to pick up the component 31 is performed at a timing when the mounting head 42 (nozzle 41) has lowered to the pickup height. Also, imaging of the vacant component supply position after component pickup is performed at a timing when the mounting head 42 (nozzle 41) has risen and the component supply position is visible.

6, when the state monitoring camera 43 captures an image of the mounting position of the component 31 on the board P, the CPU 81 is configured to move the state monitoring camera 43 to second imaging height positions H21, H22 in the vertical direction that are set based on the height of the mounting position and the size of the component 31. The second imaging height positions H21, H22 are examples of the "mounting position imaging height positions" in the claims.

Specifically, the CPU 81 sets the imaging height when mounting (attaching) components based on the component mounting height position stored in advance in the storage device 82. The CPU 81 adjusts the height of the status monitoring camera 43 so that the focal point of the status monitoring camera 43 is on the mounted component 31. The CPU 81 adjusts the height of the status monitoring camera 43 so that the height of the top surface of the component 31, the height of the bottom surface of the component 31 (component mounting height), or the intermediate height of the component 31 is the center of the focal height of the status monitoring camera 43. Note that these heights of the component 31 are calculated from the component mounting height and the thickness of the component 31.

The component mounting height is calculated from the height of the conveyor 2 and the thickness of the substrate P, which are stored in advance. As shown in FIG. 6B, if warping occurs in the substrate P, the warping of the substrate P is measured by the laser displacement meter 44 of the head unit 4 before the components are mounted, and the mounting height position is calculated.

As shown in FIG. 6(A), when there is no effect of warping of the substrate P, the CPU 81 moves the condition monitoring camera 43 to the second imaging height position H21 when imaging the mounting position of the component 31 on the substrate P with the condition monitoring camera 43. Also, as shown in FIG. 6(B), when there is an effect of warping of the substrate P, the CPU 81 moves the condition monitoring camera 43 to the second imaging height position H22 when imaging the mounting position of the component 31 on the substrate P with the condition monitoring camera 43.

The CPU 81 is also configured to move the status monitoring camera 43 to the second imaging height positions H21 and H22 in the vertical direction after a movement command is issued to move the mounting head 42 to the mounting position and before the mounting head 42 has completed moving to the horizontal position where the component 31 is to be mounted.

When imaging the component mounting position (component attachment position) on the board P, at least one of the following images is taken: imaging the board P before components are mounted (determining the presence or absence of foreign matter before components are mounted, and the solder state), imaging the components 31 when the components are mounted (determining the posture when the components are mounted), imaging the components 31 after mounting (determining the posture after the components are mounted), imaging the tip of the nozzle 41 after components are mounted (determining the component state when the components 31 are separated, and determining whether the components are taken home), and imaging the board P and components 31 after components are mounted (determining the state of the mounted components).

The timing of imaging during component mounting is any timing between immediately after component mounting, through component mounting, and immediately before component mounting. Imaging may also be performed at multiple of these timings. For example, imaging of the board P before component mounting is performed between the time when the mounting head 42 reaches the component mounting position (XY position) and the time when the mounting head (nozzle 41) descends. Imaging of the component 31 during component mounting is performed when the mounting head 42 (nozzle 41) descends to the mounting height (Z position). Imaging of the component 31 after mounting is performed when the mounting head 42 (nozzle 41) begins to rise. Imaging of the board P and the component 31 after component mounting is performed when the mounting head 42 (nozzle 41) rises and the component mounting position becomes visible.

7, when capturing an image of the component 31 transferred by the mounting head 42, the CPU 81 is configured to move the status monitoring camera 43 to third imaging height positions H31, H32 in the vertical direction that are set based on the transfer height of the mounting head 42. The third imaging height positions H31, H32 are examples of the "transfer imaging height positions" in the claims.

Specifically, the CPU 81 sets the imaging height of the transferred component 31 based on the height of the mounting head 42 during XY movement. The CPU 81 adjusts the height of the condition monitoring camera 43 so that the focal point of the condition monitoring camera 43 is on the transferred component 31. The CPU 81 adjusts the height of the condition monitoring camera 43 so that the height of the top surface of the component 31, the height of the bottom surface of the component 31, or the intermediate height of the component 31 is centered as the focal height of the condition monitoring camera 43. The heights of these components 31 are calculated from the height of the mounting head 42 during XY movement and the thickness of the component 31.

The height of the mounting head 42 during its XY movement is a height at which the mounting head 42 and the component 31 picked up at the tip of the mounting head 42 do not interfere with other components (transport device, various cameras, substrate P, mounted component 31, etc.) above the component recognition camera 7, above the substrate P, or in other areas when the mounting head 42 moves along the XY axes (horizontal movement) from the component suction position to the component mounting position to transfer the component. The height of the mounting head 42 during its XY movement is calculated from the interference height and the component thickness.

As shown in FIG. 7(A), when the interference height is low, the CPU 81 moves the status monitoring camera 43 to the third imaging height position H31 when the status monitoring camera 43 is to image the component 31 being transferred by the mounting head 42. Also, as shown in FIG. 7(B), when the interference height is high, the CPU 81 moves the status monitoring camera 43 to the third imaging height position H32 when the status monitoring camera 43 is to image the component 31 being transferred by the mounting head 42.

The CPU 81 is also configured to move the status monitoring camera 43 to the third imaging height positions H31 and H32 in the vertical direction after the mounting head 42 has picked up the component 31 and before the mounting head 42 has completed rising to the transfer height position.

When imaging the component 31 being transferred, at least one of the following is performed: imaging the component 31 during transfer from when the component 31 is picked up until when it is imaged by the component recognition camera 7 (determining whether the component 31 is present during transfer, and determining the pickup posture of the component 31 during transfer), and imaging the component 31 during transfer from when the component 31 is imaged by the component recognition camera 7 until when it is mounted (determining whether the component 31 is present during transfer, and determining the pickup posture of the component 31 during transfer).

The timing for imaging the component 31 being transferred is any timing after the component is picked up and before the component is mounted. Also, imaging may be performed at more than one of these timings. For example, imaging of the component 31 during transportation from when the component 31 is picked up until when it is imaged by the component recognition camera 7 is performed at a timing between when the component 31 held by the mounting head 42 (nozzle 41) reaches a recognizable height and when it is imaged by the component recognition camera 7. Also, imaging of the component 31 during transportation from when the component 31 is imaged by the component recognition camera 7 until it is mounted is performed at a timing between when the component 31 held by the mounting head 42 (nozzle 41) reaches the XY movement height and when it reaches the component mounting position (XY position).

The CPU 81 is also configured to move the status monitoring camera 43 to the imaging height position ahead of, and not in synchronization with, the movement of the mounting head 42.

The vertical movement of the status monitoring camera 43, which captures images when a component is being picked up, preferably begins after the next component 31 to be picked up is determined (for example, when the previous component mounting is completed or when the fiducial mark F is recognized), and is completed before the mounting head 42 completes its movement along the X and Y axes to the component pick-up position.

The vertical movement of the status monitoring camera 43 for capturing images during component mounting preferably begins immediately after capturing images of the component 31 during transport, and is completed before the mounting head 42 completes its movement along the X and Y axes to the component mounting position.

When imaging the part 31 being transferred, the status monitoring camera 43 preferably starts moving up and down immediately after imaging is completed when the part is being picked up, and completes its movement in time to image the part being transferred.

The CPU 81 is also configured to calibrate the imaging range, scale, and focal height position of the condition monitoring camera 43 based on the imaging results of the reference calibration member 11 captured by the condition monitoring camera 43. The reference calibration member 11 is placed at a predetermined height position and is imaged by the condition monitoring camera 43. The reference calibration member 11 displays a predetermined shape indicating the reference position on its upper surface. The CPU 81 images the shape of the upper surface of the reference calibration member 11 by the condition monitoring camera 43, and adjusts the reference position of the height position of the condition monitoring camera 43 based on the imaging results so that the imaging range, scale, and focus of the condition monitoring camera 43 are correct. The CPU 81 then updates and stores the adjusted reference position.

(Component mounting process)
Next, the mounting process of the component 31 on the board P by the CPU 81 of the component mounting apparatus 100 will be described with reference to FIGS.

In step S1 of FIG. 8, the next component 31 to be picked up is determined based on the mounting program. In step S2, the mounting head 42 is moved in the XY direction (moved horizontally) to the component supply position. In addition, the status monitoring camera 43 is moved in the Z direction (moved vertically) to the first imaging height.

In step S3, the status monitoring camera 43 captures an image of the component supply position. In step S4, it is determined whether the component supply position has been judged to be OK. For example, it is determined whether the measurement of the component supply position, the judgment of the component supply posture, and the component type are normal. It is also determined whether the posture of the component 31 when the component is picked up is normal. It is also determined whether the posture of the component 31 after the component is picked up is normal. It is also determined whether the state of the component supply position after the component is supplied is normal. If the component pick-up position is judged to be OK, proceed to step S5, and if it is not OK (NG), proceed to step S11.

In step S5, the mounting head 42 is moved in the XY direction to the component recognition position (above the component recognition camera 7). In addition, the status monitoring camera 43 is moved in the Z direction (up and down) to a third imaging height. In step S6, the status monitoring camera 43 captures an image of the component 31 that is transferred by the mounting head 42 from the component supply position to the component recognition position.

In step S7, it is determined whether the judgment during part transfer is OK or not. For example, it is determined whether or not there is a part 31 being transferred. It is also determined whether or not the suction posture of the part 31 being transferred is normal. If the judgment during part transfer is OK, proceed to step S8, and if it is not OK (NG), proceed to step S11.

In step S8, the mounting head 42 is moved in the XY direction to the component mounting position. In addition, the condition monitoring camera 43 is moved in the Z direction (up and down) to the third imaging height. In step S9, the condition monitoring camera 43 captures an image of the component 31 that is transferred by the mounting head 42 from the component recognition position to the component mounting position.

In step S10, it is determined whether the judgment during component transfer is OK or not. For example, it is determined whether or not a component 31 is being transferred. It is also determined whether or not the suction posture of the component 31 being transferred is normal. If the judgment during component transfer is OK, the process proceeds to step S12 in FIG. 9, and if it is not OK (NG), the process proceeds to step S11. In step S11, the mounting head 42 is moved in the XY direction to the component disposal position, and the component 31 is discarded.

In step S12 of FIG. 9, the mounting head 42 is moved in the XY direction to the component mounting position. In addition, the condition monitoring camera 43 is moved in the Z direction (up and down) to the second imaging height. In step S13, the condition monitoring camera 43 captures an image of the component mounting position before the component is mounted.

In step S14, it is determined whether the pre-component mounting judgment of the component mounting position is OK or not. For example, it is determined whether there is any foreign matter at the component mounting position before the component mounting. It is also determined whether the solder condition at the component mounting position before the component mounting is normal or not. If the pre-component mounting judgment of the component mounting position is OK, proceed to step S15, and if not OK (NG), proceed to step S19.

In step S15, the mounting head 42 is moved (lowered) in the Z direction to the component mounting position. Then, the mounting head 42 mounts (attaches) the component 31 at the component mounting position. In step S16, the status monitoring camera 43 captures an image of the component mounting position after the component is mounted.

In step S17, it is determined whether the post-component mounting judgment at the component mounting position is OK or not. For example, it is determined whether the posture of the component 31 at the time of component mounting is normal or not. It is also determined whether the mounting state of the component 31 after component mounting is normal or not. It is also determined whether the component 31 is taken home after mounting. If the post-component mounting judgment at the component mounting position is OK, proceed to step S18, and if not OK (NG), proceed to step S19.

In step S18, the component mounting process was performed successfully, so the next step of the component mounting program is executed.

In step S19, the abnormality is reported and the machine operation is stopped, or the error is recorded and operation continues.

(Effects of the embodiment)
In this embodiment, the following effects can be obtained.

In this embodiment, as described above, the optical member 433, the image plane 432a on which the image of the subject O is formed, and the subject plane are arranged so as to satisfy the Scheimpflug condition, so that the entire subject O, such as the substrate P extending in the horizontal direction, can be focused on even when imaging from an inclined direction. In addition, the condition monitoring camera 43 is configured to be able to image the subject O from a plurality of different vertical imaging height positions. As a result, even if the vertical position of the subject O is not constant, the imaging height position of the condition monitoring camera 43 can be adjusted to match the vertical position of the subject O, so that the subject O can be prevented from going out of the angle of view of the condition monitoring camera 43 even when imaging from an inclined direction. In addition, since the vertical focal position can be adjusted, the subject O can be clearly imaged. As a result, the entire subject O can be clearly imaged even when imaging from an inclined direction by the condition monitoring camera 43. As a result, in the component mounting device 100, when the subject O, such as the component 31 or the mounting position of the component 31, is imaged by the condition monitoring camera 43 to determine the state, the state of the subject O can be determined with high accuracy. In addition, since there is no need to increase the angle of view to prevent the subject O from going out of the angle of view, it is possible to prevent the image quality from deteriorating for an image capture range of the same size. In addition, since there is no need to increase (narrow) the aperture value to increase the vertical range of the focus (depth of field), it is possible to prevent the captured image from becoming dark.

In addition, in this embodiment, as described above, the condition monitoring camera 43 includes a vertical movement unit 43a that moves the imaging height position in the vertical direction. By providing the vertical movement unit 43a that moves the imaging height position in the vertical direction, the height position of the condition monitoring camera 43 can be easily changed in the vertical direction.

In addition, in this embodiment, as described above, a CPU 81 is provided that controls the movement of the vertical movement unit 43a. The CPU 81 is also configured to move the status monitoring camera 43 so as to adjust the vertical imaging height position of the status monitoring camera 43 so that the subject O is included within the imaging range of the status monitoring camera 43 and the focus of the status monitoring camera 43 is on the subject plane. This makes it possible to more reliably capture a clear image of the entire subject O even when imaging from an inclined direction by the status monitoring camera 43.

In addition, in this embodiment, as described above, when the CPU 81 images the component supply unit 3 with the status monitoring camera 43, it is configured to move the status monitoring camera 43 to the first imaging height position H11, H12 in the vertical direction, which is set based on the height of the supply position of the component 31 in the component supply unit 3. This allows the imaging to be performed by moving the imaging height position to the first imaging height position H11, H12, which is set based on the height of the supply position of the component 31 in the component supply unit 3, depending on changes in the height position of the component supply unit 3 and the thickness of the component 31, etc., so that the status of the component supply unit 3 can be accurately imaged by the status monitoring camera 43.

In addition, in this embodiment, as described above, the CPU 81 is configured to move the status monitoring camera 43 to the first vertical imaging height positions H11, H12 after the timing at which the component 31 to be picked up is determined and before the mounting head 42 has completed moving to the horizontal position at which the component 31 is picked up. This allows the adjustment of the height position of the status monitoring camera 43 to be completed before the component 31 is picked up, thereby reducing the wait time required for the status monitoring camera 43 to complete its vertical movement.

In addition, in this embodiment, as described above, when the CPU 81 uses the status monitoring camera 43 to capture an image of the mounting position of the component 31 on the board P, the CPU 81 is configured to move the status monitoring camera 43 to the second imaging height positions H21, H22 in the vertical direction that are set based on the height of the mounting position and the size of the component 31. This allows the imaging to be performed by moving the imaging height position to the second imaging height positions H21, H22 that are set based on the height of the mounting position and the size of the component 31 in response to changes in the height of the mounting position of the component 31 and the size of the component 31, etc., so that the state of the mounting position of the component 31 can be accurately captured by the status monitoring camera 43.

In addition, in this embodiment, as described above, the CPU 81 is configured to move the status monitoring camera 43 to the second vertical imaging height positions H21, H22 after a movement command is issued to move the mounting head 42 to the mounting position and before the mounting head 42 has completed moving to the horizontal position where the component 31 is to be mounted. This allows the adjustment of the height position of the status monitoring camera 43 to be completed before the component 31 is mounted, thereby reducing the wait time required for the status monitoring camera 43 to complete its vertical movement.

In addition, in this embodiment, as described above, the CPU 81 is configured to move the status monitoring camera 43 to the third imaging height position H31, H32 in the vertical direction set based on the transfer height of the mounting head 42 when capturing an image of the component 31 being transferred by the mounting head 42. This allows the status monitoring camera 43 to be moved to the set third imaging height position H31, H32, so that the transfer position located above the suction position and mounting position of the component 31 can be captured using the common status monitoring camera 43 that captures the suction position and mounting position.

In addition, in this embodiment, as described above, the CPU 81 is configured to move the status monitoring camera 43 to the third imaging height positions H31, H32 in the vertical direction after the mounting head 42 has picked up the component 31 and before the mounting head 42 has completed rising to the transfer height position. This allows the adjustment of the height position of the status monitoring camera 43 to be completed before the mounting head 42 is transferred, thereby reducing the wait time required for the status monitoring camera 43 to complete its vertical movement.

In addition, in this embodiment, as described above, the CPU 81 is configured to move the status monitoring camera 43 to the imaging height position in advance of, and not in synchronization with, the movement of the mounting head 42. This allows the status monitoring camera 43 to move in the up and down direction in advance, effectively reducing the waiting time required for the status monitoring camera 43 to complete its up and down movement. In addition, since the status monitoring camera 43 moves in the up and down direction independently of the movement of the mounting head 42, the status monitoring camera 43 can capture an image of the subject O that is not related to the operation of the mounting head 42 in parallel with the movement of the mounting head 42.

Furthermore, in this embodiment, as described above, the horizontal position and orientation of subject O are measured based on the imaging height position of the condition monitoring camera 43 and the height of subject O. This makes it possible to more accurately measure the horizontal position and orientation of subject O based on an image in which the entire subject O is clearly captured.

In addition, in this embodiment, as described above, a reference calibration member 11 is provided that is placed at a predetermined height position and is imaged by the condition monitoring camera 43. Furthermore, based on the image of the reference calibration member 11 captured by the condition monitoring camera 43, the imaging range, scale, and focal height position of the condition monitoring camera 43 are calibrated. As a result, even if the vertical height position of the condition monitoring camera 43 changes due to aging, thermal expansion, etc., the imaging of the reference calibration member 11 makes it possible to calibrate the height position of the condition monitoring camera 43 to an appropriate position that corresponds to the imaging range, scale, and focus of the condition monitoring camera 43.

(Modification)
It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

For example, in the above embodiment, an example of a configuration was shown in which the imaging unit includes a vertical movement unit that moves the imaging height position in the vertical direction, and the imaging height position of the imaging unit is changed by moving the vertical movement unit, but the present invention is not limited to this. In the present invention, as in the modified example shown in FIG. 10, the imaging unit may include multiple imaging units 43b arranged at multiple different imaging height positions in the vertical direction. In this case, the control unit is configured to control switching between imaging of the multiple imaging units. Also, the control unit is configured to switch between imaging of the multiple imaging units so that the subject is included within the imaging range of the imaging unit and the imaging unit is focused on the subject plane.

In addition, in the above embodiment, an example of a configuration in which the optical member is inclined (not perpendicular) to the optical axis of the imaging unit is shown, but the present invention is not limited to this. In the present invention, the imaging unit 43c may have the image surface 432a of the imaging element 432 inclined to the optical axis, as in the modified example shown in FIG. 11.

In the above embodiment, an example of a configuration in which one mounting head is provided on the head unit is shown, but the present invention is not limited to this. In the present invention, multiple mounting heads may be provided on the head unit. In this case, the multiple mounting heads may be arranged in a straight line, which is called an inline type head unit, or multiple mounting heads may be arranged in a circular pattern, which is called a rotary type head unit.

In addition, in the above embodiment, an example of a configuration in which one head unit is provided is shown, but the present invention is not limited to this. In the present invention, multiple head units may be provided.

In addition, in the above embodiment, an example of a configuration in which a pair of conveyors are provided to transport the boards is shown, but the present invention is not limited to this. In the present invention, multiple pairs of conveyors for transporting the boards may be provided. For example, the present invention may be applied to a component mounting device that can transport boards in parallel and mount components on the boards in parallel.

In the above embodiment, for convenience of explanation, an example was shown in which the control processing of the CPU (control unit) as the control unit was explained using a flow-driven flowchart in which processing is performed in sequence according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or event-driven and flow-driven may be combined.

3 Component supply unit 11 Reference calibration member 31 Component 42 Mounting head 43 Status monitoring camera (imaging unit)
43a: Up-down moving unit 43b, 43c: Imaging unit 81: CPU (control unit)
100 Component mounting device 433 Imaging element 432a Image surface 433 Optical member O Subject P Substrate

Claims (12)

a mounting head that mounts components on a board;
an imaging unit including an optical element and an imaging element having an image surface on which an image of a subject is formed via the optical element, the image surface of the optical element or the imaging element being arranged at an angle with respect to the optical axis, and the optical element, the image surface and the subject surface being arranged so as to satisfy the Scheimpflug condition;
the imaging unit includes a vertical movement unit that moves an imaging height position in a vertical direction, and is configured to be able to image the subject from a plurality of imaging height positions in the vertical direction that are different from each other ;
A control unit that controls the movement of the vertical movement unit;
a component supply unit that supplies components to the mounting head,
The control unit of the component mounting device is configured to move the imaging unit to a component supply imaging height position in the vertical direction that is set based on the height of the component supply position of the component supply unit when imaging the component supply unit with the imaging unit . a mounting head that mounts components on a board;
an imaging unit including an optical element and an imaging element having an image surface on which an image of a subject is formed via the optical element, the image surface of the optical element or the imaging element being arranged at an angle with respect to the optical axis, and the optical element, the image surface and the subject surface being arranged so as to satisfy the Scheimpflug condition;
the imaging unit includes a vertical movement unit that moves an imaging height position in a vertical direction, and is configured to be able to image the subject from a plurality of imaging height positions in the vertical direction that are different from each other;
A control unit that controls the movement of the vertical movement unit is further provided.
the control unit is configured to move the imaging unit to a component mounting imaging height position in the vertical direction that is set based on the height of the mounting position and the size of the component when imaging the mounting position of the component on the board using the imaging unit. 3. The component mounting device according to claim 1, wherein the control unit moves the imaging unit to adjust an imaging height position in the vertical direction of the imaging unit so that the subject is included within an imaging range of the imaging unit and the imaging unit is focused on a surface of the subject . a component supply unit that supplies components to the mounting head,
3. The component mounting device according to claim 2, wherein the control unit is configured to move the imaging unit to a component supply imaging height position in the vertical direction that is set based on the height of a component supply position of the component supply unit when imaging the component supply unit with the imaging unit. 5. The component mounting device according to claim 1, wherein the control unit is configured to move the imaging unit in the vertical direction to the component supply imaging height position after the timing at which the component to be picked up is determined and before the mounting head has completed moving to a horizontal position at which the component is picked up. 2. The component mounting device according to claim 1, wherein the control unit is configured to move the imaging unit to a component mounting imaging height position in the vertical direction that is set based on the height of the mounting position and the size of the component when imaging the mounting position of the component on the board with the imaging unit . 7. The component mounting device according to claim 2 or 6, wherein the control unit is configured to move the imaging unit in the vertical direction to the component mounting imaging height position after a movement command is issued to move the mounting head to the mounting position and before the mounting head has completed moving to a horizontal position where it will mount a component. The component mounting device according to any one of claims 1 to 7, wherein the control unit is configured to move the imaging unit to a vertical transfer imaging height position set based on the transfer height of the mounting head when imaging a component being transferred by the mounting head. 9. The component mounting device according to claim 8, wherein the control unit is configured to move the imaging unit in the vertical direction to the transfer imaging height position after the mounting head has adsorbed a component and before the mounting head has completed rising to the transfer height position. The component mounting device according to claim 1 , wherein the control unit is configured to move the imaging unit to an imaging height position prior to, and not in synchronization with, the movement of the mounting head. The component mounting device according to any one of claims 1 to 10, wherein the horizontal position and orientation of the subject are measured based on the imaging height position of the imaging unit and the height of the subject. a reference calibration member that is arranged at a predetermined height and is imaged by the imaging unit;
The component mounting device according to any one of claims 1 to 11, wherein the imaging range, scale, and focal height position of the imaging unit are calibrated based on an imaging result of imaging the reference calibration member by the imaging unit.

Images