KR20110053923A - Electronic fabric - Google Patents

Abstract

The invention relates to a fabric (1) for mounting a first electronic component at a first designated location (121) on a fabric and for mounting a second electronic component at a second specified location (122) on a fabric. Includes a first marker pattern 111, 112 associated with the first specified location and a second marker pattern 113, 114 associated with the second specified location. According to the fabric according to the invention, electronic fabrics can be reliably produced using conventional equipment known from the electronic assembly industry, such as pick and place devices, whereby the electronic components are assigned to their respective designations on the fabric. Are provided exactly at the locations.

Description

Electronic fabric {ELECTRONIC TEXTILE}

The present invention relates to a fabric for mounting a first electronic component at a first designated location on a fabric and mounting a second electronic component at a second designated location on the fabric. The invention also relates to a method of making an electronic fabric. The invention also relates to an apparatus for manufacturing an electronic fabric. The invention also relates to an electronic fabric comprising a first electronic component, a second electronic component, and a fabric.

Fabrics are interwoven fibers that can be produced, for example, by weaving, knitting, crocheting, knotting, or pressing together fibers. It is a material composed of interlacing fibers. Many types of fabrics are used in our daily lives. New applications emerge when electronic components (ie, devices that operate by controlling the flow of electrons) are incorporated into a fabric. When the fabric is an integral part of the electronic circuit containing the electronic components, the electronic fabric is obtained.

An example of an electronic component is an LED package in the form of a surface mounted device (SMD-LED), which is gluing, soldering, snap button connection or stitching. Can be attached to the fabric substrate. The resulting light emitting fabric can open up a wide range of new interior and garment applications, from lighting to atmosphere creation and messaging.

Electronic fabrics are known from British patent application GB2396252A. Known electronic fabrics include SMD-LEDs mounted at designated locations on the fabric by hand or using conventional equipment known from the electronic assembly industry. SMD-LEDs are electrically addressable through conductive tracks, formed from woven yarns or from tracks printed onto the fabric.

A disadvantage of known electronic fabrics is that manufacturing by using conventional equipment known from the electronic assembly industry often results in that at least some of the electronic components are not provided at their respective designated locations on the fabric.

[Summary of invention]

It is an object of the present invention to provide a fabric that can be used to make electronic fabrics in a more reliable manner.

It is a further object of the present invention to provide a method of making an electronic fabric using the fabric.

It is a further object of the present invention to provide an apparatus for manufacturing an electronic fabric using the fabric.

It is a further object of the present invention to provide an electronic fabric comprising the fabric.

According to a first aspect of the invention, the object is that the fabric according to the opening paragraph comprises a first marker pattern associated with a first designated position and a second marker pattern associated with a second designated position. Is realized in this respect.

In the fabric according to the invention, first and second marker patterns are provided for marking the designated positions of the first and second electronic components, respectively. With regard to aligning the fabric with respect to the first and second electronic components, the tolerance to dimensional non-uniformity of the fabric has been increased.

Conventional manufacturing processes in the electronic assembly industry are the so-called pick-and-place processes. In this process, the substrate is aligned with respect to the electronic component using a marker pattern to prepare for placing the electronic component in the designated location. To this end, the device has an optical detector that recognizes a marker pattern on the substrate. After recognizing the marker pattern, the designated positions at which the electronic components should be placed are calculated. That is, to provide electronic components at their respective designated locations, known pick and place procedures include a common marker pattern, ie, a single marker pattern shared by multiple electronic components.

The inventors have realized that the pick and place procedure commonly used is not suitable for automatic pick and place of electronic components on a fabric because the use of a common marker pattern requires the fabric to have substantially constant dimensions. In fact, the dimensions of the fabric may vary as a result of, for example, stretching or heating, so the dimensions of the fabric are not constant, and the distances between components often change more than the tolerances available in the connection. .

In a first embodiment of the fabric according to the invention, the first and second marker patterns are detectable using non-visible radiation. Such detectability is based on the absorption of invisible radiation such as, for example, X-rays, ultraviolet radiation or infrared radiation, and possibly results in luminescence of the marker patterns. This embodiment ensures that the marker patterns do not negatively affect the appearance of the fabric, since they are not visible to the observer and at least in normal daylight conditions.

In a second embodiment of the fabric according to the invention, the first and second marker patterns are detectable using magnetic field detection.

In a third embodiment of the fabric according to the invention, the first and second marker patterns are formed from yarns woven into a fabric. This embodiment represents a fabric according to the invention, which can be conveniently produced, for example, using an automated weaving loom. If the yarns are electrically conductive yarns that form magnetically detectable marker patterns, the yarns may also help to improve heat dissipation in the fabric.

In a fourth embodiment of the fabric according to the invention, the fabric comprises a first layer and a second layer, the first layer arranged to have the electronic components, the second layer being the first and the first 2 marker patterns. Since multilayer textiles can be easily manufactured using an automated weaving room, this is a convenient embodiment to ensure that the marker patterns do not adversely affect the appearance of the fabric of the observer.

According to a second aspect of the invention, an object is a method of manufacturing an electronic fabric, comprising: a first marker pattern associated with a first designated position of a first electronic component, and a second associated with a second designated position of a second electronic component Providing the marker pattern to a fabric, providing the first electronic component, and using the first marker pattern to prepare for placing the first electronic component at the first designated location. Aligning the fabric with respect to, placing the first electronic component above the first designated position, providing the second electronic component, placing the second electronic component at the second designated position Aligning the fabric with respect to the second electronic component using the second marker pattern to prepare, and the second Above the specified position is achieved with the method for manufacturing an electronic textile comprising the step of placing the second electronic component.

In a first embodiment of the method according to the invention, the step of aligning the fabric involves the use of an apparatus comprising a detector arranged to detect the first and second marker patterns. This embodiment enables a convenient way of implementing the method according to the invention.

In a second embodiment of the method according to the invention, the step of aligning the fabric comprises the use of an apparatus comprising a detector arranged to recognize the first and second marker patterns, the detector being a light detection system. . The use of a light detection system such as a camera is a convenient way of recognizing the first and second marker patterns on the fabric.

According to a third aspect of the invention, the object is a first electron by detecting a first marker pattern associated with a first designated location of a holder for holding a fabric, and a first electronic component. Fabricating an electronic fabric comprising an alignment tool for aligning the fabric with respect to the second electronic component with respect to the component and by recognizing in the fabric a second marker pattern associated with a second designated location of a second electronic component. To achieve the device.

According to a fourth aspect of the invention, the object comprises a fabric comprising a first electronic component, a second electronic component, and a first marker pattern associated with the first designated position and a second marker pattern associated with the second designated position And the first electronic component is provided at the first designated position and the second electronic component is provided at the second designated position.

Examples of the present invention will now be described in detail with reference to the accompanying drawings.
1 is a top view of a first fabric according to the present invention.
2 is an exploded perspective view of a second fabric according to the present invention.
3a and 3b schematically illustrate first and second methods of manufacturing an electronic fabric according to the invention.
4 shows an apparatus for producing an electronic fabric according to the present invention.
It should be noted that these figures are schematic and not drawn to scale. For the sake of clarity and convenience, the relative dimensions and ratios of parts of these figures have been shown to be exaggerated or reduced in size.

In the following description, the invention is described with reference to exemplary fabrics according to the invention.

A first embodiment of the fabric according to the invention is the fabric 1 shown in FIG. 1 arranged to electrically address electronic components through warp yarns and weft yarns comprising electrically conductive fibers. to be. 1 shows warp yarns 141 and 142 and weft yarns 151 and 152, respectively.

Fabric 1 includes four designated locations 121, 122, 123, and 124 in a 2-by-2 arrangement. The location specified is the location on the fabric where the electronic component should be provided, taking into account the tolerances available when connecting the electronic component to the fabric. That is, the designated location defines the area on the fabric where the electronic component must be placed in order to be electrically addressable through the fabric.

The fabric 1 comprises eight markers 111, 112, 113, 114, 115, 116, 117, and 118, which may be woven, embroidered or printed on the fabric 1, for example. .

Markers 111-118 define a set of marker patterns. In the context of this invention, the marker pattern may consist of a single marker or an arrangement comprising a plurality of markers. A marker pattern comprising a single marker defines a point, a marker pattern comprising two markers defines a line (individual markers are endpoints of the line), and a marker pattern comprising three or more markers defines an area. (Individual markers are corner points of the region). In the remainder of this description, the marker pattern will be referenced by {x, y, ...}, where x and y are the individual markers that together make up the marker pattern. For example, in the fabric 1, the marker pattern {111, 112} defines a line with markers 111 and 112 at its endpoints.

Each of the marker patterns on the fabric 1 is associated with a separate designated location. For example, the marker pattern {111, 112} is associated with the designated position 121. The marker pattern is preferably located in close proximity to the designated location associated with it. In particular, it is desirable that no other marker pattern is closer to the designated position than the marker pattern associated with the designated position, and no other designated position is closer to the marker than the designated position associated with the marker pattern. This is particularly desirable because it can improve the processability of fabrics that suffer from dimensional instability.

The distance to the designated location is determined relative to the center of mass at the designated location. The determination of the distance to the marker pattern depends on the type of pattern. If the marker pattern defines a line, the distance is determined with respect to the center of the line, and if the marker pattern defines a region, it is determined with respect to the center of mass of the area.

Table 1 lists the marker patterns associated with them, together with the designated locations of the electronic fabric 1.

(Designated locations of fabric 1, and marker patterns associated with them) Specified location Marker pattern 121 {111, 112} 122 {113, 114} 123 {115, 116} 124 {117, 118}

Table 1 includes eight cross-shaped markers for defining four marker patterns, each of which marks a designated position for the electronic component. The skilled artisan will understand that for a given number of designated positions in a particular arrangement, each marker pattern may be satisfied with any number of marks of any given material and any shape as long as it can be associated with a separate designated position. .

Preferably, the point, line, or region defined by the marker pattern overlaps with the designated location associated with it. For example, the line defined by the marker pattern {111, 112} overlaps with the designated position 121 associated therewith. If an individual marker of a marker pattern is located outside of a designated position associated therewith, it is preferably located within a distance of 10 mm from the designated position associated therewith.

The markers 111-118 are woven into the fabric 1 and are made of electrically insulating yarns having a color (eg black) that contrasts well with the color of the fabric 1, so that they are optical cameras. It can be easily detected by a detector, using the irradiation of markers with visible light, such as.

The marker may also be detectable using radiation invisible to the human eye, such as X-ray, ultraviolet or infrared radiation. Such markers can be produced, for example, from yarns coated with a luminescent material that can be excited by ultraviolet radiation or from yarns that strongly absorb X-ray, ultraviolet or infrared radiation. The advantage of such a marker is that it cannot be observed by an observer and at least in normal daylight conditions, which means that the marker patterns do not negatively affect the appearance of the fabric.

Alternatively, the marker may also be detectable using magnetic field detection. Magnetically detectable markers can be made from any magnetically detectable material. For example, magnetically detectable markers can be printed onto a fabric using a composition comprising magnetic particles. Magnetically detectable markers can also be formed from a seal having a coating comprising magnetic particles. Preferably, the magnetically detectable marker is formed from an electrically conductive seal. When a current flows through the yarn, a detectable magnetic field is induced. When current flows through two chambers with intersections, the induced magnetic field will be the highest at the intersection, whereby the intersection can constitute a marker. Markers made from electrically conductive seals can also function as an interwoven heat sink.

A second embodiment of the fabric according to the invention comprises a fabric as shown in FIG. 2, comprising a first layer 21 and a second layer 22, which can be easily manufactured using an automated weaving room. (2).

In the fabric 2, the first layer 21 is arranged to have electronic components at designated locations 221, 222, 223, and 224, and the second layer 22 is markers 211, 212, 213. , 214, 215, 216, 217, and 218). In FIG. 2, the projections of the markers 211-218 on the first layer 21 are represented by dashed outlines. Similar to the fabric 1 of FIG. 1, the markers 211-218 define four marker patterns, each marker pattern having a designated position associated with its projection over the first layer 21. Mark a designated location above the first layer 21, such as a designated location 221 marked by the marker pattern {211, 212}, which defines a line overlapping the 221.

The markers 211-218 may be detected by a detector facing the first layer 21, or by a detector facing the second layer 22. In the former case, the markers 211-218 can be detected because of their ability to absorb invisible radiation such as, for example, X-rays that can penetrate the fabric 2. To this end, the markers 211-218 may be formed from metal threads woven into the second layer 22.

The first layer 21 and the second layer 22 are arranged such that when the fabric 2 is viewed from the viewing direction 23, the second layer 22 is covered by the first layer 21. From the viewer's perspective, since the second layer 22 comprising the markers 211-218 is covered by the first layer 21, the markers 211-218 can not be observed by the viewer, This means that the markers 211-218 do not negatively affect the appearance of the fabric 2.

3a schematically illustrates a method of manufacturing an electronic fabric according to the present invention.

In a first step 31, a fabric 3 is provided. Fabric 3 includes electrically conductive yarns 341, 342, 343, and 345, and markers 311, 312, 313, 314, 315, 316, 317, and 318. The markers 311-318 are marked with marker patterns {311, 312}, {313, 314}, {315, 316}, and {317 associated with the designated locations on the fabric 3 on which the electronic components are to be provided. , 318}. The fabric 3 may be provided with markers 311-318, for example by embroidering or printing.

In a second step 32, a first electronic component 331 is provided.

In a third step 33, an apparatus comprising a detector arranged to detect a first marker pattern {311, 312} to prepare for placing the first electronic component 331 at the first designated location 321. Is used to align the fabric 3 with respect to the first electronic component 331.

In a fourth step 34, the electronic component 331 is disposed above the designated location 321 and then connected to the electrically conductive threads 341 and 342, for example by snap button connection or by sewing. Alternatively, an adhesive means such as an electrically conductive epoxy or solder may be used, in which case the adhesive means must be applied at the designated location 321 before the electronic component 331 is disposed, and the electronic component 331 is disposed. Afterwards, a stimulus (such as heat) should usually be applied to establish the connection.

The second, third, and fourth steps are repeated for each of the additional components to place additional electronic components 332, 333, and 334 to manufacture the electronic fabric 301.

In the method shown in FIG. 3A, providing an electronic component (second step 32), aligning the fabric 3 with respect to the electronic component (third step 33), and above the fabric 3. Placing the electronic component above the designated location of (fourth step 34) is performed sequentially for each electronic component. However, each of the steps can also be performed simultaneously for all the electronic components that must be placed on the fabric. This is shown in FIG. 3B, where in a second step 32 electronic components 331, 332, 333, and 334 are provided simultaneously, and in a third step 33, the fabric 3 is connected to the electronic components ( 331, 332, 333, and 334, and in a fourth step 34, the electronic components 331, 332, 333, and 334 are simultaneously in their respective designated positions 321, 322, 323, and 324 is disposed.

The second step 32, the third step 33, and the fourth step 34 are performed using a pick and place device with a detector for recognizing the markers 311-318. Preferably, the second step 32, the third step 33, and the fourth step 34 are designed to prevent the fabric 3 from changing in shape and / or dimension during the pick and place process. This is done while being fixed to the frame or fixed on a rigid holder. In the case where a stimulus such as heat is applied to harden the adhesion means, this measure has the advantage that the fabric 3 cannot shrink during the heating step, thereby preventing the electronic component from detaching from its designated position, which It is particularly advantageous when the component is a relatively large electronic component.

4 schematically shows an apparatus for producing an electronic fabric according to the invention. The device 4 comprises a fabric holder 41 and an alignment tool 42. The fabric holder 41 and the alignment tool 42 can move relative to each other. Fabric 43, similar to fabric 1 shown in FIG. 1, is secured over fabric holder 41 to prevent variations in the shape and / or dimensions of fabric 43 during the manufacturing process. The alignment tool 42 relates to the first electronic component and to the second designated position of the second electronic component by detecting on the fabric 43 a first marker pattern associated with the first designated position of the first electronic component. Arranged to align the fabric 43 with respect to the second electronic component by recognizing the second marker pattern on the fabric. To this end, the alignment tool 42 includes a detector 44 capable of detecting a marker pattern on the fabric 43. The alignment tool 42 further includes a component holder 45 for holding the electronic component.

While the invention has been shown and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; The invention is not limited to the disclosed embodiments. Modifications to the disclosed embodiments can be made and understood by those skilled in the art upon practicing the claimed invention from the study of the drawings, the specification, and the appended claims. In the claims, the word "comprising" does not exclude other elements and the indefinite article "a" or "an" does not exclude a plurality. The simple fact that certain means are described in different dependent claims does not indicate that a combination of such means cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

Claims (10)

A fabric (1) for mounting a first electronic component at a first designated location (121) over a fabric (1) and for mounting a second electronic component at a second designated location (122) over a fabric (1), wherein Fabric 1 includes first marker patterns 111 and 112 associated with the first designated location 121 and second marker patterns 113 and 114 associated with the second designated location 122. Fabric (1) characterized in that. The fabric (1) according to claim 1, wherein the first marker pattern (111, 112) and the second marker pattern (113, 114) are detectable using non-visible radiation. The fabric (1) according to claim 1, wherein the first marker pattern (111, 112) and the second marker pattern (113, 114) are detectable using magnetic field detection. The method of claim 1, wherein the first marker patterns 111, 112 and the second marker patterns 113, 114 are formed from yarns woven from the fabric 1. Fabric (1). 5. The fabric of claim 1 wherein the fabric 2 comprises a first layer 21 and a second layer 22, wherein the first layer 21 comprises the electronic components. 6. And a second layer (22) comprising the first marker pattern (211, 212) and the second marker pattern (213, 214). As a method of manufacturing the electronic fabric 301,
First marker patterns 311, 312 associated with the first designated location 321 of the first electronic component 331, and second marker patterns associated with the second designated location 322 of the second electronic component 332 ( Providing 313, 314 to the fabric 3,
Providing the first electronic component 331,
The fabric with respect to the first electronic component 331 using the first marker patterns 311, 312 to prepare for placing the first electronic component 331 at the first designated location 321. 3) aligning,
Placing the first electronic component 331 above the first designated location 321,
Providing the second electronic component 332,
The fabric with respect to the second electronic component 332 using the second marker patterns 313, 314 to prepare for placing the second electronic component 332 at the second designated location 322. Aligning 3), and
Placing the second electronic component 332 above the second designated location 322.
How to include. 7. The apparatus of claim 6, wherein the step of aligning the fabric (3) comprises a detector (44) arranged to detect the first marker pattern (311, 312) and the second marker pattern (313, 314). Method with use of (4). 8. The method of claim 7, wherein the detector (44) is a photo detector. As an apparatus 4 for producing an electronic fabric,
With respect to the first electronic component by detecting on the fabric 43 a holder 41 for holding the fabric 43, and a first marker pattern associated with a first designated position of a first electronic component; An apparatus comprising an alignment tool 42 for aligning the fabric 43 with respect to the second electronic component by recognizing a second marker pattern associated with a second designated position of an electronic component on the fabric 43. (4). As the electronic fabric 301,
First marker patterns 311 and 312 associated with the first electronic component 331, the second electronic component 332, and the first designated position 321 and the second marker pattern associated with the second designated position 322 ( 313, 314, comprising a fabric 3, wherein the first electronic component 331 is provided in the first designated location 321 and the second electronic component 332 is provided in the second designated location ( Electronic fabric 301 provided to 322.

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