KR20090092426A - Apparatus and method for bonding a die - Google Patents

Abstract

A die bonding method is disclosed. The dies are sequentially bonded to the package regions of the substrate. Subsequently, when the die is bonded to the sampling area selected from the package areas while the dies are bonded, the substrate is transferred to the inspection site. Then, it is checked whether the die bonded to the sampling area is bonded at the normal position. Subsequently, when the inspection result is out of the tolerance range, the substrate is transferred to an external defective storage place. Therefore, during the bonding of the die to the substrate, a defect can be detected by sampling inspection of the position where the die is bonded.

Description

Die bonding method and apparatus {APPARATUS AND METHOD FOR BONDING A DIE}

The present invention relates to a die bonding apparatus and method, and more particularly, to a method and apparatus for bonding a die, which is a semiconductor chip, to a substrate for manufacturing a semiconductor package.

In general, a semiconductor device includes a bonding process of bonding a wafer on which a plurality of dies, which are semiconductor chips, are formed to an adhesive sheet, a sawing process of cutting the wafer bonded to the adhesive sheet to individualize each of the dies, and the individualized said A die separation process of separating a die from the adhesive sheet, a die bonding process of bonding the die separated from the adhesive sheet to a substrate, a wire bonding process of electrically connecting the die with a connection pad of the substrate through a wire, the And a molding step of molding a die with an epoxy resin, and a terminal forming step of forming a connection terminal electrically extended from the substrate to the outside.

Among these, the die bonding process is performed by a die bonding apparatus including a transfer unit for transferring the substrate while the substrate is seated, and a bonding unit installed on the substrate mounted on the transfer unit and holding the die to bond the substrate. Proceed.

Here, the substrate is made of a relatively larger area than the die, on which package regions in which the die is sequentially bonded are formed. In addition, circuit patterns mutually mutually are patterned in the package regions and the die of the substrate.

However, although the dies must be bonded precisely in the package area due to the circuit patterns as described above, the bonding position of the dies cannot be inspected during the bonding of the dies, resulting in unreliability of the die bonding process. There is a problem falling.

Accordingly, when the bonding position of the die is poor, there may be another problem that the efficiency of the semiconductor package manufacturing process is impaired by proceeding with subsequent processes for the defective die unnecessarily.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a die bonding method capable of inspecting a position thereof while bonding a die to a substrate.

Another object of the present invention is to provide a die bonding apparatus to which the die bonding method is applied.

In order to achieve the above object of the present invention, a die bonding method according to one aspect is disclosed. The dies are sequentially bonded to the package regions of the substrate. Subsequently, when the die is bonded to a sampling area selected from the package areas while bonding the dies, the substrate is transferred to an inspection site. Then, it is checked whether the die bonded to the sampling area is bonded at a normal position. Subsequently, when the inspection result is out of the tolerance range, the substrate is transferred to an external defective storage location.

Examining the bonding position of the die includes measuring a distance between the substrate and the first and second patterns formed on the die bonded to the substrate and comparing whether the measured distance is within a tolerance range of a reference distance. It includes a step.

In addition, the checking of the bonding position of the die may include measuring an angle between an extension line connecting the first and second patterns formed on the substrate and the die bonded to the substrate with an x-axis, and the measured angle being a reference. Comparing whether the angle is within the tolerance range of the angle.

The package regions of the substrate may be formed in regular rows, and the sampling regions may be package regions constituting any one row or column.

In order to achieve the above object of the present invention, a die bonding apparatus according to one aspect includes a bonding portion, a conveying portion and an inspection portion. The bonding unit transfers the substrate to an inspection site when the die is bonded to a sampling area selected from the package areas while bonding the dies. The inspection unit is installed at the inspection site and inspects whether the die bonded to the sampling area is bonded at a normal position. Accordingly, the transfer unit is connected to the inspection unit and transfers the substrate to an external defective storage location when the inspection result is out of an allowable error range.

The inspection unit may include a measurement unit and the measurement unit configured to measure an angle between a distance between the first and second patterns formed on the substrate and the die bonded to the substrate, or an x-axis of an extension line connecting the first and second patterns. And a comparison unit for comparing whether the measured distance or angle measured by the measurement unit is within a tolerance range of the reference distance or the reference angle, respectively.

Here, the measuring unit may include a photographing unit photographing the positions of the first and second patterns and a calculating unit connected to the photographing unit and calculating the distance and the angle through the first and second patterns. .

According to such a die bonding method and apparatus, a sampling region is preferentially selected in package regions of a substrate, and when a die is bonded to the selected sampling region, the die is transferred to an inspection place and the position where the die is bonded is examined. The reliability of the process of bonding the die can be ensured.

In addition, by inspecting the bonding position of the die in real time that the die is poorly bonded to the substrate, it is possible to prevent a subsequent process from being performed on the defective die and the substrate. Thereby, the manufacturing process of the semiconductor package including the process of bonding the said die to the said board | substrate can be advanced more efficiently.

1 is a schematic view showing a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a state in which a sampling region is selected according to an embodiment of package regions formed on a substrate of the die bonding apparatus illustrated in FIG. 1.

3 is a view illustrating a state in which a sampling region is selected according to another embodiment of package regions formed on a substrate of the die bonding apparatus illustrated in FIG. 1.

FIG. 4 is a view schematically illustrating an image in which a die is bonded to a sampling area of the substrate illustrated in FIG. 2.

5 is a view illustrating in detail the positions of the first pattern of the substrate of FIG. 4 and the second pattern of the die.

FIG. 6 is a flowchart schematically illustrating a method of bonding a die by using the die bonding apparatus shown in FIG. 1.

<Description of the symbols for the main parts of the drawings>

S: Substrate C: Die

PA: Package Area SA: Sampling Area

100 bonding unit 200 transfer unit

300: measuring unit 400: comparison unit

500: inspection unit 1000: die bonding device

Hereinafter, with reference to the accompanying drawings will be described in detail a die bonding method and apparatus according to an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

FIG. 1 is a schematic view illustrating a die bonding apparatus according to an embodiment of the present invention, and FIG. 2 illustrates a sampling region according to one embodiment of package regions formed on a substrate of the die bonding apparatus illustrated in FIG. 1. It is a figure which shows the selected state.

1 and 2, the die bonding apparatus 1000 according to an embodiment of the present invention includes a bonding unit 100, a transfer unit 200, and an inspection unit 500.

The bonding unit 100 bonds the die C, which is a semiconductor chip, to the substrate S to manufacture a semiconductor package. Specifically, the bonding part 100 receives the die C from the wafer attached to the adhesive sheet from the outside and bonds the upper portion of the substrate S.

Here, the substrate S is formed with a relatively larger area than the die C, and thus, the package S is formed with a plurality of package areas PA in which the die C is substantially bonded. do. In this case, the package areas PA of the substrate S have a structure regularly arranged along columns and rows. Meanwhile, the substrate S and the die C have a structure in which mutual circuit patterns are formed through the previous processes.

In order to bond the die C to the package areas PA of the substrate S at the correct position, the bonding part 100 may be separately arranged to align the position at which the die C is bonded. It may include an alignment device (not shown).

The transfer part 200 transfers the substrate S by mounting the substrate S thereon. In detail, the transfer part 200 transfers the substrate S to allow the bonding part 100 to sequentially bond the die C to the package areas PA of the substrate S. FIG.

 For example, the transfer part 200 causes the die C to be preferentially bonded in correspondence with the columns of the package areas PA, and then the substrate S to be bonded in correspondence with the rows of the package areas PA. ) Can be transferred. On the contrary, the transfer unit 200 may transfer the substrate S to proceed with the row first, and then proceed with the row, as opposed to the above.

On the other hand, the transfer part 200 is coupled to the bonding part 100 in a state in which the substrate (S) is seated on a separate stage (not shown) to transfer the bonding part 100, the bonding part 100 The die C may be sequentially bonded to the package areas PA of the substrate S.

Meanwhile, the sampling area SA is selected from the package areas PA of the substrate S to sample the bonding position of the die C bonded by the bonding part 100. The sampling area SA may be randomly selected from the package areas PA to increase the reliability of the sampling test as shown in FIG. 2. That is, the number and location of the sampling areas SA may be changed as much as possible.

When the die C is bonded from the bonding unit 100 to the selected sampling area SA, the transfer unit 200 moves the substrate S to an inspection site for performing the sampling inspection. Transfer. Here, in the inspection place, the bonding unit 100 is adjacent to the bonding unit 100 under conditions that do not interfere with the process of bonding the die C. FIG.

On the contrary, as shown in FIG. 3, the sampling area SA selected according to another embodiment among the package areas PA formed on the substrate S of the die bonding apparatus 1000 shown in FIG. A plurality of sampling areas SA may be selected along one of the columns or the rows.

In this case, since the positions of the sampling areas SA are gathered, the reliability of the sampling test may be lower than in the embodiment of FIG. 2. However, the sampling test may be performed collectively to perform the sampling. There is also an advantage that the bonding process time of the die C added with the inspection can be shortened.

Of course, the transfer part 200 may be appropriate to transfer the substrate S to the inspection site when the die C is bonded to the plurality of sampling areas SA in order to realize the advantage. Can be.

The inspection unit 500 is installed at the inspection place. The inspection unit 500 inspects whether the die C bonded to the sampling area SA is normally bonded. The inspection unit 500 may measure the position of the die C bonded to the sampling area SA of the substrate S and the position measured by the measurement unit 300. Comparing unit 400 includes a comparison.

The measurement unit 300 measures the position of the die C bonded to the sampling area SA of the substrate S according to a visual inspection method. In detail, the measurement unit 300 captures an image IM of the die C bonded to the substrate S and the substrate S at the same time. It is connected to the and includes a calculator 320 for calculating the actual position data through the image (IM).

Hereinafter, the data measured by the measuring unit 300 will be described in more detail with reference to FIGS. 4 and 5.

FIG. 4 is a view schematically illustrating an image in which a die is bonded to a sampling area of the substrate illustrated in FIG. 2, and FIG. 5 illustrates the positions of the first pattern of the substrate and the second pattern of the die of FIG. 4. It is a figure shown.

4 and 5, the imaging unit 310 may include a first pattern P1 formed in the sampling area SA of the substrate S and the die C bonded to the sampling area SA. Photograph the second pattern P2.

Here, each of the first and second patterns P1 and P2 may define positions of the first and second patterns P1 and P2 along the x and y axes of the circuit patterns formed in the sampling area SA and the die C of the substrate S. That means any one point. In this case, the first and second patterns P1 and P2 may set points close to each other in order to allow the photographing unit 310 to secure an enlarged image IM. This is to make the data calculated by the calculator 320 more accurate.

The calculator 320 calculates a distance D between the first and second patterns P1 and P2 based on the image IM photographed by the photographing unit 310. Hereinafter, the method of calculating the distance D between the first and second patterns P1 and P2 by the calculator 320 will be described in brief. First, the first and second patterns P1 and P2 will be described. The positions along the x and y axes of are measured as [x1, y1] and [x2, y2], respectively.

Thus, as shown in FIG. 5, the calculator 320 uses Pythagorean theorem from a right triangle having the first and second patterns P1 and P2 as both vertices and the distance D as the hypotenuse. The distance D is calculated through Equation 1.

In addition, the calculator 320 may measure an extension line connecting the first and second patterns P1 and P2, that is, the distance D measured from the angle A of the distance D to the x-axis. Based on the distance (y1-y2) of the vertical sides of the right triangle is calculated through the following equation (2).

As described above, the calculation unit 320 based on the position along the x and y axis of the first and second patterns (P1, P2) through the above equations (1) and (2) and the angle (D) A) can be calculated simply.

The comparison unit 400 receives the distance (D) and the angle (A) calculated in connection with the calculation unit 320 of the measurement unit 300. The comparison unit 500 compares the input distance D and the angle D with a reference distance SD and a reference angle SA, respectively.

Here, the reference distance SD and the reference angle SA are calculated from the first and second patterns P1 and P2 of the substrate S and the die C most suitably bonded.

The comparison unit 400 outputs a result value by comparing the distance D and the angle A with the reference distance SD and the reference angle SA. Specifically, the comparison unit 400 is when the distance (D) and the angle (A) is within the first and second tolerance range of each of the reference distance (SD) and the reference angle (SA). A first result value that is suitable is output, and a second result value that is not suitable is output when the first and second tolerance ranges are departed.

Here, the first and second tolerance ranges are such that the semiconductor package manufactured by bonding the die C to the substrate S is not badly treated due to the bonded position of the die C. For example, the first tolerance range may be about ± 50 μm, and the second tolerance range may be about ± 1 degree. Specifically, the first tolerance range may be about ± 20 μm, and the second tolerance range may be about ± 0.5 degrees.

Accordingly, the comparison unit 400 is connected to the transfer unit 200 and controls the transfer unit 200 according to the result value. In detail, when the comparison unit 400 outputs the first result value, the transfer unit 200 causes the substrate S to be transferred to the bonding unit 100, and the second result value is transferred. When outputting, the transfer part 200 causes the substrate S to be transferred to a defective storage location to the outside.

Therefore, when the sampling area SA is preferentially selected in the package areas PA of the substrate S, and the die C is bonded to the selected sampling area SA, the inspection part It is possible to ensure the reliability of the bonding process of the die (C) by transferring to the inspection place 500 is installed to inspect the bonding position of the die (C).

Hereinafter, a method of bonding the die C to the substrate S using the die bonding apparatus 1000 will be described in more detail with reference to FIG. 6.

FIG. 6 is a flowchart schematically illustrating a method of bonding a die by using the die bonding apparatus shown in FIG. 1.

Referring to FIG. 6, the method of bonding the die C using the die bonding apparatus 1000 may be sequentially performed on the package areas PA regularly formed along the matrix of the substrate S. FIG. Bonding the die (C) (S10).

Subsequently, when the die C is bonded to the sampling area SA selected from the package areas PA, the inspection part 500 is installed at the inspection part 500 by using the transfer part 200. Transfer to (S20).

Subsequently, the inspection unit 500 determines positions of the first pattern P1 of the transferred substrate S and the second pattern P2 of the die C bonded to the substrate S along the x and y axes. Measured from the measuring unit 300 of. In detail, the positions of the first and second patterns P1 and P2 are measured based on the image IM photographed by the photographing unit 310 of the measuring unit 300.

Next, the distance D and the angle A are measured from the positions of the first and second patterns P1 and P2 (S30). The distance D and the angle A are calculated by the calculation unit 300 of the measurement unit 300 using Equations 1 and 2 based on the measured positions of the first and second patterns P1 and P2. From 320).

Subsequently, the comparison unit 400 of the inspection unit 500 compares the distance D and the angle D with the reference distance SD and the reference angle SA (S40). Specifically, the comparison unit 400 is suitable when the distance (D) and the angle (A) are within the first and second tolerance ranges of the reference distance (SD) and the reference angle (SA), respectively. Outputs a first result value and outputs a second result value of inconsistency when the first and second tolerance ranges deviate.

In this case, when the first result value is output from the comparator 400, the transfer part 200 transfers the substrate S back to the bonding part 100 in step S10 and continuously the die C ) Is bonded to the package areas PA of the substrate S. When the die C is bonded to all of the package areas PA of the substrate S through the series of processes, the transfer part 200 may transfer the substrate S to a subsequent process. The new substrate S for bonding the die C may be transferred to the bonding part 100 from the previous process.

On the other hand, when the second result is output from the comparison unit 400, the transfer unit 200 transfers the substrate (S) to the defective storage location (S50). In this case, the die C having a poor bonding position may be separated, and then reworked by transferring the die C to the bonding unit 100 of the step S10 through the transfer unit 200. However, when it is impossible to separate the defective die C, the substrate S may be disposed of.

Therefore, during the process of bonding the die C to the substrate S, the bonding position of the die C is inspected to detect in real time that the die C is poorly bonded to the substrate S. As a result, it is possible to prevent a subsequent process from being performed on the die C and the substrate S which are defective. Thereby, the manufacturing process of the semiconductor package including the process of bonding the said die C to the said board | substrate S can be advanced more efficiently.

In the present embodiment, the distance D and the angle A are simultaneously measured and compared to examine the bonding position of the die C. However, the first pattern P1 of the substrate S is substantially compared. Since the size of the second pattern P2 of the die C may be very small and close, the bonded position of the die C may be inspected only by the distance D in some cases.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

The present invention described above can be used to inspect defects that may occur during the process of bonding the die in near real time to improve the reliability and efficiency of the process.

Claims (7)

Bonding dies sequentially to package regions of the substrate; Transferring the substrate to an inspection site when the die is bonded to a sampling region selected from the package regions while bonding the dies; Checking whether a die bonded to the sampling area is bonded at a normal position; And Transferring the substrate to an external defective storage location if the test result is outside the tolerance range. The method of claim 1 wherein the step of checking the bonding position of the die is Measuring a distance between the substrate and the first and second patterns formed on the die bonded to the substrate, respectively; And And comparing the measured distance to be within a tolerance range of the reference distance. The method of claim 1 wherein the step of checking the bonding position of the die is Measuring an angle between an x-axis and an extension line connecting the first and second patterns respectively formed on the substrate and the die bonded to the substrate; And And comparing whether the measured angle is within a tolerance range of a reference angle. The die bonding method of claim 1, wherein the package regions of the substrate are arranged in regular rows, and the sampling regions are package regions constituting any one row or column. A bonding portion for sequentially bonding dies to package regions of the substrate; A transfer unit for transferring the substrate to an inspection site when the die is bonded to a sampling area selected from the package areas while bonding the dies; And An inspection unit installed at the inspection place and inspecting whether the die bonded to the sampling area is bonded at a normal position; And the transfer unit is connected to the inspection unit to transfer the substrate to an external defective storage location when the inspection result is out of an allowable error range. The method of claim 5, wherein the inspection unit A measuring unit measuring a distance between the first and second patterns formed on the substrate and the die bonded to the substrate, or an angle formed by an extension line connecting the first and second patterns with an x axis; And And a comparing unit connected to the measuring unit and comparing whether the measured distance or angle measured by the measuring unit exists within a tolerance range of the reference distance or the reference angle, respectively. The method of claim 6, wherein the measuring unit A photographing unit photographing positions of the first and second patterns; And And a calculating unit connected to the photographing unit and calculating the distance and the angle through the first and second patterns.