KR20080113093A - 다중 파장 조명을 이용한 화질 개선 방법 - Google Patents
다중 파장 조명을 이용한 화질 개선 방법 Download PDFInfo
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- KR20080113093A KR20080113093A KR1020087026737A KR20087026737A KR20080113093A KR 20080113093 A KR20080113093 A KR 20080113093A KR 1020087026737 A KR1020087026737 A KR 1020087026737A KR 20087026737 A KR20087026737 A KR 20087026737A KR 20080113093 A KR20080113093 A KR 20080113093A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/141—Control of illumination
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/143—Sensing or illuminating at different wavelengths
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
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- Image Processing (AREA)
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Abstract
Description
Claims (10)
- 단색 카메라에 의해 포착된, 목표 및 배경을 포함한, 표면 이미지의 화질을 개선하는 방법에 있어서,다중 파장 조명을 이용하여 복수의 이미지를 얻는 단계와;복수의 이미지에 기초한 표면의 각 부분들간의 콘트라스트를 최적화하는 단계를 포함하는 화질 개선 방법.
- 제1항에 있어서, 다중 파장 조명을 이용하는 단계는 복수의 파장 중에서 다중 파장 조명을 변경하는 단계를 포함하고, 콘트라스트를 최적화하는 단계는 복수의 파장 중의 어느 파장이 최적의 콘트라스트를 가진 이미지를 생성하는지를 결정하는 단계를 포함하는 것인 화질 개선 방법.
- 제1항 또는 제2항에 있어서, 다중 파장 조명의 각 파장마다 목표 및 배경에 대한 각각의 카메라 출력을 결정하는 단계와;콘트라스트를 최적화시킬 때 목표 및 배경에 대한 각각의 카메라 출력을 이용하는 단계를 더 포함하는 화질 개선 방법.
- 제1항 내지 제3항 중 어느 한 항에 있어서, 다중 파장 조명의 파장에 대한 이미지를 포착하는 단계와;목표만의 영역 내에서 적어도 2개의 목표 영역을 식별하는 단계와;배경만의 영역 내에서 적어도 2개의 배경 영역을 식별하는 단계와;적어도 2개의 목표 영역의 화소값들을 평균화하는 단계와;적어도 2개의 배경 영역의 화소값들을 평균화하는 단계와;이미지를 포착하는 동안 사용된 강도 레벨을 인수분해하는 단계와;콘트라스트를 최적화할 때 목표 및 배경에 대한 각각의 카메라 출력을 사용하는 단계를 더 포함하는 화질 개선 방법.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 표면의 각 부분들간의 콘트라스트를 최적화하는 단계는,다중 파장 조면에 이용가능한 복수의 파장 중 각 파장에 대한 표면의 단일 소스 콘트라스트를 계산하는 단계와;최대 단일 소스 콘트라스트 값에 대응하는 파장을 선택하는 단계를 더 포함하는 화질 개선 방법.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 최소 콘트라스트 이미지에 의해 최대 콘트라스트 이미지의 화소별 나누기를 수행하여 신호대 잡음비가 감소된 복합 이미지를 생성하는 단계를 더 포함하는 화질 개선 방법.
- 제6항에 있어서, 다중 파장 조명의 콘트라스트를 최적화할 때 얻어진 콘트라 스트를 이용하여 최대 콘트라스트 이미지인 제1 이미지를 포착하는 단계와;복수의 이미지를 이용하여 다중 파장 조명의 콘트라스트를 최소화하는 단계와;다중 파장 조명의 콘트라스트를 최소화할 때 얻어진 콘트라스트를 이용하여 최소 콘트라스트 이미지인 제2 이미지를 포착하는 단계를 더 포함하는 화질 개선 방법.
- 제1항 내지 제7항 중 어느 한 항에 있어서, 적어도 2개의 이미지를 대수적으로 합성하여 높은 콘트라스트의 복합 이미지를 합성하는 단계를 더 포함하는 화질 개선 방법.
- 제8항에 있어서, 적어도 2개의 이미지를 대수적으로 결합하는 단계는,제1 이미지를 선택하는 단계와;제2 이미지를 선택하는 단계와;제1 이미지를 스케일하여 스케일된 이미지를 얻는 단계와;스케일된 이미지를 제2 이미지로부터 감산하여 배경과 목표 중의 어느 하나의 콘트라스트가 약 제로인 제3 이미지를 얻는 단계와;제3 이미지의 각 화소를 스케일하여 결과적인 이미지가 높은 콘트라스트의 복합 이미지로 되는 최대 평균 화소값을 얻는 단계를 더 포함하는 것인 화질 개선 방법.
- 제1항 내지 제9항 중 어느 한 항의 화질 개선 방법을 수행하는 장치.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/414,678 | 2006-04-28 | ||
US11/414,678 US7589869B2 (en) | 2006-04-28 | 2006-04-28 | Adjusting image quality using multi-wavelength light |
PCT/US2007/010323 WO2007127420A2 (en) | 2006-04-28 | 2007-04-27 | Improving image quality via multi-wavelength light |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080113093A true KR20080113093A (ko) | 2008-12-26 |
KR101370697B1 KR101370697B1 (ko) | 2014-03-05 |
Family
ID=38647994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020087026737A Active KR101370697B1 (ko) | 2006-04-28 | 2007-04-27 | 다중 파장 조명을 이용한 화질 개선 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7589869B2 (ko) |
JP (1) | JP5108003B2 (ko) |
KR (1) | KR101370697B1 (ko) |
CN (1) | CN101536483B (ko) |
TW (1) | TWI418207B (ko) |
WO (1) | WO2007127420A2 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8024060B2 (en) * | 2008-06-16 | 2011-09-20 | Electro Scientific Industries, Inc. | Method for defining safe zones in laser machining systems |
DE102008031243B4 (de) * | 2008-07-02 | 2010-09-16 | Eads Deutschland Gmbh | Verfahren und Vorrichtung zur Erzeugung von High Dynamic Range(HDR)-Bildaufnahmen sowie Belichtungsvorrichtungen zur Verwendung darin |
US8570516B2 (en) * | 2008-09-12 | 2013-10-29 | Cognex Corporation | Infrared direct illumination machine vision technique for semiconductor processing equipment |
TWI391872B (zh) * | 2008-10-14 | 2013-04-01 | Chung Shan Inst Of Science | Multi - band image imaging method |
US8223327B2 (en) * | 2009-01-26 | 2012-07-17 | Kla-Tencor Corp. | Systems and methods for detecting defects on a wafer |
US8859943B2 (en) | 2009-05-22 | 2014-10-14 | Parker-Hannifin Corporation | Method for maximizing the contrast of an image |
JP5417268B2 (ja) * | 2010-06-28 | 2014-02-12 | 富士フイルム株式会社 | 内視鏡システム |
GB2487940B (en) * | 2011-02-09 | 2014-12-17 | Tel Hashomer Medical Res Infrastructure & Services Ltd | Methods and devices suitable for imaging blood-containing tissue |
WO2013044405A1 (en) * | 2011-09-26 | 2013-04-04 | Metrologic Instruments, Inc. | Optical indicia reading terminal with combined illumination |
US9007454B2 (en) * | 2012-10-31 | 2015-04-14 | The Aerospace Corporation | Optimized illumination for imaging |
TWI477766B (zh) | 2012-12-18 | 2015-03-21 | Ind Tech Res Inst | 檢測裝置以及檢測方法 |
US9269035B2 (en) | 2014-02-28 | 2016-02-23 | Electro Scientific Industries, Inc. | Modified two-dimensional codes, and laser systems and methods for producing such codes |
US9594937B2 (en) | 2014-02-28 | 2017-03-14 | Electro Scientific Industries, Inc. | Optical mark reader |
CN106461566B (zh) * | 2014-06-24 | 2019-05-17 | Ykk株式会社 | 拉链链牙的检查条件设定方法和拉链链牙检查方法 |
US9747520B2 (en) * | 2015-03-16 | 2017-08-29 | Kla-Tencor Corporation | Systems and methods for enhancing inspection sensitivity of an inspection tool |
TWI531984B (zh) | 2015-05-26 | 2016-05-01 | 原相科技股份有限公司 | 影像處理方法以及影像處理裝置 |
WO2018176370A1 (zh) * | 2017-03-31 | 2018-10-04 | 深圳配天智能技术研究院有限公司 | 一种视觉检测系统及方法 |
JP6500070B1 (ja) * | 2017-10-16 | 2019-04-10 | ジャパンシステム株式会社 | 検査装置、検査用照明装置 |
WO2020198487A1 (en) | 2019-03-26 | 2020-10-01 | The Johns Hopkins University | Background-suppressed sted nanoscope |
DE102021209240B4 (de) * | 2021-08-23 | 2025-05-22 | Pepperl+Fuchs Se | Verfahren und Vorrichtung zur Führung eines Fahrzeugs auf einem Untergrund |
CN113916906B (zh) * | 2021-09-03 | 2024-01-09 | 江苏理工学院 | 视觉检测系统led光源照度优化方法及所用实验设备 |
TWI863447B (zh) * | 2023-07-21 | 2024-11-21 | 財團法人紡織產業綜合研究所 | 布料檢測設備及布料檢測方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5737122A (en) | 1992-05-01 | 1998-04-07 | Electro Scientific Industries, Inc. | Illumination system for OCR of indicia on a substrate |
JPH08219716A (ja) * | 1994-12-13 | 1996-08-30 | Toshiba Corp | 入力画像コントラスト処理装置およびこれを用いた装置 |
US6298149B1 (en) * | 1996-03-21 | 2001-10-02 | Cognex Corporation | Semiconductor device image inspection with contrast enhancement |
US6259827B1 (en) * | 1996-03-21 | 2001-07-10 | Cognex Corporation | Machine vision methods for enhancing the contrast between an object and its background using multiple on-axis images |
JP3808169B2 (ja) * | 1997-05-23 | 2006-08-09 | 株式会社ルネサステクノロジ | 検査方法およびその装置並びに半導体基板の製造方法 |
DE60011764T2 (de) * | 1999-04-07 | 2005-07-07 | Mv Research Ltd. | Werkstoffsprüfung |
TW491938B (en) * | 2000-11-28 | 2002-06-21 | Yung-Chang Chen | Method of designing a multichannel filtering system for measuring digital camera's spectral responsivities |
CN1543325A (zh) * | 2001-07-16 | 2004-11-03 | ART�Ƚ��о��Ƽ���˾ | 高度混浊介质的多波长成像 |
JP2003130811A (ja) | 2001-10-25 | 2003-05-08 | Dainippon Screen Mfg Co Ltd | 波長選択機能を利用した検査対象物の検査 |
US6847443B1 (en) * | 2002-01-17 | 2005-01-25 | Rudolph Technologies, Inc. | System and method for multi-wavelength, narrow-bandwidth detection of surface defects |
US7015418B2 (en) * | 2002-05-17 | 2006-03-21 | Gsi Group Corporation | Method and system for calibrating a laser processing system and laser marking system utilizing same |
US6870949B2 (en) | 2003-02-26 | 2005-03-22 | Electro Scientific Industries | Coaxial narrow angle dark field lighting |
US7420675B2 (en) * | 2003-06-25 | 2008-09-02 | The University Of Akron | Multi-wavelength imaging system |
US7967205B2 (en) * | 2005-11-17 | 2011-06-28 | Hand Held Products, Inc. | Optical reading device with programmable parameter control |
-
2006
- 2006-04-28 US US11/414,678 patent/US7589869B2/en active Active
-
2007
- 2007-04-27 WO PCT/US2007/010323 patent/WO2007127420A2/en active Application Filing
- 2007-04-27 TW TW096115191A patent/TWI418207B/zh active
- 2007-04-27 KR KR1020087026737A patent/KR101370697B1/ko active Active
- 2007-04-27 CN CN2007800147540A patent/CN101536483B/zh not_active Expired - Fee Related
- 2007-04-27 JP JP2009507835A patent/JP5108003B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR101370697B1 (ko) | 2014-03-05 |
WO2007127420A3 (en) | 2009-04-02 |
WO2007127420A2 (en) | 2007-11-08 |
US20070253033A1 (en) | 2007-11-01 |
JP2009535705A (ja) | 2009-10-01 |
JP5108003B2 (ja) | 2012-12-26 |
US7589869B2 (en) | 2009-09-15 |
TWI418207B (zh) | 2013-12-01 |
CN101536483B (zh) | 2011-08-31 |
TW200816784A (en) | 2008-04-01 |
CN101536483A (zh) | 2009-09-16 |
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