KR20080042736A - 헤드폰 및 이어 패드 - Google Patents
헤드폰 및 이어 패드 Download PDFInfo
- Publication number
- KR20080042736A KR20080042736A KR1020070114063A KR20070114063A KR20080042736A KR 20080042736 A KR20080042736 A KR 20080042736A KR 1020070114063 A KR1020070114063 A KR 1020070114063A KR 20070114063 A KR20070114063 A KR 20070114063A KR 20080042736 A KR20080042736 A KR 20080042736A
- Authority
- KR
- South Korea
- Prior art keywords
- ear
- pad
- earring
- low
- hanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000004744 fabric Substances 0.000 claims abstract description 10
- 239000006260 foam Substances 0.000 claims description 24
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 22
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 8
- 239000011496 polyurethane foam Substances 0.000 claims description 8
- 235000012489 doughnuts Nutrition 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims 3
- 239000000806 elastomer Substances 0.000 claims 3
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000004804 winding Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 210000005069 ears Anatomy 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002649 leather substitute Substances 0.000 description 2
- 238000009958 sewing Methods 0.000 description 2
- 235000010585 Ammi visnaga Nutrition 0.000 description 1
- 244000153158 Ammi visnaga Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 210000003027 ear inner Anatomy 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 210000003128 head Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 210000003254 palate Anatomy 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1008—Earpieces of the supra-aural or circum-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/105—Earpiece supports, e.g. ear hooks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1066—Constructional aspects of the interconnection between earpiece and earpiece support
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Headphones And Earphones (AREA)
Abstract
Description
Claims (6)
- 전방면측에 스피커 유닛의 방음부가 배치되고 배면측이 하우징에 의해 덮여 있는 헤드폰부와,상기 스피커 유닛의 방음부를 덮는 이어 패드를 구비하고,상기 이어 패드는 저반발의 다공성 탄성체가 패드 커버에 의해 덮인 구조를 갖는 것을 특징으로 하는 헤드폰.
- 제1항에 있어서, 상기 저반발의 다공성 탄성체는 반발 탄성이 20 % 이하인 것을 특징으로 하는 귀걸이 장착 방식의 헤드폰.
- 제1항에 있어서, 상기 저반발의 다공성 탄성체는 저반발 우레탄폼으로 이루어지고, 그 중앙 부분에 구멍이 마련된 도넛 형상으로 형성되어 있는 것을 특징으로 하는 헤드폰.
- 제1항에 있어서, 상기 저반발의 다공성 탄성체를 수납하는 상기 패드 커버는 연속 기포 처리가 실시된 폴리우레탄폼과 포재(布材)로 이루어지고, 사용자의 귀와 접촉하는 전방면측에 상기 포재가 배치된 것을 특징으로 하는 헤드폰.
- 제1항에 있어서, 상기 패드 커버는 상기 저반발의 다공성 탄성체가 상기 패 드 커버의 내측에서 열용착되어 있는 것을 특징으로 하는 헤드폰.
- 중앙 부분에 구멍이 마련된 도넛 형상으로 형성되어 있는 저반발의 다공성 탄성체와,상기 저반발의 다공성 탄성체를 덮는 패드 커버를 구비하고,상기 패드 커버는 연속 기포 처리가 실시된 폴리우레탄폼과 포재로 이루어지고, 사용자의 귀와 접촉하는 전방면측에 상기 포재가 배치된 것을 특징으로 하는 이어 패드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006305627A JP4899810B2 (ja) | 2006-11-10 | 2006-11-10 | ヘッドホン及びイヤーパッド |
JPJP-P-2006-00305627 | 2006-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20080042736A true KR20080042736A (ko) | 2008-05-15 |
Family
ID=38969799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070114063A Ceased KR20080042736A (ko) | 2006-11-10 | 2007-11-09 | 헤드폰 및 이어 패드 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8150090B2 (ko) |
EP (1) | EP1921889A1 (ko) |
JP (1) | JP4899810B2 (ko) |
KR (1) | KR20080042736A (ko) |
CN (1) | CN101198193B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10932029B2 (en) | 2017-03-15 | 2021-02-23 | Sony Corporation | Headphones |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8503688B2 (en) * | 2009-08-24 | 2013-08-06 | Gregory DiRusso | Device to enhance an ear bud |
JP2012160787A (ja) * | 2011-01-28 | 2012-08-23 | Sony Corp | イヤパッド |
JP2013138350A (ja) * | 2011-12-28 | 2013-07-11 | D & M Holdings Inc | ヘッドホン及びイヤーパッド |
CN103108267A (zh) * | 2013-01-16 | 2013-05-15 | 歌尔声学股份有限公司 | 一种复合结构耳套 |
JP2015133609A (ja) * | 2014-01-14 | 2015-07-23 | フィフティスクエア株式会社 | ヘッドホンカバー |
CN105611452A (zh) * | 2016-02-25 | 2016-05-25 | 歌尔声学股份有限公司 | 一种可调耳机 |
CN105635883A (zh) * | 2016-02-25 | 2016-06-01 | 歌尔声学股份有限公司 | 一种耳机 |
US9807493B1 (en) | 2016-04-21 | 2017-10-31 | Human, Incorporated | Attachment apparatus |
USD908666S1 (en) * | 2019-05-06 | 2021-01-26 | Human, Incorporated | Earphone accessory |
US11064279B2 (en) | 2019-10-09 | 2021-07-13 | Microsoft Technology Licensing, Llc | Headphone earcup including seamless cover |
WO2022073735A1 (en) * | 2020-10-09 | 2022-04-14 | Gn Audio A/S | On-the-ear ear cushion with multiple foams having different properties |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5162819U (ko) | 1974-11-13 | 1976-05-18 | ||
US4856118A (en) * | 1987-02-11 | 1989-08-15 | Bose Corporation | Headphone cushioning |
JPS63268395A (ja) * | 1987-04-27 | 1988-11-07 | Matsushita Electric Ind Co Ltd | イヤ−パツド |
US4958697A (en) * | 1989-09-11 | 1990-09-25 | The United States Of America As Represented By The Secretary Of The Army | Anatomically shaped earseals for headsets |
JP2635791B2 (ja) * | 1990-01-31 | 1997-07-30 | アイワ株式会社 | イヤホンパッドの製造方法およびイヤホンパッド |
JP3227200B2 (ja) | 1992-05-19 | 2001-11-12 | キヤノン株式会社 | 表示制御装置及び方法 |
JP3097340B2 (ja) | 1992-08-19 | 2000-10-10 | ソニー株式会社 | ヘッドホン装置 |
JPH0678386A (ja) * | 1992-08-26 | 1994-03-18 | Sony Corp | ヘッドホン装置 |
JP3154214B2 (ja) * | 1992-09-25 | 2001-04-09 | ソニー株式会社 | ヘッドホン |
JP3672619B2 (ja) | 1995-04-28 | 2005-07-20 | ソニー株式会社 | 騒音低減ヘツドホン装置 |
JPH1155777A (ja) | 1997-07-31 | 1999-02-26 | Sony Corp | 集音器 |
US5996123A (en) * | 1998-10-16 | 1999-12-07 | Bacon Usa Safety, Inc. | Earmuff for noise blocking |
JP4103267B2 (ja) | 1999-10-12 | 2008-06-18 | ソニー株式会社 | ヘッドホン |
JP4127235B2 (ja) | 2004-04-16 | 2008-07-30 | ソニー株式会社 | ヘッドホン装置 |
JP3933142B2 (ja) * | 2004-04-27 | 2007-06-20 | ソニー株式会社 | コード巻き取り装置付きヘッドホン |
CN2734192Y (zh) * | 2004-06-18 | 2005-10-19 | 彭希年 | 防噪声耳塞 |
JP2006249270A (ja) * | 2005-03-11 | 2006-09-21 | Nippon Polyurethane Ind Co Ltd | 粘弾性ポリウレタンフォームの製造方法 |
JP4812721B2 (ja) | 2007-09-27 | 2011-11-09 | 株式会社羽田 | 茶葉冷却装置 |
-
2006
- 2006-11-10 JP JP2006305627A patent/JP4899810B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-31 EP EP07254320A patent/EP1921889A1/en not_active Withdrawn
- 2007-11-08 US US11/983,320 patent/US8150090B2/en not_active Expired - Fee Related
- 2007-11-09 KR KR1020070114063A patent/KR20080042736A/ko not_active Ceased
- 2007-11-12 CN CN2007101703413A patent/CN101198193B/zh not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10932029B2 (en) | 2017-03-15 | 2021-02-23 | Sony Corporation | Headphones |
Also Published As
Publication number | Publication date |
---|---|
US8150090B2 (en) | 2012-04-03 |
JP2008124734A (ja) | 2008-05-29 |
EP1921889A1 (en) | 2008-05-14 |
JP4899810B2 (ja) | 2012-03-21 |
US20080112586A1 (en) | 2008-05-15 |
CN101198193B (zh) | 2012-07-18 |
CN101198193A (zh) | 2008-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20071109 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20121106 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20071109 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20131031 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20140114 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20131031 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |