KR20070082055A - 기판 진공처리용 로드락 챔버 - Google Patents
기판 진공처리용 로드락 챔버 Download PDFInfo
- Publication number
- KR20070082055A KR20070082055A KR1020070015628A KR20070015628A KR20070082055A KR 20070082055 A KR20070082055 A KR 20070082055A KR 1020070015628 A KR1020070015628 A KR 1020070015628A KR 20070015628 A KR20070015628 A KR 20070015628A KR 20070082055 A KR20070082055 A KR 20070082055A
- Authority
- KR
- South Korea
- Prior art keywords
- lock chamber
- load lock
- chamber
- side wall
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (11)
- 기판 진공처리용 로드락 챔버에 있어서, 양단부가 단차진 저판과, 상기 저판의 양단부에 밀착할 수 있도록 하단부가 단차지게 형성되고, 상기 저판에 결합되며 상면에 오링홈이 형성된 측벽과, 상기 측벽의 오링홈에 개재되는 오링과, 상기 오링이 개재된 측벽(12)의 상부에 결합되는 덮개(20)로 구성됨을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제1항에 있어서, 상기 측벽(12)과 저판(11)은 그 밀착부위에 용접 및 볼팅에 의해 결합되도록 구성됨을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제1항에 있어서, 상기 측벽(12)에 상기 볼트(40)의 헤드가 함몰되는 홈(13)을 구비하고, 상기 홈(13)에 고정부재(50)를 충진시켜 외부환경요인에 의하여 상기 볼트(40)가 이탈되지 않도록 구성됨을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제1항에 있어서, 상기 기판 진공처리용 로드락 챔버는 공정챔버 또는 이송챔버 중 어느 하나인 것을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제1항에 있어서, 상기 측벽(12)은 오링홈(15)을 기준으로 내측벽(12a)의 상 면이 상판과 접촉되지 않도록 단차지게 형성됨을 특징으로 하는 기판의 기판 진공처리용 로드락 챔버.
- 제1항에 있어서, 상기 측벽(12)은 오링홈(15)을 기준으로 외측벽(12b)의 상면 또는 상기 상판(20)의 하면에 돌기(60)가 형성됨을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제6항에 있어서, 상기 돌기는 테프론재질 임을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제6항에 있어서, 상기 돌기는 다수개 구비되는 것을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제6항에 있어서, 상기 돌기는 연속된 띠형상인 것을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제6항에 있어서, 상기 돌기는 외측벽에 삽입홈을 형성한 후, 상기 삽입홈에 억지끼움함으로써 결합됨을 특징으로 하는 기판 진공처리용 로드락 챔버.
- 제6항에 있어서, 상기 돌기는 외측벽의 일부를 절개한 후, 절개된 부분보다 더 높은 돌기를 밀착한 다음, 돌기와 측벽을 순차적으로 관통하는 볼트를 체결하여 결합됨을 특징으로 하는 기판 진공처리용 로드락 챔버.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20060014052 | 2006-02-14 | ||
KR1020060014052 | 2006-02-14 | ||
KR20060015236 | 2006-02-16 | ||
KR1020060015236 | 2006-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20070082055A true KR20070082055A (ko) | 2007-08-20 |
Family
ID=38371749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070015628A Ceased KR20070082055A (ko) | 2006-02-14 | 2007-02-14 | 기판 진공처리용 로드락 챔버 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20070082055A (ko) |
WO (1) | WO2007094616A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101049087B1 (ko) * | 2008-06-18 | 2011-07-15 | 최만호 | 진공챔버의 용접부 결합구조 |
KR20160043820A (ko) * | 2014-10-14 | 2016-04-22 | (주)트리플코어스코리아 | 플라즈마 처리 장치 |
KR20220082606A (ko) * | 2020-12-10 | 2022-06-17 | 주식회사 원익아이피에스 | 챔버벽체, 챔버 및 로드락모듈 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102622985B1 (ko) * | 2020-12-31 | 2024-01-11 | 세메스 주식회사 | 기판 처리 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001288232A1 (en) * | 2000-08-10 | 2002-02-25 | Tokyo Electron Limited | Method and apparatus for tuning a plasma reactor chamber |
JP2002164685A (ja) * | 2000-11-29 | 2002-06-07 | Matsushita Electric Ind Co Ltd | 真空処理装置と電磁シールド装置及び傾斜コイルばね |
KR20040037288A (ko) * | 2002-10-28 | 2004-05-07 | 삼성전자주식회사 | 플라즈마 처리장치 |
JP4258803B2 (ja) * | 2003-03-26 | 2009-04-30 | シーワイジー技術研究所株式会社 | 真空チャンバ組立体 |
-
2007
- 2007-02-14 WO PCT/KR2007/000794 patent/WO2007094616A1/en active Application Filing
- 2007-02-14 KR KR1020070015628A patent/KR20070082055A/ko not_active Ceased
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101049087B1 (ko) * | 2008-06-18 | 2011-07-15 | 최만호 | 진공챔버의 용접부 결합구조 |
KR20160043820A (ko) * | 2014-10-14 | 2016-04-22 | (주)트리플코어스코리아 | 플라즈마 처리 장치 |
KR20220082606A (ko) * | 2020-12-10 | 2022-06-17 | 주식회사 원익아이피에스 | 챔버벽체, 챔버 및 로드락모듈 |
Also Published As
Publication number | Publication date |
---|---|
WO2007094616A1 (en) | 2007-08-23 |
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Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20070214 |
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Comment text: Notification of reason for refusal Patent event date: 20080303 Patent event code: PE09021S01D |
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Patent event date: 20080509 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20080303 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |