KR20060127301A - 전자기기의 연성회로 - Google Patents
전자기기의 연성회로 Download PDFInfo
- Publication number
- KR20060127301A KR20060127301A KR1020050048281A KR20050048281A KR20060127301A KR 20060127301 A KR20060127301 A KR 20060127301A KR 1020050048281 A KR1020050048281 A KR 1020050048281A KR 20050048281 A KR20050048281 A KR 20050048281A KR 20060127301 A KR20060127301 A KR 20060127301A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit
- flexible circuit
- folded
- side connector
- connector
- Prior art date
Links
- 238000002788 crimping Methods 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- RYGMFSIKBFXOCR-BJUDXGSMSA-N copper-63 Chemical compound [63Cu] RYGMFSIKBFXOCR-BJUDXGSMSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Claims (7)
- 인쇄회로기판상에 구비된 회로기판 콘넥터와 전기적으로 연결되는 회로측 콘넥터를 구비한 연성회로로 구성된 전자기기의 연성회로에 있어서,상기 회로측 콘넥터에는 제 1, 2 압착부가 구비되고,상기 제 1, 2 압착부들의 사이 경계면에는 상기 회로기판 콘넥터에 상기 회로측 콘넥터를 체결시 발생하는 힘으로 인해 상기 압착부의 도금 경계면 대신 접히도록 한 접힘부가 구성되어짐을 특징으로 하는 전자기기의 연성회로
- 제 1 항에 있어서, 상기 접힘부에는 상기 회로측 콘넥터를 체결시 접힐 수 있도록 접힘공간이 제공되고,상기 접힘공간의 형상은 절곡되어 계단식으로 제공되어짐을 특징으로 하는 전자기기의 연성회로.
- 제 1 항에 있어서, 상기 제 1 압착부는 상기 접힘공간의 형상을 절곡시킬 수 있도록 다수개의 돌출부가 돌출되어짐을 특징으로 하는 전자기기의 연성회로.
- 제 1 항 또는 제 3 항에 있어서, 상기 제 2 압착부에는 상기 돌출부와 대응되게 삽입됨과 아울러 상기 접힘공간의 형상을 절곡시킬 수 있도록 다수개의 삽입부가 형성되어짐을 특징으로 하는 전자기기의 연성회로.
- 제 1 항에 있어서, 상기 접힘공간의 형상은 한쪽이 돌출되면 다른쪽을 삽입되는 지그재그로 이루어짐을 특징으로 하는 전자기기의 연성회로.
- 제 1 항에 있어서, 상기 접힘공간의 지그재그 형상은 직선 및 곡선으로 이루어짐을 특징으로 하는 전자기기의 연성회로.
- 인쇄회로기판상에 구비된 회로기판 콘넥터와 전기적으로 연결되는 회로측 콘넥터를 구비한 연성회로로 구성된 전자기기의 연성회로에 있어서,상기 회로측 콘넥터에는 적어도 하나 이상의 압착부가 구비되고,상기 압착부들의 사이 경계면에는 상기 회로기판 콘넥터에 상기 회로측 콘넥터를 체결시 발생하는 힘으로 인해 상기 압착부의 도금 경계면 대신 접히도록 접힘 수단이 구성되어짐을 특징으로 하는 전자기기의 연성회로
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050048281A KR100713536B1 (ko) | 2005-06-07 | 2005-06-07 | 전자기기의 연성회로 |
US11/344,123 US7447040B2 (en) | 2005-06-07 | 2006-02-01 | Flexible printed circuit board for electronic equipment |
CNA200610084635XA CN1878446A (zh) | 2005-06-07 | 2006-05-26 | 用于电子设备的柔性印刷电路板 |
JP2006152052A JP2006344950A (ja) | 2005-06-07 | 2006-05-31 | 電子機器のfpcb |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050048281A KR100713536B1 (ko) | 2005-06-07 | 2005-06-07 | 전자기기의 연성회로 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060127301A true KR20060127301A (ko) | 2006-12-12 |
KR100713536B1 KR100713536B1 (ko) | 2007-04-30 |
Family
ID=37510688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050048281A KR100713536B1 (ko) | 2005-06-07 | 2005-06-07 | 전자기기의 연성회로 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7447040B2 (ko) |
JP (1) | JP2006344950A (ko) |
KR (1) | KR100713536B1 (ko) |
CN (1) | CN1878446A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101449220B1 (ko) * | 2010-01-06 | 2014-10-08 | 애플 인크. | 인쇄 회로 기판 |
Families Citing this family (18)
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US7477521B2 (en) * | 2007-05-15 | 2009-01-13 | Acterna Llc | Isolating stress on a printed circuit board |
KR100904710B1 (ko) | 2007-11-01 | 2009-06-29 | 삼성에스디아이 주식회사 | 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩 |
US8238087B2 (en) | 2010-01-06 | 2012-08-07 | Apple Inc. | Display module |
TWI392409B (zh) * | 2009-05-26 | 2013-04-01 | Wistron Corp | 電子裝置及其軟性電路板 |
CN101877933B (zh) * | 2009-12-02 | 2012-06-27 | 友达光电股份有限公司 | 柔性电路板 |
US8345410B2 (en) * | 2010-01-06 | 2013-01-01 | Apple Inc. | Handheld computing device |
US8432678B2 (en) | 2010-01-06 | 2013-04-30 | Apple Inc. | Component assembly |
US8213168B2 (en) * | 2010-01-06 | 2012-07-03 | Apple Inc. | Assembly of a display module |
US9210240B2 (en) | 2010-02-15 | 2015-12-08 | Blackberry Limited | Portable slidable electronic device having a dynamic flex alignment scheme and methods of assembling same |
KR102105462B1 (ko) * | 2013-08-12 | 2020-04-28 | 엘지전자 주식회사 | 이동 단말기 |
EP4039322B1 (en) | 2014-02-24 | 2023-09-06 | Element Science, Inc. | External defibrillator |
CN103974533B (zh) * | 2014-04-30 | 2017-03-15 | 苏州倍辰莱电子科技有限公司 | 一种折叠式双层印刷电路板 |
US20150373830A1 (en) * | 2014-06-19 | 2015-12-24 | Kabushiki Kaisha Toshiba | Composite substrate including foldable portion |
CA2994436A1 (en) | 2015-08-26 | 2017-03-02 | Element Science, Inc. | Wearable devices |
JP2019140356A (ja) * | 2018-02-15 | 2019-08-22 | シャープ株式会社 | フレキシブル回路基板 |
JP2022504629A (ja) | 2018-10-10 | 2022-01-13 | エレメント サイエンス,インク | 使い捨て部品と再使用可能部品を備えたウェアラブル医療機器 |
KR20210064474A (ko) | 2019-11-25 | 2021-06-03 | 삼성디스플레이 주식회사 | 연성 인쇄회로기판 및 이를 포함하는 표시 장치 |
CN113839239A (zh) * | 2020-06-24 | 2021-12-24 | 富士康(昆山)电脑接插件有限公司 | 电路板连接组合 |
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-
2005
- 2005-06-07 KR KR1020050048281A patent/KR100713536B1/ko not_active IP Right Cessation
-
2006
- 2006-02-01 US US11/344,123 patent/US7447040B2/en not_active Expired - Fee Related
- 2006-05-26 CN CNA200610084635XA patent/CN1878446A/zh active Pending
- 2006-05-31 JP JP2006152052A patent/JP2006344950A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101449220B1 (ko) * | 2010-01-06 | 2014-10-08 | 애플 인크. | 인쇄 회로 기판 |
Also Published As
Publication number | Publication date |
---|---|
US20060285302A1 (en) | 2006-12-21 |
KR100713536B1 (ko) | 2007-04-30 |
JP2006344950A (ja) | 2006-12-21 |
CN1878446A (zh) | 2006-12-13 |
US7447040B2 (en) | 2008-11-04 |
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