KR20060056598A - Filter Package and Package Lead Manufacturing Method - Google Patents

Abstract

The present invention relates to a filter package and a package lead manufacturing method capable of maintaining uniform cavity formation and airtightness.

The filter package according to the present invention includes a circuit board, a filter mounted on the circuit board, a photosensitive film dam formed on the filter, and a resin-based adhesive film adhered to the photosensitive film dam to seal the pattern portion of the filter. The lead is included, and in particular, the resin-based adhesive film is made of either a dry film or a uniformly applied paste.

Accordingly, the airtightness of the cavity of the saw filter package formed by surrounding the photosensitive film dam formed on the filter and the adhesive layer of the resin series is increased, thereby making it possible to manufacture a saw filter package having improved reliability.

Saw filter, package, film, cavity

Description

Filter package and package lead manufacturing method {FILTER PACKAGE AND METHOD FOR MANUFACTURING PACKAGE LID}             

1 shows a saw filter package according to the prior art;

2a to 2d are views illustrating a structure of a saw filter package and a method of manufacturing the same according to the present invention.

3A to 3E illustrate a method of manufacturing a filter package lead according to an embodiment of the present invention.

4A to 4E are views illustrating a method of manufacturing a filter package lead according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

200: circuit board 211a, 211b: foot pad

212a and 212b: internal electrode 213: wire

215: filter adhesive 220: saw filter

221: photosensitive film dam 230,330,430: lid

240, 340, 440: adhesive layer 250: mold part

The present invention relates to a filter package and a package lead manufacturing method capable of maintaining uniform cavity formation and airtightness.

Background Art In recent years, with the development of mobile communication systems, mobile communication devices such as mobile phones and portable information terminals are rapidly spreading, and the demand for miniaturization and high performance of these devices has been required to reduce the size and performance of components used therein. In addition, two types of wireless communication systems, analog and digital, are used in mobile telephones, and the frequencies used for wireless communication are also in the 800 MHz to 1 GHz band and the 1.5 GHz to 2.0 GHz band.

In particular, surface acoustic wave (SAW) filters are widely used as band pass filters in communication devices and other electronic devices. SAW filters include a lateral SAW filter having two interdigital transducers (IDTs) arranged at a predetermined distance on a piezoelectric substrate, and a SAW resonator filter constituting a resonator on a piezoelectric substrate.

As SAW resonator filters, a single-sided reflection SAW resonator filter using love waves, BGS (Bluestein-Gulyaev-Shimuzu) waves, and SH (Shear Horizontal) surface acoustic waves is known.

Recently, a duplexer has been manufactured and used as a chip so that only a signal of a certain frequency band can be filtered or transmitted when a signal is transmitted from a communication device or only a signal of a certain frequency band is received when a signal is transmitted.

In addition, a film type bulk acoustic resonator (FBAR), which is a mobile communication component, has been developed. The FBAR filter extracts only a specific frequency, removes noise, and improves sound quality while receiving a high frequency of 1 to 15 kHz. It is a next-generation filter that is smaller and lighter than 1 / 10th of a size and smaller than existing SAW filter and ceramic filter by thinning by sputtering process of semiconductor as a core component that functions. This is a complementary metal oxide semiconductor (CMOS) process is evaluated as a technology capable of a single-chip high-frequency integrated circuit (MMIC: Microwave Monolithic IC) of the RF stage of wireless communication.

In the above, described Saw-duplexer is used as such for the time delay for the intermediate-frequency filter of an image on a television, and a signal, the arrangement of the electrical input signal to the piezoelectric body, such as modified or LiTaO _3, LiNbO ₃ machine An input converter for converting vibration and an output converter configured to oppose and converting mechanical vibration into an electrical signal and outputting the load to the load are formed. Spaced apart.

The saw duplexer having such a structure is sealed in one package by combining two separate saw filters and a phase shifter composed of strip lines.

1 illustrates a saw filter package according to the prior art.

As shown in FIG. 1, the saw filter package according to the related art includes a substrate package 110 for mounting a saw filter and a film bulk acoustic resonator (FBAR) filter that is a mobile communication component. do.

The substrate package 110 is formed of a multilayer ceramic substrate, and signal wires are formed to mount the saw filter.

The signal wires are electrically connected to internal electrodes 112a and 112b formed inside the substrate package 110 and foot pads 111a and 111b formed outside the substrate package 110 through via holes.

The saw filter 120 is mounted on the substrate package 110 on which the internal electrodes 112a and 112b and the foot pads 111a and 111b are formed, and the saw filter 120 and the substrate package 110 are mounted. The wire 113 is bonded so as to be electrically connected.

A dam is formed at the side of the substrate package 110, and a lid 130 forms a cover at the top to form a saw filter package.

The lid 130 is covered to prevent foreign matter from entering the inside of the substrate package 110 and to prevent the saw filter 120 from being damaged.

Since the saw filter 120 is a filter using surface acoustic waves, an air cavity is formed between the lead 130 and the inside of the substrate package 110.

However, since the saw filter package having the structure as described above is formed in a form in which the lead 130 is attached to the substrate package 110, it is difficult to maintain hermetic inside the saw filter package.

In particular, if the air layer interposed between the saw filter 120 and the lead 130 does not maintain hermeticity, it becomes difficult to maintain the reliability of the saw filter package.

SUMMARY OF THE INVENTION An object of the present invention is to provide a filter package having improved airtightness, in which a dam is provided on a filter and a lead having strong adhesion to the dam is attached.

It is another object of the present invention to provide a method for producing a lead of a filter package used to improve the airtightness of the filter package cavity.

The filter package according to the present invention for achieving the above object, the circuit board, the filter mounted on the circuit board, the photosensitive film dam formed on the filter, the photosensitive film dam is bonded to the pattern portion of the filter It is characterized in that it comprises a lead with a resin-based adhesive film is sealed.

The resin-based adhesive film is any one of a dry film or a uniformly applied paste.

On the other hand, the filter package lead manufacturing method according to the present invention for achieving the above another object, the step of adhering the lead to a dry film provided on the separator, and separating the lead to which the dry film is bonded from the separator Attaching the lead to which the dry film is adhered to an ultraviolet tape, dicing the lead to which the dry film adhered to the ultraviolet tape is bonded into a plurality of pieces of lead and the dicing the And separating the plurality of lead pieces from the ultraviolet tape.

In addition, the method for manufacturing a filter package lead according to another embodiment of the present invention for achieving the above object is the step of applying a paste on the lead, the step of screen printing the applied paste to a constant thickness, and the application Adhering the pasted paste to a lead, adhering the lead to which the paste is adhered to an ultraviolet tape, dicing the lead to which the paste adhered to the ultraviolet tape is bonded into a plurality of lead pieces; and And separating the diced plurality of lead pieces from the ultraviolet tape.

The dry film and the applied paste is characterized in that the resin-based material.

According to the present invention as described above, the air layer airtightness of the upper part of the filter mounted by the photosensitive film dam formed on the filter of the lead and the package of the resin-based adhesive film attached to the lead can be further improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2D are views illustrating a structure of a saw filter package and a method of manufacturing the same according to the present invention.

As shown in FIG. 2A, the saw filter 220 is formed using a filter adhesive 215 on a circuit board 200 on which signal patterns are formed and internal electrodes 212a and 212b connected to the signal patterns are formed. Implement                     

Instead of the saw filter 220, a film-type optimal elastic resonator (FBAR) filter or a bulk acoustic wave (BAW) filter, which is a mobile communication component, may be mounted.

In addition, foot pads 211a and 211b are formed on an outer surface of the circuit board 200 to electrically connect with external terminals.

The saw filter 220 is coated with a photo resistor on the saw filter 220 by a semiconductor processing method, and then exposed and developed the photo filter film to form an air layer region. 221 is formed.

As shown in FIG. 2B, the saw filter 220 in which the photosensitive dam 221 is formed, has a wire 213 for electrical connection with internal electrodes 212a and 212b formed on the circuit board 200. ) The bonding process is performed.

As described above, when the sawing filter 220 and the wire 213 bonding process of the internal electrodes 212a and 212b are completed, as shown in FIG. 2C, a lead is formed on the saw filter 220 in which the photosensitive film dam 213 is formed. To form 230.

The lead 230 has a glass-based film structure.

In order to form the lead 230 on the saw filter 220, a glue film or a resin-based adhesive film 240 is formed on the lead 230, and then the photosensitive film dam 221 on the saw filter 220 is formed. A capping process is attached to the c). The lead 230 using the resin-based adhesive film will be described later.

By the capping process, the top surface of the saw filter 200, the photosensitive film dam 220, and the lead 230 form an air layer, so that the saw filter 200 can properly exhibit its function.

As described above, when the lead 230 is formed on the photosensitive film dam 221 formed on the saw filter 220, an epoxy resin or the like is used to surround the circuit board 200 and the lead 230, and the like. To form the molding part 250.

Since the molding part 250 covers the saw filter 220 and the entire lead 230 mounted on the circuit board 200, the airtightness of the air layer formed by the photosensitive film dam 221 is further improved. do.

By the above process, the filter package according to the present invention as shown in Figure 2d is manufactured.

On the other hand, SAW filter or BAW filter uses the principle of surface acoustic wave, so an air layer is formed on the surface of the resonator, and this air layer structure is tested for airtightness according to the Joint Electron Device Engineering Council (JEDEC) standard in terms of reliability. Pass the Pressure Cooker Test (PCT).

With respect to the completed filter package according to the present invention manufactured according to the above manufacturing method, as described above, the glue 230 and the resin-based adhesive film 240 is attached to the lead 230 to the photosensitive film The autoclave test, a kind of PCT, was performed on the filter package attached to the dam 221.

In this test, PCT conditions were 121 degreeC, 99.8%, and 48 hours. The PCT result when the pass criterion was set to be within 150% of the peak IL variation was significantly different depending on the adhesive film attached to the lead 230.                     

When the glue film was attached to the lead 230 and adhered onto the photosensitive film dam 221, 60% was determined as pass.

When the resin-based adhesive film was attached to the lead 230 and adhered onto the photosensitive film dam 221, 100% of the total was determined to pass.

As described above, a method of manufacturing a filter package lead according to the present invention having a satisfactory effect will be described with reference to the accompanying drawings.

3A to 3E are views illustrating a method of manufacturing a filter package lead according to an embodiment of the present invention.

In manufacturing the filter package lead according to an embodiment of the present invention, as shown in Figure 3a, first to prepare a dry film 340 to be used as an adhesive film on the separator 300. The dry film 340 is a resin-based film, it is preferable that the thickness has a range of 20 ~ 70 ㎛.

Thereafter, the lead 330 is attached to the dry film 340 as shown in FIG. 3B. The step of adhering the lead 330 to the dry film 340 is using a heater 380 and the pressurizer 370 to increase the mutual adhesion, at a pressure of 0.2 ~ 0.5 MPa at a temperature of 75 ~ 95 ℃ Preheat for 3 to 5 seconds. Preferably the temperature conditions are carried out at 80 ~ 90 ℃.

After the step of adhering the lead 330 to the dry film 340, the separation plate 300 used for the adhesion is removed to leave only the lead 330 to which the dry film 340 is attached.                     

When the removal of the separator 300 is completed and only the lid 330 to which the dry film 340 is attached remains, as shown in FIG. 3D, the lid 330 to which the dry film 340 is attached has a required size. Adhesion to ultraviolet (UV) film 360 for cutting. At this time, the surface of the dry film 340 is fixed to contact with the ultraviolet film (360).

When the lead 330 to which the dry film 340 is attached is fixed to the ultraviolet ray film 360 by the above process, cutting is performed to fit the patterned photoresist film using a cutting device such as a diamond knife as shown in FIG. 3E. Let's do it.

After the cutting process of the lead 330 to which the dry film 340 is attached is completed, ultraviolet light is irradiated to remove the ultraviolet film 360 used for the cutting process. Thereby, the lead piece 330a with the dry film of the size suitable for a use purpose can be obtained.

In the above, an embodiment using a resin-based dry film 340 as an adhesive film has been described. However, the method for manufacturing a filter package lead according to the present invention is not limited thereto.

4A to 4E are diagrams illustrating a method of manufacturing a lead of a filter package according to another exemplary embodiment of the present invention.

In the method of manufacturing a filter package lead according to another embodiment of the present invention, as shown in FIG. 4A, first, a resin-based adhesive 440 to be used as an adhesive film is coated on the lead 430. To this end, after the mask 471 is installed on the lead 430, the resin-based adhesive 440 is administered in a predetermined amount.                     

The adhesive applied by the step of applying the resin-based adhesive 440 is such that the height of the surface film as a whole is not constant.

The resin-based adhesive 440 having a non-uniform film height applied on the lead 430 is made to have a film having a uniform height as shown in FIG. 4B by using a rubber stick 472 or the like. At this time, the thickness of the film is preferably to have a range of 20 ~ 70 ㎛.

After the resin-based adhesive film 440 having a uniform thickness of a predetermined thickness is formed on the lead 430, for good adhesion between the lead 430 and the resin-based adhesive film 440. The adhesion strengthening process is performed as in FIG. 4C. For this purpose, it is preferable to perform preheating for 3 to 5 seconds using a heater 480 at a temperature of 75 to 95 ℃. Preferably the temperature conditions are carried out at 80 ~ 90 ℃.

After the lead 430 and the resin-based adhesive film 440 are properly adhered by the preheating process, the lead 430 to which the resin-based adhesive film 440 is attached is cut to a required size. In order to make it adhere to the ultraviolet (UV) film 460 as shown in Figure 4d. At this time, the surface of the dry film 440 is fixed to contact with the ultraviolet film 460.

When the lead 430 to which the resin-based adhesive film 440 is attached is fixed to the ultraviolet ray film 460 by the above process, as shown in FIG. 4E, the size of the photosensitive film patterned using a cutting device such as a diamond knife is used. Cut appropriately.

After the cutting process of the lead 430 to which the resin-based adhesive film 440 is attached is completed, ultraviolet light is irradiated to remove the ultraviolet film 460 used for the cutting process. As a result, a large number of lead pieces 430a having a dry film having a size suitable for the purpose of use can be obtained.

The lead piece 330a to which the resin-based dry film 340 is attached and the lead piece 430a to which the resin-based adhesive film 440 is attached are manufactured as described above. Bonding on the photosensitive film dam 221 in one capping process causes the cavity to be sufficiently sealed to be formed on the surface of a resonator such as a SAW filter or a BAW filter required by the JEDEC standard.

As described in detail above, the present invention is a saw filter package formed by enclosing a lead made of a resin-based dry film or a glass-based film having a resin-based adhesive film or the like adhered to a photosensitive film dam. The increased tightness of the cavity allows for the manufacture of highly reliable saw filter packages.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims (9)

A circuit board; A filter mounted on the circuit board; A photoresist dam formed on the filter; And a lid having a resin-based adhesive film attached to the photosensitive film dam. The filter package according to claim 1, wherein the resin-based adhesive film is any one of a dry film or a uniformly applied paste. Adhering a lead to a dry film provided on a separator; Separating the lead to which the dry film is adhered from the separator; Attaching the lead to which the dry film is adhered, to an ultraviolet tape; Dicing the lead to which the dry film bonded to the ultraviolet tape is bonded into a plurality of lead pieces; And And separating the diced plurality of lead pieces from the ultraviolet tape. The method of claim 3, wherein the attaching the lead to the dry film comprises: A method of manufacturing a filter package lead, wherein preheating is performed at a temperature of 75 to 95 ° C. for a pressure of 0.2 to 0.5 MPa for 3 to 5 seconds. The method of claim 3, wherein the dry film is a resin-based material. The method of claim 3, wherein the dry film has a thickness of 20 μm to 70 μm. Applying a paste on the lid; Screen printing the applied paste to a constant thickness; Adhering the applied paste to a lead; Attaching the lead to which the paste is attached to an ultraviolet tape; Dicing the lead bonded to the ultraviolet tape to a plurality of lead pieces; And And separating the diced plurality of lead pieces from the ultraviolet tape. 8. The method of claim 7, wherein the applied paste is a resin-based material. The method of claim 7, wherein the applied paste has a thickness of 20 to 70 μm.

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