KR20060048853A - Substrate Processing Equipment - Google Patents

Abstract

According to the processing speed of the plasma processing apparatus, there is provided a substrate processing apparatus capable of increasing the processing speed in another processing apparatus.

The substrate processing apparatus includes a pair of cassettes (1, 1), a carrying in / out device (2), a pair of cleaning devices (liquid supply) (3, 3), a handling robot (4), a cooling device (5), a pair of rods The lock chambers 6 and 6 and a pair of ashing devices (plasma processing devices) 7 and 7 are arranged. The cooling apparatus 5 is equipped with the cool plate 51 which coolant circulates, and the lifting pin 52 which mounts the board | substrate W on this cool plate 51. As shown in FIG. In particular, the cool plate 51 is formed in two stages up and down, and allows the lifting pins 52 to pass through the through holes 53 formed in the respective cool plates 51, and the lifting pins 52 have a common support member. It attaches to (54), and drives the cylinder unit to raise and lower the support member 54, and it is made to raise and lower two board | substrates W simultaneously. Moreover, the washing | cleaning apparatus 3 which becomes the cup 31 and the chuck 2 is also multistage similarly to the cooling apparatus 5. As shown in FIG.

Plasma Processing Equipment, Substrate Processing Equipment, Chuck, Cup, Cleaning Equipment

Description

Substrate treatment apparatus

1 is an overall plan view of a substrate processing apparatus of the present invention.

FIG. 2 is a diagram showing a plasma processing apparatus that forms part of the substrate processing apparatus of the present invention. FIG.

3 is a side view of a cooling apparatus that forms part of the substrate processing apparatus of the present invention.

4 (a) and 4 (b) are side views of another embodiment of a cooling device.

Fig. 5 is a side view of the liquid processing apparatus that forms part of the substrate processing apparatus of the present invention.

6 is an enlarged cross-sectional view of the liquid processing apparatus.

FIG. 7 is the same view as FIG. 6 showing another embodiment of the liquid treatment apparatus.

Explanation of the sign

One … cassette

2 … Import / Export Device

 21. rail

 22. 3-axis robot

3…. Cleaning device (liquid supply device)

 31. Cup

 32. Chuck

 32a... Rectifying plate

 33. Lifting member

 34. Cylinder unit

 35. Support pillar

 36. Horizontal arm

 37. Cleaning liquid supply nozzle

 38. Tubular part

 39. Temperature control member

 40…. Drain hole

 41…. Fixing member

 42. Cavity support pillar

 43. Cavity-shaped cancer

 44. driving axle

 45.. Universal joint

 46. bearing

 47. Driving pulley

 48. Driven pulley

 49. Timing belt

4 … Handling robot

 4a... cancer

 4' … Stock point

5... Chiller

 51. Cool plate

 52... Lifting pin

 53. Through hole

 54. Support member

6. Loadlock chamber

 61. Robot in Roadlock Room

7. Ashing device (plasma processing device)

 71. Base

 72. table

 73. Opening

 74. Chamber

 75... induction coil

 76. Electrostatic shielding

 77. Reaction gas inlet

W… Board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus that performs a series of processes from a plasma process such as ashing to a liquid process such as cleaning for a substrate such as a semiconductor wafer.

As disclosed in Patent Literatures 1 to 3, after a plasma treatment such as ashing or etching is performed on a substrate such as a semiconductor wafer or a glass substrate, cooling or cleaning is performed by an apparatus arranged near the plasma processing apparatus. .

That is, Patent Document 1 shows a layout in which an etching apparatus and an ashing apparatus are disposed as a load lock chamber and a plasma processing apparatus around a conveyance transfer robot, and a cleaning apparatus is further disposed at a location away from them. have.

In Patent Document 2, an indexer robot and a processor robot are installed to be movable in a direction orthogonal to each other, a cassette is arranged along the moving direction of the indexer robot, and the moving direction of the processor robot is adjusted. Accordingly, a layout in which a plasma processing apparatus and a plurality of liquid phase processing apparatuses are arranged is shown.

Patent Literature 3 discloses a layout in which an ashing plasma processing apparatus, a cooling device, a surface scrubber, and a back side scrubber are disposed around a transfer robot.

[Patent Document 1] Japanese Patent Application Laid-Open No. 11-003925

[Patent Document 2] Japanese Patent Laid-Open No. 2003-115525

[Patent Document 3] Japanese Patent Laid-Open No. 2003-257945

According to the apparatus disclosed in Patent Documents 1 to 3 described above, the processes from plasma processing such as ashing to washing can be continuously performed. However, since the time required for ashing and etching is usually shorter than the time required for cooling and cleaning, throughput as a whole of the process is not the best.

In order to solve the above problems, the substrate processing apparatus of the present invention includes a plasma processing apparatus for performing plasma processing on a substrate, a cooling apparatus for cooling the substrate on which the plasma processing is completed, and a liquid supply apparatus for supplying a cleaning liquid to the substrate after cooling. In addition, the cooling device and the liquid supply device were multistage.

As the said cooling apparatus, the structure provided with the cool plate of several stages and the lifting pin which raises and lowers a board | substrate simultaneously with respect to these multiple stage cool plates can be considered.

The liquid supply apparatus includes a liquid supply nozzle at each stage, a cup surrounding the attention of the substrate, and a chuck for holding and rotating the substrate, wherein the cup and the chuck are separated, and all the cups are raised and lowered integrally. It is conceivable that the structure is supported by the lift member so as to be possible, and all the chucks are supported by the stationary member and at the same time the rotational driving force is diverged from the drive shaft disposed in the vertical direction.

Moreover, as a layout of each apparatus, it is preferable to arrange a transfer robot in the center, and arrange | position the said plasma processing apparatus, a cooling apparatus, and a liquid supply apparatus around this transfer robot, Furthermore, the substrate processing apparatus of this invention is ashing-processed. Is especially available to.

EMBODIMENT OF THE INVENTION Below, the Example of this invention is described based on an accompanying drawing. 1 is an overall plan view of a substrate processing apparatus of the present invention, in order from left to right in the drawing, a pair of cassettes (1, 1), a carrying in / out device (2), a pair of cleaning devices (liquid supply device) ( 3, 3, the handling robot 4, the cooling device 5, a pair of load lock chambers 6 and 6, and a pair of ashing devices (plasma processing devices) 7 and 7 are arranged.

The carry-in / out device 2 is attached to the rail 21 so that the three-axis robot 22 can run, and takes out the unprocessed board | substrate W in one cassette 1, and handles it through the stock point 4 '. At the same time, the processed substrate W is received from the handling robot 4 via the stock point 4 'and delivered to the other cassette 1.

The handling robot 4 includes two arms 4a of freely stretchable material on a base rotatable 360 °, and the unprocessed substrate W received from the three-axis robot 22. Is passed to the robot 61 arranged in one load lock chamber 6 of the pair of load lock chambers 6.

The robot 61 then carries the unprocessed substrate W into the ashing device 7 disposed behind the load lock chamber 6. As shown in FIG. 2, the ashing apparatus 7 forms an opening 73 in the base 71 with the table 72 facing from the bottom, and covers the opening 73 with the chamber 74 above the base 71. ), The induction coil 75 connected to the high frequency power supply is wound around the chamber 74 and an electrostatic shield 76 is provided between the induction coil 75 and the chamber 74. Further, the reaction gas inlet 77 is connected to the ceiling of the chamber 74.

Since the temperature of the ashed substrate W in the ashing device 7 rises to about 200 ° C, non-uniformity in temperature distribution occurs when immediately washed. Therefore, the said processed substrate W is sent to the cooling apparatus 5 by the said robot 61 and the handling robot 4, and it is forcibly cooled to room temperature (about 23 degreeC).

As shown in FIG. 3, the cooling apparatus 5 is equipped with the cool plate 51 which coolant circulates, and the lifting pin 52 which mounts the board | substrate W on this cool plate 51. As shown in FIG. In particular, in this embodiment, the cool plate 51 is made up and down in two stages, and the lifting pins 52 are inserted through the through holes 53 formed in the respective cool plates 51, and the lifting pins 52 are each. Is attached to the common support member 54, and the support unit 54 is moved up and down by driving a cylinder unit (not shown) to move the two substrates W up and down at the same time.

That is, in the present embodiment, since the two substrates W are simultaneously processed by the pair of ashing apparatuses 7, 7, the two substrates W are simultaneously cooled in the cooling apparatus 5 as well.

However, as described above, the time required for the cooling treatment is longer than the time required for the ashing treatment. Therefore, in consideration of the overall efficiency, as shown in Fig. 4 (a), the cool plate 51 is arranged in four stages at the top and bottom, and a total of four pieces of two are simultaneously or slightly cooled at a time, or the same degree ( As shown in b), the structure which cools the cool plate 51 to 6 steps | pieces up and down, and cools 6 pieces of a total of 2 pieces simultaneously or slightly with time difference is also possible.

Next, the structure of the liquid processing apparatus (liquid supply apparatus) 3 is demonstrated based on FIG. 5 is a side view of the liquid processing apparatus, FIG. 6 is an enlarged cross-sectional view of the liquid processing apparatus, and FIG. 7 is the same view as FIG. 6 which shows another embodiment of the liquid processing apparatus.

The liquid processing apparatus 3 is comprised of the cup 31 surrounding the periphery of the board | substrate W, and the chuck 32 which hold | maintains and rotates the board | substrate W, and the cup 31 can raise and lower with respect to the chuck 32. It is supposed to be done. In addition, although the number of the cups 31 was two, you may be more than this like the said cool plate.

Each cup 31 is supported by the elevating member 33. The lifting member 33 moves up and down along the support pillar 35 by the driving of the cylinder unit 34. The lifting member 33 is provided with an arm 36 in the horizontal direction, and the cup 31 is fixed to the arm 36. Further, a cleaning liquid supply nozzle 37 is attached to the arm 36, and the front end of the cleaning liquid supply nozzle 37 coincides with the center of the chuck 32. In addition, the cleaning liquid supply nozzle 37 may be fixed to the member on which the chuck 32 is fixed, not the arm 36.

The upper end of the cup 31 is integrally formed with a tubular portion 38 extending upwardly, and the temperature control member 39 is disposed in the cup 31, and the bottom of the cup 31 is also provided. The drain hole 40 is opened in the surface, and the waste liquid pipe which is not shown in figure is connected to this drain hole 40.

On the other hand, the chuck 32 is supported by the fixing member 41. The fixing member 41 is a cavity-shaped arm 43 extending in the horizontal direction with the cavity-shaped support column 42 in the vertical direction, and the drive shaft 44 rotated by a motor (not shown) in the cavity-shaped support column 42. Is arranged in the vertical direction.

The drive shaft 44 is divided in each stage, and the divided drive shaft 44 is connected by the universal joint 45, and is supported by the bearing 46 for rotation freely. In addition, the drive pulley 47 is fixed to the divided drive shaft 44, and the driven pulley 48 is fixed to the shaft of the chuck 32, and the drive pulley 47 and the driven pulley 48 are tightened. The installed timing belt 49 is housed in the cavity arm 43.

In the above, the cylinder unit 34 is reduced and the upper and lower cups 31 are simultaneously lowered by about 15 mm. By this operation, the upper end surface of the chuck 32 is slightly above the upper end of the cup 31. In this state, the substrate W is placed on the chuck 32 and suction-fixed thereto.

Then, the cylinder unit 34 is extended to raise the upper and lower cups 31 integrally, and the substrate W is stored in the cup 31. In this state, a developer is dropped from the cleaning liquid supply nozzle 37 to the center of the surface of the substrate W, and a motor (not shown) is driven to drive the drive shaft 44 and the timing belt 49. The chuck 32 (substrate W) is rotated so that the cleaning liquid is evenly spread on the surface of the substrate W. As shown in FIG.

Fig. 7 shows a separate embodiment, which omits the cylindrical portion 38 and the temperature regulating member 39, instead of a rectifying plate on the outer periphery of the chuck 32. 32a is provided.

According to the present invention, there is provided a substrate processing apparatus having a plasma processing apparatus, a cooling apparatus for cooling the substrate on which the plasma processing is completed, and a liquid supply apparatus for supplying a cleaning liquid or the like to the substrate after cooling, wherein Since the apparatus for cooling and supplying liquid having a slow tack time is used in multiple stages, the occupied area can be kept and the tack time can be matched to the fastest processing speed, thereby achieving the fastest throughput.

Claims (5)

A substrate processing apparatus comprising a plasma processing apparatus for performing plasma processing on a substrate, a cooling apparatus for cooling the substrate on which the plasma processing is completed, and a liquid supply apparatus for supplying a cleaning liquid or the like to a substrate after cooling, wherein the cooling apparatus and liquid Substrate processing apparatus, characterized in that the supply device is a multi-stage. 2. The substrate processing apparatus of claim 1, wherein the cooling apparatus includes a plurality of stage cool plates and a lift pin for moving the substrate up and down simultaneously with the plurality of stage cool plates. 2. The substrate processing apparatus of claim 1, wherein the liquid supply device includes a liquid supply nozzle at each stage, a cup surrounding the substrate, and a chuck holding and rotating the substrate, wherein the cup and the chuck are separated and all the cups are separated. Is supported by the elevating member so as to be capable of elevating integrally, and all the chucks are supported by the fixing member and at the same time, the rotational driving force is branched and transmitted from the drive shaft disposed in the vertical direction. The substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate processing apparatus has a transfer robot disposed at the center thereof, and the plasma processing apparatus, the cooling apparatus, and the liquid supply apparatus are arranged around the transfer robot. Substrate processing equipment, characterized in that. The substrate processing apparatus of any one of claims 1 to 4, wherein the plasma processing is ashing processing.

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