KR20050059621A - Nest fixture used for manufacturing stacked semiconductor chip package - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nest fixture for guiding the stacking of a unit semiconductor chip package in the manufacture of a laminated package. The present invention relates to a nested ring having a window formed therein and adjacent to two windows facing each other. The unit fixture includes a nest fixture body in which bar mounting grooves are formed, and a plurality of removable guide bars coupled to opposite mounting grooves opposite to each other and crossing the window, and adjacent to the unit guides by neighboring removable guide bars. The chip package and the flexible circuit board are inserted to form a stacking guide hole for guiding the stacking. According to this, the manufacturing cost and manufacturing time of the nest fixture can be reduced, a high quality nest fixture can be obtained, and the cleaning work on the nest fixture can be made perfectly and easily. In addition, by replacing the guide bar at a suitable time, it is possible to prevent the package quality defects generated during the package stacking process by preventing the stacking failure due to the contaminant or nest fixture deformation.

Description

Nest fixture used for manufacturing stacked semiconductor chip package

The present invention relates to a lamination package manufacturing apparatus, and more particularly, a nest fixture for guiding lamination of a unit semiconductor chip package in a lamination package manufacturing implemented by vertically laminating a plurality of unit semiconductor chip packages. ).

Recently, in accordance with the development of the semiconductor industry and the demands of users, electronic devices are increasingly required to be smaller and lighter. Accordingly, one of the developed technologies is a three-dimensional stacking technology in which a plurality of unit semiconductor devices or unit semiconductor chip packages are stacked in order to increase capacity and mounting density.

Packages manufactured with three-dimensional stacking technology are commonly referred to as three-dimensional packages and were first introduced by IBM. In addition to the high integration, the three-dimensional package technology has advantages such as improved electrical characteristics and low power consumption by reducing the overall interconnect length. In the implementation of such a stacking technology, a technique for stacking a plurality of unpacked semiconductor devices requires a number of necessary technologies, such as manufacturing a known good die, which has proven reliability. Therefore, there is a high possibility of realizing a package stacking technique formed by stacking a plurality of unit semiconductor chip packages in which individual assembly processes are completed.

1 is a cross-sectional view showing an example of a typical laminated package. The stacked package 10 shown in FIG. 1 is a representative example in which a three-dimensional stacking technology is applied. A plurality of unit semiconductor chip packages 11 and 21 having the same storage capacity, for example, two are used by using the flexible circuit board 30. It is laminated in three dimensions.

Each of the unit semiconductor chip packages 11 and 21 has a structure in which the semiconductor chips 12 and 22 are attached to the bottom surfaces of the inner leads 13 and 23, and the semiconductor chip packages 11 and 21 are interposed therebetween. It is laminated vertically by the adhesive layer 33 of the intervening flexible circuit board 30. The electrical interconnection between the packages is made by attaching the beam leads 31 of the flexible circuit board 30 to the upper and lower semiconductor chip package outer leads 11 and 21. The outer lead 14 of the upper semiconductor chip package 11 and the outer lead 24 of the lower semiconductor chip package 21 may be elastically contacted, and the upper and lower semiconductor chip package outer leads 14 and 24 may be elastically contacted. In order to compensate for the positional difference therebetween, the beam lead 31 is shaped into a "??" shape.

In the multilayer package manufacturing process, a forming step for the flexible circuit board and a plasma cleaning step for the unit semiconductor chip package are preceded, and then the unit semiconductor chip packages are laminated through the flexible circuit board. After the soldering step, the cleaning step and the test step, etc. are configured.

The stacking of the unit semiconductor chip packages in the stack package manufacturing process is performed by applying a high-temperature atmosphere condition and applying pressure in a state in which the stacks are vertically aligned through a flexible circuit board having an adhesive layer formed between the unit semiconductor chip packages. This is done by having a combination. Since alignment of the unit semiconductor chip packages and the flexible circuit board is important in this process, a nest fixture is installed in the package stacking facility to guide the alignment of the unit semiconductor chip package and the flexible circuit board.

2 is a plan view of a nested fixture according to the prior art. As shown in FIG. 2, the nest fixture 210 according to the related art includes a plurality of stacked guide holes 215 corresponding to the sizes of unit semiconductor chip packages and a flexible circuit board in an integrated nest fixture body 211. It is a structure arranged in a matrix.

The nested fixture for the laminated package having such a structure is manufactured by forming a laminated guide hole in the nested fixture body in the form of a plate during its manufacturing process. In the formation of the laminated guide hole, first, by forming a fine hole through drilling in the area of the laminated guide hole to be formed, inserting a wire into the hole, and then applying different polarities to the wire and the nest fixture body. The wire cutting method of forming a laminated guide hole in the plate-shaped nest fixture body by applying a high temperature is used. Accordingly, the conventional nest fixture manufactured by using the wire cutting method has a problem that a lot of manufacturing time is required according to the precision processing using the wire cutting method. In addition, the nest fixture according to the prior art of such a structure has a problem that the cost is increased due to deformation and poor dimensions.

Furthermore, fumes are generated from the adhesive layer of the flexible circuit board interposed between the unit semiconductor chip packages stacked during the curing process after stacking the package, and the accumulation of these gases causes contaminants around the stacking guide holes of the nested fixture. The cleaning process for generating and removing them is carried out. In the case of the nest fixture according to the prior art, since the contaminants are not completely removed around the lamination guide holes, they are not inserted and discharged in the package lamination process. This can lead to poor package quality, such as poor lead bent.

Accordingly, an object of the present invention is to provide a nest fixture for manufacturing a laminated package that can reduce the cost and time required to fabricate the nest fixture, can be easily cleaned, and can prevent package quality defects generated during the package lamination process. Is in.

Nested fixture for lamination package according to the present invention for achieving the above object, the nest fixture body with a guide bar mounting groove is formed adjacent to the window at the two edge portions facing each other in the form of a rectangular ring formed with a window therein, Both end portions are coupled to the corresponding guide bar mounting grooves facing each other and include a plurality of removable guide bars crossing the window, and the unit semiconductor chip package and the flexible circuit board are inserted and stacked by neighboring removable guide bars. It characterized in that the laminated guide hole is formed to guide the.

Hereinafter, a nest fixture for a multilayer package according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view illustrating a nested fixture for a laminated package according to the present invention, Figure 4 is a partial cross-sectional view showing a state in which a package is laminated to the nested fixture for a laminated package according to the present invention. 3 and 4, the nested fixture 110 for a laminated package according to the present invention includes a nested fixture body 111 and a plurality of nested fixture guide bars 113 forming a skeleton.

The nest fixture body 111 has a rectangular rectangular ring shape and has a window 112 formed therein. A plurality of guide bar mounting grooves 113 are formed adjacent to the window 112 at two opposite edge portions. The size of the nest fixture 110 is determined in consideration of the number of stacking packages to be stacked at a time.

The nested fixture body 111 has both end portions coupled to guide bar mounting grooves 113 facing each other and facing each other, and a plurality of detachable guide bars 114 across the window 112 are coupled thereto. The adjacent removable guide bars 114 are inserted into the unit semiconductor chip packages 11 and 21 and the flexible circuit board 30 to form a stacking guide hole 115 through which stacking is guided. The removable guide bar 114 is inserted into each guide bar mounting groove 113 and fixed with a fastening member 116 such as a screw or bolt.

In the nested fixture for fixture 110 according to the present invention as described above, the removable guide bar 114 forming the laminated guide hole 115 can be separated and combined from the nest fixture body 111. The nest fixture body 111 and the removable guide bar 114 can be easily manufactured by polishing using a cutting wheel without using wire cutting, respectively, and the nest fixture body 111 manufactured accordingly. And the removable guide bar 114 has a good surface roughness. If deformation occurs or a contaminant is formed in a predetermined removable guide bar 114 of the laminated guide hole 115, the removable guide bar 114 may be replaced. In addition, when the cleaning of the nest fixture 110 is performed, the removable guide bar 114 and the nest fixture body 111 may be separated to proceed to a more perfect cleaning effect.

According to the nested fixture for the laminated package according to the present invention as described above, by forming the nested fixture separated from the nested fixture body and the removable guide bar to form a laminated guide hole by neighboring guide bars, the nested fixture instead of wire cutting It can be produced by a method that does not require relatively precise machining such as wheel polishing. Accordingly, the manufacturing cost and manufacturing time of the nest fixture can be reduced, and a high quality nest fixture can be obtained. In addition, separate cleaning is possible, so that the cleaning operation on the nest fixture can be made perfectly and easily. In addition, when contaminants remaining in the laminated guide holes or deformation of the nested fixture are generated during the use of the nested fixture, the corresponding removable guide bar is replaced with the normal guide bar, thereby causing poor stacking. Poor package quality defects due to this can be prevented and laminated package productivity can be improved.

1 is a cross-sectional view showing an example of a typical laminated package,

2 is a plan view of a nested fixture according to the prior art,

3 is a plan view showing a nested fixture for a laminated package according to the present invention. And

4 is a partial cross-sectional view showing a state in which a package is stacked on a nested fixture for a laminated package according to the present invention.

Explanation of symbols on the main parts of the drawings

10: stacked package 11, 21: unit semiconductor chip package

12,22: semiconductor chip 13,23: internal lead

14, 24: external lead 30: flexible circuit board

31: beam lead 33: adhesive layer

110: nest fixture 111: nest fixture body

112: Windows 113: Guide bar mounting groove

114: removable guide bar 115: laminated guide hole

116: fastening member

Claims (1)

It is a rectangular ring shape with a window formed inside, and both end portions are coupled to a nest fixture body having guide bar mounting grooves formed adjacent to the window at two opposite edge portions, and guide bar mounting grooves facing each other. A nest fixture for a laminated package, comprising a plurality of removable guide bars that traverse, wherein a neighboring guide bar inserts a unit semiconductor chip package and a flexible circuit board to form a stacking guide hole for guiding stacking. .