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KR200452760Y1 - LED lighting - Google Patents

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Publication number
KR200452760Y1
KR200452760Y1 KR2020100001975U KR20100001975U KR200452760Y1 KR 200452760 Y1 KR200452760 Y1 KR 200452760Y1 KR 2020100001975 U KR2020100001975 U KR 2020100001975U KR 20100001975 U KR20100001975 U KR 20100001975U KR 200452760 Y1 KR200452760 Y1 KR 200452760Y1
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South Korea
Prior art keywords
led
light
substrate
heat
outside
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KR2020100001975U
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Korean (ko)
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이종한
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주식회사 유니테스트
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

본 고안은 엘이디 조명장치에 관한 것으로, 본 고안의 엘이디 조명장치는 전기를 공급받아 발광하는 엘이디 소자와 이러한 다수의 엘이디 소자가 배열되어 장착된 인쇄회로기판으로 구성되어 있는 엘이디 모듈, 엘이디 모듈에서 방생하는 열을 밖으로 방출하는 역할을 하는 방열판, 엘이디 모듈에 장착되어 있는 엘이디 소자를 외부로부터 보호하고, 빛을 확산시키는 역할을 하는 굴곡부가 형성된 조명커버로 구성되어 있다. 그러므로, 직진성을 가진 빛을 발하는 엘이디 소자의 빛을 넓은 범위로 조사되게 하여, 실내 조명장치로 이용되기에 적합한 효과가 있다. The present invention relates to an LED lighting device, the LED lighting device of the present invention is emitted from the LED module, the LED module consisting of an LED element for emitting light and a plurality of LED elements are arranged and mounted on the printed circuit board It consists of a heat sink that serves to discharge the heat to the outside, the LED cover mounted on the LED module to protect the LED element from the outside, and a bent portion that serves to diffuse light. Therefore, it is possible to irradiate a wide range of light of the LED element that emits light with a straightness, there is an effect that is suitable for use as an indoor lighting device.

Description

엘이디 조명장치 {LIGHTING APPARATUS OF LED}LED lighting device {LIGHTING APPARATUS OF LED}

본 고안은 엘이디 조명장치에 있어서 엘이디 소자에서 발산되는 빛의 확산 특성을 향상시키는 조명커버에 관한 기술이다. The present invention is a technology for the lighting cover to improve the diffusion characteristics of the light emitted from the LED element in the LED lighting device.

엘이디(Light Emitting Diode;LED)는 화합물반도체의 특성을 이용해 전기신호를 적외선 또는 빛으로 변환시켜 신호를 보내고 받는데 사용되는 반도체 소자이다. 엘이디는 저전압에서 구동할 수 있는 발광소자로 다른 발광체에 비해 수명이 길고, 소비전력이 낮으며, 소형 경량화가 가능하다는 장점이 있기 때문에 일반표시장치나, 디스플레이의 백라이트 광원, 조명등에 이용되고 있다. LED (Light Emitting Diode) is a semiconductor device used to send and receive signals by converting electrical signals into infrared or light using the characteristics of compound semiconductors. LED is a light emitting device that can be driven at low voltage, and has a long life, low power consumption, and small size and light weight than other light emitting devices. Therefore, the LED is used in general display devices, display backlight sources, and lighting.

특히, 가정에서 사용되는 형광등의 경우 소비전력 사용량이 높고, 수명이 짧아 일정기간을 사용한 뒤 교체해야 한다는 불편함 때문에, 실내조명으로 엘이디 소자를 이용한 것이 최근에 각광을 받고 있다. In particular, in the case of fluorescent lamps used at home, high power consumption, short lifespan and inconvenience to replace after a certain period of time, the use of the LED element for indoor lighting has been in the spotlight recently.

그러나 엘이디 소자를 이용한 조명장치의 경우 직진성의 빛을 발하는 특징 때문에 넓은 부분으로 빛을 조사할 수 없는 것이 단점이 되어 실내 조명으로 사용되기에는 문제점이 있었다. 그래서 엘이디 조명장치에서 조명커버를 사용하여 엘이디 소자의 빛을 확산시키는 효과를 가졌지만 계속해서 소형화되고 있는 엘이디 소자의 빛을 실내 조명장치로써 충분하게 확산시키기에는 한계가 있었다.
However, in the case of the lighting device using the LED element is a disadvantage that can not irradiate the light in a wide part because of the characteristic of emitting a straight light, there is a problem to be used as indoor lighting. Therefore, the LED lighting device has an effect of diffusing light of the LED element by using a light cover, but there is a limit to sufficiently diffuse the light of the LED element, which is continuously miniaturized, as an indoor lighting device.

따라서 본 고안은 상술한 바와 같은 문제점을 해결하기 위하여 안출된 것으로 본 고안이 해결하고자 하는 과제는 엘이디 조명장치에서 조사되는 엘이디 소자의 빛을 효과적으로 확산시키는 장치를 제공하는데 그 목적이 있다. Accordingly, an object of the present invention is to provide a device for effectively diffusing light of an LED element irradiated from an LED lighting device.

이러한 목적을 달성하기 위하여 본 고안의 일 태양으로 엘이디 조명장치는 전기를 공급받아 발광하는 엘이디소자; 다수의 상기 엘이디소자가 배열되어 장착되며, 외부로부터 전기를 공급받아 상기 엘이디소자로 전달하는 기판; 두께를 가지며 상기 엘이디소자의 빛의 확산을 돕는 커버; 상기 기판 및 커버가 결합되어 지지되고, 상기 엘이디소자로부터 방출되는 열을 외부로 방출하는 방열판;을 포함하되, 상기 커버의 내면에는 굴곡부가 형성되어 있는 것을 특징으로 한다.In one aspect of the present invention, the LED lighting apparatus for achieving the above object is an LED element for emitting light; A substrate in which a plurality of the LED elements are arranged and mounted; A cover having a thickness to help diffuse light of the LED device; And a heat dissipation plate coupled to and supported by the substrate and the cover, the heat dissipating plate dissipating heat emitted from the LED element to the outside, wherein a bent portion is formed on an inner surface of the cover.

또한, 상기 다수의 엘이디소자는 일 방향으로 상기 기판에 배열되고,상기 커버는 상기 일 방향을 축으로 대칭적으로 라운드져 있고, 상기 굴곡부는 상기 커버의 라운드진 면을 따라 굴곡되어 형성되어 있는 것을 특징으로 한다.The plurality of LED elements may be arranged on the substrate in one direction, and the cover may be symmetrically rounded about the one direction, and the bent portion may be bent along a rounded surface of the cover. It features.

또한, 상기 굴곡부는 요철형상인 것을 특징으로 한다. In addition, the bent portion is characterized in that the irregular shape.

또한, 상기 굴곡부는 상기 커버의 내면 전체에 형성되어 있는 것을 특징으로 한다.
In addition, the bent portion is characterized in that formed on the entire inner surface of the cover.

본 고안에 따른 엘이디 조명장치의 조명커버에 굴곡부를 형성하여 엘이디 소자에서 발생되는 빛을 넓은 범위로 확산시킬 수 있어 실내 조명으로 이용하기에 적합한 효과가 있다. Forming a bent portion in the lighting cover of the LED lighting apparatus according to the present invention can diffuse the light generated from the LED element to a wide range there is an effect suitable for use as indoor lighting.

도1은 본 고안에 따른 엘이디 조명장치를 나타낸 도면이다.
도2는 본 고안에 따른 방열판과 엘이디모듈이 결합된 단면도이다.
도3과 도4는 본 고안에 따른 엘이디 조명장치의 단면도이다. 1 is a view showing the LED lighting apparatus according to the present invention.
Figure 2 is a cross-sectional view of the heat sink and the LED module combined according to the present invention.
3 and 4 are cross-sectional views of the LED lighting apparatus according to the present invention.

이하에서는 본 고안에 대하여 보다 구체적으로 이해할 수 있도록 첨부된 도면을 참조한 바람직한 실시 예를 들어 설명한다.Hereinafter, a preferred embodiment with reference to the accompanying drawings to be described in more detail with respect to the present invention will be described.

도1은 본 고안에 따른 엘이디 조명장치의 실시예를 나타낸 도면이고, 도2는 본 고안의 방열판과 엘이디 모듈이 결합된 단면도이고, 도3은 본 고안의 실시예에 따른 엘이디 조명장치의 단면도이고, 도4는 본 고안의 실시예에 따른 엘이디 조명장치의 빛의 확산을 표현한 도면이다. 1 is a view showing an embodiment of the LED lighting apparatus according to the present invention, Figure 2 is a cross-sectional view of the heat sink and the LED module of the present invention, Figure 3 is a cross-sectional view of the LED lighting device according to an embodiment of the present invention 4 is a view representing the diffusion of light of the LED lighting apparatus according to an embodiment of the present invention.

도1에 따르면 엘이디 조명장치(100)는 방열판(110), 엘이디 모듈(120), 조명커버(130)로 이루어져 있다. According to FIG. 1, the LED lighting device 100 includes a heat sink 110, an LED module 120, and a light cover 130.

상기 엘이디 모듈(120)은 방열판(110)에 연결되어 있으며 엘이디 모듈(120)은 다수개의 엘이디 소자(미도시)가 인쇄회로기판(미도시)의 길이를 따라 일정한 간격을 가지고 부착되어 구성된다. 엘이디 소자는 외부에서 인가된 전기를 공급받아 조명커버(130) 방향으로 빛을 발하게 된다. The LED module 120 is connected to the heat sink 110, the LED module 120 is composed of a plurality of LED elements (not shown) are attached at regular intervals along the length of the printed circuit board (not shown). The LED device receives light applied from the outside to emit light toward the lighting cover 130.

상기 방열판(110)은 엘이디 모듈(120)의 후면에 부착되어 엘이디 모듈(120)에 장착되어 있는 다수의 엘이디 소자가 빛을 발할 때 발생하는 열을 외부로 방출시켜주는 역할을 한다. 엘이디 모듈(120)에서 발생하는 열을 효과적으로 전달받기 위해 일반적으로 알루미늄이나 알루미늄 합금 소재를 사용한다. The heat sink 110 is attached to the rear of the LED module 120 serves to emit heat generated when a plurality of LED elements mounted on the LED module 120 emits light to the outside. In order to receive heat generated from the LED module 120 effectively, aluminum or aluminum alloy is generally used.

방열판(110)에 일정한 간격을 가지고 방출홀(111)이 형성되어 있고, 방열판(110)의 양끝에는 LED 모듈(120)과 연결하기 위한 관통구(112)가 형성되어 있다. 방출홀(111)은 5개 내지 6개의 엘이디 소자에 한 개의 비율로 형성되는 것이 바람직하여, 본 고안에서 LED 모듈(120)에는 엘이디 소자가 한 열에 28개가 장착되어 있기 때문에, 방열판(110)의 방출홀(111)은 한 열에 5개가 형성되어 10개의 방출홀(111)이 형성되어 있다. 엘이디 소자 10개당 하나의 비율로 방출홀이 형성됐을 경우 방열판의 내부 온도는 43°였고, 엘이디 소자 5개당 하나의 비율로 방출홀(111)이 형성되었을 때는 43.5°의 온도를 가졌다. 방열판의 내부 온도를 비교했을 때, 방출홀의 갯수가 두 배일 때는 온도차이가 0.5°밖에 나지 않았지만, 외부에서 유입되는 이물질이나 먼지등의 양은 엘이디 소자 5개당 하나의 비율로 방출홀(111)이 형성되었을 때 최대한 방지할 수 있었다. 그렇기 때문에 방열효과를 가지면서 외부의 이물질을 최소화시킬 수 있는 방출홀(111)의 갯수는 8개 내지 10개가 바람직하며, 또한 유입되는 이물질을 최소화시키는 방출홀(111)의 직경으로 3π 내지 5π를 갖는 것이 바람직하다. The heat dissipation holes 111 are formed at regular intervals in the heat dissipation plate 110, and through-holes 112 for connecting the LED module 120 are formed at both ends of the heat dissipation plate 110. It is preferable that the discharge holes 111 are formed at a ratio of 5 to 6 LED elements in one ratio. In the present invention, since 28 LED elements are mounted in a row in the LED module 120, the heat sink 110 Five discharge holes 111 are formed in one row, and ten discharge holes 111 are formed. When the discharge holes were formed in one ratio per 10 LED elements, the internal temperature of the heat sink was 43 °, and when the discharge holes 111 were formed in one ratio per 5 LED elements, the temperature was 43.5 °. When the internal temperature of the heat sink is compared, when the number of the discharge holes is double, the temperature difference is only 0.5 °, but the amount of foreign matter or dust flowing in from the outside is formed in one ratio per five LED elements. When it was possible to prevent as much as possible. Therefore, the number of the discharge holes 111 that can minimize the foreign matter while having a heat dissipation effect is preferably 8 to 10, and also 3π to 5π as the diameter of the discharge hole 111 to minimize the foreign matter introduced It is desirable to have.

엘이디 소자의 구동시 발생된 열은 방열판(110)으로 전달되어 머물게 된다. 이러한 열로 인해 방열판(110)의 공기는 팽창하게 되고 작은 밀도를 갖는다. 이것은 방열판(110)에 형성되어 있는 방출홀(111) 외부의 공기에 비해 작은 밀도를 갖기 때문에 밀도차에 의해 외부로 방출되게 되고, 상대적으로 밀도가 높은 외부공기는 방출홀(111)을 통해 방열판 내부로 유입되게 된다. 이렇게 뜨거운 공기의 방출과 차가운 공기의 유입으로 자연스럽게 엘이디 조명장치(100)의 공기의 순환이 일어난다. 이러한 대류현상으로 인해 엘이디 조명장치(100) 내의 열을 효과적으로 방출하고 동시에 냉각 효과도 가질 수 있다. 즉, 방열판(110)에 형성된 방출홀(111)에 의해 엘이디 소자로부터 전달된 열을 효과적으로 방출할 수 있다.Heat generated when the LED element is driven is transmitted to the heat sink 110 to stay. This heat causes the air in the heat sink 110 to expand and has a small density. Since it has a smaller density than the air outside the discharge hole 111 formed in the heat sink 110, it is discharged to the outside due to the difference in density, and the relatively high density of external air is discharged through the heat discharge plate 111. It will flow inside. The circulation of the air of the LED lighting device 100 occurs naturally by the discharge of hot air and the inflow of cold air. Due to this convection phenomenon, the heat in the LED lighting device 100 can be effectively released and at the same time have a cooling effect. That is, the heat transmitted from the LED element by the discharge hole 111 formed in the heat sink 110 can be effectively released.

도2는 본 고안의 엘이디 모듈(120)과 방열판(110)이 연결되었을 때의 단면도를 나타낸 도면이다. 도2에 따라 엘이디 모듈(120)에 방열판(110)이 부착되었을 때 엘이디 소자(L)가 장착된 인쇄회로기판은 방열판(110)과 직접 접촉되어있으며, 이러한 접촉되는 면에 연장부(113)가 형성되어 역 T 자 형상을 가진다. 그러므로 엘이디 소자(L)로부터 발생된 열은 접촉되는 면으로 전도되고 연장부를 따라 빠르고 효과적으로 전달된다. Figure 2 is a view showing a cross-sectional view when the LED module 120 and the heat sink 110 of the present invention is connected. When the heat dissipation plate 110 is attached to the LED module 120 according to FIG. 2, the printed circuit board on which the LED element L is mounted is in direct contact with the heat dissipation plate 110. Is formed to have an inverted T shape. Therefore, the heat generated from the LED element L is conducted to the contacting surface and transferred quickly and effectively along the extension.

상기 조명커버(130)는 엘이디 모듈(120)의 전면에 장착되어 엘이디 모듈(120) 전체를 감쌀 수 있는 긴 관의 형태이다. 또한, 폴리카보네이트 소재로 제작되어 외부에서 조명장치의 내부가 보일 수 있는 투명재질로 이루어져 있다. 조명커버(130)는 엘이디 소자에서 발하는 빛을 확산시켜주는 역할을 하며 또한 엘이디 모듈(120) 전체를 감싸주고 있기 때문에 외부로부터 유입될 수 있는 이물질이나 먼지들을 막아주고, 엘이디 소자를 외부로부터 보호하는 역할을 한다. The lighting cover 130 is mounted on the front of the LED module 120 is in the form of a long tube that can wrap the entire LED module 120. In addition, it is made of a polycarbonate material is made of a transparent material that can see the inside of the lighting device from the outside. The lighting cover 130 serves to diffuse the light emitted from the LED device and also covers the entire LED module 120 to prevent foreign substances or dust from entering from the outside and to protect the LED device from the outside. Play a role.

도3는 본 고안의 실시예에 따른 엘이디 조명장치용 조명커버(130)의 단면도로서, 조명커버(130)는 다수의 엘이디 소자(L)가 인쇄회로기판의 길이를 따라 일방향으로 배열되어 있고 상기 일방향을 축으로 대칭적으로 라운드져 있다. 또한, 라운드 진 면을 따라 굴곡이 형성되어 있으며, 형성된 굴곡은 조명커버(130)의 내면에 형성되는 것이 빛의 확산에 있어서 바람직하다. 3 is a cross-sectional view of an LED lighting device lighting cover 130 according to an embodiment of the present invention, the lighting cover 130 is a plurality of LED elements (L) is arranged in one direction along the length of the printed circuit board It is symmetrically rounded around one direction. In addition, the curved is formed along the rounded surface, the formed curved is preferably formed on the inner surface of the light cover 130 in the diffusion of light.

도4에 도시된 바와 같이 엘이디 모듈(120)로 전원이 인가되었을 때 엘이디 소자(L)로부터 발생된 빛은 조명커버(130)를 통과하여 외부로 조사된다. 엘이디 소자(L)에서 발생된 빛이 굴곡부가 형성된 조명커버(130)를 통과했을 때의 반사되는 빛의 경로를 나타내었다. 본 고안의 조명커버(130)에서는 내면에 굴곡이 형성되어 빛이 조사되었을 때 조사된 빛이 굴절되어 더 넓은 범위로 퍼지기 때문에 큰 각도로 빛이 확산되게 된다. 일반적으로 엘이디 소자에서 발산되는 빛은 직진성을 가져 40°(θ1)의 각도를 가지고 빛을 확산시킨다. 그렇기 때문에 엘이디 소자만을 이용한 조명을 사용할 경우 좁은 범위의 공간에 빛을 비춘다. 하지만 본 고안의 조명커버(130)를 사용하였을 경우 빛은 굴곡에 의해 굴절되어 170°(θ2)의 각도로 빛을 확산시킬 수 있었고, 넓은 범위에 빛을 조사하는 효과가 있기 때문에 실내 조명장치로 이용되기에 적합하다. As shown in FIG. 4, when power is applied to the LED module 120, light generated from the LED element L is irradiated to the outside through the lighting cover 130. When the light generated from the LED element (L) passes through the lighting cover 130, the bent portion is shown a path of the reflected light. In the illumination cover 130 of the present invention is bent on the inner surface when the light is irradiated when the light is refracted and spread to a wider range so that the light is diffused at a large angle. In general, the light emitted from the LED element has a linearity and diffuses the light at an angle of 40 ° (θ1). For this reason, when using only LED elements, light is emitted in a narrow range of space. However, when the lighting cover 130 of the present invention was used, the light could be refracted by bending to diffuse the light at an angle of 170 ° (θ2), and because it had the effect of irradiating the light over a wide range, the indoor lighting device Suitable for use.

또한, 폴리카보네이트로 제작된 투명소재이기 때문에, 광량을 높일 수 있으며 엘이디 소자(L)가 빛을 내면서 조명커버(130) 방향으로 발하는 열을 보다 빨리 외부로 방출될 수 있게 하는 효과가 있다. In addition, since the transparent material is made of polycarbonate, it is possible to increase the amount of light, and the LED element (L) has the effect of allowing the heat emitted in the direction of the light cover 130 to emit light faster to the outside.

따라서, 본 고안의 실시예에 따라 폴리카보네이트 소재로 만들어져, 내면에 굴곡이 형성된 긴 관의 조명커버(130)를 사용함으로써, 엘이디 소자에서 발생되는 빛을 충분히 확산시켜 단위 면적이 받는 빛의 양을 높일 수 있는 효과가 있었다. 또한, 투명재질로 이루어져 조사되는 빛의 광량을 높이며 열의 확산을 쉽게 도와주어 엘이디 소자의 수명을 단축시키는 요인을 줄일 수 있었다.
Therefore, by using the light cover 130 of a long tube made of a polycarbonate material, the inner surface of the bent in accordance with an embodiment of the present invention, the light generated from the LED element is sufficiently diffused to receive the amount of light received by the unit area There was an effect to increase. In addition, it is possible to reduce the factors that shorten the life of the LED device by increasing the amount of light irradiated made of a transparent material to facilitate the diffusion of heat.

위에서 설명한 바와 같이 본 고안에 대한 구체적인 설명은 첨부된 도면을 참조한 실시예에 의해서 이루어졌지만, 상술한 실시예는 본 고안의 바람직한 예를 들어 설명하였을 뿐이기 때문에, 본 고안이 상기의 실시예에만 국한되는 것으로 이해되어져서는 아니되며, 본 고안의 권리범위는 후술하는 청구범위 및 그 등가개념으로 이해되어져야 할 것이다.
As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to preferred examples of the present invention, the present invention is limited to the above embodiments. It is not to be understood that the scope of the present invention will be understood by the claims and equivalent concepts described below.

100 : 엘이디 조명장치
110 : 방열판
120 : 엘이디 모듈
130 : 조명커버100: LED lighting device
110: heat sink
120: LED module
130: light cover

Claims (4)

전기를 공급받아 발광하는 엘이디소자;
다수의 상기 엘이디소자가 일 방향으로 배열되어 장착되며, 외부로부터 전기를 공급받아 상기 엘이디소자로 전달하는 기판;
두께를 가지며 내면에는 굴곡부가 형성되어 있고 상기 엘이디소자가 배열된 일 방향을 축으로 대칭적으로 라운드져 있어, 상기 엘이디소자에서 발광된 빛의 확산을 돕는 커버;
상기 기판 및 커버가 결합되어 지지되며, 상기 엘이디소자로부터 방출되는 열을 외부로 방출하는 방열판;을 포함하되,
상기 방열판은 상기 기판에서 발생되어 상기 방열판으로 전달된 열에 의해 공기의 대류현상이 발생할 수 있도록 상기 기판과의 사이에 공간이 마련될 수 있도록 형성되며,
상기 방열판에는 상기 기판과의 사이에 마련된 공간에서 대류현상이 발생한 공기와 외부의 공기가 출입이 가능하도록 상기 엘이디소자 5개 내지 6개당 한 개의 비율로 형성된 직경 3π 내지 5π 크기의 방출홀을 구비하고,
상기 기판과 상기 방열판 사이에는 역 T자 형상의 연장부가 형성되어, 상기 엘이디 소자로부터 발생되어 상기 기판으로 전달된 열이 상기 연장부를 따라 상기 방열판으로 전달될 수 있도록 하는 것을 특징으로 하는 엘이디 조명장치.LED device for emitting light by receiving electricity;
A plurality of LED elements arranged in one direction and mounted thereon, the substrate receiving electricity from the outside and transferring the LED elements to the LED elements;
A cover having a thickness and a curved portion formed on an inner surface thereof and symmetrically rounded in one direction in which the LED elements are arranged, to help spread light emitted from the LED element;
And a heat sink coupled to and supported by the substrate and the cover and dissipating heat emitted from the LED element to the outside.
The heat dissipation plate is formed to provide a space between the substrate and the air so that convection of air is generated by heat generated from the substrate and transferred to the heat dissipation plate.
The heat sink is provided with a discharge hole having a diameter of 3π to 5π formed in a ratio of one to five to six LED elements so that the air and the air outside the convection occurs in the space provided between the substrate and the outside ,
An inverted T-shaped extension part is formed between the substrate and the heat sink, so that heat generated from the LED element and transferred to the substrate can be transferred to the heat sink along the extension part. 삭제delete 제1항에 있어서,
상기 굴곡부는 요철형상인 것을 특징으로 하는
엘이디 조명장치.The method of claim 1,
The curved portion is characterized in that the irregular shape
LED lighting device. 제1항에 있어서,
상기 굴곡부는 상기 커버의 내면 전체에 형성되어 있는 것을 특징으로 하는
엘이디 조명장치.






The method of claim 1,
The bent portion is formed on the entire inner surface of the cover
LED lighting device.






KR2020100001975U 2010-02-24 2010-02-24 LED lighting Expired - Lifetime KR200452760Y1 (en)

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