KR20040012593A - 히트 파이프 유니트 및, 히트 파이프 유형의 열교환기 - Google Patents
히트 파이프 유니트 및, 히트 파이프 유형의 열교환기 Download PDFInfo
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- KR20040012593A KR20040012593A KR1020030053400A KR20030053400A KR20040012593A KR 20040012593 A KR20040012593 A KR 20040012593A KR 1020030053400 A KR1020030053400 A KR 1020030053400A KR 20030053400 A KR20030053400 A KR 20030053400A KR 20040012593 A KR20040012593 A KR 20040012593A
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- tank
- pipes
- heat pipe
- base block
- heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/20—Fastening; Joining with threaded elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
실험번호 | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 |
홈유형 | 나선 | 나선 | 나선 | 나선 | 나선 | 나선 | 나선 | 나선 | 길이방향으로 직선 | 홈없음 | 나선 |
홈형상 | 삼각형 | 삼각형 | 삼각형 | 삼각형 | 삼각형 | 삼각형 | 삼각형 | 삼각형 | 부등변4각형 | - | 삼각형 |
피치p(mm) | 1.5 | 2.5 | 4 | 4 | 4 | 8 | 8 | 8 | 1.2 | - | 1 |
깊이d(mm) | 0.09 | 0.09 | 0.59 | 0.34 | 0.09 | 0.59 | 0.34 | 0.09 | 0.36 | - | 0.09 |
폭w(mm) | 0.18 | 0.18 | 1.18 | 0.68 | 0.18 | 1.18 | 0.68 | 0.18 | 0.84 | - | 0.18 |
각도(°) | 85.67 | 82.81 | 78.59 | 78.59 | 78.59 | 68.02 | 68.02 | 21.98 | - | - | 85.67 |
열저항(K/W) | 0.0646 | 0.0654 | 0.0692 | 0.0695 | 0.0697 | 0.0743 | 0.0743 | 0.0746 | 0.0778 | 0.0908 | 0.0646 |
Claims (17)
- 탱크;상기 탱크와 교통하도록 상기 탱크의 일측에 접합되어 그 위에 똑바로 서서 제공된 복수개의 파이프로서, 상기 복수개의 파이프가 상기 탱크에 접합된 단부의 반대편에서 단부가 폐쇄되어 있는 복수개의 파이프;상기 탱크내에 시일되고 상기 복수개의 파이프와 상기 탱크 사이에서 움직일 수 있는 작동 유체; 및,상기 복수개의 파이프상에 각각 제공된 복수개의 핀;을 구비하는 히트 파이프 유니트.
- 제 1 항에 있어서,상기 탱크는 상기 복수개의 파이프의 단면적보다 넓은 단면적을 가지는 것을 특징으로 하는 히트 파이프 유니트.
- 제 1 항에 있어서,상기 탱크는 원형 단면의 파이프를 구비하며 그것의 내측 표면상에 홈이 제공된 것을 특징으로 하는 히트 파이프 유니트
- 제 3 항에 있어서, 상기 홈은 0.01 내지 0.5 mm 의 깊이와 4 mm 또는 그 이하의 피치를 가지는 것을 특징으로 하는 히트 파이프 유니트.
- 탱크;상기 탱크와 교통하도록 상기 탱크의 일측에 접합되어 그 위에 똑바로 서서 제공되는 복수개의 파이프로서, 상기 복수개의 파이프가 상기 탱크에 접합된 단부의 반대편에서 그 단부가 폐쇄된 복수개의 파이프;상기 탱크내에 시일되고 상기 복수개의 파이프와 상기 탱크 사이에서 움직일 수 있는 작동 유체;상기 탱크가 그 안에 함입되어 있는 금속의 베이스 블록; 및,상기 복수개의 파이프상에 각각 제공된 복수개의 핀;을 구비하는 히트 파이프 유형의 열교환기.
- 제 5 항에 있어서,상기 탱크는 상기 복수개의 파이프의 단면적보다 넓은 단면적을 가지는 것을 특징으로 하는 히트 파이프 유형의 열 교환기.
- 제 5 항에 있어서,상기 탱크는 원형 단면의 파이프를 구비하며 그것의 내측 표면상에 홈이 제공된 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 7 항에 있어서,상기 홈은 0.01 내지 0.5 mm 의 깊이와 4 mm 또는 그 이하의 피치를 가지는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 복수개의 탱크;상기 탱크들의 대응하는 하나와 교통하도록 상기 각 탱크의 일측에 접합되어 그 위에 똑바로 서서 제공된 복수개의 파이프로서, 상기 복수개의 파이프가 상기 탱크들중 대응하는 하나에 접합된 단부의 반대편인 그 단부에서 폐쇄된 복수개의 파이프;상기 각 탱크내에 시일되고 상기 복수개의 파이프와 상기 탱크들중 대응하는 하나 사이에서 움직일 수 있는 작동 유체;상기 복수개의 탱크가 그 안에 함입된 금속의 베이스 블록; 및,상기 복수개의 탱크들중 하나 또는 그 이상의 상기 복수개의 파이프들중 적어도 일부상에 제공된 복수개의 핀;을 구비하는 히트 파이프 유형의 열교환기.
- 제 9 항에 있어서,상기 복수개의 탱크들중 각각은 원형 단면의 파이프를 구비하며 그것의 내표면상에 홈이 제공된 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 10 항에 있어서,상기 홈은 0.01 내지 0.5 mm 의 깊이와 4 mm 또는 그 이하의 피치를 가지는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 9 항에 있어서,상기 복수개의 탱크들중 하나 또는 그 이상의 상기 복수개의 파이프들은 평면상에서 격자와 같은 방식으로 또는 엇갈림 방식으로 배치되는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 5 항에 있어서,상기 탱크는 장착용 하드웨어로써 상기 베이스 블록에 나사 결합되는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 9 항에 있어서,상기 각각의 탱크는 장착용 하드웨어로써 상기 베이스 블록에 나사 결합되는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 탱크;상기 탱크와 교통하도록 상기 탱크에 접합되고 그 위에 똑바로 서서 제공되는 복수개의 파이프로서, 상기 복수개의 파이프들이 상기 탱크에 접합되는 단부의 반대편인 단부에서 폐쇄되는 복수개의 파이프;상기 탱크내에서 시일되고 상기 복수개의 파이프와 상기 탱크 사이에서 움직일 수 있는 작동 유체;상기 탱크가 그 안에 함입된 금속의 베이스 블록; 및,상기 복수개의 파이프상에 제공된 복수개의 핀;을 구비하고,상기 베이스 블록이 수직으로 장착되었을 때 상기 복수개의 파이프가 수평면에 대하여 5 내지 10 °의 각도로 연장되도록, 상기 복수개의 파이프가 상기 베이스 블록에 대하여 각도가 형성된 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 15 항에 있어서,상기 탱크는 상기 복수개의 파이프의 단면적보다 넓은 단면적을 가지는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
- 제 15 항에 있어서,상기 탱크는 원형의 단면을 가지며 그것의 내측 표면상에 형성된 홈을 가지는 것을 특징으로 하는 히트 파이프 유형의 열교환기.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002226634 | 2002-08-02 | ||
JPJP-P-2002-00226634 | 2002-08-02 | ||
JP2003166557A JP2004125381A (ja) | 2002-08-02 | 2003-06-11 | ヒートパイプユニット及びヒートパイプ冷却器 |
JPJP-P-2003-00166557 | 2003-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040012593A true KR20040012593A (ko) | 2004-02-11 |
KR100606283B1 KR100606283B1 (ko) | 2006-07-28 |
Family
ID=30117515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020030053400A Expired - Lifetime KR100606283B1 (ko) | 2002-08-02 | 2003-08-01 | 히트 파이프 유니트 및, 히트 파이프 유형의 열교환기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6843307B2 (ko) |
EP (1) | EP1387139B1 (ko) |
JP (1) | JP2004125381A (ko) |
KR (1) | KR100606283B1 (ko) |
CN (1) | CN100347852C (ko) |
Cited By (1)
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KR101382454B1 (ko) * | 2011-08-17 | 2014-04-08 | 현대모비스 주식회사 | 헤드램프의 방열장치 |
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US7420810B2 (en) * | 2006-09-12 | 2008-09-02 | Graftech International Holdings, Inc. | Base heat spreader with fins |
US20100132924A1 (en) * | 2007-04-27 | 2010-06-03 | National University Of Singapore | Cooling device for electronic components |
KR200450584Y1 (ko) * | 2007-12-12 | 2010-10-13 | 충-시엔 후앙 | 히트 싱크 |
TW200926945A (en) * | 2007-12-12 | 2009-06-16 | chong-xian Huang | Cylindrical heat dissipater equipped with cooling fins |
EP2112689A3 (en) * | 2008-04-24 | 2012-06-13 | ABB Research Ltd. | Heat exchange device |
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- 2003-07-30 EP EP03016632.6A patent/EP1387139B1/en not_active Expired - Lifetime
- 2003-08-01 CN CNB031580386A patent/CN100347852C/zh not_active Expired - Lifetime
- 2003-08-01 KR KR1020030053400A patent/KR100606283B1/ko not_active Expired - Lifetime
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KR101382454B1 (ko) * | 2011-08-17 | 2014-04-08 | 현대모비스 주식회사 | 헤드램프의 방열장치 |
Also Published As
Publication number | Publication date |
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EP1387139A2 (en) | 2004-02-04 |
CN1489204A (zh) | 2004-04-14 |
US20040069461A1 (en) | 2004-04-15 |
EP1387139A3 (en) | 2006-09-06 |
CN100347852C (zh) | 2007-11-07 |
US6843307B2 (en) | 2005-01-18 |
EP1387139B1 (en) | 2013-10-23 |
KR100606283B1 (ko) | 2006-07-28 |
JP2004125381A (ja) | 2004-04-22 |
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