KR20020095007A - 밀봉 요소, 기밀 용기 및 그의 밀봉 방법 - Google Patents
밀봉 요소, 기밀 용기 및 그의 밀봉 방법 Download PDFInfo
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- KR20020095007A KR20020095007A KR1020010078451A KR20010078451A KR20020095007A KR 20020095007 A KR20020095007 A KR 20020095007A KR 1020010078451 A KR1020010078451 A KR 1020010078451A KR 20010078451 A KR20010078451 A KR 20010078451A KR 20020095007 A KR20020095007 A KR 20020095007A
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- fitting
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- container body
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- 238000007789 sealing Methods 0.000 title claims abstract description 155
- 238000000034 method Methods 0.000 title claims description 31
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- 239000004065 semiconductor Substances 0.000 description 12
- 230000036961 partial effect Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 8
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
- B65D53/02—Collars or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S277/00—Seal for a joint or juncture
- Y10S277/921—Closure or weather strip seal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cookers (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Abstract
Description
-2×104 Pa(감압시) | +2×104 Pa(가압시) | |
실시예 | -9×103 Pa 10분 후 | 0 Pa 20초 후 |
비교예 | -2×103 Pa 10분 후 | 0 Pa 즉시 |
반발력(N/cm) | |||
압축량(㎜) | 0.5 | 1.0 | 1.5 |
실시예 | 0.12 | 0.19 | 0.19 |
비교예 | 0.94 | 0.94 | 1.46 |
Claims (11)
- 끼워지는 요소의 개방면과 끼우는 요소 사이에 개재되고 내부로부터의 누출 및 외부로부터의 침입을 방지하도록 탄성변형 가능한 밀봉 요소에 있어서,무한부와,상기 무한부의 외주로부터 외향으로 대략 비스듬하게 돌출한 가요성 돌출부와,상기 무한부의 표면 및 배면 중 적어도 하나상에 형성된 노치 또는 돌기를 갖는 끼워맞춤 수단을 포함하는밀봉 요소.
- 제 1 항에 있어서,상기 돌출부의 말단부에 원형 돌기가 형성되어 있는밀봉 요소.
- 제 1 항에 있어서,상기 끼워맞춤 수단은 다수의 끼워맞춤 리브를 포함하고 있고, 상기 다수의 끼워맞춤 리브 중에서, 끼워지는 요소의 개방면에 또는 끼우는 요소에 형성된 끼워맞춤 유지부의 입구측에 가장 가깝게 위치한 끼워맞춤 리브의 높이가 끼워맞춤 유지부의 내부측에 위치한 끼워맞춤 리브의 높이 보다 높은밀봉 요소.
- 제 2 항에 있어서,상기 끼워맞춤 수단은 다수의 끼워맞춤 리브를 포함하며, 상기 다수의 끼워맞춤 리브 중에서, 끼워지는 요소의 개방면에 또는 끼우는 요소에 형성된 끼워맞춤 유지부의 입구측에 가장 가깝게 위치한 끼워맞춤 리브의 높이가 끼워맞춤 유지부의 내부측에 위치한 끼워맞춤 리브의 높이 보다 더 높은밀봉 요소.
- 제 1 항에 있어서,상기 돌출부가 압축 방향의 내향으로 만곡되어, 상기 돌출부의 만곡부가 끼워지는 요소의 접촉면 또는 끼우는 요소의 접촉면과 접촉하게 되는밀봉 요소.
- 제 2 항에 있어서,상기 돌출부가 압축 방향의 내향으로 만곡되어, 상기 돌출부의 만곡부가 끼워지는 요소의 접촉면 또는 끼우는 요소의 접촉면과 접촉하게 되는밀봉 요소.
- 제 3 항에 있어서,상기 돌출부가 압축 방향의 내향으로 만곡되어, 상기 돌출부의 만곡부가 끼워지는 요소의 접촉면 또는 끼우는 요소의 접촉면과 접촉하게 되는밀봉 요소.
- 제 4 항에 있어서,상기 돌출부가 압축 방향의 내향으로 만곡되어, 상기 돌출부의 만곡부가 끼워지는 요소의 접촉면 또는 끼우는 요소의 접촉면과 접촉하게 되는밀봉 요소.
- 개방면을 갖는 용기 본체와,상기 용기 본체의 개방면에 탈착 가능하게 끼워지는 도어 요소와,상기 개방면과 상기 도어 요소 사이에 개재된 탄성변형 가능한 밀봉 요소를 포함하는 기밀 용기에 있어서,상기 용기 본체의 개방면의 내주부 또는 상기 도어 요소의 외주부에 노치를 형성하는 것에 의해 끼워맞춤 유지부를 형성하고,상기 밀봉 요소는, 상기 끼워맞춤 유지부 내에 끼워맞춤될 무한부와; 상기 무한부로부터 상기 용기 본체의 개방면에 대해 외향으로 비스듬하게 돌출하여, 그 자체와 상기 도어 요소의 접촉면 또는 상기 용기 본체의 개방면의 접촉면 사이에 실질적으로 예각을 형성하는 가요성 돌출부와; 상기 무한부의 표면 및 배면 중 적어도 하나에 형성되고 그리고 상기 끼워맞춤 유지부의 구분된 내벽과 접촉하여 끼워맞춤되는 노치 또는 돌기를 갖는 끼워맞춤 수단을 포함하는 것을 특징으로 하는기밀 용기.
- 제 9 항에 있어서,상기 밀봉 요소는 플루오르화 고무 조성물을 이용하여 형성되는기밀 용기.
- 개방면을 갖는 용기 본체와, 상기 용기 본체의 개방면에 탈착 가능하게 끼워지는 도어 요소와, 상기 용기 본체의 개방면의 내주부 또는 상기 도어 요소의 외주부에 노치를 형성하는 것에 의해 형성되는 끼워맞춤 유지부와, 상기 끼워맞춤 유지부에 끼워지고 그리고 상기 용기 본체와 상기 도어 요소 사이에 개재되는 탄성변형 가능한 밀봉 요소를 사용하여 기밀 용기를 밀봉하는, 기밀 용기의 밀봉 방법에 있어서,상기 밀봉 요소는, 상기 끼워맞춤 유지부에 끼워맞춤되는 무한부와, 상기 무한부로부터 연장된 가요성 돌출부와, 상기 무한부의 표면 및 배면 중 적어도 하나에 형성되고 그리고 상기 끼워맞춤 유지부의 구분된 내벽과 접촉하여 끼워맞춤되는 노치 또는 돌기를 갖는 끼워맞춤 수단으로 구성되고, 상기 밀봉 요소의 돌출부는 용기의 개방면에 대해 외향으로 대략 비스듬하게 연장되어, 상기 도어 요소의 접촉면 또는 상기 용기 본체의 개방면의 접촉면과 그 자체 사이에 실질적으로 예각을 형성하며, 상기 도어 요소가 폐쇄될 때, 상기 밀봉 요소의 돌출부는 상기 용기 본체의 개방면에 대해 외향으로 만곡되어 밀봉을 확립하는 것을 특징으로 하는기밀 용기의 밀봉 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001174401A JP3556185B2 (ja) | 2000-06-13 | 2001-06-08 | シール部材、密封容器及びそのシール方法 |
JPJP-P-2001-00174401 | 2001-06-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090004251A Division KR100904799B1 (ko) | 2001-06-08 | 2009-01-19 | 밀봉 용기 |
Publications (1)
Publication Number | Publication Date |
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KR20020095007A true KR20020095007A (ko) | 2002-12-20 |
Family
ID=19015691
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010078451A Ceased KR20020095007A (ko) | 2001-06-08 | 2001-12-12 | 밀봉 요소, 기밀 용기 및 그의 밀봉 방법 |
KR1020090004251A Expired - Lifetime KR100904799B1 (ko) | 2001-06-08 | 2009-01-19 | 밀봉 용기 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090004251A Expired - Lifetime KR100904799B1 (ko) | 2001-06-08 | 2009-01-19 | 밀봉 용기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7413099B2 (ko) |
EP (1) | EP1291287B1 (ko) |
KR (2) | KR20020095007A (ko) |
DE (1) | DE60138381D1 (ko) |
TW (1) | TW522529B (ko) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002329540A (ja) * | 2001-05-01 | 2002-11-15 | Shin Etsu Polymer Co Ltd | 携帯電話の圧接型コネクタ及びその接続構造 |
US7157270B2 (en) * | 2002-04-24 | 2007-01-02 | Genx International Inc. | Lightweight chamber having variable configurations and a method for making such |
US7578407B2 (en) * | 2004-04-18 | 2009-08-25 | Entegris, Inc. | Wafer container with sealable door |
CN101432202B (zh) * | 2004-04-18 | 2011-12-07 | 安堤格里斯公司 | 具有密封门的晶片容器 |
US8648977B2 (en) * | 2004-06-02 | 2014-02-11 | Applied Materials, Inc. | Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors |
US8206075B2 (en) * | 2004-06-02 | 2012-06-26 | Applied Materials, Inc. | Methods and apparatus for sealing a chamber |
DE102004028199A1 (de) * | 2004-06-04 | 2005-12-22 | Wabco Gmbh & Co.Ohg | Elektronikgehäuse |
JP4634772B2 (ja) * | 2004-10-14 | 2011-02-16 | ミライアル株式会社 | 収納容器 |
JP4482655B2 (ja) * | 2005-04-22 | 2010-06-16 | ゴールド工業株式会社 | 精密基板収納容器のガスケット |
US8037847B2 (en) * | 2005-05-13 | 2011-10-18 | Tecniplast, S.p.A. | Closure system for a cage containing laboratory animals and methods thereof |
JP2007062804A (ja) * | 2005-08-31 | 2007-03-15 | Miraial Kk | シール部材 |
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EP2022730B1 (en) * | 2006-05-29 | 2013-08-14 | Shin-Etsu Polymer Co. Ltd. | Substrate container |
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US20100052260A1 (en) * | 2007-03-07 | 2010-03-04 | Siemens Aktiengesellscahft | Device and method for producing a seal |
FR2919702A1 (fr) | 2007-08-02 | 2009-02-06 | Dominique Leroy Production Soc | Joint de fermeture et d'etancheite |
US7975870B2 (en) * | 2007-08-29 | 2011-07-12 | Ti Group Automotive Systems, L.L.C. | Ring seal having sealing lobes |
US8226131B1 (en) | 2007-09-04 | 2012-07-24 | Augmentix Corporation | System, method and apparatus for door latching using a spring latch |
TWI331123B (en) * | 2008-03-06 | 2010-10-01 | Gudeng Prec Ind Co Ltd | Reticle pod and method for keeping reticle clean and dry |
JP5264555B2 (ja) * | 2008-03-06 | 2013-08-14 | キヤノン株式会社 | 走査光学装置 |
JP5173732B2 (ja) * | 2008-10-23 | 2013-04-03 | Nok株式会社 | ガスケット |
US20100117309A1 (en) * | 2008-11-13 | 2010-05-13 | Applied Materials, Inc. | Sealing apparatus for a process chamber |
CA2688677C (en) * | 2008-12-15 | 2018-10-02 | Randy Soibel | Container assembly with flexible seal |
US20110103728A1 (en) * | 2009-10-15 | 2011-05-05 | Roller Bearing Company Of America, Inc. | Seal for bearings to accommodate large deformations |
DE112010005185B4 (de) | 2010-01-26 | 2019-01-17 | Miraial Co., Ltd. | Halbleiterwafer-Lagerbehälter |
JP5834233B2 (ja) * | 2010-02-17 | 2015-12-16 | パナソニックIpマネジメント株式会社 | 蓋シール構造およびそれを備えた電子機器 |
US8376181B2 (en) | 2010-05-21 | 2013-02-19 | Wki Holding Company, Inc. | Container assembly with flexible lid seal and releasing arrangement |
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Also Published As
Publication number | Publication date |
---|---|
EP1291287B1 (en) | 2009-04-15 |
US20020195455A1 (en) | 2002-12-26 |
US7413099B2 (en) | 2008-08-19 |
EP1291287A2 (en) | 2003-03-12 |
KR100904799B1 (ko) | 2009-06-25 |
EP1291287A3 (en) | 2005-04-06 |
DE60138381D1 (de) | 2009-05-28 |
KR20090023427A (ko) | 2009-03-04 |
TW522529B (en) | 2003-03-01 |
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