KR200162796Y1 - Packing film for enveloping electronic accessories and packing bag thereof - Google Patents

Abstract

A packaging film for packaging an electronic component and a semiconductor and a packaging bag employing the same are disclosed. The disclosed packaging film includes an antistatic layer that prevents the generation of static electricity, a first polyethylene layer laminated on the antistatic layer, an aluminum foil laminated on the first polyethylene layer, and an aluminum foil laminated on the aluminum foil. A second polyethylene layer, a low linear density polyethylene (LLDPE) layer laminated to the second polyethylene layer to prevent the laminate structure from being stretched, and a first surface resistance coated on the LLDPE layer to prevent the generation of static electricity With layers. The opposing LLDPE layers of such a packaging film can be bonded together to make a packaging bag.

Description

Packaging film for enveloping electronic accessories and packing bag

The present invention relates to an electronic component and a semiconductor packaging film and a packaging bag employing the same.

Many modern electronic devices are used to make life easier for humans. Electronic devices are usually made up of many electronic components or semiconductors. These electronic components and semiconductors are manufactured in a factory, packaged in packaging films or packaging bags, and passed through numerous transportation and storage processes before being delivered to consumers.

However, such electronic components and semiconductors are very precise and extremely sensitive to static electricity. Static electricity generates sparks for a short time, which takes only 100 nanoseconds, which instantly damages or vaporizes electronic components, metal wires, or extremely fine devices by damaging normal electronic components or semiconductors.

In addition, the electronic component or semiconductor may be easily corroded by being exposed to moisture during long-term transportation or storage.

On the other hand, since electronic components or semiconductors often have sharp electrodes or protrusions, the packaging film or the packaging bag may be torn by such electrodes.

The present invention has been made to solve the above problems, it is possible to prevent damage to the product by external factors, such as static electricity, oxidation and corrosion phenomena, and packaging for electronic components having a burst strength that is not easily ruptured by the electrode It is an object to provide a film and a packaging bag employing the same.

1 is a view showing a laminated state of the first embodiment of the electronic component and the semiconductor packaging film according to the present invention.

2 is a view showing a laminated state of a second embodiment of the electronic component and semiconductor packaging film of the present invention.

3 is a view showing a laminated state of a third embodiment of the electronic component and semiconductor packaging film of the present invention.

Figure 4 is a view showing a laminated state of the packaging bag employing the electronic component packaging film of the present invention.

<Description of the symbols for the main parts of the drawings>

10, 70, 80 ... antistatic layer

12 ... Nylon

14 ... second surface resistive layer

20 ... First Polyethylene

30 ... Aluminum Foil

40 ... Second Polyethylene Film

50 ... LLDPE (Low Linear Deny Polyethylene) Film

60 ... first surface resistive layer

70 ... Tyvek

82 ... polyethylene terephthalate

84 ... third surface resistive layer

100 ... Packing Bag

In order to achieve the above object, the electronic component and the semiconductor packaging film according to the present invention, an antistatic layer for preventing the generation of static electricity; A first polyethylene layer laminated on the antistatic layer; An aluminum foil laminated on the first polyethylene layer; A second polyethylene layer laminated on the aluminum foil; A Low Linear Density Polyethylene (LLDPE) layer laminated on the second polyethylene layer to prevent the laminate structure from being stretched; And a first surface resistive layer coated on the LLDPE layer to prevent generation of static electricity.

In the present invention, it is preferable that the first surface resistance layer has a surface resistance of 10 ¹¹ to 10 ¹² Ω / sq, and the thickness of the laminate structure is 80 to 160 µm.

In the present invention. The antistatic layer preferably includes a nylon layer laminated on the first polyethylene layer and a second surface resistance layer coated on the nylon layer and having a surface resistance of 10 ¹¹ to 10 ¹² Ω / sq. Do.

In addition, the antistatic layer is preferably TYVEK having a surface resistance of 10 ⁸ to 10 ¹⁰ Ω / sq.

On the other hand, the antistatic layer, a polyethylene terephthalate layer (laminated to the first polyethylene layer), and a third surface resistance layer coated on the polyethylene terephthalate and the surface resistance of 10 ¹¹ ~ 10 ¹² Ω / sq It is preferable that it is provided with.

In order to achieve the above object, the packaging bag for electronic components and semiconductor packaging, the antistatic layer to prevent the generation of static electricity, the first polyethylene layer laminated on the antistatic layer, and the aluminum foil laminated on the first polyethylene layer And a second polyethylene layer laminated on the aluminum foil, an LLDPE layer laminated on the second polyethylene layer to prevent the laminate structure from being stretched, and a first coated on the LLDPE layer to prevent generation of static electricity. A film provided with a surface resistive layer, characterized by adhering the LLDPE layers facing each other.

Hereinafter, a first embodiment of an electronic component and a semiconductor packaging film of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, an electronic component and a semiconductor packaging film may include an antistatic layer 10 that prevents generation of static electricity, a first polyethylene layer 20 laminated on the antistatic layer 10, and the first polyethylene layer. Laminated to the aluminum foil 30, the second polyethylene layer 40 laminated to the aluminum foil 30, and the second polyethylene layer 40 to prevent the laminate structure from being stretched LLDPE layer 50 and a second surface resistance layer 60 coated on the LLDPE layer 50 to prevent the generation of static electricity. At this time, the layers are closely bonded to each other so that no peeling occurs.

The antistatic layer 10 prevents generation of static electricity and prevents moisture from permeating. The antistatic layer 10 is composed of a nylon layer 12 laminated on the first polyethylene layer 20 and a second surface resistance layer 14 coated on the nylon layer 12. The nylon layer 12 is a polyamide-based synthetic polymer, and is excellent in moisture resistance because it is light and there are no pinholes. The second surface resistive layer 14 has a surface resistance of 10 ¹¹ to 10 ¹² Ω / sq, and its components include deionized water (85-90%), ethanol (less than 10%), and ammonium compound ( ammonium compound (less than 5%), methanol (less than 0.3%) and isopropanol (less than 0.7%). The antistatic layer 10 can also be printed with the product standard and the manufacturer's name.

The first polyethylene layer 20 is used to bond the aluminum foil 30 and the antistatic layer 10 to be described later. Such first polyethylene is a representative thermoplastic resin having good electrical insulation, water resistance, moisture resistance, and cold resistance. In the present embodiment, the first polyethylene layer 20 has a thickness of about 35 μm, because when the thickness is too thick or too thin, the adhesive force with the aluminum foil 30 is reduced.

The aluminum foil 30 is effective in preventing static electricity because of its high electrical conductivity, and prevents damage to the packaged product from external factors due to ultraviolet rays and heat because of its high ultraviolet and heat reflectance. In addition, since the gloss is excellent, the wrapping paper employing aluminum foil has a high visual value.

The second polyethylene layer 40 has the same characteristics and thickness as the first polyethylene layer 20.

The LLDPE layer 50 can control the burst strength of the laminate structure by varying its thickness.

The packaging film of the present invention can prevent the generation of static electricity by employing such a laminate structure. At this time, it is preferable to set it as about 80-160 micrometers of this packaging film. This is because if the thickness of the packaging film is 80 μm or less, the adhesive force between the layers is lowered, and if the thickness of the packaging film is 160 μm or more, the effects of cost burden and productivity decrease are generated.

Such a laminated packaging film is used to package ICs embedded in SMD (Surface Mount Device), Tape, Reel, Flat Rack or Shipping Tubes.

Next, a second embodiment of the electronic component and the semiconductor packaging film according to the present invention will be described in detail.

2, in the second embodiment, the Tyvek 70 is employed as the antistatic layer. In this case, since the first polyethylene layer 20, the aluminum foil 30, the second polyethylene layer 40, the LLDPE layer 50, and the second surface resistance layer 60 are the same as those of the first embodiment and have a laminate structure, Detailed description will be omitted.

Tyvek 70, which is laminated to the first polyethylene layer 20, is a product developed and marketed by Dupont, USA. The most important feature is that it prevents the generation of static electricity, has good moisture resistance, and has a strong burst strength. The tyvek 70 has a surface resistance of 10 ⁸ to 10 ¹⁰ Ω / sq. At this time, the tyvek 70 has a translucent grayish white color, thus contributing to increase the visual value of the product. The thickness of the packaging film which employ | adopted this Tyvek 70 is made into about 80-160 micrometers.

The packaging film employing the Tyvek 70 is used to package electronic components or devices sensitive to electrostatic damage (ESD), electro magnetic interference (EMI) and radio frequency (RF).

Next, a third embodiment of the electronic component and the semiconductor packaging film according to the present invention will be described in detail.

Referring to FIG. 3, in the third embodiment, the antistatic layer 80 is coated with the polyethylene terephthalate layer 82 laminated on the first polyethylene layer 20 and the third coated with the polyethylene terephthalate layer 82. The surface resistive layer 84 is comprised. In this case, the first polyethylene layer 20, the aluminum foil 30, the second polyethylene layer 40, the LLDPE layer 50, and the second surface resistance layer 60 are the same as those of the first and second embodiments. Since the configuration and the laminate structure, detailed description thereof will be omitted.

The polyethylene terephthalate layer 82 laminated on the first polyethylene layer 20 is commonly referred to as PET. The polyethylene terephthalate layer 82 is hard, has a hard property, is resistant to gas, moisture, and has good cold resistance and heat resistance. It is preferable that the thickness of the packaging film which employ | adopted this polyethylene terephthalate layer 82 is about 80-160 micrometers.

The packaging film laminated with the polyethylene terephthalate layer 82 is suitable for packaging electronic components or devices sensitive to electrostatic damage (ESD), electro magnetic interference (EMI) and radio frequency (RF).

Next, the electronic component and the semiconductor packaging bag according to the present invention manufactured using the packaging film described above will be described in detail.

Referring to FIG. 4, the electronic component and the semiconductor packaging bag 100 may include an antistatic layer that prevents generation of static electricity, a first polyethylene layer 20 laminated on the antistatic layer, and the first polyethylene layer 20. Laminated aluminum foil 30, a second polyethylene layer 40 laminated to the aluminum foil 30, and an LLDPE layer laminated to the second polyethylene layer 40 to prevent the laminate structure from being stretched. And a film composed of a first surface resistive layer 60 coated on the LLDPE layer 50 and preventing the generation of static electricity.

When the film having the laminate structure (first, second, and third embodiments) is overlaid and then bonded to each other by a known sealing heating method while facing the first surface resistance layer 60 of the packaging film, As the first surface resistance layer 60 is removed, the LLDPE layer 50 is closely adhered to each other, thereby making the packaging bag 100. After storing the product in the open portion of the packaging bag 100, the nitrogen gas is filled and the edges 100a and 100b are sealed and heat-sealed to seal the product.

As described above, the electronic component packaging film and the packaging bag according to the present invention can stably package the electronic component and the semiconductor to be packaged by preventing static electricity. In addition, it is possible to effectively prevent the penetration of moisture and air and to maintain a vacuum state, so that the packaged product can be stored for a long time. On the other hand, since the burst strength of itself is strong, there is an effect that the damage caused by the electrode or the projection of the electronic component or semiconductor can be minimized.

Claims (6)

An antistatic layer having a predetermined surface resistance to prevent generation of static electricity; A first polyethylene layer 20 laminated on the antistatic layer; An aluminum foil (30) laminated on the first polyethylene layer (20); A second polyethylene layer 40 laminated on the aluminum foil 30; A Low Linear Density Polyethylene (LLDPE) layer 50 laminated to the second polyethylene layer 40 to prevent the laminate structure from being stretched; And a first surface resistance layer (60) coated on the LLDPE layer (50) and having a surface resistance of 10 ¹¹ to 10 ¹² Ω / sq. The film for electronic parts and semiconductor packaging according to claim 1, wherein the laminate structure has a thickness of 80 to 160 µm. The antistatic layer according to claim 1, wherein the antistatic layer is coated on the nylon layer 12 laminated on the first polyethylene layer 20 and the nylon layer 12, and the surface resistance thereof is 10 ¹¹ to 10 ^12. An electronic component and a semiconductor packaging film, comprising a second surface resistance layer (14) of Ω / sq. The electronic component and semiconductor packaging film according to claim 1, wherein the antistatic layer is Tyvek having a surface resistance of 10 ⁸ to 10 ¹⁰ Ω / sq. The antistatic layer according to claim 1, wherein the antistatic layer is coated on the polyethylene terephthalate layer 82 laminated on the first polyethylene layer 20 and the polyethylene terephthalate layer, and the surface resistance thereof is 10 ¹¹ to. An electronic component and semiconductor packaging film comprising a third surface resistance layer (84) of 10 ¹² Ω / sq. An antistatic layer having a predetermined surface resistance, a first polyethylene layer 20 laminated on the antistatic layer, an aluminum foil 30 laminated on the first polyethylene layer 20 to prevent the generation of static electricity, A second polyethylene layer 40 laminated on the aluminum foil 30, an LLDPE layer 50 laminated on the second polyethylene layer 40 to prevent the laminate structure from being stretched, and an LLDPE layer thereof ( 50) is a film having a first surface resistance layer 60 coated on the surface to prevent the generation of static electricity, the packaging bags for electronic components and semiconductor packaging, characterized in that by adhering the LLDPE layer 60 facing each other .