JPH05147678A - Highly moistureproof, static damage-preventive sack - Google Patents

Abstract

PURPOSE:To enable easily checking the contents when handling a sack designed to protect electronic parts from static damage and deterioration through absorption of moisture. CONSTITUTION:As a component of a laminate an outer material 16 is formed by providing on the inner side of a protective layer 11 of synthetic resin having an antistatic property an electric-conductive, opaque, steam barrier layer 12 of which the surface resistance is less than 10<6>OMEGA/square and the light ray transmittance is below 10%. Under the electric-conductive, opaque, steam barrier layer 12 the laminate has a layer of adhesive 15 and under it, with the interposition of a layer of resin 16 whose bonding strength is lower than that of the layer of adhesive 15, an inner material 13 whose innermost side has an antistatic property and which is capable of fusion attachment under heat. This laminate 10, which allows the outer material 16 to be separated from the inner material 13 by hand, is used for at least a portion of the sack to form a highly moistureproof, static damage-preventive sack. Since the outer material alone can be stripped off in part, the contents can be checked at any time at discretion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bag for protecting electronic parts such as IC and LSI from electrostatic breakdown and moisture absorption deterioration,
In particular, it relates to a bag that enables confirmation of the contents.

[0002]

2. Description of the Related Art In recent years, electronic parts are becoming smaller and thinner,
It is sensitive to static electricity and humidity. Therefore, a bag for packaging the same is required to have higher electrostatic breakdown prevention and moisture absorption prevention effects. As a bag satisfying both of these, there is a bag in which an aluminum foil is used for a water vapor barrier layer and a conductive layer, and an outer layer and an inner layer thereof have antistatic properties.

This bag has sufficient electrostatic breakdown prevention and moisture absorption prevention properties, but since the contents cannot be confirmed from the outside at the time of shipping, there is a great risk of accidents such as shipping mistakes. The only way to do this is to open the package and check the contents, which requires re-sealing work and is time-consuming, which is not practical.

On the other hand, there is a method using a metal vapor deposition film having a film thickness such that the content can be confirmed as a conductive layer, with a focus on the confirmation of the content, but the moisture proof property is not sufficient at all, and chloride is used as a countermeasure. It is considered to use a vinylidene-based resin film, but it requires a considerable thickness and is costly. Further, the use of a conductive polymer as the conductive layer has been proposed, but it was the same as above.

As described above, the contents can be checked somehow, but since the moisture proof property is completely insufficient, it can be used as a bag for a mounted substrate or the like, but it is an electronic component such as an IC or LSI before mounting. Can not be used for. Because many I
C and LSI packages are sealed with a synthetic resin such as an epoxy resin, and when this resin absorbs moisture, it is exposed to high temperatures when it is mounted on a substrate, so that the stress generated by evaporation of moisture can cause package cracks. Because there is.

[0006]

Therefore, an object of the present invention is to solve the problems of IC and LS.
A bag that protects electronic parts such as I from electrostatic damage and prevents yield and reliability from deteriorating due to moisture absorption. In addition, a bag that allows you to check the contents without opening the bag when necessary To provide.

[0007]

In order to solve the above problems, in the present invention, an outer surface material having a conductive opaque water vapor barrier layer on the inner surface of a synthetic resin protective layer having an antistatic property,
The conductive opaque water vapor barrier layer surface and an antistatic and heat-sealable synthetic resin inner surface material are laminated so that they can be peeled off by hand on at least a part of the bag body. It was used to form a highly moisture-proof electrostatic damage prevention bag.

[0008]

As described above, since the outer surface material and the inner surface material are laminated so that they can be separated by hand, if the inner surface material is made transparent when peeled to an appropriate position, the contents can be checked. You can

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

First, the laminated body forming the bag will be described.

As shown in FIG. 1, a laminate 10 has an outer surface material 16 composed of a synthetic resin protective layer 11 having an antistatic property and a conductive opaque water vapor barrier layer 12, an antistatic property, and a heat fusion material. The inner surface material 13 made of synthetic resin that can be attached,
The resin layer 14 and the adhesive layer 15 having relatively weak adhesive strength are laminated.

The synthetic resin protective layer 11 is preferably a synthetic resin stretched film such as stretched polyester, stretched nylon, stretched polypropylene, stretched polyethylene or the like in which an antistatic agent such as a surfactant is kneaded or coated on the surface. Therefore, it may be a simple substance or a complex thereof.

The conductive opaque water vapor barrier layer 12 is
Surface resistance of 10 ⁶ Ω / □ or less, light transmittance (wavelength 5
50 mm) is a metal thin film layer having a thickness of 10% or less, for example, a metal foil of aluminum, iron, copper, nickel or the like or a vapor deposition film thereof.

As shown in FIG. 2, a synthetic resin reinforcing layer 11a may be further provided on the inner surface of the barrier layer 12. As the reinforcing layer 11a, synthetic resin stretched films such as stretched polyester, stretched nylon, stretched polypropylene, and stretched polyethylene are suitable, and either a simple substance or a composite thereof may be used.

FIG. 3 shows an example of the inner surface material 13. As shown in the figure, the inner surface material 13 includes a base material 131 made of a synthetic resin film such as polyester, nylon, polypropylene or polyethylene, and a transparent water vapor barrier layer 132 made of a vapor deposition film of vinylidene chloride resin, aluminum oxide or silicon oxide. And a heat-sealing layer 133 having an antistatic property and heat-sealable, which is made of polyolefin, ethylene-vinyl acetate copolymer, or the like in which an antistatic agent such as a surfactant is kneaded or coated on the surface. Is provided.

The transparent water vapor barrier layer 132 is not always essential and may be used depending on the required water vapor barrier performance. Further, when the water vapor barrier property of the base material 131 is good, the water vapor barrier layer 132 can be omitted.

Further, if the base material 131 or the transparent water vapor barrier layer 132 has antistatic property and heat fusion property, the heat sealing layer 133 can be omitted.

The resin layer 14 and the adhesive layer 15 described above are interposed between the outer surface material 16 and the inner surface material 13 as described above. The resin layer 14 is composed of a single substance or a mixture of vinyl resin, urethane resin, acrylic resin, polyamide resin, silicone resin, etc., which has relatively weak adhesive strength,
This resin is formed by part coating, and an example of the pattern is, as shown in FIGS. And so on. The adhesive layer 15 is preferably a two-component curing type urethane dry laminate adhesive, but is not limited to this.

The laminated body 10 as described above is used to form a highly moisture-proof electrostatic damage prevention bag. FIG. 5 is a plan view of the bag body 1 formed in the shape of a flat bag, in which an electronic component integrated body 3 such as an IC and an LSI is hermetically housed by the heat sealing unit 2.

Reference numerals 4 and 4a are notches that serve as a trigger for partially peeling and removing the outer surface material 16 for confirming the contents, and 5 is an outer surface material 16 and a synthetic resin inner surface material that can be heat-sealed. 13 and 13 are the parts already peeled off, and this part 5
In, the outer surface member 16 made of a laminated body of the synthetic resin protective layer 11 and the conductive opaque water vapor barrier layer 12 can be pinched with a fingertip.

The outer surface member 16 composed of the synthetic resin protective layer 11 and the conductive opaque water vapor barrier layer 12 is removed from the notches 4 and 4a located in the portion 5 where the outer surface member and the inner surface member are separated from each other in FIG. After being torn, peeling and tearing proceed in sequence, and it becomes possible to visually observe the electronic component assembly 3 housed in the bag 1. The state is shown in FIG. This figure shows a state in which the outer surface material has been peeled off until the label attached to the electronic component assembly 3 is visible, and the contents can be confirmed in this state. In the figure, the relationship between the distance W between the outer surface material peeling and tearing notches 4 and 4a and the distance Wa at the end of peeling and tearing is preferably W≈Wa. This is because the contents can be surely visually confirmed by removing the minimum amount of outer surface material. If W> Wa, it is necessary to make W considerably large in order to secure the minimum Wa necessary for the visual confirmation of the contents. This is due to the water vapor barrier property required even after the confirmation of the contents. This is because it will have an adverse effect.

Next, a method for realizing W≈Wa will be described below. Usually, in the case of a biaxially stretched synthetic resin film, tearing proceeds substantially parallel to the direction in which the tearing force is applied.
However, like the bag of the present invention, when peeling progresses at the same time, even if a tearing force is applied so that W≈Wa,
Wa <W due to the action of the peeling force. Therefore,
If a synthetic resin stretched film in which molecules are mainly oriented substantially parallel to the direction of applying the tearing force is used as the synthetic resin protective layer 11, the influence of the peeling force is suppressed to a minimum, and W≈W
a can be realized. Further, if the same material is used for the reinforcing layer 11a, if necessary, it is further improved.

By the way, the outer surface material 16 and the inner surface material 1 in FIG.
The part 5 already separated from 3 does not have to include all notches 4, 4a as shown,
As shown in FIGS. 7 (a) and 7 (b), the notch may extend over a part of the notch or the entire side of the bag. In short, it suffices that the outer surface member 16 be pinched with a finger and that the notch that defines the tear start width be included.

[0024]

As described above, the highly moisture-proof electrostatic breakdown preventing bag of the present invention has an outer surface material comprising a synthetic resin protective layer having an antistatic property and a conductive opaque water vapor barrier layer, an antistatic property and a water vapor barrier to some extent. Since it is formed by a laminated body in which a transparent synthetic resin inner surface material having properties is peelably laminated by hand, it is possible to protect the stored electronic components such as IC and LSI from electrostatic breakdown and moisture absorption.

Further, since only the outer surface material can be partially peeled off, the contents can be confirmed at any time. Therefore, it is possible to protect electronic parts such as ICs and LSIs from electrostatic breakdown and moisture absorption deterioration, and prevent erroneous shipping, which contributes to cost reduction.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a laminate used for the bag of the present invention.

FIG. 2 is a sectional view showing another example of the above.

FIG. 3 is a cross-sectional view showing an example of the above inner surface material.

FIG. 4 is a plan view showing a coating pattern of a resin layer having a weak adhesive force.

FIG. 5 is a plan view showing an example of a highly moisture-proof electrostatic damage prevention bag.

FIG. 6 is a plan view showing a partially peeled state of the above.

FIG. 7 is a plan view showing an example of a tear notch and a peeled portion of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bag body 2 Heat sealing part 3 Electronic component integrated body 4, 4a Notch 5 Exfoliated part 10 Laminated body 13 Internal surface material 14 Resin layer 15 with comparatively weak adhesive force 15 Adhesive layer 16 External surface material

Claims (5)

[Claims] 1. A surface resistance value of 10 ⁶ Ω / □ or less and a light transmittance of 1 on the inner surface of a synthetic resin protective layer having an antistatic property.
An outer surface material having a conductive opaque water vapor barrier layer of 0% or less and an antistatic property on the innermost surface of the conductive opaque water vapor barrier layer surface via an adhesive layer and a resin layer having a weaker adhesive strength. A highly moisture-proof electrostatic breakdown prevention bag, comprising a laminated body having an inner surface material that has a heat-sealable property, and is capable of peeling the outer surface material from the inner surface material by hand as at least a part of the bag body. 2. The highly moisture-proof electrostatic breakdown prevention bag according to claim 1, wherein the inner surface material includes a transparent water vapor barrier layer. 3. The highly moisture-proof electrostatic breakdown prevention bag according to claim 1, wherein the conductive opaque water vapor barrier layer is a metal foil of aluminum, iron, copper, nickel or the like or a vapor deposition film of these metals. .. 4. The highly moisture-proof electrostatic breakdown prevention bag according to claim 1, wherein the synthetic resin protective layer is a plastic film which is mainly oriented in a direction substantially parallel to the tearing and peeling direction of the outer surface material. 5. A pair of notches for tearing and peeling off the outer surface material to allow the contents to be visually recognized are provided on at least one side of the heat-sealing portion of the bag body so as to be substantially parallel to the inner direction. The highly moisture-proof electrostatic damage prevention bag according to claim 1, wherein the outer surface material between the notches is separated from the corresponding inner surface material.