KR200144295Y1 - Concave-convex BGA Package - Google Patents
Concave-convex BGA Package Download PDFInfo
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- KR200144295Y1 KR200144295Y1 KR2019960026025U KR19960026025U KR200144295Y1 KR 200144295 Y1 KR200144295 Y1 KR 200144295Y1 KR 2019960026025 U KR2019960026025 U KR 2019960026025U KR 19960026025 U KR19960026025 U KR 19960026025U KR 200144295 Y1 KR200144295 Y1 KR 200144295Y1
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- mold
- bga
- grid array
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- 239000000758 substrate Substances 0.000 claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 claims abstract description 17
- 238000005476 soldering Methods 0.000 claims description 14
- 230000001788 irregular Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
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- Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
Abstract
외곽둘레가 요철형상을 이루는 기판(10)과, 기판(10)상면의 정사각형의 모울드(20)과, 기관하면의 정사각형의 격자구조의 솔더볼(30)으로 이루어져, 리플로어 솔더링시 외곽둘레가 요철형상을 이루는 기판(10)에 의해 중심부로의 열전달이 용이한 외곽요철형 BGA(BALL GRID ARRAY)패키지The outer periphery is formed of a substrate 10 having an uneven shape, a square mold 20 on the upper surface of the substrate 10, and a solder ball 30 having a square lattice structure at the lower surface of the engine. BG (BALL GRID ARRAY) package, which is easy to transfer heat to the center by the shape of the substrate 10
Description
제1도 종래의 BGA(BALL GRID ARRAY)패키지를 나타낸 도면으로, (a)는 평면도, (b)는 측면도, (c)는 배면도.1 is a view showing a conventional BGA (BALL GRID ARRAY) package, (a) is a plan view, (b) is a side view, (c) is a rear view.
제2도 또 다른 종래의 BGA(BALL GRID ARRAY)패키지를 나타낸 도면으로, (a)는 평면도, (b)는 측면도, (c)는 배면도.2 is a view showing another conventional BGA (BALL GRID ARRAY) package, (a) is a plan view, (b) is a side view, (c) is a rear view.
제3도 본 고안에 따른 BGA(BALL GRID ARRAY)패키지를 나타낸 도면으로, (a)는 평면도, (b)는 측면도, (c)는 배면도.3 is a view showing a BGA (BALL GRID ARRAY) package according to the present invention, (a) is a plan view, (b) is a side view, (c) is a rear view.
제4도 본 고안에 따른 또 다른 BGA(BALL GRID ARRAY)패키지를 나타낸 도면으로, (a)는 평면도, (b)는 측면도, (c)는 배면도.4 is a view showing another BGA (BALL GRID ARRAY) package according to the present invention, (a) is a plan view, (b) is a side view, (c) is a rear view.
제5도 내지 제8도 본 고안에 따른 BGA(BALL GRID ARRAY)패키지의 여러 실시예를 나타낸 평면도.5 to 8 are plan views showing various embodiments of a BGA (BALL GRID ARRAY) package according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1,10 : 기판 2,20 : 모울드1,10: substrate 2,20: mold
3,30 : 전극3,30: electrode
본 고안을 BGA(BALL GRID ARRAY)패키지에 관한 것으로, 특히, 열전달이 용이하게 이루어지게하여 주변부품에 열충격을 주지 않고, 중심부와 주변부의 온도구배를 최소화하여 솔더링불량을 억제하도록 한 외곽요철형 BGA(BALL GRID ARRAY)패키지에 관한 것이다.The present invention relates to a BGA (BALL GRID ARRAY) package, and in particular, an uneven BGA that prevents soldering defects by minimizing temperature gradients at the center and the periphery without causing thermal shock by facilitating heat transfer. (BALL GRID ARRAY) Package.
종래의 BGA(BALL GRID ARRAY)패키지는 제1도 및 제2도에 도시된 바와 같이, 정사각형의 기판(1)과, 기판상면의 정사각형의 모울드(2)와, 전극을 형성하는 기판하면의 정사각형의 격자구조의 솔더볼(3)으로 구성되며, 모울드(2)부분의 위치에 따라 제1도와 같은 A 타입과, 제2도와 같은 B 타입으로 구분된다.Conventional BGA (BALL GRID ARRAY) package, as shown in Figures 1 and 2, a square substrate 1, a square mold 2 on the upper surface of the substrate, and a square on the lower surface of the substrate forming the electrode It consists of a solder ball (3) of the lattice structure of, and is divided into A type as shown in FIG. 1 and B type as shown in FIG. 2 according to the position of the mold (2).
이러한 종래의 정사각형의 패키지에서는 리플로어(REFLOW)솔더링시, 주변부(a)와 중심부(b)의 온도구배가 발생되는데, 이러한 온도구배가 커서 중심부(b)의 솔더볼(3)의 냉땜 또는 접합불량 등의 솔더링불량이 발생된다.In the conventional square package, when the reflow (REFLOW) soldering, a temperature gradient occurs between the peripheral portion (a) and the central portion (b), the temperature gradient is so large that the cold solder or poor bonding of the solder ball (3) of the central portion (b) Soldering defects such as this occur.
또한 이러한 불량을 해결하기 위하여 중심부(b)의 온도가 적정하게 되도록 솔더링온도를 높여주면, 기판표면과 기타 주변부품등이 높은 온도에 따른 열충격의 영향을 받게 되는 문제점이 있었다.In addition, if the soldering temperature is increased so that the temperature of the center portion (b) is appropriate to solve such a defect, there was a problem that the surface of the substrate and other peripheral parts are affected by the thermal shock due to the high temperature.
본 고안을 이러한 종래기술의 문제점을 해결하기 위한 것으로, 그 형태를 변형하여 솔더링시 열전달이 용이하게 이루어지도록하여 중심부와 주변부의 온도구배를 최소화함으로서 솔더링불량을 억제할 수 있는 외곽요철형 BGA(BALL GRID ARRAY)패키지의 제공을 목적으로 한다.The present invention is to solve the problems of the prior art, by modifying its shape to facilitate the heat transfer during soldering to minimize the temperature gradient of the center and the periphery of the uneven concave type BGA (BALL) GRID ARRAY) is intended to provide a package.
상기 목적을 달성하기 위하여 본 고안의 외곽요철형 BGA(BALL GRID ARRAY)패키지는, 기판과, 기판상면의 모울드와, 기판하면의 격자구조의 솔더볼로 이루어진 BGA(BALL GRID ARRAY)패키지에 있어서, 솔더링시 열전달이 용이하도록 상기 기판의 외곽둘레가 요철 형상을 이룬 것을 특징으로 한다.,In order to achieve the above object, the outer concave-convex BGA (BALL GRID ARRAY) package of the present invention is soldered in a BGA (BALL GRID ARRAY) package consisting of a substrate, a mold on the upper surface of the substrate, and a solder ball of a lattice structure on the lower surface of the substrate. The outer periphery of the substrate is characterized in that the concave-convex shape to facilitate heat transfer.
또한, 기판과, 기판상면의 모울드와, 기판하면의 격자구조의 솔더볼로 이루어진 BGA(BALL GRID ARRAY)패키지에 있어서, 솔더링시 열전달이 용이하도록 상기 모물드의 외곽둘레가 요철 형상을 이룬 것을 특징으로 한다.In addition, in a BGA (BALL GRID ARRAY) package consisting of a substrate, a mold on the upper surface of the substrate, and a solder ball having a lattice structure on the lower surface of the substrate, an outer circumference of the mold has a concave-convex shape to facilitate heat transfer during soldering. do.
또한, 기판과, 기판상면의 모울드와, 기판하면의 격자구조의 솔더볼로 이루어진 BGA(BALL GRID ARRAY)패키지에 있어서, 솔더링시 열전달이 용이하도록 상기 모물드의 외곽둘레가 요철 형상을 이루고, 상기 기판 및 솔더볼의 배열구조가 외곽요철의 모울드의 형상에 대응하도록 형성된 것을 특징으로 한다.In addition, in a BGA (BALL GRID ARRAY) package consisting of a substrate, a mold on the upper surface of the substrate, and a solder ball having a lattice structure on the lower surface of the substrate, an outer circumference of the mold forms an uneven shape to facilitate heat transfer during soldering. And a solder ball arrangement structure corresponding to the shape of the mold of the outer concave-convex.
이하, 첨부도면에 의거하여 본 고안의 외곽요철형 BGA(BALL GRID ARRAY)패키지를 상세히 설명한다.Hereinafter, on the basis of the accompanying drawings will be described in detail the contour BGA (BALL GRID ARRAY) package of the present invention.
본 고안의 외곽요철형 BGA(BALL GRID ARRAY)패키지는, 제3도에 도시된 바와 같이, 외곽둘레가 요철형상을 이루는 기판(10)과, 기판(10)상면의 정사각형의 모울드(20)과, 기판하면의 정사각형의 격자구조의 솔더볼(30)으로 이루어진다.The outer concave-convex BGA (BALL GRID ARRAY) package of the present invention, as shown in Figure 3, the outer periphery of the concave-convex shape of the substrate 10, the square mold 20 of the upper surface of the substrate 10 and And a solder ball 30 having a square lattice structure on the bottom surface of the substrate.
따라서, 리플로어 솔더링시 외곽둘레가 요철형상을 이루는 기판(10)에 의해 중심부로의 열전달이 용이하게 이루어진다.Therefore, the heat transfer to the center part is easily performed by the substrate 10 having the outer periphery having an uneven shape during reflow soldering.
또한 모세관형상으로 인한 압력차가 발생되어 열의 침투속도가 더욱 가속될 수 있다.In addition, a pressure difference caused by the capillary shape may be generated to further accelerate the heat penetration rate.
한편, 본 고안의 또다른 외곽요철형 BGA(BALL GRID ARRAY)패키지는, 제4도에 도시된 바와 같이, 정사각형의 기판(10)과, 기판(10)상면의 외곽둘레가 요철형상을 이루는 모울드(20)과, 기판하면의 정사각형의 격자구조의 솔더볼(30)으로 이루어진다.On the other hand, another outer concave-convex BGA (BALL GRID ARRAY) package of the present invention, as shown in Figure 4, a square substrate 10, the mold with the outer periphery of the outer peripheral surface of the upper surface of the substrate 10 20 and a solder ball 30 having a square lattice structure on the lower surface of the substrate.
따라서, 리플로어 솔어링시 외곽둘레가 요철형상을 이루는 모울드(20)에 의해 중심부로의 열전달이 용이하게 이루어진다.Therefore, the heat transfer to the center part is made easy by the mold 20 whose outer periphery forms an uneven shape at the time of reflowing.
제5도 내지 제8도는, 솔더링시 열전달이 용이하도록 구성된 본 고안의 외곽요철형 BGA(BALL GRID ARRAY)패키지의 여러종류의 실시예를 나타낸 것이다.5 to 8 show various embodiments of an outer concave-convex BGA (BALL GRID ARRAY) package of the present invention, which is configured to facilitate heat transfer during soldering.
먼저, 제5도의 경우는 기판(10)의 형상이 외곽 1변에 1부분이상이 절결된 정사각형의 형상이고 모울드와 격자구조의 솔더볼은 정사각형을 형성하고 있다.First, in FIG. 5, the shape of the substrate 10 is a square shape in which one or more portions are cut at one side of the outer side, and the solder balls of the mold and the lattice structure form a square.
제6도의 경우는 기판(10)의 외곽 1변의 각 모서리가 절결된 정사각형의 형상이고 모울드와 격자구조의 솔더볼은 정사각형을 형성하고 있다.In the case of FIG. 6, the corners of the outer one side of the substrate 10 are cut out of a square shape, and the solder ball of the mold and the lattice structure forms a square.
제7도의 경우는 모울드(20)의 형상이 외곽 1변에 1부분 이상이 절결된 정사각형의 형상이고 기판과 격자구조의 솔더볼은 정사각형을 형성하고 있다.In FIG. 7, the shape of the mold 20 is a square shape in which at least one portion is cut at one side of the outer side, and the solder ball of the substrate and the lattice structure forms a square.
제8도의 경우는 모울드(20)의 형상이 왹곽 1변에 1부분 이상이 절결된 정사각형의 형상이고, 기판(10)과 솔더볼(30)의 배열구조가 상기 모울드의 형상에 대응하도록 이루어진 것이다.In FIG. 8, the shape of the mold 20 is a square shape in which one or more portions are cut at one side of the outline, and the arrangement structure of the substrate 10 and the solder balls 30 corresponds to the shape of the mold.
이상, 설명한 바와 같이, 본 고안에 따르면, 그 외곽을 요철형상으로하여 열전달이 용이하게 되도록하여, 중심부와 주변부의 온도구배를 최소환함으로서 솔더링불량을 억제할 수 있고, 중심부의 온도를 높여주어 주변부품에 열충격을 가하지 않고 고품질의 솔더링이 가능하게 되는 효과가 있다.As described above, according to the present invention, the outer periphery has an uneven shape to facilitate heat transfer, thereby minimizing the temperature gradient of the center and the periphery, thereby suppressing soldering defects, and increasing the temperature at the center to increase peripheral parts. There is an effect that high quality soldering is possible without applying a thermal shock to the.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960026025U KR200144295Y1 (en) | 1996-08-27 | 1996-08-27 | Concave-convex BGA Package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960026025U KR200144295Y1 (en) | 1996-08-27 | 1996-08-27 | Concave-convex BGA Package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980012462U KR19980012462U (en) | 1998-05-25 |
| KR200144295Y1 true KR200144295Y1 (en) | 1999-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960026025U Expired - Lifetime KR200144295Y1 (en) | 1996-08-27 | 1996-08-27 | Concave-convex BGA Package |
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| Country | Link |
|---|---|
| KR (1) | KR200144295Y1 (en) |
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1996
- 1996-08-27 KR KR2019960026025U patent/KR200144295Y1/en not_active Expired - Lifetime
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| Publication number | Publication date |
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| KR19980012462U (en) | 1998-05-25 |
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