KR20010055252A - off loader of singulation device for manufacturing semiconductor package - Google Patents
off loader of singulation device for manufacturing semiconductor package Download PDFInfo
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- KR20010055252A KR20010055252A KR1019990056406A KR19990056406A KR20010055252A KR 20010055252 A KR20010055252 A KR 20010055252A KR 1019990056406 A KR1019990056406 A KR 1019990056406A KR 19990056406 A KR19990056406 A KR 19990056406A KR 20010055252 A KR20010055252 A KR 20010055252A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
이 발명은 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 관한 것으로, 싱귤레이션된 반도체패키지 유닛을 흡착하여 상,하 및 수평으로 이동하는 흡착부와; 상기 흡착부의 하부에 위치되어 다수의 반도체패키지 유닛이 수납되는 트레이가 적재되는 적재부로 이루어진 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 있어서, 상기 적재부에는 상기적재부를 일정한 진동수로 진동시킬 수 있도록 적어도 한개 이상의 진동 수단이 더 장착된 것을 특징으로 함.The present invention relates to an off-loader of the singulation equipment for manufacturing a semiconductor package, the suction unit for adsorbing the singulated semiconductor package unit to move up, down and horizontally; In the off-loader of the singulation equipment for manufacturing a semiconductor package consisting of a stacking unit which is located in the lower portion of the adsorption unit is loaded with a tray that accommodates a plurality of semiconductor package unit, at least one in the stacking portion to vibrate the loading portion at a constant frequency Characterized in that the vibration means is further mounted.
Description
본 발명은 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 관한 것으로, 보다 상세하게 설명하면 싱귤레이션된 반도체패키지 유닛을 트레이의 정확한위치에 안착시킬 수 있는 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 관한 것이다.The present invention relates to an off loader of a singulation device for manufacturing a semiconductor package, and more particularly, to an off loader of a singulation device for manufacturing a semiconductor package capable of seating a singulated semiconductor package unit at an accurate position of a tray.
일반적으로 반도체패키지 제조 분야에서 싱귤레이션(Singulation)이란 도1에 도시된 바와 같은 인쇄회로기판 스트립(s)을 각각의 독립된 반도체패키지 유닛(u)으로 분리하여 마더보드에 실장 가능한 형태로 확정하는 공정을 말한다.In general, in the semiconductor package manufacturing field, singulation refers to a process of separating a printed circuit board strip s as shown in FIG. 1 into respective independent semiconductor package units u to determine a form that can be mounted on a motherboard. Say
여기서, 상기 인쇄회로기판 스트립(s)은 도전성 볼 융착 및 몰딩 공정 등이 완료된 이후이며, 도면 부호 sl은 낱개의 반도체패키지 유닛(u)으로 싱귤레이션되는 라인을 도시한 것이다.Here, the printed circuit board strip (s) is after the conductive ball fusion and molding process is completed, sl is shown a line that is singulated into a single semiconductor package unit (u).
이러한 싱귤레이션 공정은 크게 도2에 도시된 바와 같이, 볼 융착 및 몰딩이 완료된 인쇄회로기판을 로딩하는 온로딩 단계, 상기 인쇄회로기판에서 탑다이(top die) 및 바텀 다이(bottom die)를 이용하여 낱개의 반도체패키지 유닛으로 싱귤레이션하는 싱귤레이션 단계 및 낱개로 분리된 반도체패키지 유닛을 트레이에 수납하는 오프 로딩 단계로 이루어져 있다.This singulation process is largely shown in Figure 2, the on-loading step of loading the printed circuit board is completed ball fusion and molding, using a top die (bottom die) and a bottom die (bottom die) in the printed circuit board And a singulation step of singulating into a single semiconductor package unit and an off-loading step of accommodating the separated semiconductor package unit into a tray.
여기서, 상기 오프 로딩 단계는 통상 도3에 도시된 바와 같은 오프 로더(100')를 이용한다. 즉, 상부에는 낱개로 분리된 반도체패키지 유닛(u)을 진공 흡착하여 일정 거리 상,하 및 수평 이동이 가능한 흡착부(2)가 설치되어 있고, 상기 흡착부(2) 하단에는 다수의 트레이(4)가 적층되어 위치될 수 있도록 트레이 적재부(6)가 위치되어 있다.In this case, the off-loading step generally uses an off loader 100 ′ as shown in FIG. 3. That is, the upper portion is provided with an adsorption portion (2) capable of moving up, down and horizontally by a predetermined distance by vacuum adsorption of the semiconductor package unit (u) separated separately, a plurality of trays ( The tray stack 6 is positioned so that 4) can be stacked and positioned.
여기서, 상기 트레이(4)는 낱개의 반도체패키지 유닛(u)이 일정 거리 이격된 채 다수 수납될 수 있도록 다수의 포켓(p, pocket)이 형성된 것을 지칭한다.Here, the tray 4 refers to a plurality of pockets (p, pocket) is formed so that each of the semiconductor package unit (u) can be accommodated in a plurality of spaced apart from a certain distance.
또한, 상기 트레이 적재부(6) 하단에는 상기 트레이(4)들을 상,하로 일정 피치씩 이동시킬 수 있도록 승강부(9)가 구비되어 있다.In addition, a lowering part 9 is provided at the lower end of the tray loading part 6 to move the trays 4 up and down by a predetermined pitch.
이러한 오프 로더(100')는 먼저 승강부(9)에 트레이(4)가 적재된 후, 흡착부(2)에 의해 다수의 반도체패키지 유닛(u)이 상기 트레이(4)에 수납된다. 상기와 같이 하여 하나의 트레이(4)에 반도체패키지 유닛이 모두 수납되면, 상기 트레이(4)의 상부에 또다른 트레이(4)가 적재되고, 이때 승강부(9)는 하부로 일정 피치 하강한다. 상기와 같이 승강부(9)가 하강한 후에는 다시 흡착부(2)에 의해 싱귤레이션된 반도체패키지 유닛(u)이 상기 트레이(4)에 수납된다.In the off loader 100 ′, a tray 4 is first loaded on the lifting unit 9, and then a plurality of semiconductor package units u are accommodated in the tray 4 by the suction unit 2. When all of the semiconductor package units are accommodated in one tray 4 as described above, another tray 4 is stacked on the tray 4, and the lifter 9 lowers a predetermined pitch downward. . After the lifting unit 9 is lowered as described above, the semiconductor package unit u singulated by the adsorption unit 2 is stored in the tray 4.
그러나 종래의 이러한 오프 로더는 흡착부의 불완전한 위치로 인해 반도체패키지 유닛이 적절히 안착되지 못하고 트레이의 포켓 사이에 걸치게 되어 틸트(tilt)되는 일이 종종 발생한다. 상기와 같이 트레이의 포켓 사이에 들뜬 반도체패키지 유닛은 그 위에 안착되는 다른 트레이에 의하여 다시 겹쳐지게, 이때 상기 반도체패키지 유닛에 형성된 도전성 볼 등이 트레이에 의해 파손되는 문제가 있다.However, such off-loaders in the related art often cause the semiconductor package unit not to be properly seated due to an incomplete position of the adsorption part, and thus to be tilted between the pockets of the tray. As described above, the semiconductor package unit floated between the pockets of the tray is overlapped again by another tray seated thereon, and there is a problem in that the conductive balls formed in the semiconductor package unit are damaged by the tray.
또한, 상기 트레이 상부에 위치되는 다른 트레이 역시 수평하게 적재되지 못하고 틸트된 상태로 위치하게 됨으로써, 상기와 같은 반도체패키지 유닛의 불량이 연속적으로 발생하게 된다.In addition, the other trays located on the upper side of the tray are also placed in a tilted state without being horizontally stacked, such that a defect of the semiconductor package unit is continuously generated.
따라서 본 발명은 상기와 같은 종래의 문제점을 해결하기 위해 안출한 것으로, 싱귤레이션된 반도체패키지 유닛을 트레이의 정확한 위치에 안착시킬 수 있는반도체패키지 제조용 싱귤레이션 장비의 오프 로더를 제공하는데 있다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and to provide an off-loader of the singulation equipment for semiconductor package manufacturing that can seat the singulated semiconductor package unit in the correct position of the tray.
도1은 도전성 볼 융착 및 몰딩이 완료된 통상적인 인쇄회로기판 스트립을 도시한 평면도이다.1 is a plan view showing a conventional printed circuit board strip in which conductive ball fusion and molding are completed.
도2는 통상적인 싱귤레이션 공정을 간단히 도시한 블럭도이다.2 is a simplified block diagram of a typical singulation process.
도3은 종래의 싱귤레이션 장비에서 오프 로더를 도시한 사시도이다.3 is a perspective view showing an off loader in a conventional singulation equipment.
도4는 본 발명에 의한 싱귤레이션 장비의 오프 로더를 도시한 사시도이다.Figure 4 is a perspective view showing an off loader of the singulation equipment according to the present invention.
- 도면중 주요 부호에 대한 설명 --Description of the main symbols in the drawings-
100; 본 발명에 의한 싱귤레이션 장비의 오프 로더100; Off loader of singulation equipment according to the present invention
2; 흡착부 4; 트레이2; Adsorption unit 4; tray
6; 적재부 8; 진동수단6; Loading section 8; Vibration
9; 승강부9; Lift
상기한 목적을 달성하기 위해 본 발명에 의한 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 의하면, 싱귤레이션된 반도체패키지 유닛을 흡착하여 상,하 및 수평으로 이동하는 흡착부와; 상기 흡착부의 하부에 위치되어 다수의 반도체패키지 유닛이 수납되는 트레이가 적재되는 적재부로 이루어진 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 있어서, 상기 적재부에는 상기 적재부를 일정한 주파수로 진동시킬 수 있도록 적어도 한개 이상의 진동 수단이 장착된 것을 특징으로 한다.According to the off-loader of the singulation equipment for manufacturing a semiconductor package according to the present invention in order to achieve the above object, the suction unit for adsorbing the singulated semiconductor package unit to move up, down and horizontally; In the off-loader of the singulation equipment for manufacturing a semiconductor package consisting of a stacking unit is located in the lower portion of the adsorption unit is loaded with a tray that accommodates a plurality of semiconductor package unit, at least one in the stacking unit to vibrate the stacking unit at a constant frequency The vibration means described above is mounted.
여기서, 상기 진동 수단은 적재부의 상부에 서로 대칭되는 방향에 다수를 설치함이 바람직하다.Here, the vibration means is preferably provided a plurality in the direction symmetrical with each other on the upper portion of the loading portion.
또한, 상기 진동 수단은 통상적인 에어 바이브레이터(air vibrator) 또는 모터를 이용한 바이브레이터 중 어느 하나를 이용할 수 있으며, 이를 한정하는 것은 아니다.In addition, the vibration means may use any one of a conventional air vibrator or a vibrator using a motor, but is not limited thereto.
상기와 같이 하여 본 발명에 의한 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 의하면, 흡착부에 의해 반도체패키지 유닛이 트레이에 수납된 후, 그 트레이가 적재된 적재부 자체를 일정한 주파수로 진동시켜줌으로써, 반도체패키지 유닛이 비록 틸트된 상태로 트레이에 수납되었다 하더라도 정확한 위치로 교정되어 수납되도록 한다. 따라서, 연속적으로 적재 또는 적층되는 다른 트레이에 의해 반도체패키지 유닛의 도전성 볼에 어떠한 영향도 주지 않게 되며, 또한 다른 트레이도 정확한 위치로 적재된다.According to the off-loader of the singulation equipment for manufacturing a semiconductor package according to the present invention as described above, after the semiconductor package unit is accommodated in the tray by the adsorption unit, by vibrating the loading portion on which the tray is loaded at a constant frequency, Even if the semiconductor package unit is stored in the tray in a tilted state, it is corrected and stored in the correct position. Therefore, the other trays stacked or stacked successively do not have any influence on the conductive balls of the semiconductor package unit, and the other trays are also loaded in the correct positions.
이하 본 발명이 속한 기술분야에서 통상의 지식을 가진 자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art can easily implement the present invention.
도4는 본 발명에 의한 싱귤레이션 장비의 오프 로더(100)를 도시한 사시도이다.Figure 4 is a perspective view showing the off loader 100 of the singulation equipment according to the present invention.
도시된 바와 같이, 싱귤레이션된 반도체패키지 유닛(u)을 흡착하여 상,하 방향 및 수평 방향으로 이동하는 흡착부(2)가 구비되어 있고, 상기 흡착부(2)의 하부에는 다수의 반도체패키지 유닛(u)이 수납되는 트레이(4) 및 이 트레이(4)를 다수 적층하여 적재하는 적재부(6)가 구비되어 있다. 물론, 상기 적재부(6)의 트레이(4) 하단부에는 상기 트레이(4)를 상,하로 이동시킬 수 있도록 승강부(9)가 구비되어 있다.As shown, the adsorption part 2 which absorbs the singulated semiconductor package unit u and moves in the up, down direction and the horizontal direction is provided, and the lower part of the adsorption part 2 includes a plurality of semiconductor packages. The tray 4 in which the unit u is accommodated, and the loading part 6 which stacks and stacks many tray 4 are provided. Of course, the lower portion of the tray 4 of the stacking portion 6 is provided with a lifting portion 9 to move the tray 4 up and down.
한편, 상기 적재부(6)의 상부에는 서로 대칭되는 위치에 일정한 진동을 제공하도록 한 개 이상의 진동수단(8)이 장착되어 있다. 여기서, 상기 진동수단(8)의 장착 위치는 당업자에 의해 바뀔 수도 있다.On the other hand, one or more vibration means 8 are mounted on the upper part of the loading part 6 so as to provide a constant vibration at positions symmetric with each other. Here, the mounting position of the vibrating means 8 may be changed by those skilled in the art.
바람직하기로 상기 진동수단(8)은 적재부(6)의 상부에 서로 대칭되는 위치에 다수개 예를 들면 4개 정도를 설치함이 바람직하며, 그 갯수를 한정하는 것은 아니다.Preferably, the vibrating means 8 is preferably installed on the upper portion of the mounting portion 6 in a symmetrical position, for example four or more, and the number is not limited.
상기 진동수단(8) 각각에는 특정한 주파수 또는 주기의 흔들림이 발생하도록 하여 상기 적재부(6) 자체가 일정한 주파수로 흔들리도록 한다.Each of the vibration means 8 causes a shake of a specific frequency or period so that the loading part 6 itself shakes at a constant frequency.
상기 진동수단(8)으로서는 공기의 반복적인 분출 압력에 의해 적재부(6)를 진동시킬 수 있는 에어 바이브레이터가 사용될 수 있다.As the vibrating means 8, an air vibrator capable of vibrating the loading part 6 by repeated blowing pressure of air may be used.
또한, 상기 진동수단(8)은 캠모양으로 형성된 회전축을 갖는 모터를 설치하여, 상기 캠이 적재부(6)의 소정 부분을 일정한 주파수로 타격하도록 한 모터형 바이브레이터도 사용할 수 있으며, 이것들로 본 발명의 진동수단(8)을 한정하는 것은 아니다.In addition, the vibrating means 8 may also use a motor-type vibrator in which a motor having a rotating shaft formed in a cam shape is provided so that the cam strikes a predetermined portion of the loading portion 6 at a constant frequency. It does not limit the vibration means 8 of this invention.
이러한 오프 로더(100)는 흡착부(2)에 의해 반도체패키지 유닛(u)이 상기 적재부(6)의 트레이(4)에 모두 수납되고, 다른 트레이(4)를 적층하기 위해 상기 반도체패키지 유닛(u)이 수납된 트레이(4)가 승강부(9)에 의해 하부로 하강하는 동안 상기 진동수단(8)이 작동하여, 적재부(6) 자체를 일정한 진동수로 진동하게 된다.In the off loader 100, the semiconductor package unit u is all accommodated in the tray 4 of the stacking unit 6 by the adsorption unit 2, and the semiconductor package unit is stacked to stack other trays 4. The vibrating means 8 is operated while the tray 4 containing u is lowered by the elevating portion 9 to vibrate the loading portion 6 itself at a constant frequency.
따라서 부적절하게 수납된 반도체패키지 유닛(u)은 상기 진동수단(8)의 작동에 의해 트레이(4)의 적절한 위치에 모두 수납되게 된다. 상기와 같이 진동수단(8)이 작동한 후에는, 상기 반도체패키지 유닛(u)이 수납된 트레이(4) 위에 또다른 비어 있는 트레이(4)가 적층되어 다음 작업을 계속하게 된다.Therefore, the improperly accommodated semiconductor package unit u is all accommodated in the proper position of the tray 4 by the operation of the vibrating means 8. After the vibrating means 8 is operated as described above, another empty tray 4 is stacked on the tray 4 in which the semiconductor package unit u is accommodated to continue the next operation.
이상에서와 같이 본 발명은 비록 상기의 실시예에 한하여 설명하였지만 여기에만 한정되지 않으며, 본 발명의 범주 및 사상을 벗어나지 않는 범위내에서 여러가지로 변형된 실시예도 가능할 것이다.As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.
따라서, 본 발명에 의한 반도체패키지 제조용 싱귤레이션 장비의 오프 로더에 의하면 흡착부에 의해 반도체패키지 유닛이 트레이에 수납된 후, 그 트레이가적재된 적재부 자체를 일정한 주파수로 진동시켜줌으로써, 반도체패키지 유닛이 비록 틸트된 상태로 트레이에 수납되었다 하더라도 정확한 위치로 교정되어 수납되는 효과가 있다.Accordingly, according to the off-loader of the singulation equipment for manufacturing a semiconductor package according to the present invention, after the semiconductor package unit is accommodated in the tray by the adsorption unit, the semiconductor package unit is vibrated at a constant frequency by vibrating the loading unit on which the tray is loaded. Although stored in the tray in a tilted state, there is an effect of being corrected and stored in the correct position.
또한, 연속적으로 적재 또는 적층되는 다른 트레이에 의해 반도체패키지 유닛의 도전성 볼에 어떠한 영향도 주지 않게 되며, 또한 다른 트레이도 정확한 위치로 적재되는 효과가 있다.In addition, the other trays that are continuously stacked or stacked do not affect the conductive balls of the semiconductor package unit, and the other trays are also loaded at the correct positions.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990056406A KR20010055252A (en) | 1999-12-10 | 1999-12-10 | off loader of singulation device for manufacturing semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990056406A KR20010055252A (en) | 1999-12-10 | 1999-12-10 | off loader of singulation device for manufacturing semiconductor package |
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| KR20010055252A true KR20010055252A (en) | 2001-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990056406A Ceased KR20010055252A (en) | 1999-12-10 | 1999-12-10 | off loader of singulation device for manufacturing semiconductor package |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952851A (en) * | 2017-04-17 | 2017-07-14 | 如皋市大昌电子有限公司 | A kind of Jolting bulk quantity of chips alignment system |
| CN106952850A (en) * | 2017-04-17 | 2017-07-14 | 如皋市大昌电子有限公司 | A kind of chip batch alignment system |
| KR20240153180A (en) | 2023-04-14 | 2024-10-22 | (주)가온코리아 | transparent plastic tray seperating apparatus for receiving pcb |
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|---|---|---|---|---|
| JPS5850751A (en) * | 1981-09-22 | 1983-03-25 | Shinkawa Ltd | Replacing method for die |
| JPS6461031A (en) * | 1987-09-01 | 1989-03-08 | Sumitomo Electric Industries | Device for mounting chip |
| KR970013151A (en) * | 1995-08-21 | 1997-03-29 | 김광호 | Positioning of semiconductor chip packages in-tray handling |
| JPH1145893A (en) * | 1997-07-28 | 1999-02-16 | Mitsubishi Electric Corp | Semiconductor manufacturing device and manufacture of semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850751A (en) * | 1981-09-22 | 1983-03-25 | Shinkawa Ltd | Replacing method for die |
| JPS6461031A (en) * | 1987-09-01 | 1989-03-08 | Sumitomo Electric Industries | Device for mounting chip |
| KR970013151A (en) * | 1995-08-21 | 1997-03-29 | 김광호 | Positioning of semiconductor chip packages in-tray handling |
| JPH1145893A (en) * | 1997-07-28 | 1999-02-16 | Mitsubishi Electric Corp | Semiconductor manufacturing device and manufacture of semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106952851A (en) * | 2017-04-17 | 2017-07-14 | 如皋市大昌电子有限公司 | A kind of Jolting bulk quantity of chips alignment system |
| CN106952850A (en) * | 2017-04-17 | 2017-07-14 | 如皋市大昌电子有限公司 | A kind of chip batch alignment system |
| CN106952851B (en) * | 2017-04-17 | 2023-06-13 | 如皋市大昌电子有限公司 | Jolt type batch chip positioning system |
| CN106952850B (en) * | 2017-04-17 | 2023-09-08 | 如皋市大昌电子有限公司 | Chip batch positioning system |
| KR20240153180A (en) | 2023-04-14 | 2024-10-22 | (주)가온코리아 | transparent plastic tray seperating apparatus for receiving pcb |
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